CN107154423A - Array base palte and preparation method thereof, display device - Google Patents

Array base palte and preparation method thereof, display device Download PDF

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Publication number
CN107154423A
CN107154423A CN201710346889.2A CN201710346889A CN107154423A CN 107154423 A CN107154423 A CN 107154423A CN 201710346889 A CN201710346889 A CN 201710346889A CN 107154423 A CN107154423 A CN 107154423A
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CN
China
Prior art keywords
nano
glue material
array base
layer
base palte
Prior art date
Application number
CN201710346889.2A
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Chinese (zh)
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CN107154423B (en
Inventor
陈立强
孙韬
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京东方科技集团股份有限公司
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Priority to CN201710346889.2A priority Critical patent/CN107154423B/en
Publication of CN107154423A publication Critical patent/CN107154423A/en
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Publication of CN107154423B publication Critical patent/CN107154423B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2227/00Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2227/00Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
    • H01L2227/32Devices including an organic light emitting device [OLED], e.g. OLED display
    • H01L2227/323Multistep processes for AMOLED

Abstract

The present invention relates to display technology field, more particularly to a kind of array base palte and preparation method thereof, display device.The array base palte includes:Flexible substrate substrate, back protection film and adhesive linkage, the back protection film are mutually be bonded with the flexible substrate substrate by the adhesive linkage, and the adhesive linkage includes glue material and some nano-filled things being filled in the glue material.Array base palte of the present invention is when bearing larger pressure and higher temperature, due to the presence of nano-filled thing in array base palte, the deformation quantity of adhesive linkage can effectively be controlled, so as to improve the pressure-resistant performance and heat resistance of whole array base palte, process yields when circuit binding is carried out on the array base palte are lifted at.

Description

Array base palte and preparation method thereof, display device

【Technical field】

The present invention relates to display technology field, more particularly to a kind of array base palte and preparation method thereof, display device.

【Background technology】

In recent years, the concept of Flexible Displays more and more deeply shows market, attracts consumer's eyeball.Realize Flexible Displays Key technology can be divided into two broad aspects:Panel process and module technique, flexible module technique show very big relative to plane It is different.It is that the glass that large area is first carried out after panel pad pasting is removed and flexible to have a kind of technique in flexible module technique Substrate back pad pasting, carries out circuit binding on flexible substrates after cutting, then attach back side functional membrane.

Heating is needed to pressurize in binding circuitry processes, the heat of flexible base board, diaphragm and connection glue material in array base palte The coefficient of expansion is different, and the deformation quantity after stress is different, especially connects glue material and deformed dilation etc. occurs when heating pressurization Phenomenon, and then the phenomenon of thinning depression occur at glue material, easily cause metallic crimping in circuit binding procedure it is bad or The problems such as rupture of line.

【The content of the invention】

The purpose of the present invention aims to provide a kind of array base palte and preparation method thereof, display device, flexible to solve connection The adhesive linkage of underlay substrate and back protection film occurs deformed dilation when heating pressurization, and then appearance is thinning recessed at glue material Fall into, cause circuit to bind metallic and crimp the problem of bad or IC edges are broken.

To realize the purpose, the invention provides a kind of array base palte, including flexible substrate substrate, back protection film and viscous Layer is connect, the back protection film is mutually be bonded with the flexible substrate substrate by the adhesive linkage, the adhesive linkage includes glue material And some nano-filled things being filled in the glue material.

It is preferred that the flexible substrate substrate is plastic supporting base substrate.

It is preferred that the nano-filled thing is nano-particle.

It is preferred that the nano-particle is in spherical or olive-shaped.

Specifically, some nano-particles are woven into fibre structure or network structure.

Preferably, the adhesive linkage includes the mixed structure for being mixed and being constituted by the glue material and nano-filled thing or extremely Lack one group of layer structure folded and constituted by the glue material and nano-filled nitride layer.

Specifically, the nano-filled thing be in spherical or olive-shaped nano-particle, it is some in the mixed structure Nano-particle is in stacked.

Specifically, the nano-filled thing is that in spherical or olive-shaped nano-particle, some in the packed layer receive Rice corpuscles is in stacked.

Specifically, layered structure includes the glue material layer being made up of the glue material for two layers and one layer by described nano-filled The packed layer that thing is constituted, the packed layer is between two layers of glue material layer.

Preferably, the maximum diameter of the nano-particle is less than 5um.

Preferably, the nano-particle is the particle of material.

Correspondingly, present invention also offers a kind of preparation method of array base palte, methods described includes:

Glue application step:In the backsize or perfusion glue material of the flexible substrate substrate and nano-filled thing, with described The back side of flexible substrate substrate forms adhesive linkage;

Attach step:The back protection film is attached on the adhesive linkage.

Specifically, the adhesive linkage includes at least one set of stratiform knot folded and constituted by the glue material and nano-filled nitride layer Structure, layered structure includes the glue material layer being made up of the glue material for two layers and one layer of filling being made up of the nano-filled thing Layer, the packed layer is between two layers of glue material layer;

Wherein, the glue application step is specifically included:

Step 1, first coated at the back side of the flexible substrate substrate and irrigate one layer of glue material afterwards;

Step 2, at least one layer of nano-filled thing is elaborated in the glue material;

Step 3, one layer of glue material is coated with or irrigated on the nano-filled thing;

If the adhesive linkage includes multigroup layered structure, repeat the above steps 2 and step 3.

Further, the adhesive linkage includes the mixed structure for being mixed and being constituted by the glue material and nano-filled thing;

Wherein, before the glue application step, in addition to:The glue material and nano-filled thing are mixed according to default ratio Close.

Correspondingly, present invention also offers a kind of display panel, including the array base palte described in any of the above-described technical scheme.

Correspondingly, present invention also offers a kind of display device, it includes the array base described in any of the above-described technical scheme Plate.

Compared with prior art, the present invention possesses following advantage:

The present invention is for flexible substrate substrate, back protection film and adhesive linkage when heating pressurization, and adhesive linkage is compared to soft Property underlay substrate and back protection film the problem of be easier larger deformation quantity occur, the present invention proposes to fill nanometer in adhesive linkage Filler, the intensity for filling adhesive linkage after nano-filled thing is improved, linear expansion coefficient reduction, and dimensional stability is improved, in battle array When row substrate bears larger pressure and higher temperature, by nano-filled thing therein, the deformation quantity of adhesive linkage is effectively controlled, from And the pressure-resistant performance and heat resistance of whole array base palte are improved, it is lifted at work when circuit binding is carried out on the array base palte Skill yield.

Further, in the array base palte that provides of the present invention, in the packed layer nano-particle be woven into fibre structure or Network structure so that the pressure weave in that packed layer is subject to, the pressure of opposite direction is cancelled out each other, disperses pressure, enhancing The pressure-resistant performance of packed layer.

Further, in the array base palte that the present invention is provided, the adhesive linkage is included by the glue material and nano-filled thing Sandwich construction can be mixed by the mutual traction between nano-particle in the mixed structure or layer structure of composition, layer structure The contact area of nano-particle and flexible substrate substrate in conjunction structure is big, and two kinds of structures can improve the compression resistance of adhesive linkage, Improve the supportive of array base palte.

In addition, the display panel and display device in the present invention are improved on the basis of the array base palte, Therefore, the display panel and display device the natural succession all advantages of the array base palte.

The aspects of the invention or other aspects can more straightforwards in the following description.

【Brief description of the drawings】

The structural representation of array base palte that Fig. 1 provides for the present invention, its main presentation flexible substrate substrate, the back side are protected Relation between cuticula and adhesive linkage;

Fig. 2 is a kind of another structural representation of array base palte in the present invention, its main presentation stratiform knot of adhesive linkage Structure;

Fig. 3 is a kind of another structural representation of array base palte in the present invention, its main presentation another layer of adhesive linkage Shape structure;

Fig. 4 is the schematic flow sheet of the preparation method of array base palte in the present invention;

Fig. 5 is the Making programme schematic diagram of the layer structure of adhesive linkage in the present invention;

Fig. 6 is a kind of another structural representation of array base palte in the present invention, its main presentation mixing knot of adhesive linkage Structure.

【Embodiment】

The present invention is further described with exemplary embodiment below in conjunction with the accompanying drawings, identical label wherein in accompanying drawing All refer to identical part.In addition, if it is known that the detailed description of technology is for showing the invention is characterized in that unnecessary , then omitted.

The structural representation of array base palte of the present invention as indicated with 1, the array base palte, including flexible substrate substrate 101st, back protection film 102 and adhesive linkage 103, the back protection film pass through the adhesive linkage and the flexible substrate substrate phase Bonding, the adhesive linkage includes glue material and some nano-filled things being filled in the glue material.

Wherein, the flexible substrate substrate is preferably plastic supporting base substrate.Plastic supporting base substrate and existing glass substrate Compare, pliability more preferably, is more not easily susceptible to damage, correspondingly, service life is longer.

Wherein, nano-filled thing can improve the compressive strength of adhesive linkage after having certain intensity, filling, linear swollen Swollen coefficient reduction, the stability of size improves feature.

The nano-filled thing is preferably nano-particle.Nano-particle has small volume, surface area big, hard, resistance in itself Mill, high temperature resistant, corrosion resistant characteristic, can bear larger pressure and higher temperature.The nano-particle is material Or the similar particle of intensity therewith, for example:SiO2, ZnO, CaCO3Deng, the intensity of inorganic nano-particle is originally higher than organic material, It is filled into after adhesive linkage, due to the interaction between nano-particle intensity in itself and nano-particle so that adhesive linkage Pressure-resistant degree enhancing, linear expansion coefficient reduction, the dimensional stability of adhesive linkage is improved.The nanometer of preferably material of the invention Particle is as filler, and the nano-particle of material is in addition to nano-particle pressure-and heat-resistance characteristic in itself, and cost is low It is honest and clean, save production cost.

Wherein, the size of the nano-particle is 100nm between 5um.

The nano-particle is preferably in spherical or olive-shaped particle.The nano-particle of both shapes is being under pressure When, pressure in opposite direction in same plane can be offset, the compressive property of nano-particle is improved.

Putting in order for the nano-particle is woven into fibre structure or network structure, preferably network structure, works as nanometer When particle is woven into a mesh structure, horizontal direction and vertical direction weave in, the scattered pressure being subject to strengthen nano-particle The pressure-resistant performance of layer.

The adhesive linkage has two kinds of structures, and a kind of at least one set is folded by the glue material and nano-filled nitride layer and constituted Layer structure, another is the mixed structure for being mixed and being constituted by the glue material and nano-filled thing.

As shown in Fig. 2 layered structure includes the glue material layer 204 being made up of the glue material for two layers and one layer is received by described The packed layer that rice filler is constituted, the packed layer is between two layers of glue material layer, and the nano-filled thing selected in Fig. 2 is spherical Individual layer nanoparticle layers 205, at this can also be other shapes nano-particle, elaborate one layer or more than two layers.This layer Shape structure is conducive to, by the support between nano-particle and mutually traction, strengthening the support force of adhesive linkage.

As shown in figure 3, another form of layered structure, the nano-filled thing is preferably nano-particle, nanometer Particle is woven into a mesh structure 605, when nano-particle is woven into a mesh structure, horizontal direction and vertical direction weave in, The scattered pressure being subject to, strengthens the pressure-resistant performance of nanoparticle layers.

The preferred nano-particle of nano-filled thing, the size of nano-particle, material, shape and put in order all with it is foregoing It is identical, nano-particle can it is orderly or it is unordered stack, the loading of nano-particle is less than whole adhesive linkage wherein in packed layer 10%, to prevent the generation of agglomeration, while ensure flexible substrate substrate and glue material layer, nano-particle and glue material layer, glue material Adhesive property between layer and back protection film.

In another embodiment, the packed layer in layer structure is made up of multi-layer nano particle layer.Multi-layer nano particle Layer except can utilize same layer nano-particle between mutual tractive force, and can utilize different layers nano-particle between Mutually support, mutually traction, on array base palte direction, offsets the pressure of opposite direction between different nanometer layers, carries The resistance to pressure of high array base palte.

Present invention also offers the preparation method of the array base palte, schematic flow sheet as shown in figure 4, including:

S30, in the backsize or perfusion glue material of the flexible substrate substrate and nano-filled thing, with the flexible liner The back side of substrate forms adhesive linkage;

Wherein, the adhesive linkage has two kinds of structures, one kind be it is at least one set of by the glue material and nano-filled nitride layer it is folded and The layer structure of composition, another is the mixed structure for being mixed and being constituted by the glue material and nano-filled thing.

The component of glue material is not limited, as long as possessing good adhesive property, and coating or perfusion are those skilled in the art The customary means of known encapsulation, will not be repeated here.

Wherein, nano-filled thing improves the compressive strength of adhesive linkage after having certain intensity, filling, linear expansion system Number reduction, the nano-particle of the stability characteristic of size, preferably material, nano-particle can it is orderly or it is unordered stack, contain The nano-particle of silicon materials is in addition to nano-particle hard, small volume in itself, heat-resisting, pressure-resistant characteristic, and material It is with low cost, save cost of manufacture.

S31, attaches the back protection film on the adhesive linkage.

Before glue application step is carried out, the front of flexible substrate substrate has been carried out making thin film transistor (TFT) film layer, steamed Plating organic luminous layer and metal electrode layer, deposition film encapsulated layer, diaphragm is attached, by flexible substrate substrate from glass substrate On remove, before back protection film is attached, gluing is carried out to the back side of flexible substrate substrate, to make adhesive linkage, carried out Flexible substrate substrate is bonding with back protection film.

Present invention also offers the Making programme schematic diagram of the layered structure of adhesive linkage, as shown in figure 5, including:S40, One layer of glue material is first coated or irrigates at the back side of the flexible substrate substrate;

One layer of glue material is first coated or irrigates at the back side of flexible substrate substrate, the component of glue material is not limited, as long as possessing good Adhesive property, the customary means of encapsulation that coating or perfusion are well known to those skilled in the art will not be repeated here.

S41, elaborates at least one layer of nano-filled thing in the glue material;

One layer or more than two layers of nano-filled thing is elaborated in above-mentioned glue material, the nano-filled thing is preferably nanoparticle Son, nano-particle can it is orderly or it is unordered stack, the loading of nano-particle is similarly less than the 10% of adhesive linkage, existing with anti-agglomeration The generation of elephant, agglomeration will cause nano-particle to lose its intrinsic excellent specific property.

S42, is coated with or irrigates one layer of glue material on the nano-filled thing;

This layer structure is except that can utilize the voltage endurance of nano-particle in itself, additionally it is possible to using between nano-particle Mutual support and mutually traction, offset same plane in different directions pressure, strengthen adhesive linkage compression resistance, control array Deformation quantity of the substrate in pressurized cooking process, improves the process yields in circuit binding procedure.

In another embodiment, the adhesive linkage includes multigroup layered structure, and making step repeats above-mentioned stratiform Step S41 and S42 in structure fabrication step.That is, if the glue material for coating or irrigating in S42 steps is named as into second layer glue material If, the nano-filled nitride layer of the second layer is elaborated on second layer glue material, similarly, the nano-filled nitride layer is received by least one layer Rice corpuscles is constituted, and the nano-filled nitride layer of third layer glue material, third layer can be coated successively, is formed glue material by that analogy and is filled out with nanometer Fill thing and intersect the sandwich construction existed.The nano-filled thing is preferably nano-particle, wherein every layer of nano-filled nitride layer is equal It can be made up of, the loading of nano-particle is similarly less than 10%, to prevent the generation of agglomeration, reunite existing multi-layer nano particle As nano-particle will be caused to lose its intrinsic excellent specific property.Similarly, this layer structure is except utilizing nano-particle in itself Intensity outside, additionally it is possible to using the mutual support between nano-particle and mutually traction, more make use of pressure between different layers Power is cancelled out each other so that adhesive linkage can bear bigger pressure.

The invention provides structural representation of the adhesive linkage for the array base palte of mixed structure, as shown in fig. 6, this kind of array The bonding Rotating fields of substrate are mixed structure, and described nano-filled thing is nano-particle, the embodiment and above-mentioned first reality The difference for applying example is essentially consisted in:Adhesive linkage for being bonded back protection film and flexible substrate substrate is mixed structure, and 505 be to receive Rice filler, 504 be glue material, and both constitute tack coat 103 together, compared with the layer structure described in embodiment one, in glue material The contact area of nano-particle and flexible substrate substrate reach, increase the supporting role of adhesive linkage, meanwhile, simplify making work Sequence, saves cost of manufacture.

Wherein, nano-filled thing can improve the compressive strength of adhesive linkage after having certain intensity, filling, linear swollen Swollen coefficient reduction, the stability of size improves feature.The preferably nano-particle of material, it is except with nano-particle sheet The hard of body, small volume, outside heat-resisting, pressure-resistant characteristic, lower cost for material can save cost of manufacture.Nanometer in adhesive linkage The loading of particle is less than the 10% of whole adhesive linkage, to prevent the generation of agglomeration, while ensure that flexible liner base Plate and glue material layer, nano-particle and glue material layer, have good adhesive property between glue material layer and back protection film.Adhesive linkage it is mixed Close structure and nano-particle, a Rotating fields are directly filled in the glue material.

The nano-particle of two layers of tiling is mixed shown in Fig. 6 in array base palte, in adhesive linkage, the nano-filled thing can be One or more layers, or be blended in the form of non-tiling in glue material.

Present invention also offers the preparation method of adhesive linkage mixed structure, i.e. by the glue material and nano-filled thing according to Default ratio mixing.The pressure adjustment that the ratio can be born according to the array base palte.

The component of the glue material is not limited, and hybrid mode is not limited, nano-particle can it is orderly or it is unordered stack, as long as can will receive Rice filler is equably mixed with glue material so that being coated with or be poured in the glue material on flexible substrate substrate can equably hold By the pressure on flexible substrate substrate.Nano-particle skewness is easily caused in heating pressure process in glue material, glue Locally there is the phenomenon of thinning depression in material, and then causes metal ion in circuit binding procedure to crimp bad or IC edges broken string The problem of.

In circuit binding procedure is carried out, using prior art, the deformation quantity of back protection film utilizes this in more than 30um The adhesive linkage provided is invented, the coefficient of expansion of adhesive linkage reduces by 50% or so, i.e. temperature and often raises 1 DEG C, the size of nano-particle Variable quantity reduces 50%, and intensity improves 10% or so.

Correspondingly, this also invention additionally provides a kind of display panel, and the display panel includes foregoing any technical scheme institute The array base palte stated;Present invention also offers a kind of display device, the display device is included described in foregoing any technical scheme Array base palte, the display device can be Electronic Paper, display panel, oled panel, mobile phone, tablet personal computer, television set, display Any product or part with display function such as device, notebook computer, DPF, navigator.

It is therefore, described because the display panel, display device are improved on the basis of the array base palte Display panel and display device the natural succession all advantages of the array base palte.

To sum up, deposited provided by the present invention for nano-filled thing in the adhesive linkage of connection back protection film and flexible base board , the support degree of adhesive linkage is improved, the intensity of adhesive linkage is improved after nano-filled thing filling, linear expansion coefficient reduction, Dimensional stability is improved, when array base palte bears larger pressure and higher temperature, by the characteristic of nano-filled thing so as to have Deformation quantity of the effect control array base palte in heating pressure process, is lifted at the technique that circuit binding is carried out on the array base palte Yield.

Although having been illustrated with some exemplary embodiments of the present invention above, those skilled in the art will manage Solution, in the case where not departing from the principle or spirit of the present invention, can make a change to these exemplary embodiments, of the invention Scope is limited by claim and its equivalent.

Claims (10)

1. a kind of array base palte, it is characterised in that including flexible substrate substrate, back protection film and adhesive linkage, the back side is protected Cuticula is mutually be bonded with the flexible substrate substrate by the adhesive linkage, the adhesive linkage include glue material and it is some be filled in it is described Nano-filled thing in glue material.
2. array base palte according to claim 1, it is characterised in that the flexible substrate substrate is plastic supporting base substrate.
3. array base palte according to claim 1, it is characterised in that the nano-filled thing is nano-particle.
4. array base palte according to claim 3, it is characterised in that some nano-particles be woven into fibre structure or Network structure.
5. array base palte according to claim 1, it is characterised in that the adhesive linkage includes being filled out by the glue material and nanometer Fill mixed structure or at least one set of stratiform knot folded and constituted by the glue material and nano-filled nitride layer that thing is mixed and constituted Structure.
6. array base palte according to claim 5, it is characterised in that layered structure includes two layers by the glue material structure Into glue material layer and one layer of packed layer being made up of the nano-filled thing, the packed layer is between two layers glue material layer.
7. a kind of preparation method of array base palte as described in any one of claim 1~6, it is characterised in that including:
Glue application step, in the backsize or perfusion glue material of the flexible substrate substrate and nano-filled thing, with the flexibility The back side of underlay substrate forms adhesive linkage;
Step is attached, the back protection film is attached on the adhesive linkage.
8. the preparation method of array base palte according to claim 7, it is characterised in that the adhesive linkage includes at least one set By the layer structure that the glue material and nano-filled nitride layer are folded to be constituted, layered structure is made up of including two layers the glue material Glue material layer and one layer of packed layer being made up of the nano-filled thing, the packed layer is between two layers glue material layer;Wherein, The glue application step is specifically included:
Step 1, first coat or irrigate one layer of glue material at the back side of the flexible substrate substrate;
Step 2, at least one layer of nano-filled thing is elaborated in the glue material;
Step 3, one layer of glue material is coated with or irrigated on the nano-filled thing;
If the adhesive linkage includes multigroup layered structure, 2 and 3 are repeated the above steps.
9. the preparation method of array base palte according to claim 7, it is characterised in that the adhesive linkage is included by the glue The mixed structure that material is mixed and constituted with nano-filled thing;Wherein, before the glue application step, in addition to:By the glue Material and nano-filled thing are mixed according to default ratio.
10. a kind of display device, it is characterised in that including the array base palte as described in any one of claim 1~6.
CN201710346889.2A 2017-05-16 2017-05-16 Array substrate, manufacturing method thereof and display device CN107154423B (en)

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Publication number Priority date Publication date Assignee Title
CN109493738A (en) * 2018-12-14 2019-03-19 云谷(固安)科技有限公司 Display screen and display equipment

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CN102104114A (en) * 2010-12-09 2011-06-22 深圳丹邦投资集团有限公司 Flexible substrate and preparation method thereof
CN103413775A (en) * 2013-07-19 2013-11-27 京东方科技集团股份有限公司 Manufacturing method and device of flexible display device
CN103715365A (en) * 2012-09-28 2014-04-09 三星显示有限公司 Organic light emitting diode display and method of manufacturing the same

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Publication number Priority date Publication date Assignee Title
CN1887972A (en) * 2006-07-14 2007-01-03 浙江大学 Nanometer SiO2 modifying process of ultraviolet ray cured adhesive
CN101436644A (en) * 2008-12-08 2009-05-20 电子科技大学 Substrate for flexible organic optoelectronic device and preparation method thereof
CN102040803A (en) * 2009-10-14 2011-05-04 住友电木株式会社 Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109493738A (en) * 2018-12-14 2019-03-19 云谷(固安)科技有限公司 Display screen and display equipment

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