CN114093780B - Integrated circuit's encapsulation processing equipment - Google Patents
Integrated circuit's encapsulation processing equipment Download PDFInfo
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- CN114093780B CN114093780B CN202111390683.2A CN202111390683A CN114093780B CN 114093780 B CN114093780 B CN 114093780B CN 202111390683 A CN202111390683 A CN 202111390683A CN 114093780 B CN114093780 B CN 114093780B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7815—Means for applying permanent coating, e.g. in-situ coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses integrated circuit packaging processing equipment, which belongs to the technical field of packaging and comprises a working frame, wherein the lower surface of the inner wall of the working frame is fixedly connected with the bottom end of a supporting frame, the top end of the supporting frame is fixedly connected with the lower surface of a placing plate, and the lower surface of the placing plate is fixedly connected with the top ends of two guide rods. This integrated circuit's encapsulation processing equipment, through setting up the rubber coating head, a pressing plate, the contact plate, the pressure frame, second screw thread post, second screw cap, the orifice plate with place the board, accomplish the back of buckling when the pin, control first electronic hydraulic stem stop work, this device can fix a position the chip position, avoid the chip to appear sliding at will, can adjust the orifice plate position according to chip and pin position simultaneously, guarantee rubber coating point and pin position and correspond, avoid the pin bending process the condition that the perk of the pin other end or float to appear, guarantee that the suitability and the processing effect of this device are more ideal.
Description
Technical Field
The invention belongs to the technical field of packaging, and particularly relates to packaging processing equipment for an integrated circuit.
Background
Packaging is a process of assembling an integrated circuit into a chip final product, in short, an integrated circuit bare chip produced by a foundry is placed on a substrate which plays a bearing role, pins are led out, and then the integrated circuit bare chip is fixedly packaged into a whole.
In the integrated circuit packaging process, the chip is required to be connected with the pins through the metal wire and the conductive adhesive, the conductive adhesive is mostly coated at a fixed position in the coating process, the adjustment of coating points can not be carried out according to the positions of pins of the chip, the pins of the integrated circuit packaging generally adopt the metal pins, and part of the pins are required to be bent, but the pins are directly pressed to be bent, one part of the metal pins can be upwarped and floated by the other part of the metal pins after being pressed, so that gaps or floating can occur between the pins and the conductive adhesive, the metal pins can be different in length after being bonded, the pins are required to be subsequently cut off, more time is consumed in operation, and the overall service performance is influenced.
Disclosure of Invention
Technical problem to be solved
In order to overcome the defects in the prior art, the invention provides packaging processing equipment for an integrated circuit, which solves the problems that the coating position of conductive adhesive cannot be adjusted according to the positions of a chip and pins, gaps or floating between the pins and the conductive adhesive are easy to appear when the pins are bent, and the pins are required to be cut off again subsequently if the pins are not uniform in leakage length, so that the operation is complicated and the time is consumed.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an integrated circuit's encapsulation processing equipment, includes the work frame, the lower surface of work frame inner wall and the bottom fixed connection of support frame, the top of support frame and the lower fixed surface who places the board are connected, the lower surface of placing the board and the top fixed connection of two guide bars, the bottom of guide bar and the lower fixed surface of work frame inner wall are connected, the surface of guide bar is provided with the uide bushing, the surface of uide bushing is provided with the diaphragm.
The upper surface of diaphragm is provided with first screw cap, be provided with first screw thread post in the first screw cap, the right flank of first screw cap is provided with the carriage, the right flank of carriage is provided with cutting assembly, the left and right sides face of work frame inner wall all is provided with the fixed plate, the lower surface of fixed plate is provided with first electronic hydraulic stem, two the bottom and the same last fixed surface who presses the frame of first electronic hydraulic stem are connected, the guide way has all been seted up to the left and right sides face of pressing the frame inner wall, the guide way inner wall is provided with elastic component.
The surface of elastic component is provided with the mount, the lower surface of mount is provided with the clamp plate, two the opposite face fixed connection of clamp plate, the connecting hole has been seted up to the lower surface of clamp plate, the spout has all been seted up to the left and right sides face of connecting hole inner wall, be provided with two sliders in the spout, the left and right sides the opposite face of slider respectively with the left and right sides face fixed connection of small opening board, the upper surface of work frame inner wall and the top fixed connection of two electronic hydraulic stems of second, two the bottom of electronic hydraulic stem of second is connected with the upper surface fixed connection of same carriage, the lower surface joint of carriage has the rubber coating head, the rubber coating head communicates with the coupling pump mutually.
As a further scheme of the invention: the elastic component comprises a sliding rod, the two ends of the sliding rod are respectively fixedly connected with the upper surface of the inner wall of the guide groove and the lower surface of the inner wall of the guide groove, a sliding sleeve is arranged on the outer surface of the sliding rod, a first spring is arranged on the outer surface of the sliding rod, the two ends of the first spring are respectively fixedly connected with the upper surface of the inner wall of the guide groove and the upper surface of the sliding sleeve, and the fixing frame is arranged on the outer surface of the sliding sleeve.
As a further scheme of the invention: the top end of the first threaded column is fixedly connected with the bottom end of the first rotating shaft, a first bearing is arranged on the outer surface of the first rotating shaft, the first bearing is arranged on the lower surface of the placing plate, the bottom end of the first threaded column is fixedly connected with an output shaft of the motor, and the lower surface of the motor is fixedly connected with the lower surface of the inner wall of the working frame.
As a further scheme of the invention: the lower surface of the inner wall of the working frame is fixedly connected with the lower surface of the collecting frame, the position of the collecting frame corresponds to the position of the pressing frame, and the upper surface of the inner wall of the working frame is fixedly connected with the upper surfaces of the two lighting assemblies.
As a further scheme of the invention: the lower surface of the pressing plate is provided with two accommodating grooves, the upper surface of the inner wall of each accommodating groove is fixedly connected with the top end of the corresponding second spring, and the bottom end of each second spring is fixedly connected with the upper surface of the corresponding contact plate.
As a further scheme of the invention: the upper surface of the connecting pump is fixedly connected with the upper surface of the inner wall of the working frame, the upper surface of the connecting pump is communicated with the lower surface of the storage box, and the lower surface of the storage box is fixedly connected with the upper surface of the working frame.
As a further scheme of the invention: the back of the perforated plate is provided with a second bearing, a second rotating shaft is arranged in the second bearing, one end of the back of the second rotating shaft is fixedly connected with one end of the front face of the second threaded column, a second threaded cap is arranged on the outer surface of the second threaded column and arranged on the back of the inner wall of the connecting hole, and the position of the perforated plate corresponds to the position of the gluing head.
(III) advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
1. the packaging processing equipment of the integrated circuit directly places the chip on the surface of the placing plate corresponding to the position of the pressing plate by arranging the gluing head, the pressing plate, the contact plate, the pressing frame, the second threaded column, the second threaded cap, the leak hole plate and the placing plate, directly rotates the second threaded column, then the leak hole plate moves forwards, stops rotating the second threaded column after the leak hole plate moves to the position corresponding to the chip, then places the pin at the position corresponding to the chip, simultaneously controls the first electric hydraulic rod to drive the pressing frame to move downwards, after the contact plate is contacted with the chip and the pin, the gluing head paints the conductive adhesive on the surface of the leak hole plate, then the conductive adhesive leaks to the contact position of the pin and the chip, then the pressing frame continues to move downwards, the pin is extruded and bent, and after the pin is bent, controls the first electric hydraulic rod to stop working, the device can position the chip, avoid the chip to appear sliding at will, can adjust the bushing plate position according to chip and pin position simultaneously, guarantee that rubber coating point and pin position correspond, avoid the pin bending process pin other end perk or the condition of unsteady to appear, guarantee that the suitability and the processing effect of this device are more ideal.
2. This integrated circuit's encapsulation processing equipment, through setting up the motor, first screw thread post, first screw cap and cutting assembly, the direct control motor work, the motor drives first screw thread post and rotates, first screw cap and cutting assembly rebound, after cutting assembly removed to the pin and need the cutting position, cutting assembly pressed the pin at the pressure frame surface cutting this moment, the length that this device can need the cutting according to the pin is adjusted the cutting position, make the flexibility of this device more ideal.
3. This integrated circuit's encapsulation processing equipment through setting up contact plate and second spring, can avoid the contact plate to cause excessive extrusion to chip and pin, reduces its probability of damage when guaranteeing to advance line location to chip and pin, guarantees that the rubber coating goes on with buckling the pin process more stably smoothly.
Drawings
FIG. 1 is a schematic sectional view of the front view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a front view of the guide bar of the present invention;
FIG. 4 is a schematic cross-sectional view of an elastic assembly according to the present invention;
FIG. 5 is a schematic cross-sectional view of the platen of the present invention from above;
FIG. 6 is a schematic top view of a second threaded cap according to the present invention;
in the figure: the device comprises a working frame 1, a supporting frame 2, a placing plate 3, a collecting frame 4, a guide rod 5, a guide sleeve 6, a transverse plate 7, a first threaded cap 8, a first threaded column 9, a motor 10, a first rotating shaft 11, a first bearing 12, a supporting frame 13, a cutting assembly 14, a fixing plate 15, a first electric hydraulic rod 16, a pressing frame 17, a guide groove 18, an elastic assembly 19, a sliding rod 191, a sliding sleeve 192, a first spring 193, a fixing frame 20, a pressing plate 21, a receiving groove 22, a second spring 23, a contact plate 24, a second electric hydraulic rod 25, a connecting frame 26, a connecting pump 27, a glue coating head 28, a material storage box 29, a lighting assembly 30, a connecting hole 31, a sliding groove 32, a sliding block 33, a hole leaking plate 34, a second threaded cap 35, a second threaded column 36, a second rotating shaft 37 and a second bearing 38.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
As shown in fig. 1 to 6, the present invention provides a technical solution: the utility model provides an integrated circuit's encapsulation processing equipment, including work frame 1, the lower surface of 1 inner wall of work frame and the bottom fixed connection of support frame 2, the top of support frame 2 with place the lower fixed surface connection of board 3, through setting up support frame 2 and placing board 3, can place the chip, make things convenient for going on of follow-up rubber coating process, the lower surface of placing board 3 and the top fixed connection of two guide bars 5, through setting up guide bar 5 and uide bushing 6, can play the guide effect to the process of reciprocating of diaphragm 7, avoid diaphragm 7 to appear rotating, guarantee that first screw cap 8 can reciprocate the process smoothly, the bottom of guide bar 5 and the lower fixed surface connection of 1 inner wall of work frame, the surface of guide bar 5 is provided with uide bushing 6, the surface of uide bushing 6 is provided with diaphragm 7.
The upper surface of the transverse plate 7 is provided with a first threaded cap 8, the cutting process of pins can be realized by arranging the first threaded cap 8, a first threaded column 9, a motor 10 and a cutting assembly 14, the cutting assembly 14 is matched with a pressing frame 17, the length of the pins is convenient to process, the motor 10 drives the first threaded column 9 to rotate, the first threaded cap 8 and the cutting assembly 14 can be controlled to move up and down, the height of the cutting assembly 14 is convenient to adjust according to the length of the pins, the flexibility of the device is more ideal, the first threaded column 9 is arranged in the first threaded cap 8, the right side surface of the first threaded cap 8 is provided with a support frame 13, the right side surface of the support frame 13 is provided with the cutting assembly 14, the left side surface and the right side surface of the inner wall of the working frame 1 are both provided with fixing plates 15, and the first electric hydraulic rod 16 are arranged, the fixing plates 15 can ensure the stable placement of the first electric hydraulic rod 16, steerable pressure frame 17 of first electronic hydraulic stem 16 and clamp plate 21 reciprocate, can realize the positioning process to chip and pin, bend the operation to the pin simultaneously, the lower surface of fixed plate 15 is provided with first electronic hydraulic stem 16, the bottom of two first electronic hydraulic stems 16 is connected with the last fixed surface of same pressure frame 17, press frame 17 through setting up, press frame 17 to support the pin, guarantee going on of follow-up pin cutting process, guide way 18 has all been seted up to the left and right sides face of pressing frame 17 inner wall, the 18 inner walls of guide way are provided with elastic component 19.
The outer surface of the elastic component 19 is provided with a fixed frame 20, the lower surface of the fixed frame 20 is provided with a pressing plate 21, the opposite surfaces of the two pressing plates 21 are fixedly connected, after conductive adhesive is conveniently coated on the surface of the orifice plate 34 by arranging the pressing plate 21 and the orifice plate 34, the conductive adhesive falls on the corresponding positions of pins and chips along the surface hole of the orifice plate 34, the coating position of the conductive adhesive can be accurately controlled, the lower surface of the pressing plate 21 is provided with a connecting hole 31, the left side and the right side of the inner wall of the connecting hole 31 are provided with sliding grooves 32, two sliding blocks 33 are arranged in the sliding grooves 32, sufficient space is reserved for the back and forth movement of the orifice plate 34 by arranging the connecting hole 31, the sliding blocks 33 and the sliding grooves 32 can avoid the inclination and the shaking of the orifice plate 34 in the moving process, the opposite surfaces of the sliding blocks 33 on the left side and the right side are respectively fixedly connected with the left side and the right side of the orifice plate 34, the upper surface of the inner wall of the working frame 1 is fixedly connected with the top ends of the two second electric hydraulic rods 25, through setting up second electric hydraulic rod 25, can control the rubber coating head 28 and reciprocate, conveniently control the rubber coating head 28 and remove to the position of suitable clamp plate 21, the bottom of two second electric hydraulic rods 25 is connected with the last fixed surface of same linking frame 26, and the lower surface joint of linking frame 26 has rubber coating head 28, and rubber coating head 28 is linked together with connecting pump 27.
Specifically, as shown in fig. 4, the elastic assembly 19 includes a sliding rod 191, two ends of the sliding rod 191 are respectively and fixedly connected to the upper surface of the inner wall of the guiding groove 18 and the lower surface of the inner wall, the sliding rod 191 and the sliding sleeve 192 are arranged to ensure that the fixing frame 20 and the pressing plate 21 can move up and down relative to the pressing frame 17, the pressing frame 17 can continue to move to bend the pins while the contact plate 24 positions the chips and the pins, the sliding sleeve 192 is arranged on the outer surface of the sliding rod 191, the first spring 193 can apply a downward acting force to the fixing frame 20 and the pressing plate 21 by arranging the first spring 193, the pressing frame 17 can stably clamp the chips and the pins while bending the pins, two ends of the first spring 193 are respectively and fixedly connected to the upper surface of the inner wall of the guiding groove 18 and the upper surface of the sliding sleeve 192, the fixing frame 20 is arranged on the outer surface of the sliding sleeve 192, two grooves 22 of accomodating have been seted up to clamp plate 21's lower surface, accomodate the upper surface of groove 22 inner wall and the top fixed connection of second spring 23, the bottom of second spring 23 and the upper surface fixed connection of contact plate 24, through setting up contact plate 24 and second spring 23, can avoid contact plate 24 to cause excessive extrusion to chip and pin, reduce the probability of its damage when guaranteeing to advance line location to chip and pin, guarantee the rubber coating and buckle the pin process and go on more stably smoothly.
Specifically, as shown in fig. 1 and 3, the top end of the first threaded column 9 is fixedly connected with the bottom end of the first rotating shaft 11, the outer surface of the first rotating shaft 11 is provided with a first bearing 12, the first threaded column 9 can be supported and positioned by arranging the first bearing 12 and the first rotating shaft 11, it is ensured that the first threaded column 9 cannot incline or shake in the rotating process, the first bearing 12 is arranged on the lower surface of the placing plate 3, the bottom end of the first threaded column 9 is fixedly connected with the output shaft of the motor 10, and the lower surface of the motor 10 is fixedly connected with the lower surface of the inner wall of the working frame 1.
Specifically, as shown in fig. 1, the lower surface of the inner wall of the working frame 1 is fixedly connected with the lower surface of the collecting frame 4, the position of the collecting frame 4 corresponds to the position of the pressing frame 17, by arranging the collecting frame 4, the waste materials cut by the pins can be collected and stored, the upper surface of the inner wall of the working frame 1 is fixedly connected with the upper surfaces of the two lighting assemblies 30, and by arranging the lighting assemblies 30, can provide sufficient light for the interior of the working frame 1, is convenient for the observation and operation of workers, the upper surface of the connecting pump 27 is fixedly connected with the upper surface of the inner wall of the working frame 1, the upper surface of the connecting pump 27 is communicated with the lower surface of the storage box 29, through setting up storage case 29, connecting pump 27 and rubber coating head 28, storage case 29 is used for saving the conducting resin and places, and connecting pump 27 can paint the conducting resin on orifice plate 34 surface through rubber coating head 28 in the storage case 29, and the lower surface of storage case 29 is connected with the upper surface fixed of working frame 1.
Specifically, as shown in fig. 5 and 6, a second bearing 38 is disposed on the back of the orifice plate 34, a second rotating shaft 37 is disposed in the second bearing 38, by disposing the second bearing 38 and the second rotating shaft 37, the second threaded column 36 and the orifice plate 34 can be connected, the second threaded column 36 can be kept connected with the orifice plate 34 while rotating, one end of the back of the second rotating shaft 37 is fixedly connected with one end of the front of the second threaded column 36, a second threaded cap 35 is disposed on the outer surface of the second threaded column 36, by disposing the second threaded cap 35 and the second threaded column 36, the second threaded column 36 can move forward while rotating, so that the orifice plate 34 can be controlled to move, and the pin assembling process suitable for multiple positions is facilitated, the second threaded cap 35 is disposed on the back of the inner wall of the connecting hole 31, and the position of the orifice plate 34 corresponds to the position of the glue spreading head 28.
The working principle of the invention is as follows:
s1, when the device is required to be used for assembling chips and pins, the surfaces of the chip and the pin placing plate 3 are directly corresponding to the position of the contact plate 24, then the second threaded column 36 is controlled to rotate, at the moment, the second threaded column 36 drives the drain plate 34 to move forwards, when the position of the drain plate 34 moves to the position corresponding to the pin, the second threaded column 36 stops rotating, then the first electric hydraulic rod 16 is controlled to drive the pressing frame 17 to move downwards, at the moment, the pressing frame 17 and the pressing plate 21 move downwards, when the contact plate 24 is stably contacted with the pins and the chips, the first electric hydraulic rod 16 is controlled to stop working, then the second electric hydraulic rod 25 is controlled to drive the gluing head 28 to move downwards to a proper position, at the moment, the connection pump 27 is controlled to work, and the connection pump 27 is connected to paint conductive glue on the surface of the drain plate 34 through the gluing head 28;
s2, when the conductive adhesive on the surface of the orifice plate 34 leaks to the corresponding position of the pin and the chip, controlling the connecting pump 27 to stop working after the conductive adhesive is coated, then controlling the second electric hydraulic rod 25 to drive the gluing head 28 to move upwards to a proper height, controlling the pressing frame 17 to move downwards by the first electric hydraulic rod 16, extruding the pin to be bent by the pressing frame 17, and controlling the first electric hydraulic rod 16 to stop working after the pin is bent and the pressing frame 17 moves to the position where the pin needs to be cut;
s3, controlling the motor 10 to work, wherein the motor 10 drives the first threaded column 9 to rotate, the first threaded cap 8 and the cutting assembly 14 to move upwards, controlling the motor 10 to stop working after the cutting assembly 14 moves to a position where a pin needs to be cut, then controlling the cutting assembly 14 to cut the pin, and after the pin is cut, controlling the first electric hydraulic rod 16 to drive the pressing frame 17 to move upwards to separate the contact plate 24 from the pin, and then taking down the chip.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (7)
1. An integrated circuit packaging processing apparatus, comprising a work frame (1), characterized in that: the lower surface of the inner wall of the working frame (1) is fixedly connected with the bottom end of the supporting frame (2), the top end of the supporting frame (2) is fixedly connected with the lower surface of the placing plate (3), the lower surface of the placing plate (3) is fixedly connected with the top ends of the two guide rods (5), the bottom ends of the guide rods (5) are fixedly connected with the lower surface of the inner wall of the working frame (1), guide sleeves (6) are arranged on the outer surfaces of the guide rods (5), and transverse plates (7) are arranged on the outer surfaces of the guide sleeves (6);
a first threaded cap (8) is arranged on the upper surface of the transverse plate (7), a first threaded column (9) is arranged in the first threaded cap (8), a supporting frame (13) is arranged on the right side surface of the first threaded cap (8), a cutting assembly (14) is arranged on the right side surface of the supporting frame (13), fixing plates (15) are arranged on the left side surface and the right side surface of the inner wall of the working frame (1), first electric hydraulic rods (16) are arranged on the lower surface of the fixing plates (15), the bottom ends of the two first electric hydraulic rods (16) are fixedly connected with the upper surface of the same pressing frame (17), guide grooves (18) are formed in the left side surface and the right side surface of the inner wall of the pressing frame (17), and elastic assemblies (19) are arranged on the inner wall of the guide grooves (18);
the outer surface of the elastic component (19) is provided with a fixed frame (20), the lower surface of the fixed frame (20) is provided with a pressure plate (21), the opposite surfaces of the two pressure plates (21) are fixedly connected, the lower surface of the pressing plate (21) is provided with a connecting hole (31), the left side surface and the right side surface of the inner wall of the connecting hole (31) are both provided with sliding grooves (32), two sliding blocks (33) are arranged in the sliding groove (32), the opposite surfaces of the sliding blocks (33) on the left side and the right side are respectively fixedly connected with the left side and the right side of the perforated plate (34), the upper surface of the inner wall of the working frame (1) is fixedly connected with the top ends of the two second electric hydraulic rods (25), the bottom ends of the two second electric hydraulic rods (25) are fixedly connected with the upper surface of the same connecting frame (26), the lower surface joint of coupling frame (26) has rubber coating head (28), rubber coating head (28) are linked together with connecting pump (27).
2. The integrated circuit package processing apparatus of claim 1, wherein: elastic component (19) include slide bar (191), the both ends of slide bar (191) respectively with the upper surface of guide way (18) inner wall and the lower surface fixed connection of inner wall, the surface of slide bar (191) is provided with sliding sleeve (192), the surface of slide bar (191) is provided with first spring (193), the both ends of first spring (193) respectively with the upper surface of guide way (18) inner wall and the upper surface fixed connection of sliding sleeve (192), mount (20) set up the surface at sliding sleeve (192).
3. The apparatus of claim 1, wherein: the top of first screw thread post (9) and the bottom fixed connection of first pivot (11), the surface of first pivot (11) is provided with first bearing (12), first bearing (12) set up the lower surface of placing board (3), the bottom of first screw thread post (9) and the output shaft fixed connection of motor (10), the lower surface of motor (10) and the lower fixed connection of work frame (1) inner wall.
4. The integrated circuit package processing apparatus of claim 1, wherein: the lower surface of the inner wall of the working frame (1) is fixedly connected with the lower surface of the collecting frame (4), the position of the collecting frame (4) corresponds to the position of the pressing frame (17), and the upper surface of the inner wall of the working frame (1) is fixedly connected with the upper surfaces of the two lighting assemblies (30).
5. The integrated circuit package processing apparatus of claim 1, wherein: two accommodating grooves (22) are formed in the lower surface of the pressing plate (21), the upper surface of the inner wall of each accommodating groove (22) is fixedly connected with the top end of a second spring (23), and the bottom end of each second spring (23) is fixedly connected with the upper surface of a contact plate (24).
6. The integrated circuit package processing apparatus of claim 1, wherein: the upper surface of the connecting pump (27) is fixedly connected with the upper surface of the inner wall of the working frame (1), the upper surface of the connecting pump (27) is communicated with the lower surface of the storage box (29), and the lower surface of the storage box (29) is fixedly connected with the upper surface of the working frame (1).
7. The integrated circuit package processing apparatus of claim 1, wherein: the back of orifice plate (34) is provided with second bearing (38), be provided with second pivot (37) in second bearing (38), the one end at the back of second pivot (37) and the positive one end fixed connection of second screw thread post (36), the surface of second screw thread post (36) is provided with second screw cap (35), second screw cap (35) set up the back at connecting hole (31) inner wall, the position of orifice plate (34) is corresponding with the position of gluing head (28).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111390683.2A CN114093780B (en) | 2021-11-23 | 2021-11-23 | Integrated circuit's encapsulation processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111390683.2A CN114093780B (en) | 2021-11-23 | 2021-11-23 | Integrated circuit's encapsulation processing equipment |
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| CN114093780A CN114093780A (en) | 2022-02-25 |
| CN114093780B true CN114093780B (en) | 2022-07-26 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0820070A (en) * | 1994-07-06 | 1996-01-23 | Terumo Corp | Tube connection apparatus |
| CN211303627U (en) * | 2019-08-30 | 2020-08-21 | 辽阳泽华电子产品有限责任公司 | Gluing device for triode production |
| CN212062399U (en) * | 2020-04-02 | 2020-12-01 | 熊明存 | Adhesive deposite device is used in integrated circuit production and processing |
| CN213222966U (en) * | 2020-09-25 | 2021-05-18 | 重庆信易源智能科技有限公司 | Gluing device with protection and clamping functions for computer chip production |
| CN113262942A (en) * | 2021-05-08 | 2021-08-17 | 桂林芯飞光电子科技有限公司 | Dispensing device convenient to carry out chip package |
| CN214289096U (en) * | 2020-12-30 | 2021-09-28 | 亿科联合(深圳)集成电路有限公司 | Gluing device for triode production |
-
2021
- 2021-11-23 CN CN202111390683.2A patent/CN114093780B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0820070A (en) * | 1994-07-06 | 1996-01-23 | Terumo Corp | Tube connection apparatus |
| CN211303627U (en) * | 2019-08-30 | 2020-08-21 | 辽阳泽华电子产品有限责任公司 | Gluing device for triode production |
| CN212062399U (en) * | 2020-04-02 | 2020-12-01 | 熊明存 | Adhesive deposite device is used in integrated circuit production and processing |
| CN213222966U (en) * | 2020-09-25 | 2021-05-18 | 重庆信易源智能科技有限公司 | Gluing device with protection and clamping functions for computer chip production |
| CN214289096U (en) * | 2020-12-30 | 2021-09-28 | 亿科联合(深圳)集成电路有限公司 | Gluing device for triode production |
| CN113262942A (en) * | 2021-05-08 | 2021-08-17 | 桂林芯飞光电子科技有限公司 | Dispensing device convenient to carry out chip package |
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|---|---|
| CN114093780A (en) | 2022-02-25 |
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Effective date of registration: 20221111 Address after: 223800 Building 5-C, Beidou Electronic Information Industrial Park, Suqian High tech Industrial Development Zone, Jiangsu Province Patentee after: Jiangsu instant core semiconductor Co.,Ltd. Address before: 223801 a308, R & D building, Beidou Electronic Information Industrial Park, Suqian high tech Industrial Development Zone, Suqian City, Jiangsu Province Patentee before: Suqian Xunjie Automation Technology Co.,Ltd. |
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