CN114083005A - Turning device - Google Patents
Turning device Download PDFInfo
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- CN114083005A CN114083005A CN202111524002.7A CN202111524002A CN114083005A CN 114083005 A CN114083005 A CN 114083005A CN 202111524002 A CN202111524002 A CN 202111524002A CN 114083005 A CN114083005 A CN 114083005A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
- B23Q17/0952—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
- B23Q17/0966—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining by measuring a force on parts of the machine other than a motor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention relates to a turning device which comprises a cutter, a stress detection element and a signal processing element, wherein a first groove is formed in the cutter, a second groove is formed in the first groove, a lead channel is further formed in the cutter and is communicated with the second groove, the stress detection element comprises a substrate, an insulating layer and a sensitive layer, the insulating layer and the sensitive layer are sequentially formed on the substrate, the sensitive layer comprises a sensitive grid and two electrodes connected with two ends of the sensitive grid, a protective layer is formed on the sensitive grid, an electrode layer is formed on the electrodes, the substrate is assembled in the first groove, the sensitive layer is accommodated in the second groove, and the signal processing element is connected with the sensitive layer through a lead penetrating through the lead channel. Among the above-mentioned turning device, the stress detection component is not restricted to installation space and temperature environment, improves measurement accuracy effectively, can protect the stress detection component to use under environments such as impact, friction, acid-base corrosion moreover, and the turning device is realized through wireless mode to the measurement of cutting force in the turning process.
Description
Technical Field
The invention relates to the technical field of turning, in particular to a turning device.
Background
The cutting force is equal and opposite force acting on the workpiece and the tool in the cutting process, and in popular terms, the resistance generated when the workpiece resists the tool to cut in the cutting process is the cutting force. The cutting force affects the processing quality of the workpiece, such as surface roughness, workpiece deformation and the like, and the cutting force can also reflect the working state in the processing process of the machine tool, such as tool abrasion, power consumption and generation of cutting heat, so that the measurement of the cutting force has great significance for researching a turning mechanism and guiding actual turning.
In the prior art, the cutting force is mainly measured by adopting a strain gauge or a piezoelectric type force gauge, and the sticking process of a resistance strain gauge in the strain gauge has limitations, so that the measurement precision is low, the resistance strain gauge is not suitable for being used in a high-temperature environment, and the application range is limited. The piezoelectric force measuring instrument has insufficient unidirectionality of the piezoelectric transistor, which causes mutual interference when measuring three-dimensional force and hysteresis when measuring static force, thereby causing low measurement accuracy. Moreover, both the strain type dynamometer and the piezoelectric type dynamometer have the defect of large volume, are inconvenient to use and have limited application range.
Based on this, it is urgently needed to develop a suitable cutting force measuring system to solve the problems of low measuring accuracy and limited application range in the existing cutting force measuring technology.
Disclosure of Invention
Therefore, it is necessary to provide a turning device for solving the problems of low measurement accuracy and limited application range in the cutting force measurement technology.
The invention provides a turning device, comprising:
the cutting tool is provided with a first groove, a second groove is formed in the first groove, the cutting tool is further provided with a wire channel, and the wire channel is communicated with the second groove;
the stress detection element comprises a substrate, and an insulating layer and a sensitive layer which are sequentially formed on the substrate, wherein the sensitive layer comprises a sensitive grid and two electrodes connected with two ends of the sensitive grid, a protective layer is formed on the sensitive grid, an electrode layer is formed on the electrodes, the substrate is assembled in the first groove, and the sensitive layer is accommodated in the second groove;
the signal processing element is connected with the sensitive layer through a lead penetrating in the lead channel.
In one embodiment, the substrate is fixed in the first groove by vacuum hot pressing.
In one embodiment, the vacuum degree of the vacuum hot pressing is 1.8x10-3Pa-2.2x10-3Pa, the welding pressure of the vacuum hot pressing is 3.8MPa-4.2MPa, the temperature of the vacuum hot pressing is changed into the temperature of 200 ℃ within 1 hour and is kept for 3.5-4.5 hours, then the temperature is increased to 800 ℃ within 6 hours and is kept for 1.5-2.5 hours, and finally the temperature is reduced to 0 ℃ within 6 hours.
In one embodiment, a wire electrode is disposed on the wire, and the wire electrode and the electrode layer are connected through a conductive metal layer.
In one embodiment, in a state where the lead electrode and the electrode layer are in contact, a conductive silver paste in a liquid state is introduced to the lead electrode and the electrode layer, and the conductive silver paste is cured at a temperature environment of 145 ℃ to 155 ℃ to form the conductive metal layer.
In one embodiment, a portion of the lead adjacent to the lead electrode is fixed to the substrate by epoxy.
In one embodiment, the insulating layer includes a first transition unit layer, a composite insulating unit layer, and a second transition unit layer sequentially formed on the substrate.
In one embodiment, the material of the first transition cell layer and/or the second transition cell layer is chromium or nickel; and/or the presence of a gas in the gas,
the composite insulating unit layer comprises two silicon nitride layers and an aluminum oxide layer positioned between the two silicon nitride layers; and/or the presence of a gas in the gas,
the sensitive layer is made of nickel-chromium alloy; and/or the presence of a gas in the gas,
the protective layer is made of silicon nitride; and/or the presence of a gas in the gas,
the electrode layer is made of copper, gold or silver.
In one embodiment, the stress detection element is obtained by vacuum annealing in a temperature environment of 300-800 ℃; and/or the stress detection element adjusts the resistance value of the sensitive layer through laser sintering.
In one embodiment, the signal processing element comprises a current amplification module, a current conversion module, a wireless transmission module, a wireless receiving module, a receiving storage and a serial interface, the current amplification module is connected with the electrode layer through the conducting wire, the wireless transmission module is connected with the current amplification module through the current conversion module, the wireless transmission module is in wireless communication connection with the wireless receiving module, the wireless receiving module is connected with the serial interface through the receiving storage, and the serial interface is configured for connecting a readable device.
In the turning device, the stress detection element can not use a photoetching machine in the manufacturing process, and can not use harmful gases such as developing stripping liquid and the like, volatility and the like, the method is simplified, batch production is easy to realize, cost can be effectively reduced, the stress detection element is not limited by installation space and temperature environment, measurement precision is effectively improved, and the stress detection element can be protected from being used in the environments such as impact, friction, acid-base corrosion and the like, the turning device realizes the measurement of the cutting force in the turning process in a wireless mode, a cutter is integrated and intelligentized, and the monitoring distance can be further increased.
Drawings
FIG. 1 is a schematic structural view of a turning device according to an embodiment of the present invention;
FIG. 2a is a schematic structural diagram of a manufacturing process of a stress detection device according to an embodiment of the present invention 1;
FIG. 2b is a schematic structural diagram of a manufacturing process of a stress detection device according to an embodiment of the present invention;
FIG. 2c is a structural diagram of a manufacturing process of a stress detection device according to an embodiment of the present invention, schematically illustrated in FIG. 3;
FIG. 2d is a structural diagram of a manufacturing process of a stress detection device according to an embodiment of the present invention;
FIG. 2e is a structural diagram of a manufacturing process of a stress detection device according to an embodiment of the present invention, schematically illustrated in FIG. 5;
FIG. 2f is a structural diagram of a manufacturing process of a stress detection device according to an embodiment of the present invention, schematically illustrated in FIG. 6;
FIG. 3 is a schematic diagram of a pattern of a sensitive layer provided in accordance with an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first mask according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a second mask according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a third mask according to an embodiment of the present invention.
Reference numerals:
100. a cutter; 200. a stress detection element; 300. a wire;
110. a turning tool handle; 120. a cutting insert; 130. a fixing member;
111. a first groove; 112. a second groove; 113. a wire passage;
210. a substrate; 220. an insulating layer; 230. a sensitive layer; 240. a protective layer; 250. an electrode layer;
221. a first transition cell layer; 222. a composite insulating unit layer; 223. a second transition unit layer;
231. a sensitive grid; 232. and an electrode.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, an embodiment of the present invention provides a turning apparatus, which includes a tool 100, a stress detection element 200 and a signal processing element, a first groove 111 is formed on the cutter 100, a second groove 112 is formed in the first groove 111, the cutter 100 is further provided with a wire channel 113, the wire channel 113 is communicated with the second groove 112, the stress detection element 200 comprises a substrate 210, and an insulating layer 220 and a sensitive layer 230 which are sequentially formed on the substrate 210, the sensitive layer 230 comprises a sensitive grid 231 and two electrodes 232 connected to both ends of the sensitive grid 231, a protective layer 240 is formed on the sensitive gate 231, an electrode layer 250 is formed on the electrode 232, the substrate 210 is fitted in the first recess 111, the sensitive layer 230 is accommodated in the second recess 112, the signal processing element is connected with the sensitive layer 230 through a wire 300 passing through the wire passage 113.
The cutting tool 100 may include a cutting blade 120 and a turning tool holder 110, the cutting blade 120 may be mounted at a front end of the turning tool holder 110, for example, when the turning tool holder 110 has a cylindrical structure, such as a prism or a cylinder, the cutting blade 120 may be mounted at a center of a front end surface of the turning tool holder 110 according to a cutting requirement, or mounted at a position deviated from the center on the front end surface of the turning tool holder 110, which is not limited herein. The cutting insert 120 may be mounted by various fasteners 130, for example, the cutting insert 120 may be threadably secured to the tool holder 110 by a compression screw.
For example, when the four adjacent side surfaces are all provided with the first grooves 111, if the first grooves 111 on the adjacent side surfaces are spaced from each other, the stress detection elements 200 mounted in different first grooves 111 are also spaced from each other, when the four adjacent side surfaces are all provided with the first grooves 111, if the first grooves 111 on the adjacent side surfaces are communicated with each other, at this time, the plurality of first grooves 111 may form a continuous groove structure surrounding along the circumferential direction of the turning tool holder 110, at this time, the plurality of stress detection elements 200 mounted in different first grooves 111 may also form interconnection, and a specific mounting form may be selected as required, which is not limited herein.
Moreover, one port of the wire channel 113 may be located in the second groove 112, and the other port of the wire channel 113 may be located at the tail end of the tool 100, when the stress detection element 200 and the signal processing element are connected, the wire 300 may be inserted into the wire channel 113, so that one end of the wire 300 passes through the second groove 112 and is connected to the sensitive layer 230 assembled in the second groove 112, and the wire 300 needs to be electrically connected to the electrode 232 of the sensitive layer 230, wherein the wire 300 may be directly or indirectly connected to the electrode 232 of the sensitive layer 230, for example, the wire 300 may be connected to the electrode layer 250, and further electrically connected to the electrode 232 of the sensitive layer 230 through the electrode layer 250.
The lead 300 may be directly connected to the electrode layer 250, or may be connected to the electrode layer 250 through the lead electrode 232, in one embodiment, the lead 300 may be provided with the lead electrode 232, the structural shape of the lead electrode 232 may be configured to match the structural shape of the electrode layer 250, and then the lead electrode 232 and the electrode layer 250 are connected through a conductive metal layer. The material of the conductive metal layer may be gold, silver or copper, for example, in one embodiment, in a state where the lead electrode 232 and the electrode layer 250 are in contact, a liquid conductive silver paste is introduced into the lead electrode 232 and the electrode layer 250, and when the lead electrode 232 and the electrode layer 250 are effectively wrapped by the liquid conductive silver paste, the conductive silver paste may be cured at a temperature of 145 ℃ to 155 ℃, and the cured conductive silver paste may form the conductive metal layer, so that the connection strength between the lead electrode 232 and the electrode layer 250 can be improved, and besides, in one embodiment, a portion of the lead 300 close to the lead electrode 232 may be fixed on the substrate 210 by an epoxy resin, and after the lead 300 with a portion of the lead is fixed on the substrate 210 by the epoxy resin, the pulling of the wire electrode 232 caused by the movement of the wire 300 can be reduced by the fixation of the wire 300, thereby improving the connection strength between the wire electrode 232 and the electrode layer 250.
The substrate 210 can be fixed in the first groove 111 by various methods, such as bonding, clamping, etc., in one embodiment, the substrate 210 is fixed in the first groove 111 by vacuum heat pressing, and the substrate is fixed by vacuum heat pressingWhen the substrate 210 is a sheet 210, the substrate 210 can be placed in the first groove 111, then the substrate 210 and the cutter 100 are placed together into the inner cavity of the hot press, and when the vacuum hot pressing is performed through the hot press, the vacuum degree of the vacuum hot pressing can be controlled to be 1.8x10-3Pa-2.2x10-3Pa, the vacuum degree of the vacuum hot pressing may be 1.85x10-3Pa、1.9x10-3Pa、1.95x10-3Pa、2x10-3Pa、2.05x10-3Pa、2.1x10-3Pa、2.15x10-3Pa、2.2x10-3Pa, etc., and are not limited thereto. Meanwhile, the welding pressure of the vacuum hot pressing can be controlled to be 3.8MPa-4.2MPa, for example, the welding pressure of the vacuum hot pressing can be 3.8MPa, 3.85MPa, 3.9MPa, 3.95MPa, 4MPa, 4.05MPa, 4.1MPa, 4.15MPa, 4.2MPa and the like, and is not limited herein. Meanwhile, the temperature change can be adjusted according to the requirement, for example, the temperature change of the vacuum hot pressing can be controlled to be heated to 200 ℃ within 1 hour and kept for heat preservation for 3.5-4.5 hours, then heated to 800 ℃ within 6 hours and kept for heat preservation for 1.5-2.5 hours, and finally cooled to 0 ℃ within 6 hours.
The substrate 210 may be made of 45-steel material, and after being cut by electric spark, is processed by rough polishing, semi-fine polishing, etc., and is cleaned and dried in acetone, isopropanol, ethanol, and deionized water, and is placed in a vacuum chamber to prepare the insulating layer 220, the sensitive layer 230, the protective layer 240, the electrode layer 250, etc. Wherein the thickness of the substrate 210 can be controlled to be 0.1mm-0.5mm, and in one embodiment, the insulating layer 220 includes a first transition unit layer 221, a composite insulating unit layer 222, and a second transition unit layer 223 sequentially formed on the substrate 210. For the material of each film layer, the material of the first transition unit layer 221 and/or the second transition unit layer 223 is chromium or nickel, the composite insulating unit layer 222 includes two silicon nitride layers and an aluminum oxide layer located between the two silicon nitride layers, the material of the sensitive layer 230 is nichrome, the material of the protective layer 240 is silicon nitride, and the material of the electrode layer 250 is copper, gold, or silver.
Referring to fig. 2a to 2f, in the process of manufacturing the stress detection element 200, a first transition unit layer 221 is formed on a substrate 210, a silicon nitride layer, an aluminum oxide layer, and another silicon nitride layer are sequentially formed on the first transition unit layer 221, a composite insulating unit layer 222 is formed by the silicon nitride layer and the aluminum oxide layer between the two silicon nitride layers, a second transition unit layer 223 is formed on the composite insulating unit layer 222, a sensitive layer 230 is formed on the second transition unit layer 223, a protection layer 240 is formed on a sensitive gate 231 of the sensitive layer 230, and an electrode layer 250 is formed on an electrode 232 of the sensitive layer 230, so that the entire stress detection element 200 is formed.
In one embodiment, the patterns of the insulating layer 220 and the sensitive layer 230 may be prepared by using masks having corresponding patterns, as shown in fig. 3 and 4, the first mask shown in fig. 4 has a hollow pattern that is the same as the patterns of the sensitive gate 231 and the electrode 232 in the sensitive layer 230, so that the insulating layer 220 and the sensitive layer 230 may be formed by using the first mask, and of course, the patterns of the insulating layer 220 and the sensitive layer 230 may be the same or different, so that the insulating layer 220 may be prepared by using the first mask or may not be prepared by using the first mask. As shown in fig. 5, the hollow pattern of the second mask corresponds to the position of the sensitive gate 231 in the sensitive layer 230, so that the protective layer 240 can be prepared by using the first mask, and similarly, as shown in fig. 6, the hollow pattern of the third mask corresponds to the position of the electrode 232 in the sensitive layer 230, so that the electrode layer 250 can be prepared by using the third mask.
In one embodiment, the stress detection element 200 is obtained by vacuum annealing in a temperature environment of 300 ℃ to 800 ℃, the stress detection element 200 may be placed in a vacuum annealing furnace during vacuum annealing, and then the temperature may be controlled between 300 ℃ to 800 ℃, for example, the temperature may be controlled at 300 ℃, 350 ℃, 400 ℃, 450 ℃, 500 ℃, 550 ℃, 600 ℃, 650 ℃, 700 ℃, 750 ℃, 800 ℃, and the like, without limitation, and the temperature increase rate may be controlled at about 1 minute and 2 °, for example, the temperature increase rate of 1 minute and 1.5 °, the temperature increase rate of 1 minute and 2 °, or the temperature increase rate of 1 minute and 2.5 °, without limitation, and finally, the temperature may be naturally reduced. The stress detection element 200 adjusts the resistance value of the sensitive layer 230 through laser sintering, and particularly when a plurality of stress detection elements 200 are disposed on the tool 100, it should be ensured that the resistance values of the sensitive layers 230 in the plurality of stress detection elements 200 are equal or at least within a reasonable error range, so that the resistance value of the sensitive layer 230 can be adjusted through laser sintering.
In one embodiment, the signal processing element includes a current amplifying module, a current converting module, a wireless transmitting module, a wireless receiving module, a receiving memory and a serial interface, the current amplifying module is connected to the electrode layer 250 through the conducting wire 300, the wireless transmitting module is connected to the current amplifying module through the current converting module, the wireless transmitting module is in wireless communication connection with the wireless receiving module, the wireless receiving module is connected to the serial interface through the receiving memory, and the serial interface is configured to connect to a readable device.
The signal processing element may be powered by any external power source, for example, a button battery may be used for supplying power, and the change of output voltage is processed by the signal processing element, and then the visualized signal is output by the computer, specifically, the wire 300 may be connected to the electrode layer 250, and then connected to one or more current amplification modules, the current conversion module, and the wireless transmission module in sequence, and then wirelessly transmit data through the wireless communication connection between the wireless transmission module and the wireless reception module, and finally transmit the data to a computer and other readable devices through the receiving memory and the serial interface for data processing, and the computer visualizes the test result. The wireless transmitting module and the wireless receiving module can be nRF24L01, 2.4G, the current conversion module (such as an A/D converter) can be STC12L5608AD, and labview can be selected to visually display signals on a computer desktop.
When the turning device performs a turning motion, the cutting force may cause deformation of the tool 100, the deformation of the tool 100 may cause deformation of the substrate 210 of the stress detection element 200, so that the sensitive layer 230 on the substrate 210 is also deformed synchronously, and the deformation of the sensitive layer 230 may cause a change in its own resistance value, such as but not limited to a bending moment, tension, compression, torsion, etc. of the tool 100, for example, when the stress detection element 200 is disposed on the turning tool handle 110, the deformation of the turning tool handle 110 may cause deformation of the substrate 210, so that the sensitive layer 230 on the substrate 210 is also deformed synchronously, and a change in the resistance value of the sensitive layer 230 is further performed, and at this time, the signal processing element may convert the change in the resistance value of the sensitive layer 230 caused by the cutting force into an electrical signal, which is sequentially processed by the current amplification module, the current conversion module and the wireless transmission module, the wireless transmission is carried out to the readable and writable device to display the result, for example, the measurement result can be displayed on a visual terminal, and the measurement result includes but is not limited to resistance, voltage, current or other forms.
The stress detection element 200 in the turning device does not need a photoetching machine in the manufacturing process, and does not use harmful, volatile and other gases such as developing stripping liquid, the method is simplified, the mass production is easy to realize, the cost can be effectively reduced, the stress detection element 200 is not limited by installation space and temperature environment, the measurement precision is effectively improved, the stress detection element 200 can be protected from being used in the environments such as impact, friction, acid and alkali corrosion and the like, the turning device realizes the measurement of the cutting force in the turning process in a wireless mode, the cutter 100 is integrated and intelligent, and the monitoring distance can be further.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A turning device, characterized in that the turning device comprises:
the cutting tool is provided with a first groove, a second groove is formed in the first groove, the cutting tool is further provided with a wire channel, and the wire channel is communicated with the second groove;
the stress detection element comprises a substrate, and an insulating layer and a sensitive layer which are sequentially formed on the substrate, wherein the sensitive layer comprises a sensitive grid and two electrodes connected with two ends of the sensitive grid, a protective layer is formed on the sensitive grid, an electrode layer is formed on the electrodes, the substrate is assembled in the first groove, and the sensitive layer is accommodated in the second groove;
the signal processing element is connected with the sensitive layer through a lead penetrating in the lead channel.
2. The turning device of claim 1 wherein the substrate is secured within the first groove by vacuum hot pressing.
3. The turning device according to claim 2, wherein the vacuum degree of the vacuum hot pressing is 1.8x10-3Pa-2.2x10-3Pa, the welding pressure of the vacuum hot pressing is 3.8MPa-4.2MPa, the temperature of the vacuum hot pressing is changed into the temperature of 200 ℃ within 1 hour and is kept for 3.5-4.5 hours, then the temperature is increased to 800 ℃ within 6 hours and is kept for 1.5-2.5 hours, and finally the temperature is reduced to 0 ℃ within 6 hours.
4. The turning device according to claim 1, wherein a wire electrode is provided on the wire, and the wire electrode and the electrode layer are connected by a conductive metal layer.
5. The turning device according to claim 4, wherein in a state where the lead electrode and the electrode layer are in contact, a conductive silver paste in a liquid state is introduced to the lead electrode and the electrode layer, and the conductive silver paste is cured at a temperature environment of 145 ℃ to 155 ℃ to form the conductive metal layer.
6. The turning device according to claim 4, wherein a portion of the lead adjacent to the lead electrode is fixed to the substrate by epoxy.
7. The turning device according to any one of claims 1-6, wherein the insulating layer comprises a first transition unit layer, a composite insulating unit layer and a second transition unit layer formed on the substrate in this order.
8. The turning device according to claim 7, wherein the material of the first transition unit layer and/or the second transition unit layer is chromium or nickel; and/or the presence of a gas in the gas,
the composite insulating unit layer comprises two silicon nitride layers and an aluminum oxide layer positioned between the two silicon nitride layers; and/or the presence of a gas in the gas,
the sensitive layer is made of nickel-chromium alloy; and/or the presence of a gas in the gas,
the protective layer is made of silicon nitride; and/or the presence of a gas in the gas,
the electrode layer is made of copper, gold or silver.
9. The turning device according to claim 7, wherein the stress detection element is obtained by vacuum annealing in a temperature environment of 300-800 ℃; and/or the stress detection element adjusts the resistance value of the sensitive layer through laser sintering.
10. The turning device according to claim 7, wherein the signal processing element comprises a current amplification module, a current conversion module, a wireless transmission module, a wireless receiving module, a receiving memory and a serial interface, the current amplification module is connected with the electrode layer through the conducting wire, the wireless transmission module is connected with the current amplification module through the current conversion module, the wireless transmission module is in wireless communication connection with the wireless receiving module, the wireless receiving module is connected with the serial interface through the receiving memory, and the serial interface is configured for connecting a readable device.
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