CN114078396A - Bonding method and bonding apparatus - Google Patents
Bonding method and bonding apparatus Download PDFInfo
- Publication number
- CN114078396A CN114078396A CN202111449603.6A CN202111449603A CN114078396A CN 114078396 A CN114078396 A CN 114078396A CN 202111449603 A CN202111449603 A CN 202111449603A CN 114078396 A CN114078396 A CN 114078396A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- display panel
- film
- layer structure
- profiling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 77
- 238000010030 laminating Methods 0.000 claims abstract description 62
- 230000008569 process Effects 0.000 claims abstract description 33
- 239000010410 layer Substances 0.000 claims description 103
- 239000012790 adhesive layer Substances 0.000 claims description 56
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 40
- 230000003287 optical effect Effects 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 abstract description 3
- 239000004568 cement Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 206010027146 Melanoderma Diseases 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The application discloses a laminating method and a laminating device, wherein the laminating method is used for laminating a display panel and a cover plate, and the laminating method comprises the following steps: forming a bonding layer covering the light-emitting surface on the light-emitting surface of the display panel to form a film structure to be formed, wherein the film structure to be formed comprises the display panel and the bonding layer; the film layer structure to be formed is subjected to debonding and profiling treatment to form a film layer structure to be attached, and the viscosity of the bonding layer is reduced in the debonding and profiling treatment process, so that the shape of the film layer structure to be formed is matched with that of the cover plate; and the film layer structure to be attached is contacted with the cover plate, and the adhesion layer is recovered to be subjected to adhesion treatment, so that the display panel and the cover plate are attached through the adhesion layer. The laminating method can effectively prevent the display panel and the cover plate from being laminated in advance to cause poor lamination, and greatly improves the lamination yield.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a laminating method and a laminating device.
Background
Along with the development of display technology, the screen to display device accounts for more and more highly, and flexible display panel has advantages such as flexible, flexible good, the volume is frivolous, the low power dissipation, can laminate with the apron that has the curved surface to satisfy people extremely and pursue the demand that narrow frame or no frame show, among the prior art, the laminating is bad easily to appear when curved surface apron and flexible display panel laminate.
Disclosure of Invention
The embodiment of the application provides a laminating method and a laminating device, the laminating method can effectively prevent poor lamination caused by the fact that a display panel and a cover plate are laminated in advance, and the laminating yield is greatly improved.
An embodiment of a first aspect of an embodiment of the present application provides a method for attaching a display panel to a cover plate, including:
forming a bonding layer covering the light-emitting surface on the light-emitting surface of the display panel to form a film structure to be formed, wherein the film structure to be formed comprises the display panel and the bonding layer;
performing debonding and profiling treatment on the film layer structure to be formed to form a film layer structure to be attached, wherein the viscosity of the bonding layer is reduced in the debonding and profiling treatment process, and the shape of the film layer structure to be formed is matched with that of the cover plate;
and contacting the film layer structure to be attached with the cover plate, and performing viscosity recovery treatment on the bonding layer to enable the display panel and the cover plate to be attached through the bonding layer.
According to an embodiment of the first aspect of the present invention, the forming, on the light emitting surface of the display panel, the adhesive layer covering the light emitting surface includes:
the glue body is attached to the light emitting surface of the display panel through the roller, so that the bonding layer covering the light emitting surface is formed.
According to an embodiment of the first aspect of the present invention, the material of the colloid includes an optical cement.
According to an embodiment of the first aspect of the invention, the debonding profiling process comprises:
placing the film layer structure to be formed in an environment with a first preset temperature, and after a first preset time, enabling the bonding layer not to have viscosity;
moving the film structure to be formed to an environment with a second preset temperature, and after a second preset time, heating the film structure to be formed to a third preset temperature, wherein the viscosity of the bonding layer on the side departing from the display panel is less than a preset value;
will display panel deviates from the surface of adhesive linkage one side is fixed with the carrier film, and the tip and the fixture of carrier film are fixed, and make the carrier film counterpoints with the profile modeling pressure head, will fixture removes in order to form to be close to one side of profile modeling pressure head treat laminating membranous layer structure.
According to an embodiment of the first aspect of the present invention, said first preset temperature is lower than or equal to-70 ℃; the first preset time is greater than or equal to 30 minutes;
the second preset temperature is greater than or equal to 0 ℃ and less than or equal to 10 ℃, and the second preset time is greater than 0 minute and less than or equal to 10 minutes;
the preset value is 7 g/inch
According to an embodiment of the first aspect of the present invention, the contacting the film layer structure to be attached with the cover plate includes:
and aligning the film layer structure to be attached with the cover plate, and moving the film layer structure to be attached to the direction close to the cover plate, so that when the viscosity of the bonding layer departing from one side of the display panel is less than or equal to the preset value, the film layer structure to be attached is in contact with one side of the cover plate departing from the display surface.
According to an embodiment of the first aspect of the invention, the debonding profiling process comprises:
fixing the surface of one side of the display panel, which is far away from the bonding layer, with a carrier film, fixing the end part of the carrier film with a clamping mechanism, aligning the carrier film with a profiling pressure head, and moving the clamping mechanism to one side close to the profiling pressure head so as to realize profiling of the film layer structure to be formed;
and placing the film structure to be formed in an environment with a first preset temperature for a first preset time, so that one side of the bonding layer, which is deviated from the flexible layer, is not sticky, and the film structure to be attached is formed.
According to an embodiment of the first aspect of the present invention, said first preset temperature is lower than or equal to-70 ℃; the first predetermined time is greater than or equal to 30 minutes.
According to the embodiment of the first aspect of the present invention, the film layer structure to be bonded gradually contacts the cover plate from the middle of the cover plate to the periphery of the cover plate, and simultaneously, the adhesion layer gradually recovers the viscosity from the contact direction to be bonded with the cover plate;
or the adhesive layer recovers viscosity after the film layer structure to be attached and one side of the cover plate, which deviates from the display surface of the cover plate, completely contact with each other, bubbles between the adhesive layer and the cover plate are removed through defoaming treatment, and the defoaming treatment comprises applying 150kpa of pressure to the cover plate and the adhesive layer after the attachment is completed.
An embodiment of the second aspect of the present application further provides a bonding apparatus for bonding a display panel to a cover plate, including:
the cover plate fixing device is used for fixing the cover plate;
the carrier film clamping device is used for clamping the end part of the carrier film;
the profiling pressure head is used for profiling the film layer structure to be formed so as to enable the shape of the film layer structure to be formed to be matched with that of the cover plate, and the film layer structure to be formed comprises the display panel and an adhesive layer formed on a light emitting surface of the display panel;
the cover plate fixing device and/or the profiling pressure head are/is internally provided with a heating module;
preferably, the heating module comprises a resistance wire.
The application provides a laminating method has realized earlier counterpointing the contact, has laminated again, and the adhesive linkage does not have stickness or stickness very low when counterpointing the contact to prevent that display panel from laminating in advance with the apron and causing the laminating bad, resume the stickness with the adhesive linkage in order to laminate apron and display panel after counterpointing the completion, use the laminating method that this application provided to laminate display panel and apron, can make display panel and apron's laminating effect better, promoted the laminating yield greatly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart of a bonding method according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a first step in a bonding method provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram illustrating a debonding process in a bonding method according to an embodiment of the disclosure;
FIG. 4 is a schematic structural diagram illustrating a profiling process in a fitting method according to an embodiment of the present disclosure;
fig. 5 is a schematic structural view illustrating a cover plate and a display panel bonded together in a bonding method according to an embodiment of the present disclosure;
FIG. 6 is a flow chart of a debonding profiling process in a bonding method provided by an embodiment of the present application;
fig. 7 is a schematic structural diagram illustrating alignment between a cover plate and a display panel in a bonding method according to an embodiment of the present disclosure;
FIG. 8 is a flow chart of another debonding profiling process in a bonding method provided by an embodiment of the present application;
FIG. 9 is a schematic structural diagram of a profiling process in another application method provided by an embodiment of the present application;
fig. 10 is a schematic structural view illustrating a debonding process in another attachment method according to an embodiment of the present application;
fig. 11 is a schematic structural diagram of a laminating apparatus according to an embodiment of the present application.
In the drawings:
1-a display panel; 2-an adhesive layer; 3-a film layer structure to be formed; 4-a film layer structure to be laminated; 5-cover plate; 6-industrial refrigerator; 7-cover plate fixing device; 8-profiling pressure heads; 9-heating the module; 10-a carrier film; 11-clamping mechanism.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The inventor finds that the reason why the curved cover plate is easy to have poor bonding when being bonded with the flexible display panel is as follows: the curved surface apron is when laminating with flexible display panel, and the edge of curved surface apron takes place to contact in advance and bonds fixedly with flexible display panel towards the adhesive linkage of curved surface apron one side easily, and especially marginal area of partial region among the flexible display panel is easily pasted in advance and is laminated with curved surface apron promptly, makes the position of laminating inaccurate, thereby makes the laminating position of flexible display panel and curved surface apron not accurate, and appear laminating bubble and black spot etc. bad, has seriously influenced the laminating yield. The inventor provides a bonding method and a bonding apparatus based on the analysis of the above problems, so as to improve the bonding yield of the cover plate and the display panel.
It can be understood that the attaching device in the present application can be applied to not only the attachment of the curved cover plate and the flexible display panel, but also the attachment of the flat cover plate and the display panel, and the present application is not particularly limited.
For a better understanding of the present application, a pasting method and a pasting apparatus according to an embodiment of the present application will be described in detail below with reference to fig. 1 to 10.
Referring to fig. 1, an embodiment of the present application provides a bonding method for bonding a display panel 1 and a cover plate 5, including:
s100, forming a bonding layer 2 covering the light-emitting surface on the light-emitting surface of the display panel 1 to form a to-be-formed film structure 3, where the to-be-formed film structure 3 includes the display panel 1 and the bonding layer 2, as shown in fig. 2.
S200, performing a de-sticking profiling process on the to-be-formed film structure 3 to form the to-be-attached film structure 4, wherein the viscosity of the adhesive layer 2 is reduced during the de-sticking profiling process, and the shape of the to-be-formed film structure 3 is matched with the shape of the cover plate 5, as shown in fig. 3 and 4.
S300, contacting the film layer structure 4 to be bonded with the cover plate 5, and performing a tack recovery process on the adhesive layer 2, so that the display panel 1 and the cover plate 5 are bonded through the adhesive layer 2, as shown in fig. 5.
According to the laminating method, the display panel 1 is bonded with the bonding layer 2 to form the film layer structure 3 to be formed, the film layer structure 3 to be formed is subjected to de-bonding profiling treatment, on one hand, the viscosity of the bonding layer 2 in the film layer structure 3 to be formed can be reduced, so that the problem that the laminating yield is influenced due to the fact that the cover plate 5 is bonded and fixed after the cover plate and the bonding layer 2 are contacted in advance in the laminating process can be avoided, on the other hand, profiling of the film layer structure 3 to be formed can be achieved, and the shape of the film layer structure 3 to be formed is matched with that of the cover plate 5, so that alignment laminating can be conducted; in the laminating process, will wait to laminate membranous layer structure 4 earlier and lap 5 and contact, 2 stickies of adhesive linkage this moment are low, can prevent to lap 5 and adhesive linkage 2 to contact the back bonding in advance and fix, avoid display panel 1 to laminate in advance with apron 5 promptly, then resume the stickies to the position that adhesive linkage 2 and apron 5 contacted again and handle to bond display panel 1 and apron 5 through adhesive linkage 2 who resumes the stickies, thereby realize the laminating of display panel 1 and apron 5.
The application provides a laminating method has realized earlier counterpointing the contact, laminate again, adhesive linkage 2 does not have stickness or stickness very low when counterpointing the contact, thereby prevent that display panel 1 from laminating in advance with apron 5 and causing the laminating bad, resume the stickness with adhesive linkage 2 after counterpointing the completion in order to laminate apron 5 and display panel 1, use the laminating method that this application provided to laminate display panel 1 and apron 5, can make display panel 1 better with apron 5's laminating effect, promoted the laminating yield greatly.
In one possible embodiment, step S100 includes:
the adhesive is attached to the light emitting surface of the display panel 1 through the roller to form the adhesive layer 2 covering the light emitting surface.
In the above embodiment, the roller is used to attach the colloid to the light emitting surface of the display panel 1 to form the adhesive layer 2, and the roller is used in the attaching process, so that the colloid is in full contact with each part of the light emitting surface, and the adhesive effect between the colloid and the display surface is better.
Specifically, the roller may be driven to roll by a driving mechanism or manually, so that the roller rolls from one side of the display panel 1 to the other side opposite to the one side, and the colloid is sequentially contacted and attached to each part of the light emitting surface.
In one possible embodiment, the material of the glue body includes an optical glue, and the optical glue is in a solid state.
In the application, the optical cement is processed by the low-temperature technology, when the temperature of the optical cement reaches a TG point (glass transition temperature) of resin, the optical cement can not have viscosity, and the viscosity of the optical cement can be gradually recovered by increasing the temperature.
In one possible embodiment, as shown in fig. 6, the detackifying profiling process in step S200 includes:
s211, placing the film structure 3 to be formed in an environment with a first preset temperature, and after a first preset time, so that the adhesive layer 2 has no viscosity.
When the bonding layer 2 adopts optical cement, the first preset temperature is lower than or equal to-70 ℃; first time of predetermineeing is more than or equal to 30 minutes to reach the TG point of optical cement, make adhesive linkage 2 not have the stickness, treat the shaping membranous layer structure 3 this moment, because there is van der waals' force between adhesive linkage 2 and the display panel 1, make adhesive linkage 2 and display panel 1 still keep the state of reciprocal anchorage, thereby adhesive linkage 2 does not have the stickness can prevent to take place to contact in advance with the adhesive linkage 2 of display panel 1 towards apron 5 one side at laminating in-process and the back bonding is fixed, help promoting the laminating quality.
Specifically, as shown in fig. 3, a first preset temperature can be provided by the industrial refrigerator 6, and in the implementation process, the film layer structure 3 to be formed can be placed in the industrial refrigerator at-70 ℃ for 30 minutes to reach the TG point of the optical adhesive, so as to realize the debonding of the optical adhesive.
S212, moving the film structure 3 to be formed to an environment with a second preset temperature, and after a second preset time, raising the temperature of the film structure 3 to be formed to a third preset temperature, wherein the viscosity of the side of the bonding layer 2 away from the display panel 1 is less than a preset value.
The second preset temperature is greater than or equal to 0 ℃ and less than or equal to 10 ℃, and the second preset time is greater than 0 minutes and less than or equal to 10 minutes, so that the film layer structure 3 to be formed is warmed to recover the flexibility of the display panel 1, and the display panel 1 is prevented from being damaged, such as broken, in the subsequent profiling process. In the above-mentioned step, because the temperature is greater than first temperature of predetermineeing to the second for the temperature of optical cement is by TG point risees gradually, thereby makes the stickness of optical cement resume gradually, and at this moment, the size of predetermineeing the temperature through the control second and the size of the time is predetermine to the second, controls the stickness recovery degree of optical cement, avoids the stickness recovery degree big and causes the condition that display panel 1 and apron 5 laminated in advance. The viscosity control of gluing with optics can avoid gluing too firm condition with lapping 5 contact backs with optics glue at being less than the default, and the default can be 7 grams/inch, even if the adhesive linkage 2 also is convenient for readjust with lapping 5 contact in advance when being less than 7 grams/inch when the viscosity of gluing, can not influence the laminating quality to can be convenient for adjust so that display panel 1 is better with lapping 5 laminating effect at the laminating in-process.
S213, fixing the surface of the display panel 1 away from the side of the adhesive layer 2 to the carrier film 10, fixing the end of the carrier film 10 to the holding mechanism 11, aligning the carrier film 10 to the profiling indenter, and moving the holding mechanism 11 to the side close to the profiling indenter to form the film layer structure 4 to be attached, as shown in fig. 4.
The profiling pressure head is provided with a profiling surface matched with the shape of the cover plate 5, and when the cover plate 5 is flat, the profiling surface is a plane; when the cover plate 5 is a curved cover plate, the curved cover plate comprises a plane part and a curved part, the profiling surface is a surface matched with the curved cover plate in shape, and the display panel 1 is a flexible display panel. In step S213, a side surface of the display panel 1 away from the adhesive layer 2 is fixed to the carrier film 10, then the end of the carrier film 10 is fixed by the clamping mechanism 11 and the carrier film 10 is tensioned, the carrier film 10 is aligned to the profiling pressure head, specifically, the display panel 1 is aligned to the profiling pressure head, and then the clamping mechanism 11 is moved to drive the carrier film 10 to move in a direction close to the profiling pressure head, so that the display panel 1 is profiled to have a shape matching the cover plate 5 by an interaction force between the profiling pressure head and the carrier film 10.
The debonding profiling process in the above embodiment includes firstly debonding and then profiling, and the purpose of debonding is to reduce the viscosity of the adhesive layer 2, so as to prevent the cover plate 5 and the adhesive layer 2 on the side of the display panel 1 departing from the cover plate 5 from contacting in advance before formal bonding and then adhering and fixing, even if contacting in advance, because the viscosity of the adhesive layer 2 is lower, the adhesive layer can be readjusted, thereby preventing the poor bonding phenomenon. The debonding needs to place the film structure 3 to be formed in the first preset temperature environment for the first preset time, so that the optical adhesive reaches the TG point, and the optical adhesive does not have viscosity, i.e., the adhesive layer 2 does not have viscosity. Then need will wait to form membranous layer structure 3 and carry out the processing of rising the temperature, prevent that the too low temperature from waiting to form membranous layer structure 3 and appearing damaging when the profile modeling. Specifically, the film structure 3 to be formed needs to be moved to the environment with the second preset temperature for a second preset time, so that the temperature of the film structure 3 to be formed is raised to the third preset temperature, and the viscosity of the side of the adhesive layer 2 away from the display panel 1 is less than 7 g/inch. Treat that shaping membranous layer structure 3 heaies up to the third and predetermines and to prevent after the temperature that the damage appears when the profile modeling, the viscosity of adhesive linkage 2 this moment though there is the reinforcing, but the stickness is very low, can not contact in advance with apron 5 after the bonding is fixed very firm, even if contact in advance after also can be again with adhesive linkage 2 and apron 5 separation, do not influence the follow-up laminating of the two to it is better to make display panel 1 and 5 laminating effects of apron.
After the above embodiment is adopted to perform the detackifying profiling process, in step S300, the film layer structure 4 to be attached is contacted with the cover plate 5, which includes:
as shown in fig. 7 and 4, the film layer structure 4 to be attached is aligned with the cover plate 5, and the film layer structure 4 to be attached is moved toward the direction close to the cover plate 5, so that when the viscosity of the adhesive layer 2 on the side departing from the display panel 1 is less than or equal to 7 g/inch, the film layer structure 4 to be attached is in contact with the side of the cover plate 5 departing from the display surface.
In the above embodiment, the film layer structure 4 to be attached is aligned with the cover plate 5, and then the film layer structure 4 to be attached is in contact with the cover plate 5; wherein, can treat laminating rete structure 4 through removing after the counterpoint for treat laminating rete structure 4 towards apron 5 translation, thereby make and treat laminating rete structure 4 and apron 5 and contact, and/or, through removing apron 5, make apron 5 towards treat laminating rete structure 4 direction translation, thereby make and treat laminating rete structure 4 and apron 5 and contact. It is unusual, need to guarantee when waiting to laminate membranous layer structure 4 and apron 5 to contact that the viscosity of waiting to laminate membranous layer structure 4 towards adhesive linkage 2 of 1 one side of display panel is less than or equal to 7 grams/inch, adhesive linkage 2 has viscosity this moment, but the stickness is very low, can not contact the back with apron 5 in advance and bond fixedly very firmly, even if also can be in advance after contacting again adhesive linkage 2 and apron 5 separation, do not influence the follow-up laminating of the two, so that display panel 1 and apron 5 laminating effect are better.
In another possible embodiment, as shown in fig. 8, the detackifying profiling process includes:
s221, fixing the surface of the display panel 1 on the side away from the adhesive layer 2 to the carrier film 10, fixing the end of the carrier film 10 to the holding mechanism 11, aligning the carrier film 10 to the profiling indenter, and moving the holding mechanism 11 to the side close to the profiling indenter to profile the film structure 3 to be formed, as shown in fig. 9.
The profiling pressure head is provided with a profiling surface matched with the shape of the cover plate 5, and when the cover plate 5 is flat, the profiling surface is a plane; when the cover plate 5 is a curved cover plate, the curved cover plate comprises a plane part and a curved part, the profiling surface is a surface matched with the curved cover plate in shape, and the display panel 1 is a flexible display panel.
In step S221, a side surface of the display panel 1 away from the adhesive layer 2 is fixed to the carrier film 10, then an end of the carrier film 10 is fixed by the clamping mechanism 11 and the carrier film 10 is tensioned, the carrier film 10 is aligned to the profiling pressure head, specifically, the display panel 1 is aligned to the profiling pressure head, and then the clamping mechanism 11 is moved to drive the carrier film 10 to move in a direction close to the profiling pressure head, so that the display panel 1 is profiled to have a shape matched with the cover plate 5 by an interaction force between the profiling pressure head and the carrier film 10.
S222, placing the film structure 3 to be formed in an environment with a first preset temperature for a first preset time, so that the side of the adhesive layer 2 away from the flexible layer has no viscosity, so as to form the film structure 4 to be bonded, as shown in fig. 10.
When the bonding layer 2 adopts optical cement, the first preset temperature is lower than or equal to-70 ℃; first time of predetermineeing is more than or equal to 30 minutes to reach the TG point of optical cement, make adhesive linkage 2 not have the stickness, treat the shaping membranous layer structure 3 this moment, because there is van der waals' force between adhesive linkage 2 and the display panel 1, make adhesive linkage 2 and display panel 1 still keep the state of reciprocal anchorage, thereby adhesive linkage 2 does not have the stickness can prevent to take place to contact in advance with the adhesive linkage 2 of display panel 1 towards apron 5 one side at laminating in-process and the back bonding is fixed, help promoting the laminating quality.
Specifically, as shown in fig. 10, after step S221 is completed, the display panel, the adhesive layer, and the device used in the profiling process may be synchronously moved into an industrial refrigerator at-70 ℃ for 30 minutes to reach the TG point of the optical adhesive, thereby realizing the debonding of the optical adhesive.
In the above embodiment, the detackifying and profiling treatment includes profiling first and then detackifying, and the detackifying step can be directly performed after the profiling of the film structure 3 to be formed, so that the process flow is simple; and in the subsequent laminating process, can contact with apron 5 when adhesive linkage 2 does not possess the stickness, avoid adhesive linkage 2 and apron 5 to remove the fixed condition of back bonding in advance for display panel 1 is better with apron 5's laminating effect.
In a possible embodiment, the film layer structure 4 to be attached is gradually contacted with the cover plate 5 from the middle of the cover plate 5 to the periphery of the cover plate 5, and at the same time, the adhesion layer 2 is gradually recovered from the contact direction to be adhered with the cover plate 5.
In the above embodiment, the film layer structure 4 to be attached gradually contacts the cover plate 5 from the middle of the cover plate 5 to the periphery of the cover plate 5, and the film layer structure 4 to be attached is attached to the cover plate 5 at the edge contact side, so that the attachment accuracy is improved, and the phenomenon of contact in advance is prevented.
In the above embodiment, the adhesive layer 2 may be restored to its adhesiveness by heating, specifically, the position of the adhesive layer 2 in contact with the lid plate 5 may be adhesively fixed to the lid plate 5 by gradually heating the region of the adhesive layer 2 opposed to the middle of the lid plate 5 toward the region of the adhesive layer 2 opposed to the periphery of the lid plate 5, specifically, the method includes heating the region of the adhesive layer 2 opposed to the middle of the lid plate 5 to adhesively fix the region of the adhesive layer 2 in contact with the lid plate 5 first, after the region of the adhesive layer 2 opposed to the middle of the lid plate 5 is contacted with the middle of the lid plate 5, the region of the adhesive layer 2 opposed to the middle of the lid plate 5 is heated to adhesively fix the part of the region to the lid plate 5 first; then, along with the contact direction between the adhesive layer 2 and the cover plate 5, the area where the adhesive layer 2 is in contact with the cover plate 5 is heated, so that the adhesive layer 2 is completely adhered to the cover plate 5, and the display panel 1 and the cover plate 5 are attached to each other.
In another possible embodiment, the adhesive layer 2 recovers its viscosity after the film layer structure 4 to be attached is completely contacted with the side of the cover plate 5 away from the display surface of the cover plate 5, and bubbles between the adhesive layer 2 and the cover plate 5 are removed through a defoaming process, wherein the defoaming process comprises applying a pressure of 150kpa to the attached cover plate 5 and the adhesive layer 2.
In the above embodiment, the cover plate 5 and the adhesive layer 2 are first brought into complete contact, and then the adhesive layer 2 recovers its adhesiveness, so that the display panel 1 and the cover plate 5 are attached to each other, which is more convenient to operate. When bubbles are generated after the display panel 1 and the cover 5 are bonded, the bubbles can be removed by defoaming treatment, so that the display panel 1 and the cover 5 are bonded well.
Referring to fig. 11, the present application further provides a bonding apparatus for bonding a display panel 1 to a cover plate 5, including a cover plate fixing device 7, a carrier film clamping device and a profiling pressure head 8, where the cover plate fixing device 7 is used to fix the cover plate 5; the carrier film clamping device is used for clamping the end part of the carrier film 10; the profiling pressure head is used for profiling the film layer structure 3 to be formed so that the shape of the film layer structure 3 to be formed is matched with that of the cover plate 5, the film layer structure 3 to be formed comprises a display panel 1 and a bonding layer 2 formed on a light emitting surface of the display panel 1, and a heating module 9 is arranged in the profiling pressure head 8 and/or the cover plate fixing device 7.
Among the above-mentioned laminating device, apron fixing device 7 is used for fixed apron 5, specifically can be for having the vacuum adsorption fixing device with 5 shape assorted accommodation space of apron, including a plurality of vacuum adsorption holes that are used for adsorbing fixed apron 5 to can avoid haring apron 5 when fixed and dismantle apron 5.
The carrier film clamping device comprises a clamping part for clamping the carrier film 10 and a driving mechanism for driving the clamping part to act, and the driving mechanism can drive the clamping part to move towards the direction close to the profiling pressure head.
The profiling indenter has a profiling surface matching the shape of the cover plate 5 so that the display panel 1 can be profiled to correspond to the shape of the cover plate 5 for subsequent application.
In a possible embodiment, the heating module 9 is disposed in the carrier film clamping device, so as to heat the portion of the adhesive layer 2 contacting the cover plate 5 after the adhesive layer 2 contacts the cover plate 5, so that the heated portion of the adhesive layer 2 recovers viscosity to adhesively fix the display panel 1 and the cover plate 5.
In another possible embodiment, the heating module 9 is arranged in a profiling indenter, a pressure sensor and a control mechanism are further arranged in the profiling indenter, specifically, after the profiling indenter moves the display panel 1 to one side of the cover plate 5, the profiling indenter and the cover plate 5 are gradually squeezed, the pressure sensor detects the pressure of each area of the profiling indenter, and when the detected pressure is greater than the pressure in the profiling process, the control mechanism controls the heating module 9 opposite to the area to work so as to heat the adhesive layer 2; the pressure sensor may not be activated, and the adhesive layer 2 may be heated after the adhesive layer 2 is completely in contact with the cover 5.
In a possible embodiment, the heating module 9 comprises a resistance wire, and the direction of the resistance wire is the same as the contact direction of the adhesive layer 2 and the cover plate 5, so as to facilitate the heating of the contact position by the adhesive layer 2 and the cover plate 5 while contacting, and optionally the adhesive layer 2 is heated after the adhesive layer 2 and the cover plate 5 are completely contacted.
In a feasible implementation mode, the resistance wires are arranged in the bearing film clamping device, and when the cover plate is a curved cover plate, the resistance wires are sequentially arranged from the position opposite to two opposite curved surface parts in the curved cover plate to the direction of a plane part in the curved cover plate; or the resistance wire is arranged in the profiling pressure head, is sequentially nested layer by layer from the middle to the periphery to form an annular arrangement, can be a circular ring or a rectangular ring and the like, and is not particularly limited in the application.
Thereby the resistance wire adopts above-mentioned mode of setting up to make the adhesive linkage reply stickness to the periphery in proper order by the centre for adhesive linkage and apron bond gradually fixedly, thereby realize laminating gradually of display panel and apron, avoid laminating badly such as gassing, fold.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and its various modifications as are suited to the particular use contemplated. The application is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A bonding method is used for bonding a display panel and a cover plate, and is characterized by comprising the following steps:
forming a bonding layer covering the light-emitting surface on the light-emitting surface of the display panel to form a film structure to be formed, wherein the film structure to be formed comprises the display panel and the bonding layer;
performing debonding and profiling treatment on the film layer structure to be formed to form a film layer structure to be attached, wherein the viscosity of the bonding layer is reduced in the debonding and profiling treatment process, and the shape of the film layer structure to be formed is matched with that of the cover plate;
and contacting the film layer structure to be attached with the cover plate, and performing viscosity recovery treatment on the bonding layer to enable the display panel and the cover plate to be attached through the bonding layer.
2. The attaching method of claim 1, wherein the forming of the adhesive layer on the light emitting surface of the display panel to cover the light emitting surface comprises:
the glue body is attached to the light emitting surface of the display panel through the roller, so that the bonding layer covering the light emitting surface is formed.
3. The attaching method according to claim 2, wherein the material of the adhesive includes an optical adhesive.
4. The method of conforming according to claim 1 wherein the debonding profiling process comprises:
placing the film layer structure to be formed in an environment with a first preset temperature, and after a first preset time, enabling the bonding layer not to have viscosity;
moving the film structure to be formed to an environment with a second preset temperature, and after a second preset time, heating the film structure to be formed to a third preset temperature, wherein the viscosity of the bonding layer on the side departing from the display panel is less than a preset value;
will display panel deviates from the surface of adhesive linkage one side is fixed with the carrier film, and the tip and the fixture of carrier film are fixed, and make the carrier film counterpoints with the profile modeling pressure head, will fixture removes in order to form to be close to one side of profile modeling pressure head treat laminating membranous layer structure.
5. The fitting method according to claim 4, characterized in that the first preset temperature is lower than or equal to-70 ℃; the first preset time is greater than or equal to 30 minutes;
the second preset temperature is greater than or equal to 0 ℃ and less than or equal to 10 ℃, and the second preset time is greater than 0 minute and less than or equal to 10 minutes;
the preset value is 7 grams/inch.
6. The attaching method according to claim 4, wherein the contacting the film layer structure to be attached with the cover plate comprises:
and aligning the film layer structure to be attached with the cover plate, and moving the film layer structure to be attached to the direction close to the cover plate, so that when the viscosity of the bonding layer departing from one side of the display panel is less than or equal to the preset value, the film layer structure to be attached is in contact with one side of the cover plate departing from the display surface.
7. The method of conforming according to claim 2 wherein the debonding profiling process comprises:
fixing the surface of one side of the display panel, which is far away from the bonding layer, with a carrier film, fixing the end part of the carrier film with a clamping mechanism, aligning the carrier film with a profiling pressure head, and moving the clamping mechanism to one side close to the profiling pressure head so as to realize profiling of the film layer structure to be formed;
and placing the film structure to be formed in an environment with a first preset temperature for a first preset time, so that one side of the bonding layer, which is deviated from the flexible layer, is not sticky, and the film structure to be attached is formed.
8. The fitting method according to claim 7, characterized in that the first preset temperature is lower than or equal to-70 ℃; the first predetermined time is greater than or equal to 30 minutes.
9. The attaching method according to claim 1, wherein the film layer structure to be attached is gradually contacted with the cover plate from the middle of the cover plate to the periphery of the cover plate, and simultaneously, the adhesion layer is gradually restored to be sticky from the contact direction so as to be attached to the cover plate;
or the adhesive layer recovers viscosity after the film layer structure to be attached and one side of the cover plate, which deviates from the display surface of the cover plate, completely contact with each other, bubbles between the adhesive layer and the cover plate are removed through defoaming treatment, and the defoaming treatment comprises applying 150kpa of pressure to the cover plate and the adhesive layer after the attachment is completed.
10. The utility model provides a laminating device for with display panel and apron laminating, its characterized in that includes:
the cover plate fixing device is used for fixing the cover plate;
the carrier film clamping device is used for clamping the end part of the carrier film;
the profiling pressure head is used for profiling the film layer structure to be formed so as to enable the shape of the film layer structure to be formed to be matched with that of the cover plate, and the film layer structure to be formed comprises the display panel and an adhesive layer formed on a light emitting surface of the display panel;
the cover plate fixing device and/or the profiling pressure head are/is internally provided with a heating module;
preferably, the heating module comprises a resistance wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111449603.6A CN114078396A (en) | 2021-11-30 | 2021-11-30 | Bonding method and bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111449603.6A CN114078396A (en) | 2021-11-30 | 2021-11-30 | Bonding method and bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114078396A true CN114078396A (en) | 2022-02-22 |
Family
ID=80284386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111449603.6A Pending CN114078396A (en) | 2021-11-30 | 2021-11-30 | Bonding method and bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114078396A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050155704A1 (en) * | 2004-01-16 | 2005-07-21 | Eastman Kodak Company | Method of making an OLED display device with enhanced optical and mechanical properties |
| CN104461203A (en) * | 2014-12-22 | 2015-03-25 | 合肥鑫晟光电科技有限公司 | Method for attaching cover plate and touch induction thin film and touch screen |
| CN205736300U (en) * | 2016-05-09 | 2016-11-30 | 深圳市高展光电有限公司 | A kind of anti-fracture FOG this pressure device of hot press |
| CN106168921A (en) * | 2016-06-30 | 2016-11-30 | 维沃移动通信有限公司 | A kind of low-temperature protection method of mobile terminal flexible screen and mobile terminal |
| CN108227842A (en) * | 2018-01-31 | 2018-06-29 | 努比亚技术有限公司 | Wearable pattern switching based reminding method, mobile terminal and readable storage medium storing program for executing |
| WO2020037543A1 (en) * | 2018-08-22 | 2020-02-27 | 深圳市柔宇科技有限公司 | Optical adhesive and preparation method therefore, and display panel |
| CN111415592A (en) * | 2020-04-29 | 2020-07-14 | 京东方科技集团股份有限公司 | Back film for laminating flexible display panel, display device and laminating method |
| CN111546749A (en) * | 2020-05-28 | 2020-08-18 | 京东方科技集团股份有限公司 | Curved surface laminating device and curved surface laminating method |
| CN112351125A (en) * | 2020-10-28 | 2021-02-09 | Oppo广东移动通信有限公司 | Electronic equipment, display unit, display screen assembly and attaching method thereof |
| CN113459630A (en) * | 2020-03-31 | 2021-10-01 | 京东方科技集团股份有限公司 | Method and device for attaching flexible panel |
-
2021
- 2021-11-30 CN CN202111449603.6A patent/CN114078396A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050155704A1 (en) * | 2004-01-16 | 2005-07-21 | Eastman Kodak Company | Method of making an OLED display device with enhanced optical and mechanical properties |
| CN104461203A (en) * | 2014-12-22 | 2015-03-25 | 合肥鑫晟光电科技有限公司 | Method for attaching cover plate and touch induction thin film and touch screen |
| CN205736300U (en) * | 2016-05-09 | 2016-11-30 | 深圳市高展光电有限公司 | A kind of anti-fracture FOG this pressure device of hot press |
| CN106168921A (en) * | 2016-06-30 | 2016-11-30 | 维沃移动通信有限公司 | A kind of low-temperature protection method of mobile terminal flexible screen and mobile terminal |
| CN108227842A (en) * | 2018-01-31 | 2018-06-29 | 努比亚技术有限公司 | Wearable pattern switching based reminding method, mobile terminal and readable storage medium storing program for executing |
| WO2020037543A1 (en) * | 2018-08-22 | 2020-02-27 | 深圳市柔宇科技有限公司 | Optical adhesive and preparation method therefore, and display panel |
| CN113459630A (en) * | 2020-03-31 | 2021-10-01 | 京东方科技集团股份有限公司 | Method and device for attaching flexible panel |
| CN111415592A (en) * | 2020-04-29 | 2020-07-14 | 京东方科技集团股份有限公司 | Back film for laminating flexible display panel, display device and laminating method |
| CN111546749A (en) * | 2020-05-28 | 2020-08-18 | 京东方科技集团股份有限公司 | Curved surface laminating device and curved surface laminating method |
| CN112351125A (en) * | 2020-10-28 | 2021-02-09 | Oppo广东移动通信有限公司 | Electronic equipment, display unit, display screen assembly and attaching method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021190054A1 (en) | Laminating device and laminating method for display substrate | |
| WO2019227670A1 (en) | Curved screen bonding device and bonding method for same | |
| JP4823383B2 (en) | Sheet peeling method and peeling apparatus | |
| WO2021196875A1 (en) | Bonding method and bonding device for flexible panel | |
| KR101828833B1 (en) | A apparatus for attaching a flexible sheet to a curved glass | |
| CN110930882A (en) | Flexible display panel laminating device and method | |
| CN111546750A (en) | Bonding apparatus and bonding method | |
| CN212266952U (en) | Laminating device | |
| CN106739400B (en) | A kind of Optical transparent adhesive applying method | |
| CN113296295A (en) | Display module encapsulation method and shading adhesive assembly | |
| CN113920875B (en) | Attaching jig | |
| KR20150077829A (en) | Fabricating Method Of Side View Display Having Edge Bending Structure | |
| CN113138625A (en) | Laminating device and assembling method of display module | |
| CN114078396A (en) | Bonding method and bonding apparatus | |
| CN107111170A (en) | The binding method of Flexible Displays module | |
| JP5249826B2 (en) | Sheet peeling apparatus and peeling method | |
| CN111290151A (en) | Assembling method for assembling and laminating planar LCD into curved surface display and integrated screen | |
| JP5554430B2 (en) | Sheet peeling apparatus, peeling method and sheet peeling plate member | |
| CN113851692B (en) | Adhesive tape sticking device, adhesive tape sticking equipment and adhesive tape sticking method | |
| JP3949031B2 (en) | Chip mounting method | |
| JPH1195210A (en) | Method for peeling polarizing film and device therefor | |
| JPH05318601A (en) | Production of laminate | |
| KR100669792B1 (en) | Method of manufacturing a forming substrate, method of manufacturing a flat panel display device thereused, and pre-bonding apparatus of flexible substrate | |
| WO2020037806A1 (en) | Substrate labeling device | |
| CN211554536U (en) | Integrated screen for assembling and laminating planar LCD into curved surface display |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |