CN114086245B

CN114086245B - Circulating cooling system and crystal growth furnace

Info

Publication number: CN114086245B
Application number: CN202111397595.5A
Authority: CN
Inventors: 李帅; 刘家朋; 潘亚妮; 邵红; 李硕; 石志强
Original assignee: Shandong Tianyue Advanced Technology Co Ltd
Current assignee: Shandong Tianyue Advanced Technology Co Ltd
Priority date: 2021-11-23
Filing date: 2021-11-23
Publication date: 2022-08-26
Anticipated expiration: 2041-11-23
Also published as: CN114086245A

Abstract

The application discloses circulative cooling system and long brilliant stove especially relate to a circulative cooling system and long brilliant stove that is used for carborundum to grow, circulative cooling system includes: a circulation line; the cooling assembly comprises a cooling cavity, a buffer cavity, a first cooling medium, a second cooling medium and a third cooling medium, the buffer cavity and the piece to be cooled are respectively connected with the circulating pipeline, the buffer cavity and the piece to be cooled form a closed loop together, and the cooling cavity can be communicated with the buffer cavity; the first cooling medium cools the second cooling medium in the cooling cavity, the cooled second cooling medium continues to cool the third cooling medium, and the third cooling medium circulates between the closed loops to cool the heat conductor of the member to be cooled. The circulating cooling system can ensure the uniform transfer of heat, is used in a crystal growth furnace, is beneficial to keeping the stability of a thermal field in the crystal growth furnace, and can improve the crystal growth quality.

Description

Circulating cooling system and crystal growth furnace

Technical Field

The application relates to a circulating cooling system and a crystal growing furnace, in particular to a circulating cooling system and a crystal growing furnace for silicon carbide growth, and belongs to the technical field of heat exchange.

Background

Silicon carbide single crystal is one of the most important third-generation semiconductor materials, and is widely applied to the fields of power electronics, radio frequency devices, photoelectronic devices and the like because of the excellent properties of large forbidden bandwidth, high saturated electron mobility, strong breakdown field, high thermal conductivity and the like. Despite the great progress made in the growth of silicon carbide crystals by physical vapor transport in recent years, the stability of the crystals grown therefrom still needs to be further investigated.

At present, a crystal growth furnace for growing the silicon carbide crystal mainly cools a hearth through circulating cooling water, the crystal growth process usually needs a long time, so that a large amount of cooling water needs to be consumed, and the cooling water is inevitably mixed with partial granular impurities and the like in the process of being input from the outside to influence the growth stability of the silicon carbide crystal; in addition, in the crystal growth process, the stability requirement of a thermal field in the furnace is high, the stability of the thermal field determines the stability of the crystal growth, the yield of the crystal is influenced finally, and defects such as polytype or microtubule and the like can be caused on the crystal, so that the temperature stability of cooling water needs to be maintained in the crystal growth process; in addition, the temperature required in the crystal growth process of different batches may be different, so the temperature of the cooling water needs to be adjusted according to the set temperature to control the temperature outside the hearth.

Disclosure of Invention

In order to solve the problems, the application provides a circulating cooling system and a crystal growing furnace. The circulating cooling system can ensure the uniform transfer of heat, is used in a crystal growth furnace, is beneficial to keeping the stability of a thermal field in the crystal growth furnace, and can improve the crystal growth quality.

According to an aspect of the present application, there is provided a circulation cooling system including:

a circulation line;

the cooling assembly comprises a cooling cavity, a buffer cavity, a first cooling medium, a second cooling medium and a third cooling medium, the buffer cavity and the piece to be cooled are respectively connected with the circulating pipeline, the buffer cavity and the piece to be cooled form a closed loop together, and the cooling cavity can be communicated with the buffer cavity;

the first cooling medium cools the second cooling medium in the cooling cavity, the cooled second cooling medium continues to cool the third cooling medium, and the third cooling medium circulates between the closed loops to cool the to-be-cooled part.

Optionally, the second cooling medium comprises a plurality of heat conductors, each of which is movable between the cooling chamber and the buffer chamber;

preferably, when at least one heat conductor is located in the cooling cavity to be cooled, the rest of the heat conductors are located in the buffer cavity to continue cooling the third cooling medium.

Optionally, the buffer cavity and the cooling cavity jointly form a "return" structure, and the cooling cavity is located in at least one side edge of the "return" structure;

preferably, the "return" structure comprises a first side wall and a second side wall sleeved inside the first side wall, and a conveyor belt is connected to the inner wall of the first side wall and/or the outer wall of the second side wall and is used for enabling the heat conductor to circularly move in the "return" structure.

Optionally, the second cooling medium is made of a metal material, the conveyor belt is provided with a first electromagnetic device, and the second cooling medium is connected with the conveyor belt through the first electromagnetic device.

Optionally, the number of the buffer cavities is at least two, each buffer cavity can be communicated with the cooling cavity, each buffer cavity and the cooling cavity form a "return" structure, a plurality of heat conductors are arranged in each "return" structure, and the cooling capacities of the second cooling media in different "return" structures are different;

when one of the buffer cavities is communicated with the cooling cavity, the rest of the buffer cavities are not communicated with the cooling cavity.

Optionally, the cooling assembly further includes a storage bin, the storage bin is connected to the cooling cavity, and a second electromagnetic device is disposed in the storage bin;

when the first electromagnetic device is closed, the second electromagnetic device can attract at least part of the heat conductor into the storage bin, so that the cooling cavity is in a cavity state; when the second electromagnetic device is turned off, the first electromagnetic device can attract at least part of the heat conductor in the storage bin to the cooling cavity.

Optionally, the cooling cavity is connected with the buffer cavity through a valve,

when the first cooling medium cools the second cooling medium, the valve is closed, the third cooling medium in the cooling cavity is discharged, and the first cooling medium is introduced into the cooling cavity to cool the second cooling medium; and after the second cooling medium is cooled, the first cooling medium in the cooling cavity is discharged, the valve is opened, and the cooling cavity and the buffer cavity jointly form a closed loop with the circulating pipeline.

Optionally, the cooling assembly further comprises a first power means for powering the circulation of the third cooling medium.

Optionally, the first cooling medium is liquid nitrogen; and/or

The third cooling medium is water.

According to another aspect of the application, a crystal growth furnace is provided, and comprises a furnace body, a double-layer quartz tube and a circulating cooling system, wherein a circulating pipeline of the circulating cooling system is connected with the double-layer quartz tube, the circulating pipeline, the double-layer quartz tube and a buffer cavity form a closed loop, and a third cooling medium circulates in the closed loop;

wherein the circulating cooling system is selected from any one of the circulating cooling systems described above.

Benefits that can be produced by the present application include, but are not limited to:

1. according to the circulating cooling system provided by the application, the cooling cavity is arranged, so that heat exchange is carried out between the first cooling medium and the second cooling medium in the cooling cavity, the second cooling medium is cooled, the second cooling medium is continuously subjected to heat exchange with the third cooling medium, and the third cooling medium is cooled, so that heat is transferred between the first cooling medium and the third cooling medium; in addition, the third cooling medium circulates in the circulating cooling system, and heat exchange with the outside is performed by the second cooling medium, so that the third cooling medium can be prevented from being contaminated by the outside.

2. According to the circulating cooling system, the cooling assembly comprises at least two 'return' structures, and the cooling capacities of the second cooling media in the different 'return' structures are different, so that the cooling cavity can be controlled to be connected with different buffer cavities, the cooling degree of the third cooling media is controlled to be different, and the temperature of the third cooling media is flexibly controlled; through setting up every cushion chamber and all forming "back" word structure with the cooling chamber, save space improves the device integration nature.

3. The crystal growth furnace is used for growing silicon carbide single crystals, is stable in thermal field and high in crystal growth quality, and greatly saves the using amount of a third cooling medium.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic view of a crystal growth furnace according to embodiments 1 and 2 of the present application;

fig. 2 is a schematic view of a structure of a loop in a circulation cooling system according to embodiment 1 of the present application;

fig. 3 is a schematic view of a combination of a plurality of "loop" structures in the circulation cooling system according to embodiment 1 of the present application;

fig. 4 is a schematic front cross-sectional view of a combination of a plurality of "loop" structures in the circulation cooling system according to embodiment 1 of the present application.

List of parts and reference numerals:

1. a circulation line; 2. a cooling assembly; 21. a cooling chamber; 22. a buffer chamber; 23. a third cooling medium; 24. a first power unit; 25. a transit trough; 26. a water injection port; 27. a water outlet; 28. a liquid nitrogen storage tank; 29. a liquid nitrogen recovery tank; 30. a heat conductor; 31. a valve; 32. a conveyor belt; 33. a storage bin; 34. a pump body; 4. a furnace body; 5. a double-layer quartz tube.

Detailed Description

In order to more clearly explain the overall concept of the present application, the following detailed description is given by way of example in conjunction with the accompanying drawings.

In order that the above objects, features and advantages of the present application can be more clearly understood, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.

In addition, in the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The circulating cooling system of the present application can be used in a production process for cooling any to-be-cooled piece or generating a large amount of waste heat, such as a brazing device, etc., and the following embodiments take a crystal growth furnace required by a silicon carbide crystal growth process as an example to illustrate the working process of the circulating cooling system, but are not limited to the application scenario.

Example 1

As shown in fig. 1 to 4, an embodiment of the present application discloses a circulation cooling system, which includes: a circulation line 1 and a cooling module 2; the cooling assembly 2 comprises a cooling cavity 21, a buffer cavity 22, a first cooling medium, a second cooling medium and a third cooling medium 23, the buffer cavity 22 and the to-be-cooled part are respectively connected with the circulating pipeline 1, the buffer cavity 22 and the to-be-cooled part form a closed loop together, and the cooling cavity 21 and the buffer cavity 22 can be communicated; the first cooling medium cools the second cooling medium in the cooling chamber 21, the cooled second cooling medium continues to cool the third cooling medium 23, and the third cooling medium 23 circulates between the closed circuits to cool the member to be cooled 30.

By arranging the cooling cavity 21, heat exchange is generated between the first cooling medium and the second cooling medium in the cooling cavity 21, the second cooling medium is cooled, heat exchange is continuously generated between the second cooling medium and the third cooling medium 23, and the third cooling medium 23 is cooled, so that heat is transferred between the first cooling medium and the third cooling medium 23; in addition, the third cooling medium 23 circulates in the circulating cooling system, and heat exchange with the outside is completed through the second cooling medium, so that the third cooling medium 23 can be prevented from being polluted by the outside, crystal growth stability is maintained, and crystal growth quality is guaranteed.

Specifically, the number of the cooling assemblies 2 is not limited in this embodiment, and it is understood that, in order to improve the cooling efficiency, multiple sets of cooling assemblies 2 may be arranged in parallel, for example, two sets, three sets, or four sets may be provided. For convenience of description, the present embodiment describes the structure of one group of cooling modules 2, and when the cooling modules 2 are multiple groups, the remaining groups of cooling modules 2 may have the same structure as the group of cooling modules 2.

It will be appreciated that in order to ensure that the third cooling medium 23 can circulate between the closed circuits, a first power means 24 is also provided, the first power means 24 being arranged to provide circulating power for the third cooling medium 23. Specifically, the first power plant 24 is a circulation pump.

Specifically, the cooling module 2 further includes a transfer groove 25 connected to the buffer chamber 22, and the transfer groove 25, the buffer chamber 22 and the circulation line 1 form a closed loop together. The transfer tank 25 is provided with a water injection port 26 and a water outlet 27, the water injection port 26 is used for supplementing the third cooling medium 23 into the closed loop, and the water outlet 27 is used for discharging the redundant third cooling medium 23 in the closed loop.

Specifically, the present embodiment does not limit the types of the first cooling medium and the second cooling medium, as long as the temperature of the first cooling medium is lower than that of the second cooling medium, so as to implement the cooling of the second cooling medium. Preferably, the first cooling medium is liquid nitrogen in order to ensure the cooling capacity of the first cooling medium, and the second cooling medium is made of metal in order to ensure the thermal conductivity of the second cooling medium. More preferably, the second cooling medium is made of stainless steel in order to prevent corrosion and the like of the second cooling medium during long-term use.

Referring to fig. 2, in particular, the cooling chamber 21 is connected to a liquid nitrogen storage tank 28 and a liquid nitrogen recovery tank 29, the liquid nitrogen storage tank 28 is used for delivering liquid nitrogen, i.e., the first cooling medium, into the cooling chamber 21, and the liquid nitrogen recovery tank 29 is used for recovering the first cooling medium in the cooling chamber 21. The liquid nitrogen storage tank 28 and the liquid nitrogen recovery tank 29 may be connected to the cooling chamber 21 through butterfly valves.

Specifically, the shape of the second cooling medium is not limited, and may be, for example, a cube, a rectangular parallelepiped, a sphere, a pyramid, or a prism. Preferably, in order to ensure the contact area between the second cooling medium and the third cooling medium 23, the second cooling medium in the present embodiment is a sphere.

It will be appreciated that, in order to ensure a smooth circulation of the third cooling medium 23, the third cooling medium 23 is a fluid, which may be water or another flowable cooling medium, for example. The third cooling medium 23 in this embodiment is water.

Specifically, the process of heat exchange between the second cooling medium and the third cooling medium 23 may be performed in the cooling chamber 21, in the buffer chamber 22, or in both the cooling chamber 21 and the buffer chamber 22. It will be appreciated that the third cooling medium 23, when carried out in the cooling chamber 21, can flow from the closed circuit into the cooling chamber 21; when proceeding in the buffer chamber 22, the second cooling medium can be transferred from the cooling chamber 21 into the buffer chamber 22; when the cooling chamber 21 and the buffer chamber 22 are simultaneously operated, the cooling chamber 21 and the buffer chamber 22 are in a communication state, the third cooling medium 23 can flow between the cooling chamber 21 and the buffer chamber 22, and preferably, the second cooling medium can be transferred from the cooling chamber 21 into the buffer chamber 22, so that heat exchange between the second cooling medium and the third cooling medium 23 is realized.

As an embodiment, the second cooling medium comprises a plurality of heat conducting bodies 30, each heat conducting body 30 being movable between the cooling chamber 21 and the buffer chamber 22. By arranging the second cooling medium to comprise a plurality of heat conductors 30, the heat conductors 30 can exchange heat with the first cooling medium and the third cooling medium 23, so that the cooling efficiency is improved, the contact area between the second cooling medium and the third cooling medium 23 can be increased, the temperature uniformity of the third cooling medium 23 is ensured, the influence on the crystal growth stability caused by the large temperature difference of cooling water at different positions outside the crystal growth furnace is avoided, and the crystal growth quality is further improved; by providing the heat conducting body 30 movable between the cooling chamber 21 and the buffer chamber 22, a recycling of the heat conducting body 30 is ensured as an intermediate conducting medium between the first cooling medium and the third cooling medium 23.

Specifically, the third cooling medium 23 may be cooled by cooling all the heat conductors 30 together in the cooling chamber 21; it is also possible to cool a part of the heat conducting body 30 in the cooling chamber 21 while the remaining part is still located in the buffer chamber 22 for cooling the third cooling medium 23.

In a preferred embodiment, when at least one of the heat conducting bodies 30 is located in the cooling chamber 21 to be cooled, the remaining heat conducting bodies 30 are located in the buffer chamber 22 to continue cooling the third cooling medium 23. This arrangement can improve the cooling efficiency.

Specifically, the present embodiment does not limit the connection structure between the buffer chamber 22 and the cooling chamber 21, as long as the movement of the plurality of heat conductors 30 between the buffer chamber 22 and the cooling chamber 21 can be achieved.

With continued reference to fig. 2, as an embodiment, the buffer chamber 22 and the cooling chamber 21 together form a "loop" structure, and the cooling chamber 21 is located in at least one side of the "loop" structure. By providing a "return" between the buffer chamber 22 and the cooling chamber 21 and forming the cooling chamber 21 on at least one side of the "return" structure, the heat conductor 30 is switched between the buffer chamber 22 and the cooling chamber 21 and the third cooling medium 23 flows between the buffer chamber 22 and the heat conductor 30.

Specifically, the position and the occupied volume of the cooling cavity 21 in the "return" structure are not limited in this embodiment, for example, the cooling cavity 21 may be located in a partial area or a whole area of one side of the "return" structure, or in partial areas or whole areas of two sides, as long as the second cooling medium can be cooled.

As an embodiment, the plurality of thermal conductors 30 are divided into four groups of thermal conductors 30. Each set of thermal conductors 30 is located within one side of the "return" structure. Preferably, the cooling cavity 21 is located in one side of the "return" structure, the volume of the cooling cavity 21 occupies one fourth of the "return" structure, and a set of heat conductors 30 is disposed in the cooling cavity 21.

In one embodiment, the cooling chamber 21 is connected to the buffer chamber 22 through a valve 31, when the first cooling medium cools the second cooling medium, the valve 31 is closed, the third cooling medium 23 in the cooling chamber 21 is discharged, and the first cooling medium is introduced into the cooling chamber 21 to cool the second cooling medium; when the cooling of the second cooling medium is completed, the first cooling medium in the cooling chamber 21 is discharged, the valve 31 is opened, and the cooling chamber 21 and the buffer chamber 22 jointly form a closed loop with the circulation pipeline 1.

For convenience of description, the four groups of thermal conductors 30 are referred to as a first group of thermal conductors, a second group of thermal conductors, a third group of thermal conductors, and a fourth group of thermal conductors, respectively. When the first group of heat-conducting bodies is cooled in the cooling cavity 21, the second, third and fourth groups of heat-conducting bodies 30 are all located in the buffer cavity 22, and cool the third cooling medium 23 in the buffer cavity 22. When the first group of heat conductors is cooled, the first group of heat conductors are transferred into the buffer cavity 22, the second group of heat conductors are transferred into the cooling cavity 21, the valve 31 can be closed to continue cooling the second group of heat conductors, and the valve 31 can also be opened to enable the third cooling medium 23 to circulate between the cooling cavity 21 and the buffer cavity 22.

In one embodiment, the "return" structure includes a first side wall and a second side wall sleeved inside, the inner wall of the first side wall and/or the outer wall of the second side wall is connected with a conveyor belt 32, and the conveyor belt 32 is used for circulating the heat conductor 30 in the "return" structure. The movement of the plurality of heat-conducting bodies 30 between the cooling chamber 21 and the buffer chamber 22 is achieved by providing a conveyor belt 32 for transporting the heat-conducting bodies 30.

In particular, the outer wall of the second side wall is connected with a conveyor belt 32.

Specifically, the connection mode between the heat conductor 30 and the conveyor belt 32 is not limited in this embodiment, and may be a fixed connection or a detachable connection. When the connection is fixed, welding and other modes can be adopted; when the detachable connection is realized, the connection can be realized in a buckling mode and the like.

In one embodiment, the second cooling medium is made of metal, the conveyor belt 32 is provided with a first electromagnetic device, and the second cooling medium is connected with the conveyor belt 32 through the first electromagnetic device. This arrangement allows flexible control of the connection or disconnection between the thermal conductor 30 and the belt 32.

When the first electromagnetic device is turned on, the second cooling medium is connected to the conveyor belt 32; when the first electromagnetic device is switched off, the second cooling medium is disconnected from the conveyor belt 32.

Referring to fig. 3-4, as an embodiment, there are at least two buffer cavities 22, each buffer cavity 22 can be communicated with the cooling cavity 21, and each buffer cavity 22 and the cooling cavity 21 form a "return" structure, each "return" structure has a plurality of heat conductors 30 therein, and the heat conductors 30 in different "return" structures have different cooling capacities; when one of the buffer chambers 22 communicates with the cooling chamber 21, the remaining buffer chambers 22 are in a non-communicating state with the cooling chamber 21. By arranging the cooling component 2 to comprise at least two structures in the shape of the Chinese character 'hui', and the cooling capacities of the second cooling media in different structures in the shape of the Chinese character 'hui' are different, the cooling cavity 21 can be controlled to be connected with different buffer cavities 22, so that the cooling degree of the third cooling media 23 is controlled to be different, and the temperature of the third cooling media 23 can be flexibly controlled according to the temperatures required by different batches of crystal growth; by arranging each buffer cavity 22 and each cooling cavity 21 to form a 'return' structure, the space is saved, and the integration of the device is improved.

In particular, the cooling capacity of the second cooling medium in the different "return" configurations can be controlled by controlling the size, number or density of the thermally conductive bodies 30. Preferably, in this embodiment, the number of the heat conducting bodies 30 is controlled to control the cooling capacity of the second cooling medium in different "return" structures, and the size, density and other properties of the heat conducting bodies 30 are the same.

Specifically, the number of the buffer cavities 22 is not limited in this embodiment, and may be, for example, three, four, five, or six. Preferably, the number of the buffer cavities 22 is four, and the four buffer cavities 22 are uniformly distributed, and the cooling cavity 21 is located at the intersection of the four buffer cavities 22.

It is understood that each of the buffer chambers 22 is connected to the circulation line 1 through an on-off valve, and when one of the buffer chambers 22 is in communication with the cooling chamber 21, the on-off valve between the buffer chamber 22 and the circulation line 1 is in an open state, the remaining buffer chambers 22 are not in communication with the cooling chamber 21, and the on-off valve between the remaining buffer chambers 22 and the circulation line 1 is in a closed state.

For convenience of description, the four buffer cavities 22 are respectively referred to as a first buffer cavity, a second buffer cavity, a third buffer cavity and a fourth buffer cavity, and the "return" structures formed by the four buffer cavities 22 and the cooling cavity 21 are referred to as a first "return" structure, a second "return" structure, a third "return" structure and a fourth "return" structure.

For example, the number of the heat conductors 30 in the first loop structure is 12, and 12 heat conductors 30 are evenly distributed in the first loop structure, so as to further ensure the uniformity of cooling the third cooling medium 23; the number of the heat conductors 30 in the second loop structure is 20, and the 20 heat conductors 30 are evenly distributed in the second loop structure; the number of the heat conductors 30 in the third Chinese character 'hui' structure is 28, and the 28 heat conductors 30 are evenly distributed in the third Chinese character 'hui' structure; the number of the heat conductors 30 in the fourth zigzag structure is 36, and the 36 heat conductors 30 are evenly distributed in the fourth zigzag structure.

With continued reference to fig. 3-4, as an embodiment, the cooling module 2 further includes a storage chamber 33, the storage chamber 33 is connected to the cooling chamber 21, and the second electromagnetic device is disposed in the storage chamber 33; when the first electromagnetic device is turned off, the second electromagnetic device can attract at least part of the heat conductor 30 into the storage chamber 33, so that the cooling chamber 21 is in a cavity state; when the second electromagnetic device is switched off, the first electromagnetic device is able to attract at least part of the heat conductor 30 inside the storage compartment 33 into the cooling chamber 21. By arranging the storage chamber 33 to be connected with the cooling chamber 21, a part of the heat conductor 30 in the cooling chamber 21 in the first 'return' structure can be attracted into the storage chamber 33, so that the cooling chamber 21 is in a cavity state, and a space is reserved for a part of the heat conductor 30 in the second 'return' structure.

Specifically, each buffer chamber 22 corresponds to one storage bin 33, so as to provide storage space for the heat conductor 30 in the corresponding "return" structure, which is respectively marked as a first storage bin, a second storage bin, a third storage bin and a fourth storage bin.

It will be understood that each of the "return" structures has a heat conducting body 30 in the cooling chamber 21, however, since a plurality of "return" structures share one cooling chamber 21, when one of the "return" structures is in operation, the heat conducting body 30 in the cooling chamber 21 in the other "return" structure should be discharged from the cooling chamber 21, and therefore the storage compartment 33 is provided to store the heat conducting body 30 in the cooling chamber 21 in the other "return" structure.

Specifically, a pump 34 is provided between the cooling chamber 21 and the relay tank 25, and the pump 34 is configured to discharge the third cooling medium 23 in the cooling chamber 21 to the relay tank 25. When the first group of heat conductors is cooled in the cooling chamber 21, the third cooling medium 23 in the cooling chamber 21 needs to be discharged, and by providing the pump body 34, the third cooling medium 23 does not need to be discharged from the circulating cooling system.

For convenience of description, the valve 31 between the first buffer chamber and the cooling chamber 21 is referred to as a first valve, the valve 31 between the second buffer chamber and the cooling chamber 21 is referred to as a second valve, the valve 31 between the third buffer chamber and the cooling chamber 21 is referred to as a third valve, and the valve 31 between the fourth buffer chamber and the cooling chamber 21 is referred to as a fourth valve.

The operation process of the circulating cooling system is as follows: taking the first "return" structure as an example, the first valve is opened, the second valve, the third valve and the fourth valve are closed, the circulation pipeline 1 is connected with the first "return" structure, at this time, the conveyor belt 32 moves, the second cooling medium cools the third cooling medium 23 in the buffer cavity 22 and the cooling cavity 21, and the time for one cycle of the third cooling medium 23 circulating in the closed system can be calculated by calculating the volume of the third cooling medium 23 in the circulation cooling system and the flow rate of the third cooling medium 23 in the circulation pipeline 1, which is denoted as T. After the interval T, entering a staying cooling stage, wherein the staying cooling stage can be 30s, in the staying cooling stage, the first valve is closed, the conveyor belt 32 is stopped, at this time, the first buffer cavity and the cooling cavity 21 are in a non-communicated state, the second cooling medium in the cooling cavity 21 is a first group of heat conductors, the pump body can discharge the third cooling medium 23 in the cooling cavity 21 into the transit tank 25 within 3s, and then the first cooling medium (the flow can be 10mL/s) is conveyed to the cooling cavity 21 through the liquid nitrogen storage tank 28, so that the first cooling medium cools the first group of heat conductors; after the cooling of the first group of heat conductors is completed, the gasified first cooling medium can be recovered within 3s by the liquid nitrogen recovery tank 29, and the cooling stage is ended. The first valve is opened to continue to connect the cooling chamber 21 and the first buffer chamber, the third cooling medium 23 flows in the first "return" structure, the conveyor belt 32 continues to move, the first group of heat conductors moves into the buffer chamber 22, and the second group of heat conductors moves into the cooling chamber 21 to cool the third cooling medium 23.

After the interval of T time again, the process enters the staying cooling stage again, the first valve is closed, at the moment, the first buffer cavity and the cooling cavity 21 are in a non-communicated state, and the second cooling medium in the cooling cavity 21 is a second group of heat conductors; the cooling process of the first group of heat conductors, the second group of heat conductors, the third group of heat conductors and the fourth group of heat conductors is performed circularly.

When crystal growth is carried out in the next batch, different structures in the shape of the Chinese character 'hui' are selected according to different crystal growth temperatures. For example, when the third "return" structure is selected, the first electromagnetic device is turned off, the second electromagnetic device is turned on, and the first storage bin and the cooling cavity 21 are in a communication state, the second, third, and fourth storage bins and the cooling cavity 21 are in a non-communication state, and the second electromagnetic device attracts the heat conductor 30 in the cooling cavity 21 in the first "return" structure to the first storage bin; the first electromagnetic device is started, the second electromagnetic device is closed, the third storage bin and the cooling cavity 21 are in a communicated state, the first storage bin, the second storage bin and the fourth storage bin are in a non-communicated state with the cooling cavity 21, and the first electromagnetic device attracts a group of heat conductors 30 in the third storage bin to the cooling cavity 21 in the third 'return' structure; and opening the third valve, closing the first valve, the third valve and the fourth valve, and enabling the rest working processes to be the same as the working process of the first return-shaped structure.

Example 2

As shown in fig. 1, embodiment 2 provides a crystal growth furnace, which includes a furnace body 4, a double-layer quartz tube 5 and a circulating cooling system, wherein a circulating pipeline 1 of the circulating cooling system is connected with the double-layer quartz tube 5, the circulating pipeline 1, the double-layer quartz tube 5 and a buffer chamber 22 form a closed loop, and a third cooling medium 23 circulates in the closed loop; wherein the circulating cooling system is selected from the circulating cooling systems in the embodiment 1. The crystal growth furnace is used for growing silicon carbide single crystals, the thermal field is stable, the crystal growth quality is high, and the consumption of the third cooling medium 23 is greatly saved.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A hydronic cooling system, comprising:

a circulation line;

the first cooling medium cools the second cooling medium in the cooling cavity, the cooled second cooling medium continues to cool the third cooling medium, and the third cooling medium circulates between the closed loops to cool the to-be-cooled part;

the second cooling medium includes a plurality of heat conductors, each of which is movable between the cooling chamber and the buffer chamber;

when at least one heat conductor is positioned in the cooling cavity to be cooled, the rest heat conductors are positioned in the buffer cavity to continue to cool the third cooling medium.

2. A circulating cooling system according to claim 1, wherein the buffer chamber and the cooling chamber together form a "return" structure, the cooling chamber being located in at least one side of the "return" structure.

3. The circulating cooling system of claim 2, wherein the "return" structure comprises a first side wall and a second side wall sleeved inside, and a conveyor belt is connected to an inner wall of the first side wall and an outer wall of the second side wall and used for enabling the heat conductor to move circularly in the "return" structure.

4. The circulating cooling system of claim 3, wherein the second cooling medium is made of metal, the conveyor belt is provided with a first electromagnetic device, and the second cooling medium is connected with the conveyor belt through the first electromagnetic device.

5. A circulating cooling system according to any one of claims 1-4, wherein there are at least two buffer chambers, each buffer chamber can communicate with the cooling chamber, and each buffer chamber and the cooling chamber form a "loop" structure, each "loop" structure has a plurality of heat conductors disposed therein, and the cooling capacity of the second cooling medium in different "loop" structures is different;

6. The hydronic cooling system according to claim 5, wherein the cooling assembly further includes a storage compartment, the storage compartment being connected to the cooling cavity, and a second electromagnetic device being disposed within the storage compartment;

7. A circulating cooling system according to any of claims 1-4, characterized in that the cooling chamber is connected to the buffer chamber by a valve,

8. A circulating cooling system according to any of claims 1-4, characterised in that the cooling package further comprises a first power means for powering the circulation of the third cooling medium.

9. A circulating cooling system according to any of claims 1-4, characterized in that the first cooling medium is liquid nitrogen; and/or

The third cooling medium is water.

10. The crystal growth furnace is characterized by comprising a furnace body, a double-layer quartz tube and a circulating cooling system, wherein a circulating pipeline of the circulating cooling system is connected with the double-layer quartz tube, the circulating pipeline, the double-layer quartz tube and a buffer cavity form a closed loop, and a third cooling medium circulates in the closed loop;

wherein the circulating cooling system is selected from the circulating cooling system of any one of claims 1-9.