CN111463245B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN111463245B CN111463245B CN202010279562.XA CN202010279562A CN111463245B CN 111463245 B CN111463245 B CN 111463245B CN 202010279562 A CN202010279562 A CN 202010279562A CN 111463245 B CN111463245 B CN 111463245B
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- 239000000758 substrate Substances 0.000 title claims abstract description 138
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 99
- 238000000059 patterning Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 126
- 239000010408 film Substances 0.000 description 18
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- 230000005611 electricity Effects 0.000 description 9
- 230000003068 static effect Effects 0.000 description 9
- 230000010354 integration Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000007648 laser printing Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0288—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0296—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices involving a specific disposition of the protective devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display substrate, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display substrate comprises a substrate and a display device positioned on the substrate, and the substrate comprises a metal antenna layer. The technical scheme of the invention can reduce the volume of the display device and lead the signals of the antenna to be more stable.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
At present, mobile phone antennas in the market are independent of other parts of mobile phones, occupy a certain volume, and cannot meet the requirement of equipment miniaturization.
Disclosure of Invention
The invention aims to solve the technical problem of providing a display substrate, a manufacturing method thereof and a display device, which can reduce the volume of the display device and enable signals of an antenna to be more stable.
In order to solve the technical problems, the embodiment of the invention provides the following technical scheme:
in one aspect, a display substrate is provided that includes a substrate including a metal antenna layer and a display device on the substrate.
In some embodiments, the substrate base further includes a first flexible base and a second flexible base respectively located at two sides of the metal antenna layer.
In some embodiments, the substrate base further comprises a first inorganic insulating layer on a side of the second flexible base remote from the metal antenna layer.
In some embodiments, the first flexible substrate has a thickness of 8-12um and the second flexible substrate has a thickness of 4-8um.
In some embodiments, the substrate base further comprises:
a third flexible substrate positioned on one side of the first inorganic insulating layer away from the metal antenna layer;
and a second inorganic insulating layer positioned on one side of the third flexible substrate away from the metal antenna layer.
In some embodiments, the display substrate includes a display area and a bonding area located at a periphery of the display area, and the metal antenna layer includes a serpentine trace located at the display area and first and second outputs connected to the serpentine trace, the first and second outputs extending from the display area to the bonding area.
The embodiment of the invention also provides a display device which comprises the display substrate.
The embodiment of the invention also provides a manufacturing method of the display substrate, which comprises the steps of forming a substrate and a display device positioned on the substrate, wherein the step of forming the substrate comprises the following steps:
forming a metal antenna layer.
In some embodiments, forming the substrate base plate comprises:
forming a first flexible substrate on a rigid carrier plate;
forming a metal layer on the first flexible substrate, and patterning the metal layer to form the metal antenna layer;
a second flexible substrate is formed overlying the metal antenna layer.
In some embodiments, forming the substrate base further comprises:
a first inorganic insulating layer is formed overlying the second flexible substrate.
The embodiment of the invention has the following beneficial effects:
in the scheme, the metal antenna layer is manufactured in the substrate, so that the plane structure of the substrate can be reasonably utilized, the use volume of the display device is effectively reduced, and the trend of integration and integration of the display device is met; in addition, the metal antenna layer is manufactured in the substrate, so that the antenna can be firmly bonded, and signals of the antenna are more stable; furthermore, the metal antenna layer is manufactured in the substrate, and the antenna is formed by metal etching or laser printing, so that the antenna has conductivity, static electricity generated in the manufacturing process of the display substrate can be effectively conducted away, and the problem of poor static electricity is avoided.
Drawings
FIGS. 1 and 2 are schematic views of a structure of a substrate according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a metal antenna layer according to an embodiment of the invention;
fig. 4 is a schematic diagram of a display device according to an embodiment of the invention.
Reference numerals
1. Substrate base
11. Metal antenna layer
12. First flexible substrate
13. Second flexible substrate
14. First inorganic insulating layer
15. Third flexible substrate
16. Second inorganic insulating layer
111. Snake-shaped wiring
2. Barrier layer
3. Buffer layer
4. First gate insulating layer
5. Second gate insulating layer
6. Interlayer insulating layer
7. Flat layer
8. Pixel defining layer
9. Light-emitting layer
10. Cathode electrode
11. Encapsulation layer
111. First inorganic film
112. Second organic film
113. Third inorganic film
15. Active layer
16. Source electrode
17. Drain electrode
18. First gate metal layer
19. Anode
20. Second gate metal layer
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more apparent, the following detailed description will be given with reference to the accompanying drawings and the specific embodiments.
An embodiment of the present invention provides a display substrate, as shown in fig. 1 to 4, comprising a substrate 1 and a display device located on the substrate 1, the substrate 1 comprising a metal antenna layer 11.
In the embodiment, the metal antenna layer is manufactured in the substrate, so that the plane structure of the substrate can be reasonably utilized, the use volume of the display device is effectively reduced, and the trend of integration and integration of the display device is met; in addition, the metal antenna layer is manufactured in the substrate, so that the antenna can be firmly bonded, and signals of the antenna are more stable; furthermore, the metal antenna layer is manufactured in the substrate, and the antenna is formed by metal etching or laser printing, so that the antenna has conductivity, static electricity generated in the manufacturing process of the display substrate can be effectively conducted away, and the problem of poor static electricity is avoided.
In some embodiments, the substrate 1 further includes a first flexible base 12 and a second flexible base 13 respectively located on two sides of the metal antenna layer 11. The metal antenna layer 11 may be manufactured by etching or laser printing, and the first flexible substrate 12 and the second flexible substrate 13 cover the metal antenna layer 11, so that the metal antenna layer 11 is firmly attached to the substrate 1.
In some embodiments, the thickness of the first flexible substrate 12 may be 8-12um, and the thickness of the second flexible substrate 13 may be 4-8um, so that the thickness of the substrate 1 is not too large, and the metal antenna layer 11 may be well protected.
In some embodiments, the substrate 1 further includes a first inorganic insulating layer 14 located on a side of the second flexible substrate 13 away from the metal antenna layer 11, where the first inorganic insulating layer 14 may ensure that the metal antenna layer 11 is not excessively bent, so as to ensure the stability and the service life of the antenna.
In some embodiments, as shown in fig. 1-2, the substrate base further includes:
the thickness of the third flexible substrate 15 is generally larger, so that the distance between the metal antenna layer 11 and the display device of the display substrate is longer, and the metal antenna layer 11 is prevented from influencing the function of the display device;
a second inorganic insulating layer 16 on a side of the third flexible substrate 15 remote from the metal antenna layer 11. The second inorganic insulating layer 16 can make the distance between the metal antenna layer 11 and the display device of the display substrate far on one hand, avoid the metal antenna layer 11 from influencing the function of the display device, and can further ensure that the metal antenna layer 11 is not excessively bent on the other hand, and ensure the use stability of the antenna.
In the embodiment, the antenna can be arranged on the whole substrate, so that the area of the antenna wiring is larger, the performance of the whole signal of the display device is improved, and the requirement of the antenna multi-frequency band product is met; on the other hand, the volume of the three-dimensional space occupied by the antenna is reduced, so that the use volume of a display device such as a mobile phone can be reduced, and the development trend of the whole mobile phone is more met; the embodiment can also enable the antenna to be fixed more firmly; thus solving the problems of poor antenna signal, instability and large occupied volume; in addition, the metal antenna layer can lead out static electricity generated in the film tearing process, so that the static electricity generated in the manufacturing process of the display substrate is eliminated, and the problem of production cost loss caused by poor static electricity in production engineering is effectively solved.
The metal antenna layer 11 can be designed into different patterns according to the needs, and the areas and the positions of the patterns can be moved according to the needs, so that the requirements of the flexible folding screen are met. In some embodiments, as shown in fig. 3, the display substrate includes a display area and a bonding area a located at a periphery of the display area, and the metal antenna layer includes a serpentine trace 111 located at the display area, and a first output terminal and a second output terminal connected to the serpentine trace 111, where the first output terminal and the second output terminal extend from the display area to the bonding area a.
The first output end and the second output end can adopt nanoscale metal wires, so that the display of the display substrate is not affected, the serpentine wire 111 extends from the display area to the binding area A through the first output end and the second output end, and then the serpentine wire can be bound and connected with the flexible circuit board FPC through the binding area A.
In order not to affect the display of the display substrate, the serpentine trace 111 may also use a metal wire with a nano-scale, that is, a metal wire with a line width of nano-scale, and specifically, the line width of the metal wire may be 20-500nm.
The embodiment of the invention also provides a display device which comprises the display substrate.
The display device includes, but is not limited to: the system comprises a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply and the like. It will be appreciated by those skilled in the art that the structure of the display device described above is not limiting of the display device, and that the display device may include more or less components described above, or may be combined with certain components, or may have different arrangements of components. In an embodiment of the invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: any product or component with display function such as a television, a display, a digital photo frame, a mobile phone, a tablet computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a backboard.
In a specific example, as shown in fig. 4, the display device includes:
a substrate base plate 1, the substrate base plate 1 including a metal antenna layer 11;
a barrier layer 2;
the buffer layer 3 is positioned on the barrier layer 2, the buffer layer 3 can adopt silicon nitride or silicon oxide, and also can adopt a double-layer structure consisting of a silicon nitride film and a silicon oxide film, wherein the thickness of the silicon nitride film can be 50-300nm, and the thickness of the silicon oxide film can be 100-300nm;
the active layer 15 is positioned on the buffer layer 3, the active layer 15 can be made of polysilicon, and the thickness of the active layer 15 can be 40-50nm;
the first gate insulating layer 4 is located at one side of the active layer 15 far from the substrate 1, the first gate insulating layer 4 can adopt silicon nitride or silicon oxide, and can also adopt a double-layer structure composed of a silicon nitride film and a silicon oxide film, wherein the thickness of the silicon nitride film can be 100-500nm, and the thickness of the silicon oxide film can be 400-1000nm;
a pattern of a first gate metal layer 18 on the first gate insulating layer 4, the pattern of the first gate metal layer 18 including a gate electrode and a gate line, and may further include a plate of a storage capacitor;
the second gate insulating layer 5 is positioned on one side of the first gate metal layer 18 far away from the substrate 1, and the second gate insulating layer 5 can be silicon nitride or silicon oxide, and can be a silicon nitride film with the thickness of 100-150 nm;
a pattern of a second gate metal layer 20 on the second gate insulating layer 5, the pattern of the second gate metal layer 20 including a plate of a storage capacitor, the pattern of the second gate metal layer 20 being capable of forming the storage capacitor with the pattern of the first gate metal layer 18;
the interlayer insulating layer 6 is positioned on one side of the second gate metal layer 20 far away from the substrate 1, the interlayer insulating layer 6 can adopt silicon nitride or silicon oxide, and can also adopt a double-layer structure consisting of a silicon nitride film and a silicon oxide film, wherein the thickness of the silicon nitride film can be 200-300nm, and the thickness of the silicon oxide film can be 150-200nm;
a pattern of a source-drain metal layer on the interlayer insulating layer 6, the pattern of the source-drain metal layer including a source electrode 16 and a drain electrode 17;
a flat layer 7 positioned on one side of the pattern of the source-drain metal layer away from the substrate 1;
an anode 19 on the planarization layer 7, the anode 19 being connected to the drain electrode 17 through a via penetrating the planarization layer 7;
a pixel defining layer 8 located on a side of the anode 19 remote from the substrate 1;
a light-emitting layer 9 located on a side of the anode 19 remote from the substrate 1;
a cathode 10 located on a side of the light-emitting layer 9 remote from the substrate 1;
the encapsulation layer 11 located at a side of the cathode 10 remote from the substrate 1, the encapsulation layer 11 may specifically include a first inorganic thin film 111, a second organic thin film 112, and a third inorganic thin film 113 that are stacked.
The embodiment of the invention also provides a manufacturing method of the display substrate, which comprises the steps of forming a substrate and a display device positioned on the substrate, wherein the step of forming the substrate comprises the following steps:
forming a metal antenna layer.
In the embodiment, the metal antenna layer is manufactured in the substrate, so that the plane structure of the substrate can be reasonably utilized, the use volume of the display device is effectively reduced, and the trend of integration and integration of the display device is met; in addition, the metal antenna layer is manufactured in the substrate, so that the antenna can be firmly bonded, and signals of the antenna are more stable; furthermore, the metal antenna layer is manufactured in the substrate, and the antenna is formed by metal etching or laser printing, so that the antenna has conductivity, static electricity generated in the manufacturing process of the display substrate can be effectively conducted away, and the problem of poor static electricity is avoided.
In some embodiments, forming the substrate base plate comprises:
forming a first flexible substrate 12 on a rigid carrier plate;
forming a metal layer on the first flexible substrate 12, patterning the metal layer to form the metal antenna layer 11, where the metal antenna layer 11 may be made by etching or laser printing;
a second flexible substrate 13 is formed covering the metal antenna layer 11.
The first flexible substrate 12 and the second flexible substrate 13 are coated with the metal antenna layer 11, so that the metal antenna layer 11 is firmly attached to the substrate 1, and the problem that the use is affected due to the fact that the antenna is not firm is prevented. The thickness of the first flexible substrate 12 may be 8-12um and the thickness of the second flexible substrate 13 may be 4-8um.
In some embodiments, forming the substrate base further comprises:
the first inorganic insulating layer 14 is formed to cover the second flexible substrate, and the first inorganic insulating layer 14 can ensure that the metal antenna layer 11 is not excessively bent, and ensure the stability and life of the antenna.
In some embodiments, forming the substrate base further comprises:
a third flexible substrate 15 is formed on the side, far away from the metal antenna layer 11, of the first inorganic insulating layer 14, and the thickness of the third flexible substrate 15 is generally larger, so that the distance between the metal antenna layer 11 and the display device of the display substrate is longer, and the metal antenna layer 11 is prevented from affecting the functions of the display device;
a second inorganic insulating layer 16 is formed on a side of the third flexible substrate 15 remote from the metal antenna layer 11. The second inorganic insulating layer 16 can make the distance between the metal antenna layer 11 and the display device of the display substrate far on one hand, avoid the metal antenna layer 11 from influencing the function of the display device, and can further ensure that the metal antenna layer 11 is not excessively bent on the other hand, and ensure the use stability of the antenna.
The metal antenna layer 11 can be designed into different patterns according to the needs, and the areas and the positions of the patterns can be moved according to the needs, so that the requirements of the flexible folding screen are met. In some embodiments, as shown in fig. 3, the display substrate includes a display area and a bonding area a located at a periphery of the display area, and the metal antenna layer includes a serpentine trace 111 located at the display area, and a first output terminal and a second output terminal connected to the serpentine trace 111, where the first output terminal and the second output terminal extend from the display area to the bonding area a.
The first output end and the second output end can adopt nanoscale metal wires, so that the display of the display substrate is not affected, the serpentine wire 111 extends from the display area to the binding area A through the first output end and the second output end, and then the serpentine wire can be bound and connected with the flexible circuit board FPC through the binding area A.
In order not to affect the display of the display substrate, the serpentine trace 111 may also use a metal wire with a nano-scale, that is, a metal wire with a line width of nano-scale, and specifically, the line width of the metal wire may be 20-500nm.
In this specification, all embodiments are described in a progressive manner, and identical and similar parts of the embodiments are all referred to each other, and each embodiment is mainly described in a different way from other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is relatively simple, and the relevant points are found in the section of the product embodiments.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the disclosure, and it is intended to cover the scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (4)
1. A display substrate, characterized by comprising a substrate and a display device positioned on the substrate, wherein the substrate comprises a metal antenna layer, and the metal antenna layer is distributed on the whole substrate;
the substrate base plate also comprises a first flexible base and a second flexible base which are respectively positioned at two sides of the metal antenna layer;
the substrate base plate further comprises a first inorganic insulating layer positioned on one side of the second flexible base away from the metal antenna layer;
a third flexible substrate positioned on one side of the first inorganic insulating layer away from the metal antenna layer;
a second inorganic insulating layer located on a side of the third flexible substrate remote from the metal antenna layer;
the display substrate comprises a display area and a binding area positioned at the periphery of the display area, the metal antenna layer comprises a snake-shaped wiring positioned in the display area, a first output end and a second output end, the first output end and the second output end are connected with the snake-shaped wiring, the first output end and the second output end extend from the display area to the binding area, and the line width of the snake-shaped wiring is 20-500nm.
2. The display substrate of claim 1, wherein the first flexible substrate has a thickness of 8-12um and the second flexible substrate has a thickness of 4-8um.
3. A display device comprising the display substrate according to any one of claims 1-2.
4. A method of fabricating a display substrate, comprising forming a substrate and a display device on the substrate, the forming the substrate comprising:
forming a metal antenna layer, wherein the metal antenna layer is distributed on the whole substrate;
forming the substrate base plate comprises:
forming a first flexible substrate on a rigid carrier plate;
forming a metal layer on the first flexible substrate, and patterning the metal layer to form the metal antenna layer;
forming a second flexible substrate covering the metal antenna layer;
forming the substrate base plate further comprises:
forming a first inorganic insulating layer covering the second flexible substrate;
forming a third flexible substrate positioned on one side of the first inorganic insulating layer away from the metal antenna layer;
forming a second inorganic insulating layer on a side of the third flexible substrate away from the metal antenna layer;
the display substrate comprises a display area and a binding area positioned at the periphery of the display area, the metal antenna layer comprises a snake-shaped wiring positioned in the display area, and a first output end and a second output end which are connected with the snake-shaped wiring, the first output end and the second output end extend from the display area to the binding area, and the line width of the snake-shaped wiring is 20-500nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010279562.XA CN111463245B (en) | 2020-04-10 | 2020-04-10 | Display substrate, manufacturing method thereof and display device |
Applications Claiming Priority (1)
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