CN114103501B - Flexible electronic transfer printing method driven by dual-material rigidity regulation - Google Patents
Flexible electronic transfer printing method driven by dual-material rigidity regulation Download PDFInfo
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- CN114103501B CN114103501B CN202111374205.2A CN202111374205A CN114103501B CN 114103501 B CN114103501 B CN 114103501B CN 202111374205 A CN202111374205 A CN 202111374205A CN 114103501 B CN114103501 B CN 114103501B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
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Abstract
The invention discloses a flexible electronic transfer printing method with dual-material rigidity regulation, wherein a stamp is composed of materials with different moduli, the surface interface of the stamp is locally deformed with large curvature by means of lateral auxiliary displacement load and material rigidity regulation, the contact area and interface viscosity between a multi-material stamp and an electronic device are effectively weakened, and the transfer printing success rate is improved. The method regulates the interface viscosity strength change by changing the auxiliary load on two sides of the seal, is not limited by the initial design size of the microstructure compared with the microstructure auxiliary transfer printing, and has wider material application range; the method adopts a mechanical displacement load as a regulation and control means, does not need to introduce temperature/shape memory alloy and surface interface chemical treatment, and does not need to exert control on the transfer speed. The method has the advantages of simple process, low cost, programmability, repeatability, reversibility and scale independence, and the scale of the transfer printing material is from nanometer to macroscopic scale. The method is in accordance with the industrial control process, has high industrial integration level, and can be applied to batch production.
Description
Technical Field
The invention belongs to the technical field of flexible electron and micro-nano processing, and relates to a flexible electron transfer printing method driven by dual-material rigidity regulation.
Technical Field
The flexible electronic technology means that functional electronic devices are manufactured on a flexible substrate, so that the electronic devices can be stretched, bent and twisted while the functionality of the electronic devices is kept, the requirements of complex working environments are met, and the flexible electronic technology has a wide application prospect in the fields of flexible display, flexible sensing, wearable equipment, robots and the like. Transfer printing is an important technology for flexible electronic fabrication, and is a method for transferring functional electronic devices from a donor (fabrication) substrate to an acceptor (application) substrate. The transfer printing comprises two steps of picking up and printing, in the picking up stage, the interface viscosity of the seal/electronic device is greater than that of the donor/electronic device, and at the moment, the electronic device is debonded from the donor substrate and is transferred to the seal; in the printing stage, the interfacial viscosity of the stamp/electronic device layer is less than that of the receptor/electronic device, and at the moment, the electronic device is separated from the stamp and is printed on the receptor substrate. The transfer process belongs to the category of fracture mechanics, and relates to the strong and weak adhesion conversion capability of an interface. Successful transfer is to both "pick up" and "put down" the device from the donor substrate and to successfully print the device to the receptor substrate. The existing transfer printing method comprises the following steps: a surface chemical and adhesive bonding transfer method, wherein the interface bonding strength is changed by surface chemical treatment or glue; the microstructure auxiliary transfer printing method controls the contact area of the surface microstructure through pressure so as to control the adhesion strength; the transfer printing method is dynamically controlled, and the transfer printing and the like are completed by controlling the peeling speed to change the strong and weak adhesion of the interface. The existing transfer printing method mostly depends on single material design, the interface adhesion strength regulation and control capability is limited, and the application material range and transfer printing yield of transfer printing are limited.
Disclosure of Invention
The invention provides a flexible electronic transfer printing method driven by dual-material rigidity regulation, which aims at the problems that a transfer printing stamp is prepared by two materials with different material attributes, the stamp is fully contacted with an electronic device in a picking-up stage to ensure stronger interface viscosity, so that the electronic device is separated from a donor, and in a printing stage, a low-modulus material area in the stamp bears main deformation under the action of auxiliary loads on two sides, and high-curvature local deformation occurs on the lower surface of the stamp contacted with the electronic device, so that the interface viscosity of the stamp/the electronic device is effectively reduced, the electronic device is separated from the stamp and is printed on an acceptor matrix, and the transfer printing is completed.
In order to achieve the purpose, the invention adopts the following technical scheme:
a flexible electronic transfer printing method driven by dual-material rigidity regulation comprises the following steps:
(1) preparing a seal by using two materials with different attributes, wherein the two materials are respectively a high-modulus solid and a low-modulus material; the high modulus material is solid, and the low modulus material is solid or fluid;
(2) moving the stamp to align the low-modulus material area with the electronic device, introducing prepressing force to make the stamp contact with the electronic device, enhancing the interfacial viscosity between the stamp and the electronic device, and making the interfacial viscosity of the stamp/electronic device material stronger than that of the electronic device/receptor;
(3) the stamp is lifted upwards, and the electronic device is debonded from the donor (preparation) matrix by the strong interface viscosity of the stamp and the electronic device, and is transferred to the stamp surface;
(4) moving the seal to enable the electronic device adhered to the seal to align and attach to the receptor substrate, introducing lateral auxiliary displacement load, enabling the seal to generate larger curvature deformation in a low-modulus material area, and greatly weakening the contact area and interface viscosity between the seal and the electronic device;
(5) and (3) lifting the stamp upwards while maintaining the lateral auxiliary displacement load, so that the electronic device and the stamp are debonded due to weak interface viscosity of the stamp and the electronic device, and printing the debonded electronic device and the stamp on the surface of a receptor (application) substrate.
When the low-modulus material is a solid, the low-modulus material is distributed too much along the vertical direction, so that the regulation and control of the strong and weak viscosity of the interface are less influenced, and the optimal layout can be given by a topological optimization algorithm; the low modulus material is in fluid or quasi-fluid form and is juxtaposed with the high modulus solid.
Different material properties refer to different tensile moduli of the material.
The high modulus solid may be PDMS or Ecoflex.
The low modulus fluid may be a hydrogel, ionic liquid or a common liquid.
The invention discloses a flexible electronic transfer printing method for adjusting and controlling rigidity of double materials, which comprises a double-material stamp, an electronic device, a donor (preparation) matrix and an acceptor (application) matrix. The stamp is made of different materials, the surface interface of the stamp generates larger curvature local deformation by means of lateral auxiliary displacement load and different modulus material rigidity regulation design, the contact area and the interface viscosity of the stamp/electronic device interface are effectively weakened, and the transfer printing success rate and the yield are improved. Compared with the interface microstructure auxiliary transfer printing, the method regulates and controls the interface viscosity strength transformation by changing the auxiliary loads on two sides of the seal, is not limited by the initial design size of the microstructure, and has wider material application range, programmability, repeatability, reversibility and size independence; the method adopts a mechanical displacement load as a regulating and controlling means, does not need to introduce temperature/shape memory alloy and surface interface chemical treatment, does not need to apply control on the transfer speed, has simple process and low cost, is in accordance with an industrial control flow, and does not cause performance reduction caused by temperature stress; the method has simple structure and convenient preparation, and is suitable for a plurality of transfer printing device materials and substrate materials.
Drawings
FIG. 1 is a schematic diagram of a transfer stamp based on dual materials of high modulus solids and low modulus liquids;
FIG. 2 is a schematic diagram of applying pre-pressure to a solid-liquid dual-material stamp to ensure a large contact area and strong interfacial adhesion between the stamp and an electronic device;
FIG. 3 is a schematic view of the stamp being lifted to debond the electronic device from the donor (preparation) substrate and transferred to the stamp surface
FIG. 4 is a schematic view of the large curvature deformation of the low modulus material region of the stamp resulting from the application of lateral auxiliary displacement loads to the two sides of the stamp, effectively reducing the contact area and interfacial adhesion between the stamp and the electronic device;
FIG. 5 is a schematic view of the stamp being lifted so that the electronic device is printed onto a receptor (application) substrate;
FIG. 6 is a schematic diagram of a transfer stamp based on a dual material of high tensile modulus solid and low modulus solid, the configuration of the low modulus material being given by a topology optimization algorithm;
FIG. 7 is a schematic diagram of pre-stressing a dual-material solid stamp of different modulus to ensure a larger contact area and strong interfacial adhesion of the stamp with an electronic device;
FIG. 8 is a schematic view of the stamp being lifted to debond the electronic device from the donor (preparation) substrate and transferred to the stamp surface
FIG. 9 is a schematic view of the low modulus material region of the stamp undergoing large curvature deformation to effectively reduce the contact area and interfacial adhesion between the stamp and the electronic device by applying lateral auxiliary displacement loads to the two sides of the stamp;
FIG. 10 is a diagram of applying a weak pre-stress to the stamp to ensure contact of the stamp with the electronic device and weak interfacial adhesion;
FIG. 11 is a schematic view of the stamp being lifted so that the electronic device is printed onto a receptor (application) substrate;
in the figure: 1 a high modulus material; 2 a low modulus material; 3 an electronic device; 4 a donor substrate; 5 the receptor matrix.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present invention will be further described below with reference to the accompanying drawings and technical solutions.
Referring to fig. 1, fig. 1 is a schematic view of a dual-material stamp design based on high-modulus solid and low-modulus fluid under dual-material stiffness control, the low-modulus fluid is hydrogel, and thin films are coated on the upper and lower surfaces of the dual-material stamp composed of the high-modulus solid and the low-modulus fluid to encapsulate the low-modulus fluid, so as to prevent liquid leakage. The packaging film can be made of high-modulus solid materials, so that the same interface viscosity as that of a single-material seal is ensured; the corresponding transfer embodiments are:
(1) as shown in fig. 2, the solid-liquid dual-material stamp is moved to align the electronic device dot matrix on the donor (preparation) substrate with the low-modulus material region of the dual-material stamp; applying downward prestress on the dual-material stamp to ensure that the stamp has larger contact area and strong interface viscosity with an electronic device;
(2) as shown in fig. 3, the solid-liquid dual-material stamp is lifted up, so that the electronic device is debonded from the donor (preparation) substrate and transferred to the lower surface of the stamp;
(3) as shown in fig. 4, the solid-liquid dual-material stamp which picks up the electronic device is contacted with the receptor (application) substrate, and lateral auxiliary load is applied to the solid-liquid dual-material stamp, so that a low-modulus material area of the stamp generates large curvature deformation, and the contact area and interface viscosity of the stamp and the electronic device are effectively weakened;
(4) as shown in fig. 5, the solid-liquid dual-material stamp is lifted up, so that the electronic device is debonded from the stamp and printed on a receptor (application) substrate;
referring to fig. 6, fig. 6 is a schematic diagram of another dual-material stamp design based on high-modulus solids and low-modulus solids under dual-material stiffness control. The high modulus solid may be PDMS and the low modulus solid may be Ecoflex. The high-modulus solids and the low-modulus solids are distributed in parallel, but the low-modulus solids which are distributed too much in height have less influence on the deformation of the lower surface of the stamp, so that the optimal layout of the low-modulus solids is given based on a topological optimization algorithm, as shown in FIG. 6. The lower surface of a dual-material stamp consisting of high-modulus solid and low-modulus solid is covered with a thin high-modulus solid layer to ensure that the interface viscosity is the same as that of a single-material stamp; the transfer printing implementation mode of the dual-material seal based on the high-modulus solid and the low-modulus solid is as follows:
(1) as shown in fig. 7, the solid two-material stamp of different modulus is moved to align the electronic device lattice on the donor (preparation) substrate with the low modulus material region of the two-material stamp; applying downward prestress on the dual-material stamp to ensure larger contact area and strong interface viscosity between the stamp and an electronic device;
(2) as shown in fig. 8, the different modulus solid two-material stamp is lifted, causing the electronic device to debond from the donor (preparation) substrate and be transferred to the stamp surface;
(3) as shown in fig. 9, a lateral auxiliary load is applied to the solid dual-material stamp with different modulus after the electronic device is picked up, and a low-modulus material region of the stamp generates large-curvature deformation, so that the contact area and the interface viscosity of the stamp and the electronic device are effectively weakened;
(4) as shown in fig. 10, the deformed solid dual-material stamp with different modulus is contacted with the receptor (application) substrate, and a lower pre-pressure is applied, so that the electronic device is contacted with the surface of the receptor (application) substrate;
(5) as shown in fig. 11, the different modulus solid bi-material stamp is lifted so that the electronic device is debonded from the stamp and printed to the receptor (application) substrate.
Claims (6)
1. A flexible electronic transfer printing method for regulating and controlling double material rigidity is characterized by comprising the following steps:
(1) preparing a seal by using two materials with different attributes, wherein the two materials are respectively a high-modulus solid and a low-modulus material;
the low modulus material is solid or fluid;
(2) moving the stamp to align the low modulus material region with the electronic device, introducing a pre-pressure to contact the stamp with the electronic device,
the interface viscosity between the seal and the electronic device is enhanced, so that the interface viscosity of the seal/electronic device material is stronger than that of the electronic device/receptor;
(3) lifting the stamp upwards, and transferring the electronic device and the donor matrix to the stamp surface by the interfacial viscosity of the stamp and the electronic device to debond the electronic device and the donor matrix;
(4) moving the seal to enable the electronic device adhered to the seal to align and attach to the receptor substrate, introducing lateral auxiliary displacement load, enabling the seal to generate large-curvature deformation in a low-modulus material area, and weakening the contact area and interface viscosity between the seal and the electronic device;
(5) and (3) lifting the seal upwards while maintaining the lateral auxiliary displacement load, so that the electronic device and the seal are debonded due to weak interface viscosity of the seal and the electronic device, and printing the electronic device and the seal onto the surface of the receptor substrate.
2. The method for bi-material stiffness-regulated flexible electronic transfer printing according to claim 1, wherein in the step (1), the different properties refer to different tensile moduli of the materials.
3. The method for flexible electronic transfer printing with dual material stiffness regulation and control according to claim 1 or 2, characterized in that when the low modulus material is a solid, the low modulus material is distributed too much along the vertical direction, which has little influence on regulation and control of interface strength and weak viscosity, and the optimal layout is given by a topological optimization algorithm; when the low modulus material is a fluid, it is distributed in parallel with the high modulus solid.
4. The method according to claim 3, wherein the high modulus solid is PDMS or Ecoflex.
5. The method for bi-material stiffness modulated flexible electronic transfer printing according to claim 1, wherein the fluid is hydrogel, ionic liquid or normal liquid.
6. The method for dual-material stiffness-regulated flexible electronic transfer printing according to claim 1, 2 or 4, wherein the strategy for regulating the interface viscosity between the stamp and the electronic device is to make the low-modulus material region bear main deformation by lateral auxiliary load to generate local large curvature.
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| WO2013010113A1 (en) * | 2011-07-14 | 2013-01-17 | The Board Of Trustees Of The University Of Illinois | Non-contact transfer printing |
| CN102522361A (en) * | 2011-12-19 | 2012-06-27 | 清华大学 | System integration method for inorganic flexible electronic devices |
| CN104538344B (en) * | 2014-12-22 | 2017-09-12 | 华中科技大学 | A kind of device shifted for ultra-thin, flexible electronic device, methods and applications |
| CN107215111B (en) * | 2017-06-14 | 2023-03-28 | 浙江大学 | Magnetic control transfer seal and magnetic control transfer printing method |
| CN109427979B (en) * | 2017-08-24 | 2020-05-01 | Tcl集团股份有限公司 | Transfer printing method based on shape memory polymer and application thereof |
| CN109808319B (en) * | 2017-11-20 | 2020-09-22 | Tcl科技集团股份有限公司 | Stamp and preparation method thereof and quantum dot transfer printing method |
| CN208543944U (en) * | 2018-07-05 | 2019-02-26 | 浙江大学 | A kind of extensive based on Bionic Design programmable actively transfers seal |
| CN108583024B (en) * | 2018-07-05 | 2024-04-30 | 浙江大学 | Large-scale programmable active transfer seal based on bionic design and transfer printing method |
| CN109941007A (en) * | 2019-03-13 | 2019-06-28 | 浙江大学 | A kind of general shape-memory polymer transfer seal and its transfer method |
| CN111086971B (en) * | 2019-12-25 | 2022-06-21 | 大连理工大学 | Transfer printing process method for flexible MEMS device |
| CN111048457B (en) * | 2019-12-26 | 2022-06-21 | 浙江大学 | Non-contact transfer printing method of thermally-driven programmable elastic active transfer printing stamp |
| CN111048458B (en) * | 2019-12-26 | 2022-06-07 | 浙江大学 | Octopus bionic programmable sucker type transfer seal and transfer method |
| CN111341703B (en) * | 2020-04-07 | 2023-03-31 | 浙江大学 | Thermal control programmable air pressure type transfer seal and transfer method |
| CN112477391B (en) * | 2020-11-27 | 2022-05-10 | 浙江大学 | Magnetic control transfer printing stamp based on bistable structure and transfer printing method |
| CN113223985A (en) * | 2021-04-28 | 2021-08-06 | 浙江大学 | Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method |
| CN113427888B (en) * | 2021-06-15 | 2022-06-17 | 清华大学 | Seal unit design method, seal unit and seal |
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