CN114089604A - Array graph drawing method and system - Google Patents
Array graph drawing method and system Download PDFInfo
- Publication number
- CN114089604A CN114089604A CN202111286402.9A CN202111286402A CN114089604A CN 114089604 A CN114089604 A CN 114089604A CN 202111286402 A CN202111286402 A CN 202111286402A CN 114089604 A CN114089604 A CN 114089604A
- Authority
- CN
- China
- Prior art keywords
- graph
- pattern
- array
- module
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000010586 diagram Methods 0.000 claims abstract description 31
- 238000000605 extraction Methods 0.000 claims abstract description 6
- 238000012544 monitoring process Methods 0.000 claims description 11
- 230000002159 abnormal effect Effects 0.000 claims description 6
- 238000009877 rendering Methods 0.000 claims description 6
- 230000005856 abnormality Effects 0.000 claims 1
- 238000012795 verification Methods 0.000 claims 1
- 238000001259 photo etching Methods 0.000 abstract description 10
- 238000013519 translation Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to an array graph drawing method, belongs to the technical field of photoetching, and solves the problem of low graph drawing speed in the prior art. The array pattern drawing method includes the following steps, S1; reading a vector graph file; s2, binarizing the vector diagram file; s3, extracting the outline in the graph; s4, matching the extracted contour with the contour in the template library; s5, performing unit grouping on the matched templates and recording the positions of the units; s6, performing fine drawing on the unit grouping graph; s7, filling the unit grouping graph after the refined drawing to the corresponding position recorded in the step S5. The invention realizes the extraction of the unit array graph in the vector diagram by processing the vector diagram, restores the unit group graph into the bitmap which can be identified by the photoetching machine by a translation filling mode after the unit group graph is drawn finely, and provides the photoetching machine for exposure.
Description
Technical Field
The invention belongs to the technical field of photoetching, relates to a method and a system for identifying and positioning a pattern based on photoetching positioning, and particularly relates to a method and a system for identifying and positioning a high-precision out-of-focus pattern.
Background
Laser Direct Imaging (LDI) is a technique in which a Laser direct imaging device is directly driven by data output from a CAM workstation, and pattern imaging is performed on a circuit board substrate coated with photoresist (similar to pattern imaging performed on a polyester substrate sheet by a Laser plotter), followed by development to obtain a desired pattern, and then etching and stripping are performed (to remove the remaining photoresist) to obtain a copper conductor pattern required for a circuit board. Obviously, LDI not only reduces the number of steps and simplifies the process of negative film manufacturing and application and storage and maintenance, but more importantly eliminates the problems of PCB dimensional accuracy and errors due to negative film pattern transfer.
In circuit board manufacturing, alignment problems include single-sided alignment, double-sided alignment (side-to-side), and interlayer alignment. For example, chinese patent publication No. CN102262358A discloses a double-sided alignment device and method for an inner layer board, which discloses an alignment method for an inner layer board, and discloses a double-sided alignment implemented by collecting alignment points through a pattern collection device during alignment.
In the field of PCB character printer technology, Gerber file is a two-dimensional vector graphics file format, which is a standard format used in printed circuit board industry software to describe printed circuit board graphics, such as: a circuit layer, a solder resist layer, a character layer, a drill hole layer, etc. The first step of the digital printer to realize the Gerber file for printing the vector is to analyze and convert the file format of the vector diagram into the bitmap file format of the dot matrix. However, in the prior art, the problems of long conversion time for converting the Gerber file into the bitmap file, low conversion efficiency and the like seriously affect the working efficiency of the printer. And because the multilayer printing needs to gather the counterpoint data between the different layers, because the printing precision is the micron order, the deviation that any position and angle appear when the PCB board is installed all can influence the printing precision, consequently all need carry out the counterpoint before every board is printed, promptly, print at every turn and must convert the vector diagram into the bitmap, therefore how to change Gerber file into the bitmap file fast effectual is the problem that technical personnel in this field need solve.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a high-efficiency drawing method for array graphics.
The aim of the invention can be achieved by the following technical scheme: an array graph drawing method comprises the following steps:
s1; reading a vector graph file;
s2, binarizing the vector diagram file;
s3, extracting the outline in the graph;
s4, matching the extracted contour with the contour in the template library;
s5, performing unit grouping on the matched templates and recording the positions of the units;
s6, performing fine drawing on the unit grouping graph;
s7, filling the unit grouping graph after the refined drawing to the corresponding position recorded in the step S5.
Because a large number of repeated patterns exist in a circuit on a PCB, and many patterns have obvious array characteristics, the patterns are formed by various units which do not pass through, clear boundaries exist between the units, and the units are not overlapped mutually, the method can extract contours after vector diagrams are binarized, the contours are matched by using a template to realize grouping among the contours, after the contours are grouped, only a single unit in the group needs to be drawn finely, and after the drawing of the single unit is completed, the patterns of the unit only need to be copied into the units corresponding to other positions, so that the pattern drawing speed can be greatly improved.
In the above-mentioned array pattern drawing method, in step S1, the read vector image is a Gerber file.
The drawing method further comprises a step S8 of finely drawing the images which are not grouped in the step S4 to form a complete bitmap file.
For the graph to be drawn on the PCB, if the extracted outlines in steps S3 and S4 are non-template outlines, it is determined as an irregular array graph, and at this time, the part of the graph is not grouped into cells, so that only the part of the graph can be individually drawn in a fine manner during drawing, so as to form a complete drawing file for printing by the lithography machine.
The method for drawing a graph further comprises a step S9 of obtaining the alignment data, wherein the step S9 can be performed synchronously with the steps S1 to S8, or between any steps S1 to S8. The aim of acquiring the alignment data is to accurately draw a circuit diagram on the PCB, and because the PCB is positioned by adopting a sucker during assembly, and has position, angle and even distortion and other deviations, the PCB needs to be printed by a method after the printing position is determined through the alignment data during printing, and the alignment data can be determined by identifying a plurality of positioning points on the PCB through a camera.
The image drawing method further comprises real-time alignment monitoring, in the image drawing process, the clock module is arranged, exposure images are periodically identified through the camera and transmitted to the drawing module to be compared, the drawing process is synchronous, if the identified exposure images are matched with the drawing module template, exposure continues, and if the identified exposure images are not matched with the drawing module template, an exposure abnormal signal is sent.
Another object of the present invention is to provide an array graphic drawing system, comprising:
the vector diagram reading module is used for identifying the vector diagram;
the binarization module is used for converting the vector diagram into a graph with higher contrast so as to conveniently extract the outline;
the contour extraction module is used for identifying the binarized graph and then extracting a clear contour, so that contour grouping is facilitated;
the contour matching module is used for comparing the extracted contour with the contours in the template library, identifying the contours capable of being grouped, recording the coordinates of the grouped units and facilitating subsequent filling;
the drawing module is used for finely drawing the specific units grouped by the units;
and the pattern filling module is used for filling the units subjected to fine drawing to specific positions according to the recorded coordinates and the number, so that the array filling of the fine drawing pattern is realized.
The system also comprises a graph checking module which checks the filled graphs, compares the checked graphs with the graphs identified by the vector diagram and draws the graphs which are not identified as unit groups and are subjected to array filling so as to form complete drawn graphs.
The system also comprises an alignment module, which is used for identifying alignment data through the camera and drawing graphs by using the alignment data as a reference.
The system also comprises a real-time monitoring module used for identifying whether the exposed graph is consistent with the set drawing graph.
In the above-mentioned array graph drawing system, the real-time monitoring module include camera acquisition unit, the clock unit, compare the unit, camera acquisition unit is used for gathering the figure of having exposed, the clock unit is used for regularly gathering camera data, compare the unit and be used for with the camera gather the figure of having exposed and set for drawing the figure contrast, if the figure of exposing of discernment matches with the figure of setting for drawing, then the exposure continues, if the figure of exposing of discernment does not match with the figure of setting for drawing, then send the exposure abnormal signal.
Compared with the prior art, the method has the advantages that the vector diagram is processed, the extraction of the unit array graph in the vector diagram is realized, the unit grouping graph is restored into the bitmap which can be identified by the photoetching machine in a translation filling mode after being drawn finely, the bitmap is exposed by the photoetching machine, the drawing time can be greatly saved, meanwhile, the method also realizes the monitoring of the exposed graph by using a real-time monitoring system, an exposure abnormal signal can be sent out when the exposed graph is different from the set graph, and the time waste and the material waste caused by the exposure error are avoided.
Drawings
FIG. 1 is a schematic illustration of a vector diagram of the present invention;
FIG. 2 is a schematic illustration of a vector diagram of the present invention;
FIG. 3 is a schematic workflow of the present invention;
fig. 4 is a schematic block diagram of the system of the present invention.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1 and 2, which are circuit diagrams on a conventional PCB, since a large number of repeated patterns (shown in red boxes of fig. 1 and 2) exist in the circuits on the PCB, and many of the repeated patterns have obvious array characteristics, the patterns are composed of a plurality of non-passing units, and clear boundaries exist between the units, and the units do not overlap with each other, the present invention provides a high-efficiency drawing method for the array patterns.
As shown in fig. 3, the method comprises the following steps:
s1; reading a vector graph file;
s2, binarizing the vector diagram file;
s3, extracting the outline in the graph;
s4, matching the extracted contour with the contour in the template library;
s5, performing unit grouping on the matched templates and recording the positions of the units;
s6, performing fine drawing on the unit grouping graph;
s7, filling the unit grouping graph after the refined drawing to the corresponding position recorded in the step S5.
By adopting the method, the vector diagram can be binarized firstly and then the contours are extracted, the contours are matched by utilizing the template to realize the grouping of the contours, after the grouping is completed, only a single unit in the group needs to be drawn finely, and after the drawing of the single unit is completed, only the graphic of the unit needs to be copied into the units corresponding to other positions, so that the graphic drawing speed can be greatly improved.
In step S1, the read vector image is a Gerber file.
The drawing method further comprises a step S8 of drawing the ungrouped graphs in the step S4 in a fine mode to form a complete bitmap file, and for the graphs to be drawn on the PCB, if the outlines extracted in the steps S3 and S4 are non-template outlines, the graphs are judged to be unconventional array graphs, at the moment, the parts of the graphs are not grouped in units, so that the parts of the graphs can only be drawn in a single fine mode during drawing, and the complete graph file is formed and printed by a photoetching machine.
The method for drawing a graph further comprises a step S9 of obtaining the alignment data, wherein the step S9 can be performed synchronously with the steps S1 to S8, or between any steps S1 to S8. The aim of acquiring the alignment data is to accurately draw a circuit diagram on the PCB, and because the PCB is positioned by adopting a sucker during assembly, and has position, angle and even distortion and other deviations, the PCB needs to be printed by a method after the printing position is determined through the alignment data during printing, and the alignment data can be determined by identifying a plurality of positioning points on the PCB through a camera.
In order to improve the drawing precision of the graph, the graph drawing method further comprises real-time alignment monitoring, in the graph drawing process, the exposure graph is periodically identified through the camera by arranging the clock module and is transmitted to the drawing module to be compared, so that the drawing process is ensured to be synchronous, if the identified exposure graph is matched with the drawing template, the exposure is continued, and if the identified exposure graph is not matched with the drawing template, an exposure abnormal signal is sent out.
Fig. 4 shows an array graphics rendering system provided by the present invention, which includes:
the vector diagram reading module is used for identifying the vector diagram;
the binarization module is used for converting the vector diagram into a graph with higher contrast so as to conveniently extract the outline;
the contour extraction module is used for identifying the binarized graph and then extracting a clear contour, so that contour grouping is facilitated;
the contour matching module is used for comparing the extracted contour with the contours in the template library, identifying the contours capable of being grouped, recording the coordinates of the grouped units and facilitating subsequent filling;
the drawing module is used for finely drawing the specific units grouped by the units;
and the pattern filling module is used for filling the units subjected to fine drawing to specific positions according to the recorded coordinates and the number, so that the array filling of the fine drawing pattern is realized.
The system also comprises a graph checking module which checks the filled graphs, compares the checked graphs with the graphs identified by the vector diagram and draws the graphs which are not identified as unit groups and are subjected to array filling so as to form complete drawn graphs.
The system also comprises an alignment module, which is used for identifying alignment data through the camera and drawing graphs by using the alignment data as a reference.
The system also comprises a real-time monitoring module used for identifying whether the exposed graph is consistent with the set drawing graph.
The real-time monitoring module comprises a camera acquisition unit, a clock unit and a comparison unit, wherein the camera acquisition unit is used for acquiring an exposed graph, the clock unit is used for acquiring camera data at regular time, the comparison unit is used for comparing the exposed graph acquired by the camera with a set drawing graph, if the identified exposed graph is matched with the set drawing graph, exposure continues, and if the identified exposed graph is not matched with the set drawing graph, an exposure abnormal signal is sent.
The invention realizes the extraction of the unit array graph in the vector diagram by processing the vector diagram, restores the unit group graph into the bitmap which can be identified by the photoetching machine in a translation filling mode after finely drawing the unit group graph for the exposure of the photoetching machine.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. An array graph drawing method comprises the following steps:
s1; reading a vector graph file;
s2, binarizing the vector diagram file;
s3, extracting the outline in the graph;
s4, matching the extracted contour with the contour in the template library;
s5, performing unit grouping on the matched templates and recording the positions of the units;
s6, performing fine drawing on the unit grouping graph;
s7, filling the unit grouping graph after the refined drawing to the corresponding position recorded in the step S5.
2. An array graphic rendering method according to claim 1, wherein in step S1, the read vector image is a Gerber file.
3. An array pattern drawing method according to claim 1 or 2, wherein the drawing method further comprises a step S8 of finely drawing the patterns not grouped in the step S4 to form a complete bitmap file.
4. An array pattern rendering method as claimed in claim 3, further comprising a step S9 of obtaining the alignment data, wherein the step S9 is performed synchronously with the steps S1 to S8, or between any of the steps S1 to S8.
5. The method for drawing an array pattern according to claim 1 or 2, wherein the method for drawing an array pattern further comprises real-time alignment monitoring, wherein in the process of drawing the pattern, a clock module is arranged, exposure patterns are periodically identified through a camera and transmitted to a drawing module for comparison so as to ensure synchronization of the drawing process, if the identified exposure patterns are matched with a drawing template, exposure is continued, and if the identified exposure patterns are not matched with the drawing template, an exposure abnormal signal is sent out.
6. An array graphics rendering system, comprising:
the vector diagram reading module is used for identifying the vector diagram;
the binarization module is used for converting the vector diagram into a graph with higher contrast so as to conveniently extract the outline;
the contour extraction module is used for identifying the binarized graph and then extracting a clear contour, so that contour grouping is facilitated;
the contour matching module is used for comparing the extracted contour with the contours in the template library, identifying the contours capable of being grouped, recording the coordinates of the grouped units and facilitating subsequent filling;
the drawing module is used for finely drawing the specific units grouped by the units;
and the pattern filling module is used for filling the units subjected to fine drawing to specific positions according to the recorded coordinates and the number, so that the array filling of the fine drawing pattern is realized.
7. An array graphics rendering system as claimed in claim 6, further comprising a graphics verification module for verifying the filled graphics, comparing the checked graphics with graphics identified by vector graphics, and rendering graphics not identified as unit groups for array filling to form complete rendered graphics.
8. An array pattern drawing system according to claim 6 or 7, further comprising an alignment module for recognizing alignment data by the camera and drawing a pattern by using the alignment data as a reference.
9. An array pattern drawing system according to claim 6 or 7, further comprising a real-time monitoring module for identifying whether the exposed pattern coincides with the set drawing pattern.
10. The array pattern drawing system of claim 9, wherein the real-time monitoring module comprises a camera collecting unit, a clock unit, and a comparing unit, the camera collecting unit is used for collecting the exposed pattern, the clock unit is used for collecting the camera data at regular time, the comparing unit is used for comparing the exposed pattern collected by the camera with the set drawing pattern, if the identified exposed pattern matches with the set drawing pattern, the exposure is continued, and if the identified exposed pattern does not match with the set drawing pattern, the exposure abnormality signal is sent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111286402.9A CN114089604B (en) | 2021-11-02 | 2021-11-02 | Array graph drawing method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111286402.9A CN114089604B (en) | 2021-11-02 | 2021-11-02 | Array graph drawing method and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114089604A true CN114089604A (en) | 2022-02-25 |
| CN114089604B CN114089604B (en) | 2024-06-21 |
Family
ID=80298573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111286402.9A Active CN114089604B (en) | 2021-11-02 | 2021-11-02 | Array graph drawing method and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114089604B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114862987A (en) * | 2022-05-27 | 2022-08-05 | 苏州天准科技股份有限公司 | Method for improving reliability of data link |
| CN116011399A (en) * | 2023-03-27 | 2023-04-25 | 深圳前海硬之城信息技术有限公司 | Method, device and equipment for generating PCB drawing and storage medium |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050065623A1 (en) * | 2003-09-05 | 2005-03-24 | Pentax Industrial Instruments Co., Ltd. | Vector-graphic data processing method and drawing apparatus |
| CN102841926A (en) * | 2012-07-12 | 2012-12-26 | 南京师范大学 | Scale-adaptive bitmap embedded coding method of element of vector data set |
| CN104240245A (en) * | 2014-09-10 | 2014-12-24 | 中国科学院光电技术研究所 | Method for converting vector graphics into bitmap and performing self-adaptive segmentation |
| KR101761140B1 (en) * | 2016-01-21 | 2017-07-25 | 이주성 | Mapping method for images |
| CN109710264A (en) * | 2018-12-19 | 2019-05-03 | 森大（深圳）技术有限公司 | Gerber file method for transformation, system, equipment and storage medium |
-
2021
- 2021-11-02 CN CN202111286402.9A patent/CN114089604B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050065623A1 (en) * | 2003-09-05 | 2005-03-24 | Pentax Industrial Instruments Co., Ltd. | Vector-graphic data processing method and drawing apparatus |
| CN102841926A (en) * | 2012-07-12 | 2012-12-26 | 南京师范大学 | Scale-adaptive bitmap embedded coding method of element of vector data set |
| CN104240245A (en) * | 2014-09-10 | 2014-12-24 | 中国科学院光电技术研究所 | Method for converting vector graphics into bitmap and performing self-adaptive segmentation |
| KR101761140B1 (en) * | 2016-01-21 | 2017-07-25 | 이주성 | Mapping method for images |
| CN109710264A (en) * | 2018-12-19 | 2019-05-03 | 森大（深圳）技术有限公司 | Gerber file method for transformation, system, equipment and storage medium |
Non-Patent Citations (1)
| Title |
|---|
| 朱天奕;金国强;竺长安;: "基于图像处理的PCB在线前景提取方法", 工业控制计算机, no. 05, 25 May 2018 (2018-05-25) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114862987A (en) * | 2022-05-27 | 2022-08-05 | 苏州天准科技股份有限公司 | Method for improving reliability of data link |
| CN116011399A (en) * | 2023-03-27 | 2023-04-25 | 深圳前海硬之城信息技术有限公司 | Method, device and equipment for generating PCB drawing and storage medium |
| CN116011399B (en) * | 2023-03-27 | 2023-06-13 | 深圳前海硬之城信息技术有限公司 | Method, device and equipment for generating PCB drawing and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114089604B (en) | 2024-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114089604B (en) | Array graph drawing method and system | |
| CN102271464B (en) | Method for tracing quality of circuit board | |
| WO2000057458A1 (en) | Method of manufacturing semiconductor device and semiconductor device manufactured by it | |
| TWI300677B (en) | Manufacturing and apparatus for printing mark on detective board | |
| CN106647188B (en) | Exposure system with double-sided alignment function | |
| US11937369B2 (en) | Traceability of subsequent layer structure manufacturing of main body for component carriers by means of laterally and vertically displaced information carrying structures | |
| CN110399937B (en) | Information detection method for printed circuit board | |
| Hong et al. | Parallel processing machine vision system for bare PCB inspection | |
| CN115460783B (en) | Method for ink-jet printing solder mask of PCB (printed circuit board) | |
| CN106896653A (en) | It is a kind of to be applied to the method that direct write exposure machine makes the non-porous aligning plate of internal layer | |
| CN109426674A (en) | A kind of printed circuit board detecting method and system | |
| CN100516845C (en) | Reading apparatus | |
| CN108012437A (en) | Flexible circuit board processing procedure retrospect Quick Response Code etching production method | |
| CN114148103B (en) | Solder paste printing mark recognition method and system based on neural network learning | |
| CN118215226A (en) | Printing method, device, equipment and storage medium for PCB characters and labels | |
| CN210488543U (en) | Device for automatically searching and applying electronic graphic data | |
| CN116419491A (en) | Anti-soldering area exposure cost-saving processing method for PCB semi-finished product | |
| CN102740667A (en) | Placement method for integrating circuit board information | |
| Ercal et al. | Fast modular RLE-based inspection scheme for PCBs | |
| JP4446845B2 (en) | Printed circuit board manufacturing method and manufacturing apparatus | |
| JP3116438B2 (en) | Inspection apparatus and inspection method for printed wiring board | |
| JP2001308545A (en) | Manufacturing device of printed circuit board and manufacturing method thereof | |
| JP4823605B2 (en) | Exposure apparatus, exposure method, and pattern manufacturing system | |
| CN114820613B (en) | Incoming material measuring and positioning method for SMT (surface mount technology) patch processing | |
| US20240196544A1 (en) | Process method for laser removal of substrate solder mask |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |