CN114093953B - Optical Module - Google Patents
Optical Module Download PDFInfo
- Publication number
- CN114093953B CN114093953B CN202011378720.3A CN202011378720A CN114093953B CN 114093953 B CN114093953 B CN 114093953B CN 202011378720 A CN202011378720 A CN 202011378720A CN 114093953 B CN114093953 B CN 114093953B
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- wiring
- signal
- differential
- flexible substrate
- ground
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- 230000003287 optical effect Effects 0.000 title claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000005452 bending Methods 0.000 claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Structure Of Printed Boards (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
The invention provides an optical module, which aims to realize good high-frequency characteristics. The optical module (100) has: an integrated circuit chip (60) capable of outputting a pair of differential signals; a printed circuit board (56) provided with a first differential wiring (62) and a second differential wiring (64); a flexible substrate (16) provided with a first signal wiring (22), a second signal wiring (24), a ground plane (42), and a ground wiring (36); a termination resistor (40) connected in series between the second signal wiring and the ground wiring, the termination resistor having an impedance of 45% to 55% of the differential impedance of the integrated circuit chip; and an optical auxiliary unit (10) having a function of converting an electrical signal into an optical signal in a single-ended manner, and connected to the first signal wiring. The flexible substrate includes a confinement region (54) that is confined to bending by overlapping and securing with the light assist assembly. The termination resistor is mounted on a limited region of the flexible substrate.
Description
Technical Field
The present invention relates to an optical module.
Background
With the recent spread of broadband networks, optical modules have become faster, smaller, and lower in cost. To cope with the high speed, it is necessary to transmit high-speed electric signals of the order of 50 Gbit/s.
Prior art literature
Patent document 1: japanese patent application laid-open No. 2004-247980
Patent document 2: japanese patent application laid-open No. 2012-244229
In the transmission of an electric signal of a single-ended system, it is difficult to achieve good high-frequency characteristics, but nevertheless, input of a single-ended signal is sometimes required. Patent document 1 discloses an improved ground reinforcement of a connection portion based on a PCB (printed circuit board) and an FPC (FlexiblePrintedCircuits: flexible printed circuit), but requires a complicated ground design. Patent document 2 discloses achieving low crosstalk characteristics, but discloses only a circuit.
Disclosure of Invention
The purpose of the present invention is to achieve good high-frequency characteristics.
(1) The optical module of the present invention is characterized by comprising: an integrated circuit chip capable of outputting a pair of differential signals; a printed circuit board having a first differential wiring and a second differential wiring on which the integrated circuit chip is mounted and which are used for transmitting the pair of differential signals, respectively; a flexible substrate having a first signal wiring having one end connected to the first differential wiring, a second signal wiring having one end connected to the second differential wiring, and a ground plane and a ground wiring connected to the ground plane; a termination resistor mounted on the flexible substrate, connected in series between the second signal wiring and the ground wiring, and having an impedance of 45% to 55% of the differential impedance of the differential signal output section of the integrated circuit chip; and an optical auxiliary module having a function of converting an electric signal into an optical signal in a single-ended manner, the optical auxiliary module being connected to the first signal wiring so that one of the pair of differential signals can be inputted, wherein the flexible substrate includes a restriction region in which bending is restricted by overlapping and fixing the optical auxiliary module, and the termination resistor is mounted on the restriction region of the flexible substrate.
According to the present invention, the electrical signal input to the optical auxiliary assembly is one of a pair of differential signals, and the pair of differential signals is transmitted through the flexible substrate. Therefore, since noise immunity is strong and attenuation of the signal is small, good high-frequency characteristics can be achieved.
(2) In the optical module according to (1), the flexible substrate and the light assist member may be fixed by a fixing material at a plurality of positions, and the limited region may include a region between the plurality of positions.
(3) The optical module of (2) wherein the fixing material is interposed between the ground plane and the optical auxiliary component.
(4) The optical module according to (3), wherein the fixing material is solder, and the ground plane and the optical auxiliary component are electrically connected.
(5) The optical module according to any one of (1) to (4), wherein the flexible substrate has an insulating film, the first signal wiring, the second signal wiring, and the ground wiring are located on a first surface of the insulating film, the ground plane is located on a second surface opposite to the first surface, and the ground wiring and the ground plane are connected to each other through the insulating film.
(6) The optical module according to any one of (1) to (5), wherein the flexible substrate includes: a pair of ground terminals connected to the ground plane; and a signal terminal located between the pair of ground terminals and at the one end of each of the first signal wiring and the second signal wiring.
(7) The optical module according to any one of (1) to (6), wherein the second signal wiring is bent and terminated in a direction away from the first signal wiring, and is connected to the termination resistor.
(8) The optical module according to any one of (1) to (7), wherein the first signal wiring and the second signal wiring have parallel transmission portions extending parallel to each other and curved transmission portions separated from each other as compared with the parallel transmission portions, and the curved transmission portions have a width larger than that of the parallel transmission portions.
Drawings
Fig. 1 is a perspective view of an optical module according to an embodiment.
Fig. 2 is a plan view of the flexible substrate on which the light assist module is mounted, as viewed from the right side of fig. 1.
Fig. 3 is a plan view of the flexible substrate on which the light assist module is mounted, as viewed from the left side of fig. 1.
Fig. 4 is a perspective view showing a connection portion between the flexible substrate and the printed circuit board.
Fig. 5 is a diagram showing frequency characteristics obtained by simulation using a three-dimensional electric field analysis tool.
Detailed Description
Hereinafter, embodiments of the present invention will be specifically and specifically described with reference to the accompanying drawings. In all the drawings, the same or equivalent functions are provided by the members denoted by the same reference numerals, and repetitive description thereof will be omitted. In addition, the size of the pattern is not necessarily consistent with the magnification.
Fig. 1 is a perspective view of an optical module according to an embodiment. The light module 100 has a light assist assembly 10. The optical auxiliary module 10 is a TO-CAN (Transistor Outline-CAN) type package, and may be any of a transmission optical auxiliary module (TOSA: TRANSMITTER OPTICALSUB-Assembly) having a built-in light emitting element, and a bidirectional optical auxiliary module (BOSA; bidirectionalOpticalSub-Assembly) having both a built-in light emitting element and a light receiving element.
The optical assist module 10 employs PAM4 (4-value pulse amplitude modulation) as a modulation scheme, and realizes a communication speed of 100Gbit/s at a modulation speed of 50 Gbit/s. The light emitting element capable of such modulation is limited to an EA modulator integrated semiconductor laser (EML; electro-absorption Modulator INTEGRATED LASER Diode) in which an Electro-absorption modulator (Electro-absorption modulator) is integrated in a distributed feedback laser (DistributedFeedback Laser).
Since the EML is common to the laser (light source) and the cathode electrode of the modulator, when a differential signal is input to the driving of the modulator, a high-frequency signal enters the laser from the cathode electrode, and the waveform quality is degraded. Thus, a single-ended signal input is required for the modulator. The optical auxiliary assembly 10 has a function of converting an electrical signal into an optical signal in a single-ended manner.
The light assist assembly 10 has a conductive block 12 (e.g., an eyelet). The conductive block 12 is connected to ground (reference potential). The light assist assembly 10 has a plurality of pins 14 extending through the conductive block 12. The pins 14 include a signal pin 14S to which an electric signal is input, a ground pin 14G connected to ground, and a power supply pin 14P. The light assist assembly 10 is mounted on a flexible substrate 16.
Fig. 2 is a plan view of the flexible substrate 16 on which the light assist module 10 is mounted, as viewed from the right side of fig. 1. Fig. 3 is a plan view of the flexible substrate 16 on which the light assist module 10 is mounted, as viewed from the left side of fig. 1. The optical module 100 has a flexible substrate 16.
The flexible substrate 16 has an insulating film 18. The flexible substrate 16 includes a first signal wiring 22 and a second signal wiring 24 on the first surface 20. The first signal wiring 22 and the second signal wiring 24 have parallel transmission portions 26 extending parallel to each other. The first signal wiring 22 and the second signal wiring 24 have curved transmission portions 28 that extend in a curved manner so as to be separated from each other than the parallel transmission portions 26.
The pair of curved conveying sections 28 are separated from each other as compared to the pair of parallel conveying sections 26. On the other hand, the width of the curved conveying section 28 (e.g., 95 μm) is greater than the width of the parallel conveying section 26 (e.g., 80 μm). Thus, the mismatch of the differential impedance due to the difference in the interval is compensated for by the difference in the width. That is, the differential impedance is uniform in both the parallel transmission section 26 and the curved transmission section 28 in the first signal wiring 22 and the second signal wiring 24.
The first signal wiring 22 and the second signal wiring 24 each include a signal terminal 30 at one end. The signal terminals 30 are connected by the through holes 30T to be located on both the first surface 20 and the second surface 32. The first signal wiring 22 includes a signal pad 34 at the other end, through which the signal pin 14S passes and is bonded. The second signal wiring 24 is bent in a direction away from the first signal wiring 22 and terminates.
The flexible substrate 16 is provided with a ground wiring 36 on the first surface 20. The ground wiring 36 has one end at a position spaced apart from the second signal wiring 24. The ground wiring 36 includes a ground pad 38 connected to the ground pin 14G at the other end. The width of the ground wiring 36 is larger than the widths of the first signal wiring 22 and the second signal wiring 24.
A termination resistor 40 is connected in series between the second signal wiring 24 and the ground wiring 36. The bonding of the termination resistor 40 uses solder. The termination resistor 40 is mounted on the flexible substrate 16. The termination resistor 40 has an impedance (for example, 45 to 55Ω) of 45% to 55% of the differential impedance (for example, 100deg.OMEGA) of the differential signal output section of the integrated circuit chip 60.
The flexible substrate 16 is provided with a ground plane 42 at a second face 32 opposite the first face 20. The ground plane 42 penetrates the insulating film 18 and is connected to the ground wiring 36. A via 42T is used in the connection. The flexible substrate 16 is provided with a pair of ground terminals 44 connected to the ground plane 42. The ground terminal 44 is connected to both the first surface 20 and the second surface 32 via a through hole 44T. The first surface 20 and the second surface 32 each have a signal terminal 30 of the first signal wiring 22 and the second signal wiring 24 between a pair of ground terminals 44.
The flexible substrate 16 includes power supply lines 46 on both sides in the width direction orthogonal to the direction in which the first signal lines 22 and the second signal lines 24 extend. Between the pair of power supply lines 46 are the first and second signal lines 22, 24 and the ground plane 42. The power supply wiring 46 includes a high potential wiring 46A and a low potential wiring 46B. The high-potential wiring 46A and the low-potential wiring 46B have terminals 48A and 48B at one end and pads 50A and 50B at the other end, respectively. The power supply pins 14P are connected to the pads 50A and 50B so as to pass through them.
The flexible substrate 16 and the light assist assembly 10 are secured at a plurality of locations by a securing material 52. The fixing material 52 is interposed between the ground plane 42 and the light assisting component 10. The fixing material 52 is solder, electrically connecting the ground plane 42 and the light assist assembly 10.
The flexible substrate 16 includes a confinement region 54 that is confined to bending by overlapping and securing with the light assist assembly 10. The confinement region 54 includes a region between a plurality of sites secured by the securing material 52. The pins 14 are also located in the confinement region 54. The leads 14 are secured to the flexible substrate 16 by solder. The termination resistor 40 is mounted on the limiting region 54 of the flexible substrate 16. Therefore, breakage and poor bonding of the termination resistor 40 due to bending of the flexible substrate 16 can be prevented.
As shown in fig. 1, the flexible substrate 16 is connected to a printed substrate 56. The optical module 100 has a printed substrate 56. An integrated circuit chip 60 is mounted on the printed board 56. The integrated circuit chip 60 can output a pair of differential signals in accordance with the differential scheme.
Fig. 4 is a perspective view showing a connection portion between the flexible board 16 and the printed board 56. The printed circuit board 56 includes a first differential wiring 62 and a second differential wiring 64 for transmitting a pair of differential signals, respectively. The printed board 56 includes a pair of ground electrodes 55 sandwiching the first differential wiring 62 and the second differential wiring 64. The printed board 56 has an inner layer ground 58 connected to a pair of ground electrodes 55.
One end (signal terminal 30) of the first signal wiring 22 is connected to the first differential wiring 62. One end (signal terminal 30) of the second signal wiring 24 is connected to the second differential wiring 64. The pair of ground terminals 44 is connected to the pair of ground electrodes 55. A pair of differential signals output from the integrated circuit chip 60 are transferred along the first signal wiring 22 and the second signal wiring 24 of the flexible substrate 16. A pair of differential signals is transmitted differentially from the integrated circuit chip 60 to the first signal wiring 22 and the second signal wiring 24 via the first differential wiring 62 and the second differential wiring 64.
Fig. 5 is a diagram showing frequency characteristics obtained by simulation using a three-dimensional electric field analysis tool. In the transfer characteristic, it is known that the differential signal is superior to the single-ended signal.
The optical auxiliary module 10 can input one differential signal from the first signal line 22. On the other hand, the energy of the differential signal of the other party transmitted along the second signal wiring 24 is consumed by the termination resistor 40. Therefore, the high-frequency signal does not enter the cathode electrode (not shown) of the light assist module 10.
According to the present embodiment, the optical auxiliary module 10 requires single-ended signal input, but the flexible substrate 16 can transmit signals with high noise resistance and low attenuation, and thus can realize good high-frequency characteristics.
The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the structures described in the embodiments may be replaced with substantially the same structure, a structure that functions and effects the same, or a structure that achieves the same object.
Symbol description
The optical auxiliary component, 12, conductive block, 14G, ground pin, 14P, power pin, 14S, signal pin, 16, flexible substrate, 18, insulating film, 20, first side, 22, first signal wiring, 24, second signal wiring, 26, parallel transfer section, 28, flex transfer section, 30, signal terminal, 30T, via, 32, second side, 34, signal pad, 36, ground wiring, 38, ground pad, 40, termination resistor, 42, ground plane, 42T, via, 44, ground terminal, 44T, via, 46, power wiring, 46A, high potential wiring, 46B, low potential wiring, 48A, 48B, 50A, 50B, pad, 52, anchor, 54, confinement region, 55, ground electrode, 56, printed substrate, 58, inner ground, 60, integrated circuit chip, 62, first differential wiring, 64, second differential wiring, 100, optical module.
Claims (8)
1. An optical module, characterized in that,
The device comprises:
an integrated circuit chip capable of outputting a pair of differential signals;
A printed circuit board on which the integrated circuit chip is mounted, the printed circuit board including a first differential wiring and a second differential wiring for transmitting the pair of differential signals, respectively;
a flexible substrate having a first signal wiring having one end connected to the first differential wiring, a second signal wiring having one end connected to the second differential wiring, and a ground plane and a ground wiring connected to the ground plane;
a termination resistor mounted on the flexible substrate and connected in series between the second signal wiring and the ground wiring, the termination resistor having an impedance of 45% or more and 55% or less of a differential impedance of a differential signal output section of the integrated circuit chip; and
An optical auxiliary unit having a function of converting an electric signal into an optical signal in a single-ended manner, connected to the first signal wiring, and capable of inputting one of the pair of differential signals,
The flexible substrate includes a confinement region that is confined to bending by overlapping and fixing with the light assist assembly,
The termination resistor is mounted on the limited region of the flexible substrate.
2. An optical module as claimed in claim 1, characterized in that,
The flexible substrate and the light assisting component are fixed by fixing materials at a plurality of positions,
The confinement region includes a region between the plurality of sites.
3. An optical module as claimed in claim 2, characterized in that,
The fixing material is interposed between the ground plane and the light assisting component.
4. An optical module as claimed in claim 3, characterized in that,
The fixing material is solder, and electrically connects the ground plane and the light auxiliary component.
5. An optical module as claimed in any one of claims 1 to 4, characterized in that,
The flexible substrate is provided with an insulating film,
The first signal wiring, the second signal wiring, and the ground wiring are located on the first surface of the insulating film,
The ground plane is located on a second face opposite the first face,
The ground wiring and the ground plane are connected to each other through the insulating film.
6. An optical module as claimed in any one of claims 1 to 4, characterized in that,
The flexible substrate includes: a pair of ground terminals connected to the ground plane; and a signal terminal located between the pair of ground terminals and at the one end of each of the first signal wiring and the second signal wiring.
7. An optical module as claimed in any one of claims 1 to 4, characterized in that,
The second signal wiring is bent to terminate in a direction away from the first signal wiring, and is connected to the termination resistor.
8. An optical module as claimed in any one of claims 1 to 4, characterized in that,
The first signal wiring and the second signal wiring have parallel transmission parts extending parallel to each other and curved transmission parts separated from each other compared with the parallel transmission parts,
The curved conveying section has a width greater than that of the parallel conveying section.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-128117 | 2020-07-29 | ||
| JP2020128117A JP7474145B2 (en) | 2020-07-29 | 2020-07-29 | Optical Modules |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114093953A CN114093953A (en) | 2022-02-25 |
| CN114093953B true CN114093953B (en) | 2024-05-28 |
Family
ID=80264557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011378720.3A Active CN114093953B (en) | 2020-07-29 | 2020-11-30 | Optical Module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7474145B2 (en) |
| CN (1) | CN114093953B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003249711A (en) * | 2002-02-26 | 2003-09-05 | Opnext Japan Inc | Optical communication module |
| JP2004363360A (en) * | 2003-06-05 | 2004-12-24 | Mitsubishi Electric Corp | Optical transmitting and receiving module |
| JP2006013202A (en) * | 2004-06-28 | 2006-01-12 | Mitsubishi Electric Corp | Optical module |
| JP2009266903A (en) * | 2008-04-22 | 2009-11-12 | Opnext Japan Inc | Optical communication module and flexible printed board |
| JP2012047823A (en) * | 2010-08-24 | 2012-03-08 | Opnext Japan Inc | Optical module and high frequency module |
| JP2012244229A (en) * | 2011-05-16 | 2012-12-10 | Mitsubishi Electric Corp | Optical transceiver |
| JP2016184091A (en) * | 2015-03-26 | 2016-10-20 | 日本オクラロ株式会社 | Optical module |
| CN106887471A (en) * | 2015-12-11 | 2017-06-23 | 日本奥兰若株式会社 | Optical module |
| JP2019046922A (en) * | 2017-08-31 | 2019-03-22 | 日本オクラロ株式会社 | Optical module and optical transmission device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011052141A1 (en) | 2009-10-29 | 2011-05-05 | パナソニック株式会社 | Data transmission system |
| JP6430160B2 (en) | 2014-07-07 | 2018-11-28 | 日本オクラロ株式会社 | Optical module and optical module manufacturing method |
| JP6497980B2 (en) | 2015-03-04 | 2019-04-10 | 日本オクラロ株式会社 | Optical transmission module and optical transmission / reception module |
| JP6914034B2 (en) | 2016-12-16 | 2021-08-04 | 日本ルメンタム株式会社 | Optical module and transmission equipment |
-
2020
- 2020-07-29 JP JP2020128117A patent/JP7474145B2/en active Active
- 2020-11-30 CN CN202011378720.3A patent/CN114093953B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003249711A (en) * | 2002-02-26 | 2003-09-05 | Opnext Japan Inc | Optical communication module |
| JP2004363360A (en) * | 2003-06-05 | 2004-12-24 | Mitsubishi Electric Corp | Optical transmitting and receiving module |
| JP2006013202A (en) * | 2004-06-28 | 2006-01-12 | Mitsubishi Electric Corp | Optical module |
| JP2009266903A (en) * | 2008-04-22 | 2009-11-12 | Opnext Japan Inc | Optical communication module and flexible printed board |
| JP2012047823A (en) * | 2010-08-24 | 2012-03-08 | Opnext Japan Inc | Optical module and high frequency module |
| JP2012244229A (en) * | 2011-05-16 | 2012-12-10 | Mitsubishi Electric Corp | Optical transceiver |
| JP2016184091A (en) * | 2015-03-26 | 2016-10-20 | 日本オクラロ株式会社 | Optical module |
| CN106887471A (en) * | 2015-12-11 | 2017-06-23 | 日本奥兰若株式会社 | Optical module |
| JP2019046922A (en) * | 2017-08-31 | 2019-03-22 | 日本オクラロ株式会社 | Optical module and optical transmission device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114093953A (en) | 2022-02-25 |
| JP7474145B2 (en) | 2024-04-24 |
| JP2022025345A (en) | 2022-02-10 |
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