CN114096054A - Flexible circuit board assembly, manufacturing method thereof and display device - Google Patents
Flexible circuit board assembly, manufacturing method thereof and display device Download PDFInfo
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- CN114096054A CN114096054A CN202111403667.2A CN202111403667A CN114096054A CN 114096054 A CN114096054 A CN 114096054A CN 202111403667 A CN202111403667 A CN 202111403667A CN 114096054 A CN114096054 A CN 114096054A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 89
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a flexible circuit board assembly, a manufacturing method thereof and a display device, and belongs to the technical field of display. Wherein, flexible circuit board subassembly includes: the conductive pattern comprises a substrate, a conductive layer and a conductive layer, wherein the substrate comprises a hollow part, and a conductive pattern is arranged in the hollow part; the first routing wire is positioned on the first surface of the substrate, an orthographic projection of the first routing wire on the substrate and the hollowed-out part have an overlapping part, and the first routing wire is in contact with the conductive pattern. The technical scheme of the invention can reduce the wiring line width of the flexible circuit board assembly.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible circuit board assembly, a manufacturing method thereof and a display device.
Background
An Organic Light-Emitting Diode (OLED) display device has the advantages of being thin, Light, wide in viewing angle, active in Emitting Light, continuously adjustable in Emitting color, low in cost, fast in response speed, low in energy consumption, low in driving voltage, wide in working temperature range, simple in production process, high in Light Emitting efficiency, flexible in display and the like, and is taken as a next generation display technology with great development prospects.
The driving integrated circuit chip (Drive IC) and the main flexible circuit board (MFPC) are used for circuit driving of the OLED display module and are generally bound and connected with the OLED display module. With the continuous development of display technology, the resolution required by a terminal is higher and higher, the power consumption of the OLED display module is increased, and in order to reduce the wiring resistance, the wiring line width of the MFPC needs to be increased, but the MFPC does not have a sufficient layout area.
Disclosure of Invention
The invention aims to provide a flexible circuit board assembly, a manufacturing method thereof and a display device, which can reduce the wiring line width of the flexible circuit board assembly.
To solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, there is provided a flexible circuit board assembly comprising:
the conductive pattern comprises a substrate, a conductive layer and a conductive layer, wherein the substrate comprises a hollow part, and a conductive pattern is arranged in the hollow part;
the first routing line is located on the first surface of the substrate, an orthographic projection of the first routing line on the substrate is overlapped with the hollow portion, and the first routing line is in contact with the conductive pattern.
In some embodiments, the conductive pattern is made of the same material as the first trace.
In some embodiments, an orthographic projection of the first trace on the substrate coincides with the hollowed-out portion.
In some embodiments, further comprising:
the second routing wire is positioned on a second surface of the substrate, the second surface is a surface opposite to the first surface, the line width of the second routing wire is smaller than that of the first routing wire, and the orthographic projection of the second routing wire on the substrate is not overlapped with that of the first routing wire on the substrate.
In some embodiments, the first trace is a power trace.
The embodiment of the invention also provides a display device which comprises a display module and the flexible circuit board assembly, wherein the flexible circuit board assembly is bound in the binding area of the display module.
The embodiment of the invention also provides a manufacturing method of the flexible circuit board assembly, which comprises the following steps:
forming a substrate comprising a hollow part, and forming a conductive pattern in the hollow part;
forming a first trace on the first surface of the substrate, wherein an orthographic projection of the first trace on the substrate and the hollowed-out part have an overlapping part, and the first trace is in contact with the conductive pattern.
In some embodiments, the manufacturing method specifically includes:
providing a flexible copper clad laminate, wherein the flexible copper clad laminate comprises a substrate, a first copper layer covering the first surface of the substrate and a second copper layer covering the second surface of the substrate;
patterning the first copper layer to form the first routing;
patterning the second copper layer to expose the second surface of the substrate;
etching the substrate from one side of the second surface to form the hollow part, wherein at least part of the first routing is exposed out of the hollow part;
and depositing a conductive material in the hollow part to form the conductive pattern.
In some embodiments, an orthographic projection of the first trace on the substrate coincides with the hollowed-out portion.
In some embodiments, the method of making further comprises:
patterning the second copper layer to form a second trace, wherein the line width of the second trace is smaller than that of the first trace, and the orthographic projection of the second trace on the substrate is not overlapped with that of the first trace on the substrate
The embodiment of the invention has the following beneficial effects:
in the above scheme, the substrate comprises the hollow part, the conductive pattern is arranged in the hollow part, the conductive pattern is in contact with the first routing wire, the resistance of the conductive structure formed by the conductive pattern and the first routing wire is smaller than that of the first routing wire, the requirement on the resistance of the routing wire can be met without increasing the line width of the first routing wire, the line width of the first routing wire can be reduced, and the layout requirement of the flexible circuit board assembly is met. In addition, when flexible circuit board subassembly and display module assembly bind, can guarantee the performance of first line of walking through the conducting pattern, reduce flexible circuit board subassembly's the risk of burning out.
Drawings
Fig. 1 and 2 are schematic routing diagrams of a flexible circuit board assembly;
FIG. 3 is a schematic structural diagram of a flexible copper clad laminate;
fig. 4-6 are schematic diagrams illustrating a flexible circuit board assembly according to an embodiment of the present invention.
Reference numerals
1 Power cord
2 second routing
31 first copper layer
32 base
33 second copper layer
4 first routing
5 conductive pattern
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, where 1 is a power line, the driving current of the display module increases with the increase of the resolution of the display module, and in order to meet the resistance requirement of the power line 1, the line width of the power line 1 is large, which results in the external dimension of the MFPC being expanded. In addition, as shown in fig. 2, when the MFPC is bonded to the display module, the bonding area is not enough, and the width of a part of the power line 1 needs to be sacrificed, so that the MFPC has a potential risk of burning.
Embodiments of the present invention provide a flexible printed circuit board assembly, a manufacturing method thereof, and a display device, which can reduce a line width of MFPC.
An embodiment of the present invention provides a flexible circuit board assembly, including:
the conductive pattern comprises a substrate, a conductive layer and a conductive layer, wherein the substrate comprises a hollow part, and a conductive pattern is arranged in the hollow part;
the first routing wire is positioned on the first surface of the substrate, an orthographic projection of the first routing wire on the substrate and the hollowed-out part have an overlapping part, and the first routing wire is in contact with the conductive pattern.
In this embodiment, the substrate includes a hollow portion, a conductive pattern is disposed in the hollow portion, the conductive pattern is in contact with the first trace, a resistance of a conductive structure formed by the conductive pattern and the first trace is smaller than a resistance of the first trace, a requirement on the resistance of the trace can be met without increasing a line width of the first trace, the line width of the first trace can be reduced, and a layout requirement of the flexible circuit board assembly is met; in addition, when flexible circuit board subassembly and display module assembly bind, can guarantee the performance of first line of walking through the conducting pattern, reduce flexible circuit board subassembly's the risk of burning out.
Further, flexible circuit board subassembly still includes the protection film of cladding in self outside, can protect first line and conductive pattern of walking.
In this embodiment, the first wire is in contact with the conductive pattern, so that the first wire is connected in parallel with the conductive pattern to form a new conductive structure, and compared with the original first wire, the resistance of the conductive structure is reduced, so that the resistance requirement on the first wire can be met without increasing the line width and the thickness of the first wire.
In this embodiment, first line of walking can be the power cord, among the correlation technique, the power cord needs transmission power signal, along with the increase of display module assembly resolution ratio, the drive current increase of display module assembly, in order to satisfy power cord 1's resistance requirement, power cord 1's linewidth needs the great that sets up, but flexible circuit board subassembly's size is limited, can reduce power cord 1's linewidth through the technical scheme of this embodiment, need not increase flexible circuit board subassembly's size. Certainly, the first routing is not limited to a power line, and may also be other routing on the flexible printed circuit board assembly, and when the layout area of other routing needs to be reduced, the line width of other routing may be reduced by using the technical scheme of this embodiment.
In this embodiment, the first trace and the conductive pattern may be made of the same material or different materials. Since copper has excellent conductivity, in this embodiment, the first trace and the conductive pattern can be made of copper.
In this embodiment, an orthographic projection of the first trace on the substrate may partially overlap the hollow portion, and preferably, the orthographic projection of the first trace on the substrate coincides with the hollow portion, so that a contact area between the first trace and the conductive pattern may be increased, and a conductive property of a conductive structure formed by the first trace and the conductive pattern is ensured. Certainly, the hollow portion is not limited to coincide with an orthographic projection of the first trace on the substrate, the area of the hollow portion may also be larger than that of the first trace, the orthographic projection of the first trace on the substrate is located in the hollow portion, and as the area of the hollow portion increases, the volume of the conductive pattern also increases, so that the resistance of the conductive structure formed by the first trace and the conductive pattern can be further reduced.
In this embodiment, as shown in fig. 6, the flexible circuit board assembly further includes:
the second trace 2 is located on a second surface of the substrate, the second surface is a surface opposite to the first surface, a line width of the second trace 2 is smaller than a line width of the first trace 4, and an orthographic projection of the second trace 2 on the substrate is not overlapped with an orthographic projection of the first trace 4 on the substrate.
In this embodiment, a second trace is further disposed on the second surface of the substrate, in order to ensure normal operation of the flexible printed circuit board assembly, an orthographic projection of the second trace 2 on the substrate is not overlapped with an orthographic projection of the first trace 4 on the substrate, and meanwhile, an orthographic projection of the second trace 2 on the substrate is not overlapped with the hollow portion, so that normal operation of the second trace is not affected by the arrangement of the hollow portion.
Of course, in the flexible circuit board assembly of this embodiment, the second surface of the substrate may also have no trace, that is, only the first trace is disposed on the first surface of the substrate.
In addition, the flexible circuit board assembly of the present embodiment may include one substrate, or may include a plurality of substrates, and at least one surface of each substrate is provided with a trace.
In a specific example, as shown in fig. 6, the flexible printed circuit board assembly includes a flexible copper clad laminate, where the flexible copper clad laminate includes a substrate, a first trace 4 located on a first surface of the substrate, and a second trace 2 located on a second surface of the substrate. The line width of the first trace 4 is greater than the line width of the second trace 2, a hollow portion is arranged in a region of the substrate corresponding to the first trace 4, a conductive material such as copper is filled in the hollow portion to form a conductive pattern 5, and the conductive pattern 5 and the first trace 4 jointly form a conductive structure with a small resistance. With both the first track 4 and the conductive pattern 5For example, the first trace has a thickness d1The thickness of the second trace is d2The thickness of the conductive pattern and the substrate is d3The line widths of the first routing line and the conductive pattern are both W according to an impedance calculation formula
If the conductive pattern is not arranged, the impedance of the first trace is
ρ is the resistivity of copper; after the conductive pattern is arranged, the impedance of the conductive structure formed by the first routing and the conductive pattern is
R1/R2＝(d1+d3)/d1With d1Is 8um, d3Is 12um for example, R1/R2＝2.5；
Therefore, after the conductive pattern is designed, the impedance of the conductive structure can be greatly reduced, and the line width of the first routing line can be reduced by at least 1 time under the condition of ensuring the same load, so that the layout of the flexible circuit board assembly is facilitated.
The embodiment of the invention also provides a display device which comprises a display module and the flexible circuit board assembly, wherein the flexible circuit board assembly is bound in the binding area of the display module.
The display device includes but is not limited to: radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. It will be appreciated by those skilled in the art that the above described configuration of the display device does not constitute a limitation of the display device, and that the display device may comprise more or less of the components described above, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: the display device comprises a television, a display, a digital photo frame, a mobile phone, a tablet personal computer and any other product or component with a display function, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
The embodiment of the invention also provides a manufacturing method of the flexible circuit board assembly, which comprises the following steps:
forming a substrate comprising a hollow-out part, and forming a conductive pattern in the hollow-out part;
forming a first trace on the first surface of the substrate, wherein an orthographic projection of the first trace on the substrate and the hollowed-out part have an overlapping part, and the first trace is in contact with the conductive pattern.
In this embodiment, the substrate includes a hollow portion, a conductive pattern is disposed in the hollow portion, the conductive pattern is in contact with the first trace, a resistance of a conductive structure formed by the conductive pattern and the first trace is smaller than a resistance of the first trace, a requirement on the resistance of the trace can be met without increasing a line width of the first trace, the line width of the first trace can be reduced, and a layout requirement of the flexible circuit board assembly is met; in addition, when flexible circuit board subassembly and display module assembly bind, can guarantee the performance of first walking the line through conductive pattern, reduce flexible circuit board subassembly's the risk of burning out.
Further, flexible circuit board subassembly still includes the protection film of cladding in self outside, can protect first line and conductive pattern of walking.
In this embodiment, the first wire is in contact with the conductive pattern, so that the first wire is connected in parallel with the conductive pattern to form a new conductive structure, and compared with the original first wire, the resistance of the conductive structure is reduced, so that the resistance requirement on the first wire can be met without increasing the line width and the thickness of the first wire.
In this embodiment, first line of walking can be the power cord, among the correlation technique, the power cord needs transmission power signal, along with the increase of display module assembly resolution ratio, the drive current increase of display module assembly, in order to satisfy power cord 1's resistance requirement, power cord 1's linewidth needs the great that sets up, but flexible circuit board subassembly's size is limited, can reduce power cord 1's linewidth through the technical scheme of this embodiment, need not increase flexible circuit board subassembly's size. Certainly, the first routing is not limited to a power line, and may also be other routing on the flexible printed circuit board assembly, and when the layout area of other routing needs to be reduced, the line width of other routing may be reduced by using the technical scheme of this embodiment.
In this embodiment, the first trace and the conductive pattern may be made of the same material or different materials. Since copper has excellent conductivity, in this embodiment, the first trace and the conductive pattern can be made of copper.
In this embodiment, an orthographic projection of the first trace on the substrate may partially overlap the hollow portion, and preferably, the orthographic projection of the first trace on the substrate coincides with the hollow portion, so that a contact area between the first trace and the conductive pattern may be increased, and a conductive property of a conductive structure formed by the first trace and the conductive pattern is ensured. Certainly, the hollow portion is not limited to coincide with an orthographic projection of the first trace on the substrate, the area of the hollow portion may also be larger than that of the first trace, the orthographic projection of the first trace on the substrate is located in the hollow portion, and as the area of the hollow portion increases, the volume of the conductive pattern also increases, so that the resistance of the conductive structure formed by the first trace and the conductive pattern can be further reduced.
In some embodiments, as shown in fig. 3 to 6, the manufacturing method specifically includes:
step 3, after the second copper layer is patterned, exposing the second surface of the substrate, and etching the substrate 32 from one side of the second surface to form the hollow portion, wherein at least part of the first trace 4 is exposed by the hollow portion; as shown in fig. 5, a hollow portion exposes all of the first traces 4, and an orthographic projection of the first traces on the substrate coincides with the hollow portion;
and 4, as shown in fig. 6, depositing a conductive material in the hollow part to form the conductive pattern 5.
In this embodiment, the line width of the conductive pattern 5 is equal to the line width of the first trace 4. When the conductive material is deposited in the hollow portion, the deposition rate and time are controlled to obtain the conductive pattern 5 having the same thickness as the substrate 32.
The conductive pattern 5 and the first trace 4 together form a conductive structure with a small resistance. Taking the first trace 4 and the conductive pattern 5 both made of copper as an example, the first trace has a thickness d1The thickness of the second trace is d2The thickness of the conductive pattern and the substrate is d3The line widths of the first routing line and the conductive pattern are both W according to an impedance calculation formula
If the conductive pattern is not arranged, the impedance of the first trace is
ρ is the resistivity of copper; after the conductive pattern is arranged, the impedance of the conductive structure formed by the first routing and the conductive pattern is
R1/R2＝(d1+d3)/d1With d1Is 8um, d3Is 12um for example, R1/R2＝2.5；
Therefore, after the conductive pattern is designed, the impedance of the conductive structure can be greatly reduced, and the line width of the first routing line can be reduced by at least 1 time under the condition of ensuring the same load, so that the layout of the flexible circuit board assembly is facilitated.
In the embodiments of the methods of the present invention, the sequence numbers of the steps are not used to limit the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative efforts.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (10)
1. A flexible circuit board assembly, comprising:
the conductive pattern comprises a substrate, a conductive layer and a conductive layer, wherein the substrate comprises a hollow part, and a conductive pattern is arranged in the hollow part;
the first routing wire is positioned on the first surface of the substrate, an orthographic projection of the first routing wire on the substrate and the hollowed-out part have an overlapping part, and the first routing wire is in contact with the conductive pattern.
2. The flexible circuit board assembly of claim 1, wherein the conductive pattern is the same material as the first trace.
3. The flexible circuit board assembly of claim 1, wherein an orthographic projection of the first trace on the substrate coincides with the hollowed-out portion.
4. The flexible circuit board assembly of claim 1, further comprising:
the second routing wire is positioned on a second surface of the substrate, the second surface is a surface opposite to the first surface, the line width of the second routing wire is smaller than that of the first routing wire, and the orthographic projection of the second routing wire on the substrate is not overlapped with that of the first routing wire on the substrate.
5. The flexible circuit board assembly of any one of claims 1-4, wherein the first trace is a power trace.
6. A display device, comprising a display module and the flexible circuit board assembly according to any one of claims 1 to 5, wherein the flexible circuit board assembly is bonded to a bonding area of the display module.
7. A method of making a flexible circuit board assembly, comprising:
forming a substrate comprising a hollow part, and forming a conductive pattern in the hollow part;
forming a first trace on the first surface of the substrate, wherein an orthographic projection of the first trace on the substrate and the hollowed-out part have an overlapping part, and the first trace is in contact with the conductive pattern.
8. The method of manufacturing a flexible circuit board assembly according to claim 7, specifically comprising:
providing a flexible copper clad laminate, wherein the flexible copper clad laminate comprises a substrate, a first copper layer covering the first surface of the substrate and a second copper layer covering the second surface of the substrate;
patterning the first copper layer to form the first routing;
patterning the second copper layer to expose the second surface of the substrate;
etching the substrate from one side of the second surface to form the hollow part, wherein at least part of the first routing is exposed out of the hollow part;
and depositing a conductive material in the hollow part to form the conductive pattern.
9. The method of claim 8, wherein an orthographic projection of the first trace on the substrate coincides with the opening.
10. The method of making a flexible circuit board assembly of claim 8, further comprising:
and patterning the second copper layer to form a second wire, wherein the line width of the second wire is smaller than that of the first wire, and the orthographic projection of the second wire on the substrate is not overlapped with that of the first wire on the substrate.
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| CN111918480A (en) * | 2020-08-17 | 2020-11-10 | 景旺电子科技(珠海)有限公司 | Manufacturing method of resistor in printed circuit board and printed circuit board |
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