CN220874821U

CN220874821U - PCB reflow soldering jig

Info

Publication number: CN220874821U
Application number: CN202322532855.6U
Authority: CN
Inventors: 熊建明; 张世杰; 叶龙
Original assignee: Nanchang Minggao Technology Co ltd
Current assignee: Nanchang Minggao Technology Co ltd
Priority date: 2023-09-18
Filing date: 2023-09-18
Publication date: 2024-04-30
Anticipated expiration: 2033-09-18

Abstract

The utility model discloses a PCB reflow soldering jig, which belongs to the technical field of PCB reflow soldering jigs and comprises a substrate and a cover plate, wherein a fixing frame is arranged at the top of the substrate, a mounting frame is arranged at the top of the fixing frame, a pressing mechanism is arranged at the top of the mounting frame, two groups of positioning plates are arranged at the top of the substrate in a sliding connection mode, one ends of two groups of sliding rods at the left side and the right side respectively penetrate through the left side wall and the right side wall of the fixing frame and extend to the outside, springs are sleeved on the outer walls of the sliding rods, one ends of the springs are connected with the outer side walls of the positioning plates, the other ends of the springs are connected with the inner side walls of the fixing frame.

Description

PCB reflow soldering jig

Technical Field

The utility model relates to the technical field of PCB reflow soldering jigs, in particular to a PCB reflow soldering jig.

Background

Because the PCB of the electronic product is continuously miniaturized, the sheet-shaped element appears, the traditional welding method can not meet the requirement, at first, only a reflow soldering process is adopted in the assembly of the hybrid integrated circuit board, and the assembled and soldered element is mostly a sheet-shaped capacitor, a sheet-shaped inductor, a mounting type transistor, a diode and the like, the existing PCB reflow soldering mode is to directly place the electronic element on the surface of the PCB and to cool and solder the electronic element through a high Wen Rongxi, but the existing PCB and the electronic element are mostly in a slender strip shape, when the PCB and the electronic element pass through a reflow soldering furnace, the PCB and the electronic element of the product possibly cause gaps to be generated between the solder feet of the electronic element and the contact surface of the PCB, so that the electronic element can be inclined or empty to influence the soldering effect, and therefore, the PCB reflow soldering jig is proposed.

Disclosure of utility model

The utility model aims to provide a PCB reflow soldering jig for solving the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a PCB reflow soldering tool, includes base plate and apron, the base plate top is equipped with the mount, the mount top is equipped with the mounting bracket, the mounting bracket top is equipped with hold-down mechanism, base plate top sliding connection is equipped with two sets of locating plates, and two sets of locating plates keep away from the lateral wall mutually and all are equipped with two sets of slide bars, and two sets of slide bars one end of left and right sides runs through the interior left and right sides wall of mount respectively and extends to outside, the slide bar outer wall has cup jointed the spring, spring one end is connected with the locating plate lateral wall, the spring other end is connected with the mount inside wall.

Further, the hold-down mechanism includes the screw rod that the mounting bracket top runs through and is equipped with, and screw rod one end is connected and is equipped with the rotor plate, the screw rod other end is equipped with the hold-down plate through the bearing connection.

Further, the guide groove is formed in the top of the base plate, and guide blocks matched with the guide groove are arranged at the bottoms of the two groups of positioning plates.

Further, the inner rear side wall of the fixing frame is provided with a limiting groove, and the rear side walls of the two groups of positioning plates are respectively provided with a limiting block matched with the limiting groove.

Further, the locating plate is arranged in an L shape.

Further, the fixing frame is arranged in a U shape, and the opening is arranged forwards.

Further, the mounting frame is arranged in a U shape, and the opening is arranged downwards.

Compared with the prior art, the utility model has the beneficial effects that: the utility model discloses can fix a position PCB under locating plate, slide bar and spring's effect, then the staff places electronic components on the PCB surface, can fix electronic components pressure fastening on the PCB surface under apron and hold-down mechanism's cooperation (the size of apron is changed according to the size of PCB board) to electronic components can stabilize the paster when the reflow soldering machine platform is crossed to electronic components and PCB board deformation lead to electronic components slope or empty welding phenomenon when avoiding high temperature, improves the welding effect.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a top view of the structure of the present utility model;

FIG. 3 is a schematic view of the structure A of the present utility model.

In the figure: 1. a substrate; 2. a fixing frame; 3. a positioning plate; 4. a slide bar; 5. a mounting frame; 6. a cover plate; 7. a compressing mechanism; 70. a rotating plate; 71. a screw; 72. a compacting plate; 8. and (3) a spring.

Description of the embodiments

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a PCB reflow soldering tool, including base plate 1 and apron 6, base plate 1 top is equipped with mount 2, mount 2 is the U-shaped setting, and the opening sets up forward, mount 2 top is equipped with mounting bracket 5, mounting bracket 5 is the U-shaped setting, and the opening sets up downwards, mounting bracket 5 top is equipped with hold-down mechanism 7, base plate 1 top sliding connection is equipped with two sets of locating plates 3, the guide way has been seted up at base plate 1 top, two sets of locating plates 3 bottoms all are equipped with the guide block with guide way assorted, make locating plate 3 remove more stably under the effect of guide way and guide block, the spacing groove has been seted up to the inside wall of mount 2, the lateral wall all is equipped with the stopper with spacing groove assorted after two sets of locating plates 3, make locating plate 3 remove more stably under the effect of spacing groove and stopper, locating plate 3 is the L-shaped setting of locating plate, the lateral wall is kept away from mutually to two sets of slide bars 4, two sets of slide bars 4 one ends of both sides run through 2 inside and right and left lateral wall and right sides respectively and extend to outside, the slide bar 4 outer wall cup joints and is equipped with spring 8, spring 8 one end is connected with locating plate 3 lateral wall, the inside wall is connected with the inside wall 2.

Referring to fig. 1, the pressing mechanism 7 includes a screw 71 penetrating through the top of the mounting frame 5, a rotating plate 70 is connected to one end of the screw 71, a pressing plate 72 is connected to the other end of the screw 71 through a bearing, and an anti-slip layer is disposed at the bottom of the pressing plate 2, so that the pressing plate 2 is more stable when contacting with the cover plate 6.

Working principle: the PCB is extruded and placed in the two groups of positioning plates 3, so that the PCB can drive the positioning plates 3 to extrude the springs 8 and the sliding rods 4, when the PCB is completely placed in the positioning plates 3, the positioning plates 3 can fix the position of the PCB under the action of elastic force of the springs 8, then electronic components are placed on the surface of the PCB, then a proper cover plate 6 is selected according to the size of the PCB to be placed on the electronic components, then a worker rotates the rotating plate 70 to drive the screw 71 to rotate, the screw 71 drives the compressing plate 72 to move downwards to extrude the cover plate 6, the cover plate 6 can press and fix the electronic components on the surface of the PCB (the size of the cover plate 6 is changed according to the size of the PCB), and therefore the electronic components can stabilize the patch when passing through a reflow soldering machine.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a PCB reflow soldering tool, includes base plate (1) and apron (6), its characterized in that: the utility model discloses a fixing rack, including base plate (1), fixing rack (2) top is equipped with mounting bracket (5), mounting bracket (5) top is equipped with hold-down mechanism (7), base plate (1) top sliding connection is equipped with two sets of locating plates (3), and two sets of locating plates (3) keep away from the lateral wall mutually and all are equipped with two sets of slide bars (4), and the lateral wall is controlled and extend to outside in fixing rack (2) respectively to two sets of slide bar (4) one end of left and right sides, slide bar (4) outer wall cup joints and has spring (8), spring (8) one end is connected with locating plate (3) lateral wall, the spring (8) other end is connected with fixing rack (2) inside wall.

2. The PCB reflow soldering jig of claim 1, wherein: the compressing mechanism (7) comprises a screw (71) penetrating through the top of the mounting frame (5), one end of the screw (71) is connected with a rotating plate (70), and the other end of the screw (71) is connected with a compressing plate (72) through a bearing.

3. The PCB reflow soldering jig of claim 1, wherein: the top of the base plate (1) is provided with a guide groove, and the bottoms of the two groups of positioning plates (3) are provided with guide blocks matched with the guide groove.

4. The PCB reflow soldering jig of claim 1, wherein: limiting grooves are formed in the inner rear side wall of the fixing frame (2), and limiting blocks matched with the limiting grooves are arranged on the rear side walls of the two groups of positioning plates (3).

5. The PCB reflow soldering jig of claim 1, wherein: the positioning plate (3) is arranged in an L shape.

6. The PCB reflow soldering jig of claim 1, wherein: the fixing frame (2) is arranged in a U shape, and the opening is arranged forwards.

7. The PCB reflow soldering jig of claim 1, wherein: the mounting frame (5) is arranged in a U shape, and the opening is downwards arranged.