CN114089823B - Overheat power-down protection system and method - Google Patents
Overheat power-down protection system and method Download PDFInfo
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- CN114089823B CN114089823B CN202111256166.6A CN202111256166A CN114089823B CN 114089823 B CN114089823 B CN 114089823B CN 202111256166 A CN202111256166 A CN 202111256166A CN 114089823 B CN114089823 B CN 114089823B
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- 238000010586 diagram Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 9
- 238000004590 computer program Methods 0.000 description 7
- 238000013021 overheating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
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Abstract
The application relates to an overheat power-down protection system and method, and in particular relates to the field of circuit control. The system comprises a temperature control module and each functional module; each functional module comprises a starting circuit unit, a hot spot temperature sensor, a sub-service processing module and the like; the hot spot temperature sensor is mutually independent with the power supply of the starting circuit unit and the sub-service processing module; the hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature reporting bus; and the temperature control module controls the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module. In the scheme, the design for closing and restarting the overheat module is provided, so that the overheat power-off protection effect is improved, the system safety is ensured, and the operation efficiency of the equipment is improved.
Description
Technical Field
The invention relates to the field of circuit control, in particular to an overheat power-down protection system and method.
Background
Many electronic devices are provided with passive heat dissipation systems such as fans, when the heat dissipation systems have serious faults, such as stalling of a plurality of fans, the systems need to perform power-down protection on overheated submodules or the whole system, so as to prevent the devices from being overheated and burnt out, even fire and the like.
For electronic equipment, the electronic equipment is generally provided with a main control module to control each module in the electronic equipment, and correspondingly, hot spot temperature information of all sub-modules of the system is uniformly reported to the main control module of the system through various buses, and when the CPU main control module of the system detects that the temperature of any one or more places is seriously overheated, the CPU can cut off the power output of the overheating module through a control line to prevent the local overheating of the system and burn out the equipment.
In the above scheme, the breakdown temperature point may be reached before other functional modules when the CPU power is larger, so that the power output of other functional modules cannot be controlled, resulting in poor overheat power-down protection effect.
Disclosure of Invention
The application provides an overheat power-down protection method and system, which can improve the operation efficiency of equipment while ensuring the safety of a system.
In one aspect, an overheat power-down protection system is provided, the system comprising a temperature control module and various functional modules;
each functional module comprises a starting circuit unit, a hot spot temperature sensor and a sub-service processing unit; the hot spot temperature sensor is mutually independent of the power supply of the starting circuit unit and the sub-service processing unit; the starting circuit unit is used for controlling the starting of the functional module according to the received temperature information under the condition of power supply;
The hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature reporting bus;
the temperature control module is used for controlling the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module.
In one possible implementation, the system further includes a CPU master control module;
the CPU master control module comprises a power-on control unit and a hot spot temperature sensor; the hot spot temperature sensor is connected with the temperature control module through the temperature reporting bus; the power-on control unit is used for controlling the starting of the CPU master control module according to the received signal under the condition of power supply.
In one possible implementation manner, the temperature control module is connected with a power-on control circuit in the CPU master control module through a power-off control line; and the temperature control module is connected with the starting circuit units of the functional modules through the power-down control line.
In one possible implementation manner, the temperature control module, the CPU master control module and the respective functional modules are powered through a system power supply bus;
The system power supply bus is respectively connected with the power-on control unit of the CPU master control module and the hot spot temperature sensor so as to realize independent power supply of the power-on control unit of the CPU master control module and the hot spot temperature sensor respectively;
the system power supply bus is respectively connected with the starting circuit units of the functional modules and the hot spot temperature bed love so as to realize independent power supply of the starting circuit units of the functional modules and the hot spot temperature sensors.
In one possible implementation, the system further comprises a power module; the power module is connected with an external circuit to supply power to the overheat power-down protection system through a system power supply bus.
In a possible implementation manner, the power module further comprises a power control unit and the hot spot temperature sensor; the power supply control unit is used for controlling the power supply condition on the system power supply bus according to the received signal when the external circuit is accessed;
the hot spot temperature sensor is connected with the temperature control module through a temperature reporting bus;
the temperature control module is also connected with a power supply control unit of the power supply module through the power-off control line.
In one possible implementation manner, the system further comprises a standby power supply module, wherein the standby power supply module is connected with the temperature control module and hot spot temperature sensors on various modules in the system;
and in response to the power control unit stopping power to the overheat power-down protection system through the system power bus, the standby power module supplies power to the temperature control module and hot spot temperature sensors on each module in the system.
In yet another aspect, a method for over-temperature power-down protection is provided for a temperature control module in an over-temperature power-down protection system; the overheat power-down protection system also comprises various functional modules; the method comprises the following steps:
acquiring hot spot temperature information uploaded by hot spot temperature sensors in the functional modules through a temperature report bus;
when the first hot spot temperature information indicates that the temperature of a target functional module is greater than a first temperature threshold, indicating a circuit starting module in the target functional module, and performing power-off processing on the target functional module;
and when the second hot spot temperature information uploaded by the hot spot temperature sensor in the target functional module is accepted, and the second hot spot temperature information indicates that the temperature of the target functional module is smaller than a second temperature threshold value, a circuit starting module in the target functional module is indicated to start the target functional module.
In still another aspect, an overheat power-down protection device is provided, the overheat power-down protection device being applied to a temperature control module in an overheat power-down protection system, the overheat power-down protection device comprising:
the temperature information acquisition unit is used for acquiring hot spot temperature information uploaded by the hot spot temperature sensors in the functional modules through a temperature report bus;
the power-off unit is used for indicating a circuit starting module in the target functional module to perform power-off processing on the target functional module when the first hot spot temperature information indicates that the temperature of the target functional module is greater than a first temperature threshold;
and the starting unit is further used for indicating a circuit starting module in the target functional module to start the target functional module when the second hot spot temperature information uploaded by the hot spot temperature sensor in the target functional module is received and the second hot spot temperature information indicates that the temperature of the target functional module is smaller than a second temperature threshold value.
In yet another aspect, a micro control unit is provided, where the micro control unit is applied to a temperature control module in an overheat power-down protection system, and the micro control unit includes a transceiver subunit and a data processing subunit;
The receiving and transmitting subunit is used for acquiring hot spot temperature information uploaded by the hot spot temperature sensors in the functional modules through a temperature reporting bus;
the data processing subunit is configured to instruct a circuit starting module in the target functional module to perform power-off processing on the target functional module when the first hot spot temperature information indicates that the temperature of the target functional module is greater than a first temperature threshold;
and the data processing subunit is further configured to instruct a circuit starting module in the target functional module to start the target functional module when receiving second hot spot temperature information uploaded by the hot spot temperature sensor in the target functional module and the second hot spot temperature information indicates that the temperature of the target functional module is less than a second temperature threshold.
In yet another aspect, a computer readable storage medium having stored therein at least one instruction loaded and executed by a micro control unit to implement the above-described method of over-temperature power-down protection is provided.
In yet another aspect, a computer program product or computer program is provided, the computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer readable storage medium and executes the computer instructions to cause the computer device to perform the above-described method of over-temperature power-down protection.
The technical scheme that this application provided can include following beneficial effect:
in the overheat power-down protection system, in order to protect the safety of each functional module, a hot spot temperature sensor is arranged in each functional module and is independently powered, at the moment, the temperature control module receives that the temperature acquired by the hot spot temperature sensor of a certain functional module is higher through a temperature reporting bus, and when potential safety hazards exist, a signal is sent to a starting circuit unit in the functional module so as to instruct the functional module to perform power-off treatment; however, because the hot spot temperature sensor and the temperature control module are independently powered, the power supply is isolated from the power supply of the monitored service module, even if the monitored service module is powered down, the hot spot temperature sensor can still acquire the temperature information of the functional module, and when the temperature information reaches a safety threshold, the functional module can be restarted; when the temperature of a certain monitored module rises to a dangerous threshold, the temperature control module can power down the monitored module, and the operation safety of the system can be still protected under the condition that the CPU temperature is too high and stops working. In the scheme, the design for closing and restarting the overheat module is provided, so that the overheat power-off protection effect is improved, the system safety is ensured, and the operation efficiency of the equipment is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram illustrating a configuration of an overheat power-down protection system according to an exemplary embodiment.
Fig. 2 is a schematic diagram illustrating a configuration of an overheat power-down protection system according to an exemplary embodiment.
Fig. 3 is a schematic diagram illustrating a configuration of an overheat power-down protection system according to an exemplary embodiment.
FIG. 4 is a method flow diagram illustrating a method of power-down protection from overheating, according to an example embodiment.
Fig. 5 is a block diagram illustrating the structure of an overheat power-down protection device according to an exemplary embodiment.
Fig. 6 is a block diagram illustrating a configuration of a micro control unit according to an exemplary embodiment.
Fig. 7 is a schematic diagram of a computer device according to an exemplary embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
It should be understood that, in the embodiments of the present application, the "indication" may be a direct indication, an indirect indication, or an indication having an association relationship. For example, a indicates B, which may mean that a indicates B directly, e.g., B may be obtained by a; it may also indicate that a indicates B indirectly, e.g. a indicates C, B may be obtained by C; it may also be indicated that there is an association between a and B.
In the description of the embodiments of the present application, the term "corresponding" may indicate that there is a direct correspondence or an indirect correspondence between the two, or may indicate that there is an association between the two, or may indicate a relationship between the two and the indicated, configured, or the like.
In the embodiment of the present application, the "predefining" may be implemented by pre-storing corresponding codes, tables or other manners that may be used to indicate relevant information in devices (including, for example, terminal devices and network devices), and the specific implementation of the present application is not limited.
Fig. 1 is a schematic diagram illustrating a configuration of an overheat power-down protection system according to an exemplary embodiment. As shown in fig. 1, the system includes a temperature control module 100 and various functional modules.
Each functional module comprises a starting circuit unit, a hot spot temperature sensor and a sub-service processing unit; the hot spot temperature sensor is mutually independent with the power supply of the starting circuit unit and the sub-service processing unit; the starting circuit unit is used for controlling the running state of the functional module according to the received signal under the condition of power supply;
the hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature report bus;
the temperature control module is used for controlling the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module.
Illustratively, the respective functional modules include a functional module 1 and a functional module 2.
In the functional module 1, a start-up circuit unit 111, a hot spot temperature sensor 112, and a sub-service processing unit 113 are included; in the functional module 2, a start-up circuit unit 121, a hot spot temperature sensor 122, and a sub-service processing unit 123 are included.
The hot spot temperature sensor 112 in the functional module 1 and the hot spot temperature sensor 122 in the functional module 2 are connected with the temperature control module 100 through a temperature report bus. Namely, the hot spot temperature sensor 112 in the functional module 1 and the hot spot temperature sensor in the functional module 2, when acquiring the temperature information, each upload the corresponding temperature information to the temperature control module.
When receiving the temperature information uploaded by the hot spot temperature sensor of the functional module, the temperature control module 100 generates a corresponding power-on signal or power-off signal according to the temperature information, and sends the power-on signal or the power-off signal to a starting circuit unit in the functional module to control the power supply state of the functional module.
For example, taking a power supply control process of the temperature control module 110 to the function module 1 as an example, when the hot spot temperature sensor 112 in the function module 1 detects that the temperature in the function module 1 is higher than a safety threshold (for example, higher than 80 ℃), the hot spot temperature sensor 112 generates corresponding temperature information, and the corresponding temperature information is uploaded to the temperature control module through a temperature report bus.
When the temperature control module detects that the temperature information uploaded by the hot spot temperature sensor 112 is greater than the preset safety threshold, the temperature control module generates a corresponding power-down signal and transmits a starting circuit unit in the functional module 1 to stop supplying power to the functional module 1.
Optionally, the temperature control module may be connected to a power supply enable terminal of a start circuit unit in the functional module, where the power supply enable terminal is at a low level, and allows the power supply bus to supply power to the functional module through the start circuit unit; when the power supply enabling terminal is at a high level, the power supply bus is not allowed to supply power to the functional module through the starting circuit.
When the hot spot temperature sensor in the functional module detects that the temperature in the functional module is in a safe state, the temperature control module does not send a signal to the power supply enabling end, and the power supply enabling end can be placed at a low level at the moment, so that the starting circuit module can still work normally based on the voltage provided on the power supply bus. When the hot spot temperature sensor in the functional module detects that the temperature in the functional module exceeds the safety threshold, the temperature control module sends a down electric signal to the power supply enabling end, namely the power supply enabling end is placed at a high level, at the moment, the starting circuit module cannot indicate the functional module to work normally based on the voltage provided on the power supply bus, and at the moment, the functional module stops working.
In the embodiment of the application, because of the hot spot temperature sensor in the functional module, the hot spot temperature sensor and the starting circuit module are independently powered; therefore, the power supply enabling end in the starting circuit module is placed at a high level to cause the power failure of the functional module, and the power failure of the hot spot temperature sensor in the functional module is not affected, so that the hot spot temperature sensor can still measure the temperature condition of the functional module after the power failure.
When the hot spot temperature sensor measures that the temperature of the functional module after power failure is lower and is lower than a restarting threshold (for example, 50 ℃), the temperature control module detects that the temperature of the functional module is reduced to a safe area, and after normal operation for a period of time can be ensured, the signal sending to the power supply enabling end is stopped, so that the starting circuit module can control the functional module to realize normal operation based on the voltage provided by the power supply bus.
In one possible implementation, the temperature control module may be an MCU (Microcontroller Unit, micro control unit) system.
Because MCU's consumption is less, and temperature control module's function is comparatively simple, consequently can reduce the extra calorific capacity that temperature control module produced in equipment as far as possible on the basis of guaranteeing to show the function that temperature control module needs to realize through MCU.
In summary, in the overheat power-down protection system, in order to protect the safety of each functional module, a hot spot temperature sensor is arranged in each functional module, and the hot spot temperature sensor is independently powered, at this time, the temperature control module receives, through a temperature report bus, that the temperature acquired by the hot spot temperature sensor of a certain functional module is higher, and when a potential safety hazard exists, a signal is sent to a starting circuit unit in the functional module to instruct the functional module to perform power-off processing; however, because the hot spot temperature sensor and the temperature control module are independently powered, the power supply is isolated from the power supply of the monitored service module, even if the monitored service module is powered down, the hot spot temperature sensor can still acquire the temperature information of the functional module, and when the temperature information reaches a safety threshold, the functional module can be restarted; when the temperature of a certain monitored module rises to a dangerous threshold, the temperature control module can power down the monitored module, and the operation safety of the system can be still protected under the condition that the CPU temperature is too high and stops working. The scheme provides a design for closing and restarting the overheat module, thereby improving the overheat power-down protection effect, ensuring the safety of the system and improving the operation efficiency of the equipment.
Fig. 2 is a schematic diagram illustrating a configuration of an overheat power-down protection system according to an exemplary embodiment. As shown in fig. 1, the system includes a temperature control module 200 and various functional modules.
Each functional module comprises a starting circuit unit and a hot spot temperature sensor; the hot spot temperature sensor and the starting circuit unit are independently powered; the starting circuit unit is used for controlling the running state of the functional module according to the received signal under the condition of power supply;
the hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature reporting bus;
the temperature control module is used for controlling the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module.
Illustratively, the respective functional modules include a functional module 1 and a functional module 2.
In the functional module 1, a start-up circuit unit 211, a hot spot temperature sensor 212, and a sub-service processing unit 213 are included; in the functional module 2, a start-up circuit unit 221, a hot spot temperature sensor 222, and a sub-service processing unit 223 are included.
In one possible implementation of the embodiment of the present application, the system further includes a CPU master control module 230.
The CPU master control module comprises a power-on control unit 231 and a hot spot temperature sensor 232; the hot spot temperature sensor is connected with the temperature control module through the temperature reporting bus; the power-on control unit is used for controlling the starting of the CPU master control module according to the received signal under the condition of power supply.
In one possible implementation manner, the temperature control module is connected with a power-on control circuit in the CPU master control module through a power-off control line; and the temperature control module is connected with the starting circuit units of the functional modules through the power-down control line.
The power-on control circuit in the CPU master control module is used for controlling the power supply condition of the CPU, the starting circuit units of the functional modules are used for controlling the power supply condition of the functional modules, the temperature control module can be connected with the starting circuit units of the functional modules according to the power-off controller, and the power-on control circuit in the CPU is connected, so that the temperature control module can simultaneously control the power supply condition of the CPU master control module and the functional modules, and the running states of the CPU master control module and the functional modules are controlled.
In one possible implementation manner, the system power supply bus is respectively connected with the power-on control unit and the hot spot temperature sensor of the CPU master control module so as to realize independent power supply of the power-on control unit and the hot spot temperature sensor of the CPU master control module respectively;
The system power supply bus is respectively connected with the starting circuit units of the functional modules and the hot spot temperature sensors so as to realize independent power supply of the starting circuit units of the functional modules and the hot spot temperature sensors.
In order to realize the independent power supply of the power-on control unit and the hot spot temperature sensor in the CPU master control module, the system power supply bus can respectively lead out two branches, and is connected with the power-on control unit and the hot spot temperature sensor of the CPU master control module.
At the moment, the hot spot temperature sensor is not controlled by the power-on control unit, and the power-on control unit can control the CPU master control module to be in a power supply state or a power-off state, and the hot spot temperature sensor can be kept in the power-on state through the power supply of the other branch based on the system power supply bus so as to detect the temperature in the CPU master control module.
Similarly, in order to realize the independent power supply of the starting circuit unit and the hot spot temperature sensor in the functional module, the system power supply bus can respectively draw out two branches and be connected with the starting circuit unit and the hot spot temperature sensor in the functional module.
At the moment, the hot spot temperature sensor is not influenced by the starting circuit unit, and the starting circuit unit controls the functional module to be in a power supply state or a power-off state, and the hot spot temperature sensor can be kept in a power-on state through the power supply of the other branch based on the system power supply bus so as to detect the temperature in the functional module.
In summary, in the overheat power-down protection system, in order to protect the safety of each functional module, a hot spot temperature sensor is arranged in each functional module, and the hot spot temperature sensor is independently powered, at this time, a temperature control module receives, through a temperature report bus, that the temperature acquired by the hot spot temperature sensor of a certain functional module is higher, and when a potential safety hazard exists, a signal is sent to a start circuit unit in the functional module to instruct the functional module to perform power-off processing; however, because the hot spot temperature sensor and the temperature control module are independently powered, the power supply is isolated from the power supply of the monitored service module, even if the monitored service module is powered down, the hot spot temperature sensor can still acquire the temperature information of the functional module, and when the temperature information reaches a safety threshold, the functional module can be restarted; when the temperature of a certain monitored module rises to a dangerous threshold, the temperature control module can power down the monitored module, and the operation safety of the system can be still protected under the condition that the CPU temperature is too high and stops working. The method provides a design of closing and restarting the overheat module, thereby improving the overheat power-down protection effect, ensuring the safety of the system and improving the operation efficiency of the equipment.
Fig. 3 is a schematic diagram illustrating a configuration of an overheat power-down protection system according to an exemplary embodiment.
As shown in fig. 3, the system includes a temperature control module 300 and various functional modules.
Each functional module comprises a starting circuit unit and a hot spot temperature sensor; the hot spot temperature sensor and the starting circuit unit are independently powered; the starting circuit unit is used for controlling the running state of the functional module according to the received signal under the condition of power supply;
the hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature reporting bus;
the temperature control module is used for controlling the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module.
Illustratively, the respective functional modules include a functional module 1 and a functional module 2.
In the functional module 1, a start-up circuit unit 311, a hot spot temperature sensor 312, and a sub-service processing unit 313 are included; in the functional module 2, a start-up circuit unit 321, a hot spot temperature sensor 322, and a sub-service processing unit 323 are included.
In one possible implementation of the embodiment of the present application, the system further includes a CPU master control module 330.
The CPU master control module comprises a power-on control unit 331 and a hot spot temperature sensor 332; the hot spot temperature sensor is connected with the temperature control module through the temperature reporting bus; the power-on control unit is used for controlling the starting of the CPU master control module according to the received signal under the condition of power supply.
In one possible implementation manner, the temperature control module is connected with a power-on control circuit in the CPU master control module through a power-off control line; and the temperature control module is connected with the starting circuit units of the functional modules through the power-down control line.
In one possible implementation, the system further includes a power module 340; the power module is connected with an external circuit to supply power to the overheat power-down protection system through a system power supply bus.
Alternatively, when the overheat power-down protection system is applied to a terminal device, the power module may be an ac-dc converter for converting external ac power into dc power for supplying power to the terminal device, so as to supply power to each module in the terminal device through a system power supply bus.
In a possible implementation manner, the power module further comprises a power control unit and the hot spot temperature sensor, wherein the power control unit is used for controlling the power supply condition on the system power supply bus according to the received signal when an external circuit is accessed;
the hot spot temperature sensor is connected with the temperature control module through a temperature reporting bus;
the temperature control module is also connected with a power supply control unit of the power supply module through the power-off controller.
When the power supply module comprises a power supply control unit and a hot spot temperature sensor, the power supply control module can determine the power supply condition on a system power supply bus when being connected to an external circuit. That is, the power control module can output a designated voltage value through the system power bus when the voltage of the external circuit is accessed, so as to supply power to each module in the overheat power-down protection system.
The hot spot temperature sensor in the power module is used for monitoring the temperature in the power module, and inputting the generated temperature information corresponding to the power module to the temperature control module through the temperature report bus. When the temperature control module detects that the temperature of the power supply module is too high, the power supply control unit of the power supply module can be instructed to control the power supply module to stop supplying power to the system power supply bus through the power-down control line.
In one possible implementation, the hotspot temperature sensor in the power module is powered via a system power bus.
Because the power of the power module is higher, when the temperature of the power module is too high, the temperature control module indicates that the power module stops supplying power through the system power supply bus, at this time, the hot spot temperature sensors in all the modules in the power module lose power supply, and the temperature control module also loses power supply, so that the temperature control module cannot restart all the functional modules including the power module, and the overheat power-down protection system needs to be restarted manually so as to ensure the safety of the overheat power-down protection system.
In another possible implementation manner, the system further comprises a standby power module; the standby power module is connected with the temperature control module and hot spot temperature sensors on each module in the system.
And when the power supply control unit stops supplying power to the overheat power-down protection system through the system power supply bus, the standby power supply module is used for supplying power to the temperature control module and the hot spot temperature sensors on each module in the system.
The backup power module may be a rechargeable battery or the like, and may store a certain amount of power to provide a voltage to the electrical energy storage device. When the system comprises a standby power supply module, the standby power supply module is connected with the temperature control module and the hot spot temperature sensors on all the modules in all the systems, and the power supply module stops supplying power to all the modules in the overheat power-down protection system through a system power supply bus due to the fact that the temperature is too high, the standby power supply module can supply power to the temperature control module and the hot spot temperature sensors on all the modules in the system so as to realize the overheat power-down protection system after the power supply module is powered off, and the overheat power-down protection system and all the modules in the overheat power-down protection system can still be restarted when the temperature of each module is detected to reach a safety threshold value.
In summary, in the overheat power-down protection system, in order to protect the safety of each functional module, a hot spot temperature sensor is arranged in each functional module, and the hot spot temperature sensor is independently powered, at this time, the temperature control module receives, through a temperature report bus, that the temperature acquired by the hot spot temperature sensor of a certain functional module is higher, and when a potential safety hazard exists, a signal is sent to a starting circuit unit in the functional module to instruct the functional module to perform power-off processing; however, because the hot spot temperature sensor and the temperature control module are independently powered, the power supply is isolated from the power supply of the monitored service module, even if the monitored service module is powered down, the hot spot temperature sensor can still acquire the temperature information of the functional module, and when the temperature information reaches a safety threshold, the functional module can be restarted; when the temperature of a certain monitored module rises to a dangerous threshold, the temperature control module can power down the monitored module, and the operation safety of the system can be still protected under the condition that the CPU temperature is too high and stops working. The method provides a design of closing and restarting the overheat module, thereby improving the overheat power-down protection effect, ensuring the safety of the system and improving the operation efficiency of the equipment.
FIG. 4 is a method flow diagram illustrating a method of power-down protection from overheating, according to an example embodiment. The method of over-temperature power-down protection may be performed by a temperature control module in an over-temperature power-down protection system as shown in fig. 1, and may include the following steps as shown in fig. 4.
Step 401, acquiring hot spot temperature information uploaded by a hot spot temperature sensor in each functional module through a temperature report bus.
After the hot spot temperature sensor in each functional module measures the temperature of each functional module, hot spot temperature information of each functional module can be generated and sent to the temperature control module through the temperature report bus.
And step 402, when the first hot spot temperature information indicates that the temperature of the target functional module is greater than a first temperature threshold, indicating a circuit starting module in the target functional module, and performing power-off processing on the target functional module.
When the temperature control module receives first hot spot temperature information in the hot spot temperature information reported by each functional module and the first hot spot temperature information indicates that the temperature of the target functional module is greater than a first temperature threshold, the temperature control module can indicate a circuit starting module in the target functional module at the moment to perform power-off processing on the target functional module.
Optionally, the temperature control module may be connected to a power supply enabling end (and the power supply enabling end is effectively at a low level) in the circuit starting module, when the temperature control module detects that the temperature information of the first hot spot indicates that the temperature of the target functional module is greater than the first temperature threshold, the level of the power supply enabling end is set at a high level, and at this moment, the power supply enabling end of the circuit starting module indicates that the circuit starting module cannot receive power supply, so as to implement power-off processing for the target functional module.
Optionally, when the temperature control module detects that the first hot spot temperature information indicates that the temperature of the target functional module is greater than the first temperature threshold, the temperature control module may further generate a corresponding power-down signal, and when the circuit starting unit receives the power-down signal, the circuit starting unit stops transmitting the voltage to other units in the functional module so as to stop the operation of the functional module. But at this time the circuit activation unit is still in a normal operation state, so that when a power-on signal is received, the circuit activation unit is still restored to a state in which it transmits a voltage to the other units of the functional module.
Step 403, when the second hot spot temperature information uploaded by the hot spot temperature sensor in the target functional module is received, and the second hot spot temperature information indicates that the temperature of the target functional module is less than the second temperature threshold, generating a target power supply signal corresponding to the target functional module, and sending the target power supply signal to a circuit starting module in the target functional module to indicate to start the target functional module.
When the target functional module is in a power-off state, the hot spot temperature sensor and the circuit starting power supply are independently powered, so that the hot spot temperature sensor can still receive the voltage provided by the system power supply bus, and normal operation is ensured.
When the hot spot temperature sensor detects that the temperature of the target functional module is smaller than the second temperature threshold, the temperature of the target functional module is within the safety threshold, and the functional module can be restarted.
Optionally, the first temperature threshold is the same as the second temperature threshold. I.e. when the temperature of the target functional module is higher than the first temperature threshold, the target functional module is powered off; when the temperature of the target function module is below the first temperature threshold, the target function module is re-powered.
Optionally, the first temperature threshold is higher than the second temperature threshold. I.e. the target functional module is powered off when the temperature of the target functional module is higher than a first temperature threshold; when the temperature of the target functional module is reduced to the second temperature threshold value, the target functional module is allowed to supply power again, so that the situation that the functional module is continuously switched between the starting state and the off state when the functional module is at the safety threshold value critical point is avoided.
In a possible implementation manner, when the overheat power-down protection system comprises a power supply module, the power supply module further comprises a power supply control unit and the hot spot temperature sensor; and the hot spot temperature sensor is connected with the temperature control module through a temperature reporting bus.
And when the power supply temperature information uploaded by the hot spot temperature sensors in the power supply modules is received and is higher than a first temperature threshold value, the power supply control unit is instructed to stop the power supply of the power supply modules to the system power supply bus.
The power-down process of the power module is similar to that of other functional modules, and will not be described here again. And, similarly, the power module also has a similar power-up process to other functions.
In one possible implementation manner, when the hot spot temperature information uploaded by the hot spot temperature sensors of each module is received, and the average value of the hot spot temperature information is higher than the first temperature threshold value, the power control unit is instructed to stop the power supply of the power module to the system power supply bus.
When the average value of the hot spot temperature information corresponding to each module is higher than the first temperature threshold value, the overall temperature in the equipment corresponding to the overheat power-down protection system can be considered to be too high, and the power supply of the power supply module to the system power supply bus is required to be stopped at the moment for the safety of the equipment, so that the equipment is cooled in an overall level.
In another possible implementation manner, when the hot spot temperature information uploaded by the hot spot temperature sensors of each module is received, and the ratio of the number of the hot spot temperature information above the first temperature threshold is greater than the target ratio, the power control unit is instructed to stop the power supply of the power module to the system power supply bus.
When the number ratio of the hot spot temperature information higher than the first temperature threshold value in the hot spot temperature information corresponding to each module is larger than the target ratio, the whole temperature of the equipment can be considered to be too high, and part of the equipment already exceeds the safety temperature, so that the equipment can work more efficiently and effectively, the power supply of the power supply module to the system power supply bus is required to be stopped, and the whole layer of the equipment is cooled.
In summary, in the overheat power-down protection system, in order to protect the safety of each functional module, a hot spot temperature sensor is arranged in each functional module, and the hot spot temperature sensor is independently powered, at this time, the temperature control module receives, through a temperature report bus, that the temperature acquired by the hot spot temperature sensor of a certain functional module is higher, and when a potential safety hazard exists, a signal is sent to a starting circuit unit in the functional module to instruct the functional module to perform power-off processing; however, because the hot spot temperature sensor and the temperature control module are independently powered, the power supply is isolated from the power supply of the monitored service module, even if the monitored service module is powered down, the hot spot temperature sensor can still acquire the temperature information of the functional module, and when the temperature information reaches a safety threshold, the functional module can be restarted; when the temperature of a certain monitored module rises to a dangerous threshold, the temperature control module can power down the monitored module, and the operation safety of the system can be still protected under the condition that the CPU temperature is too high and stops working. The method provides a design of closing and restarting the overheat module, thereby improving the overheat power-down protection effect, ensuring the safety of the system and improving the operation efficiency of the equipment.
Fig. 5 is a block diagram illustrating the structure of an overheat power-down protection device according to an exemplary embodiment. The overheat power-down protection device is applied to a temperature control module in an overheat power-down protection system, and comprises:
a temperature information obtaining unit 501, configured to obtain hot spot temperature information uploaded by a hot spot temperature sensor in each functional module through a temperature reporting bus;
the power-off unit 502 is configured to instruct a circuit start module in a target functional module to perform power-off processing on the target functional module when the first hot spot temperature information indicates that the temperature of the target functional module is greater than a first temperature threshold;
and the starting unit 503 is further configured to instruct a circuit starting module in the target functional module to start the target functional module when the second hotspot temperature information uploaded by the hotspot temperature sensor in the target functional module is received and the second hotspot temperature information indicates that the temperature of the target functional module is less than a second temperature threshold.
In summary, in the overheat power-down protection system, in order to protect the safety of each functional module, a hot spot temperature sensor is arranged in each functional module, and the hot spot temperature sensor is independently powered, at this time, the temperature control module receives, through a temperature report bus, that the temperature acquired by the hot spot temperature sensor of a certain functional module is higher, and when a potential safety hazard exists, a signal is sent to a starting circuit unit in the functional module to instruct the functional module to perform power-off processing; however, because the hot spot temperature sensor and the temperature control module are independently powered, the power supply is isolated from the power supply of the monitored service module, even if the monitored service module is powered down, the hot spot temperature sensor can still acquire the temperature information of the functional module, and when the temperature information reaches a safety threshold, the functional module can be restarted; when the temperature of a certain monitored module rises to a dangerous threshold, the temperature control module can power down the monitored module, and the operation safety of the system can be still protected under the condition that the CPU temperature is too high and stops working. The method provides a design of closing and restarting the overheat module, thereby improving the overheat power-down protection effect, ensuring the safety of the system and improving the operation efficiency of the equipment.
Fig. 6 is a block diagram illustrating a configuration of a micro control unit according to an exemplary embodiment. The micro control unit is applied to a temperature control module in the overheat power-on protection system and comprises a transceiver subunit and a data processing subunit;
the transceiver subunit 601 is configured to obtain hot spot temperature information uploaded by the hot spot temperature sensors in the respective functional modules through a temperature reporting bus;
the data processing subunit 602 is configured to instruct a circuit start module in the target functional module to perform power-off processing on the target functional module when the first hot spot temperature information indicates that the temperature of the target functional module is greater than a first temperature threshold;
the data processing subunit 603 is further configured to instruct a circuit start module in the target functional module to start the target functional module when receiving second hot spot temperature information uploaded by the hot spot temperature sensor in the target functional module and the second hot spot temperature information indicates that the temperature of the target functional module is less than a second temperature threshold.
In summary, in the overheat power-down protection system, in order to protect the safety of each functional module, a hot spot temperature sensor is arranged in each functional module, and the hot spot temperature sensor is independently powered, at this time, the temperature control module receives, through a temperature report bus, that the temperature acquired by the hot spot temperature sensor of a certain functional module is higher, and when a potential safety hazard exists, a signal is sent to a starting circuit unit in the functional module to instruct the functional module to perform power-off processing; however, because the hot spot temperature sensor and the temperature control module are independently powered, the power supply is isolated from the power supply of the monitored service module, even if the monitored service module is powered down, the hot spot temperature sensor can still acquire the temperature information of the functional module, and when the temperature information reaches a safety threshold, the functional module can be restarted; when the temperature of a certain monitored module rises to a dangerous threshold, the temperature control module can power down the monitored module, and the operation safety of the system can be still protected under the condition that the CPU temperature is too high and stops working. The method provides a design of closing and restarting the overheat module, thereby improving the overheat power-down protection effect, ensuring the safety of the system and improving the operation efficiency of the equipment.
Referring to fig. 7, a schematic diagram of a computer device according to an exemplary embodiment of the present application is provided, where the computer device includes a memory and a processor, and the memory is configured to store a computer program, and the computer program is executed by the processor to implement the data flow control method described above.
The processor may be a central processing unit (Central Processing Unit, CPU). The processor may also be any other general purpose processor, digital signal processor (Digital Signal Processor, DSP), application specific integrated circuit (Application Specific Integrated Circuit, ASIC), field programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof.
The memory, as a non-transitory computer readable storage medium, may be used to store non-transitory software programs, non-transitory computer-executable programs, and modules, such as program instructions/modules, corresponding to the methods in embodiments of the present invention. The processor executes various functional applications of the processor and data processing, i.e., implements the methods of the method embodiments described above, by running non-transitory software programs, instructions, and modules stored in memory.
The memory may include a memory program area and a memory data area, wherein the memory program area may store an operating system, at least one application program required for a function; the storage data area may store data created by the processor, etc. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some implementations, the memory optionally includes memory remotely located relative to the processor, the remote memory being connectable to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
In an exemplary embodiment, a computer readable storage medium is also provided for storing at least one computer program that is loaded and executed by a processor to implement all or part of the steps of the above method. For example, the computer readable storage medium may be Read-Only Memory (ROM), random-access Memory (Random Access Memory, RAM), compact disc Read-Only Memory (CD-ROM), magnetic tape, floppy disk, optical data storage device, and the like.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (7)
1. An overheat power-down protection system is characterized by comprising a temperature control module and each functional module;
each functional module comprises a starting circuit unit, a hot spot temperature sensor and a sub-service processing unit; the hot spot temperature sensor is mutually independent of the power supply of the starting circuit unit and the sub-service processing unit; the starting circuit unit is used for controlling the starting of the functional module according to the received temperature information under the condition of power supply;
The hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature reporting bus;
the temperature control module is used for controlling the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module;
the system also comprises a CPU master control module;
the CPU master control module comprises a power-on control unit and a hot spot temperature sensor; the hot spot temperature sensor is connected with the temperature control module through the temperature reporting bus; the power-on control unit is used for controlling the starting of the CPU master control module according to the received signal under the condition of power supply;
the temperature control module is connected with a power-on control circuit in the CPU master control module through a power-off control line; the temperature control module is connected with the starting circuit units of the functional modules through the power-down control line;
the temperature control module, the CPU master control module and the functional modules are powered by a system power supply bus, and the temperature control module, the CPU master control module and the functional modules comprise:
the system power supply bus is respectively connected with the power-on control unit of the CPU master control module and the hot spot temperature sensor so as to realize independent power supply of the power-on control unit of the CPU master control module and the hot spot temperature sensor respectively;
The system power supply bus is respectively connected with the starting circuit units of the functional modules and the hot spot temperature sensors so as to realize independent power supply of the starting circuit units of the functional modules and the hot spot temperature sensors.
2. The system of claim 1, further comprising a power module; the power module is connected with an external circuit to supply power to the overheat power-down protection system through a system power supply bus.
3. The system of claim 2, wherein the power module further comprises a power control unit and the hotspot temperature sensor; the power supply control unit is used for controlling the power supply condition on the system power supply bus according to the received signal when the external circuit is accessed;
the hot spot temperature sensor is connected with the temperature control module through a temperature reporting bus;
the temperature control module is also connected with a power supply control unit of the power supply module through the power-off control line.
4. A system according to claim 3, further comprising a backup power module; the standby power supply module is connected with the temperature control module and hot spot temperature sensors on all modules in the system;
And when the power supply control unit stops supplying power to the overheat power-down protection system through the system power supply bus, the standby power supply module is used for supplying power to the temperature control module and the hot spot temperature sensors on the modules in the system.
5. The overheat power-down protection method is characterized by being used for a temperature control module in an overheat power-down protection system; the overheat power-down protection system also comprises various functional modules;
each functional module comprises a starting circuit unit, a hot spot temperature sensor and a sub-service processing unit; the hot spot temperature sensor is mutually independent of the power supply of the starting circuit unit and the sub-service processing unit; the starting circuit unit is used for controlling the starting of the functional module according to the received temperature information under the condition of power supply;
the hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature reporting bus;
the temperature control module is used for controlling the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module;
the system also comprises a CPU master control module;
The CPU master control module comprises a power-on control unit and a hot spot temperature sensor; the hot spot temperature sensor is connected with the temperature control module through the temperature reporting bus; the power-on control unit is used for controlling the starting of the CPU master control module according to the received signal under the condition of power supply;
the temperature control module is connected with a power-on control circuit in the CPU master control module through a power-off control line; the temperature control module is connected with the starting circuit units of the functional modules through the power-down control line;
the temperature control module, the CPU master control module and the functional modules are powered by a system power supply bus, and the temperature control module, the CPU master control module and the functional modules comprise:
the system power supply bus is respectively connected with the power-on control unit of the CPU master control module and the hot spot temperature sensor so as to realize independent power supply of the power-on control unit of the CPU master control module and the hot spot temperature sensor respectively;
the system power supply bus is respectively connected with the starting circuit units of the functional modules and the hot spot temperature sensors so as to realize independent power supply of the starting circuit units of the functional modules and the hot spot temperature sensors;
The method comprises the following steps:
acquiring hot spot temperature information uploaded by hot spot temperature sensors in the functional modules through a temperature report bus;
when the first hot spot temperature information indicates that the temperature of a target functional module is greater than a first temperature threshold, indicating a circuit starting module in the target functional module, and performing power-off processing on the target functional module;
and when the second hot spot temperature information uploaded by the hot spot temperature sensor in the target functional module is accepted, and the second hot spot temperature information indicates that the temperature of the target functional module is smaller than a second temperature threshold value, a circuit starting module in the target functional module is indicated to start the target functional module.
6. The micro control unit is characterized by being applied to a temperature control module in an overheat power-down protection system; the overheat power-down protection system also comprises various functional modules; each functional module comprises a starting circuit unit, a hot spot temperature sensor and a sub-service processing unit; the hot spot temperature sensor is mutually independent of the power supply of the starting circuit unit and the sub-service processing unit; the starting circuit unit is used for controlling the starting of the functional module according to the received temperature information under the condition of power supply;
The hot spot temperature sensors in the functional modules are connected with the temperature control module through a temperature reporting bus;
the temperature control module is used for controlling the power supply state of each functional module according to the temperature information uploaded by the hot spot temperature sensor in each functional module;
the system also comprises a CPU master control module;
the CPU master control module comprises a power-on control unit and a hot spot temperature sensor; the hot spot temperature sensor is connected with the temperature control module through the temperature reporting bus; the power-on control unit is used for controlling the starting of the CPU master control module according to the received signal under the condition of power supply;
the temperature control module is connected with a power-on control circuit in the CPU master control module through a power-off control line; the temperature control module is connected with the starting circuit units of the functional modules through the power-down control line;
the temperature control module, the CPU master control module and the functional modules are powered by a system power supply bus, and the temperature control module, the CPU master control module and the functional modules comprise:
the system power supply bus is respectively connected with the power-on control unit of the CPU master control module and the hot spot temperature sensor so as to realize independent power supply of the power-on control unit of the CPU master control module and the hot spot temperature sensor respectively;
The system power supply bus is respectively connected with the starting circuit units of the functional modules and the hot spot temperature sensors so as to realize independent power supply of the starting circuit units of the functional modules and the hot spot temperature sensors;
the micro control unit comprises a transceiver subunit and a data processing subunit;
the receiving and transmitting subunit is used for acquiring hot spot temperature information uploaded by the hot spot temperature sensors in the functional modules through a temperature reporting bus;
the data processing subunit is configured to instruct a circuit starting module in the target functional module to perform power-off processing on the target functional module when the first hot spot temperature information indicates that the temperature of the target functional module is greater than a first temperature threshold;
and the data processing subunit is further configured to instruct a circuit starting module in the target functional module to start the target functional module when receiving second hot spot temperature information uploaded by the hot spot temperature sensor in the target functional module and the second hot spot temperature information indicates that the temperature of the target functional module is less than a second temperature threshold.
7. A computer readable storage medium having stored therein at least one instruction or information loaded and executed by a micro control unit to implement the method of claim 5.
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| 船舱热温度感应系统设计与实现;陈正振;;舰船科学技术;20180228(第04期);全文 * |
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