CN114054420B - Method for removing silicone oil sticky dirt on surface of silicon-based chip - Google Patents
Method for removing silicone oil sticky dirt on surface of silicon-based chip Download PDFInfo
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- CN114054420B CN114054420B CN202111245352.XA CN202111245352A CN114054420B CN 114054420 B CN114054420 B CN 114054420B CN 202111245352 A CN202111245352 A CN 202111245352A CN 114054420 B CN114054420 B CN 114054420B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a method for removing silicone oil sticky dirt on the surface of a silicon-based chip, and belongs to the technical field of integrated circuit electronic packaging. According to the method, a UV film is used for fixing a chip, the chip is placed in isopropanol serving as an organic solvent, an ultrasonic cleaning method is used, the ultrasonic power is set to 270W through a comparison experiment, the frequency is 26.4KHz, when the cleaning time is 5min, silicone oil on the surface of the chip can be removed, and the performance and the assembly reliability of the chip are not affected after the cleaning through experimental verification.
Description
Technical Field
The invention relates to the technical field of integrated circuit electronic packaging, in particular to a method for removing silicone oil sticky dirt on the surface of a silicon-based chip.
Background
The chip is the core of an electronic component, in particular to a military chip, in order to ensure the stability and the reliability of the chip, the chip is subjected to 100% internal visual inspection before sealing in the GJB548B method 2021.1 monolithic internal visual inspection, so that internal defects and redundant substances which can cause the failure of the device in normal use are detected and removed. Defects include metal layer defects, diffusion and passivation layer defects, scribe and chip defects, glass passivation layer defects, and the like, and the excess on the chip includes droplets, chemical stains, ink or photoresist, and other movable residues.
The surface of each sliced wafer stored in the nitrogen cabinet is found to be sticky when the wafer is inspected visually before use, the pollutants are observed to be black particles under a 50-time microscope and are denser, as shown in fig. 1, the pollutants are observed to be transparent colloidal particles under a 100-time microscope, as shown in fig. 2, no obvious effect is achieved when the wafer is cleaned by using a conventional cleaning means in the industry such as ethanol soaking and brushing by a brushing machine, the sticky particles are obviously reduced after the surface of the chip is wiped by the ethanol cotton, but part of the particles enter gaps of the aluminum strips under the action of pressure, and the particles cannot be removed cleanly.
Disclosure of Invention
The invention aims to provide a method for removing silicone oil sticky dirt on the surface of a silicon-based chip, which is in an ultrasonic cleaning mode and is matched with specific organic solvent isopropanol to realize effective removal of the silicone oil on the surface of the chip, and meanwhile, the test shows that the performance and the assembly reliability of the chip are not affected after the cleaning.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a method for removing silicone oil sticky dirt on the surface of a chip comprises the following steps:
(A) Placing a silicon-based chip on the adhesive film;
(B) Fixing the adhesive film using a metal device;
(C) Placing a metal device in a beaker filled with an organic solvent;
(D) Placing the beaker in an ultrasonic cleaner;
(E) And setting process parameters for ultrasonic cleaning.
In the step (a), the adhesive film is a UV film, and it is necessary to ensure that the organic component thereof is insoluble in the organic solvent in the step (C) so as to avoid secondary sticky dirt.
In the step (B), the metal device is a steel needle, is not easy to rust, and ensures that the UV film is tight.
In the step (C), the organic solvent is isopropanol.
In the step (D), the water interface in the ultrasonic cleaner is higher than or equal to the isopropanol solvent interface.
In the step (E), in the ultrasonic cleaning process, the ultrasonic power is 150-280W, the ultrasonic frequency is 15-28KHz, and the ultrasonic time is 3-7min; preferred process parameters are: ultrasonic power 270W, ultrasonic frequency 26.4KHz, ultrasonic time 5min.
The invention has the following advantages and beneficial effects:
the method can remove the silicone oil sticky dirt on the surface of the chip, and the test proves that the performance and the assembly reliability of the chip are not affected after the cleaning.
Drawings
Fig. 1 shows a 50-fold microscope with dense black particles.
FIG. 2 shows transparent colloidal particles under a 100-fold microscope.
FIG. 3 is a schematic view of the ultrasonic cleaning process of the method of the present invention.
Detailed Description
For a further understanding of the present invention, the present invention is described below with reference to the examples, which are only illustrative of the features and advantages of the present invention and are not intended to limit the scope of the claims of the present invention.
The invention provides a method for removing silicone oil sticky dirt on the surface of a chip, which comprises the following steps: after the dirt sticking chip is taken down from the blue film, the dirt sticking chip is stuck to a UV film with a proper size, the UV film is fixed by a fixing clamp (steel needle) and kept in a tight state, the whole structure is placed into a beaker filled with isopropanol, the chip is immersed by the isopropanol, the beaker is placed into an ultrasonic cleaning machine filled with a certain amount of water, the water level in a water tank in the ultrasonic cleaning machine is higher than or equal to the liquid level of the isopropanol in the beaker, ultrasonic cleaning is carried out according to set parameters, the UV film is threshed by ultraviolet light after cleaning, and a cleaning device is shown in figure 3. The UV film is chosen to ensure that the organic components are insoluble in isopropanol and should not have an additional impact on the chip surface. The isopropanol is used once and is poured into the recovery cylinder, if repeatedly used, the silicon slag dropped from the chip can damage the surface of the chip under the action of ultrasound.
Example 1:
after the cleaning method is determined, 2 kinds of dirt sticking chips are used as supports, the area of the type 1 chip is 2.28mm multiplied by 2.28mm, the area of the type 2 chip is 1.92mm multiplied by 1.24mm, and the influence of the number of single cleaning to the cleaning effect by the ultrasonic parameter setting is studied. Because of three parameters of ultrasonic power, ultrasonic frequency and ultrasonic time, the three-phase orthogonal data sample size is larger, so that a single variable method is adopted to determine one parameter first, then orthogonal experiments of the other two parameters are carried out, and the optimal ultrasonic cleaning parameter is determined.
The influence of ultrasonic frequency change on the cleaning effect is researched, the maximum ultrasonic frequency of equipment is 33KHz, the parameters are 10% -100% adjustable, 10 parameters are set from 3.3KHz, 6.6KHz, 9.9KHz … …, 29.7KHz and 33KHz according to 3.3KHz steps, the corresponding relation between the ultrasonic frequency of model 1 and model 2 and the qualification rate (per hundred) of the cleaned chips is listed in table 2, and the data in the table shows that the qualification rate of the model 1 chips reaches 83% when the frequency is 26.4KHz, the qualification rate of the model 2 chips is 85% after cleaning, the cleaning effect is optimal, the frequency exceeds 26.4KHz, and the failure of the chips is mainly caused by fluctuation.
After the ultrasonic frequency is determined to be 26.4KHz, performing an orthogonal test of ultrasonic power and ultrasonic time, wherein the ultrasonic power of the equipment is 300W, the parameters are 10% -100% adjustable, 10 parameters are set from 30W, 60W, 90W, … …, 270W and 300W according to 30W steps, and the ultrasonic cleaning time is 3 according to the earlier-stage fumbling test data, and the time is 3min, 5min and 7min. Table 3 lists the corresponding relation between the ultrasonic power and ultrasonic time of model 1 and the qualification rate (per hundred) of the cleaned chips, table 4 lists the corresponding relation between the ultrasonic power and ultrasonic time of model 2 and the qualification rate (per hundred) of the cleaned chips, and the ultrasonic power 270W and ultrasonic time of 5min are shown in the table, so that the qualification rates of the cleaned chips of model 1 and model 2 are 100%, and the cleaning effect is optimal. When the ultrasonic power is lower than 120W, the silicone oil on the surface of the chip is basically ineffective, and when the ultrasonic power is 300W, the surface of the chip is seriously scratched. The cleaning time is short, the removing effect is not obvious, the cleaning time is long, and the surface of the chip has the phenomenon of scratch.
TABLE 2 correspondence between ultrasonic frequencies for model one and model two and chip yield after cleaning (per hundred)
TABLE 3 ultrasonic Power and ultrasonic time for chip model one and chip yield after cleaning (per hundred)
TABLE 4 ultrasonic power and ultrasonic time for chip model two and chip percent of pass after cleaning (per hundred) relationship
And (3) verifying the reliability after cleaning:
the model 1 chip packaging technology comprises conductive adhesive sheets, 25 mu m gold wire bonding and AuSn fusion sealing, the model 2 chip packaging technology comprises alloy adhesive sheets, 32 mu m silicon aluminum wire bonding and AnSn fusion sealing, each model 10 is subjected to small-batch verification, appearance inspection after the adhesive sheets and after the bonding is normal, 5 models 1 and 2 are extracted to carry out bonding tension and chip shearing force tests, the bonding tension and the chip shearing force meet the related requirements of GJB548, and the bonding tension and the shearing force values of the same model chips are basically consistent with those of the same model chips without bonding pollution. The residual circuit is qualified in appearance inspection after being sealed, qualified in air tightness inspection, qualified in three-temperature test function and consistent with the test result of the chip with the same model and without adhering dirt. And 3 products with the air tightness being qualified are extracted from the rest 5 products with the air tightness being qualified in the model 1 and the model 2, wherein the water vapor content is detected, the water vapor content is less than 5000ppm, and the components are free of isopropanol. After the small-batch verification is qualified, the two types of products are subjected to batch verification, the examination is carried out according to the detailed specification requirements of the respective products, the screening qualification rate is 100% according to GJB548, and the consistency inspection is passed.
Claims (4)
1. A method for removing silicone oil sticky dirt on the surface of a chip is characterized by comprising the following steps: the method comprises the following steps:
(A) Placing a silicon-based chip on the adhesive film; the adhesive film is a UV film, and organic components of the adhesive film need to be insoluble in the organic solvent in the step (C), so that secondary adhesive pollution is avoided;
(B) Fixing the adhesive film using a metal device;
(C) Placing a metal device in a beaker filled with an organic solvent; the organic solvent is isopropanol;
(D) Placing the beaker in an ultrasonic cleaner, wherein the water interface in the ultrasonic cleaner is higher than or equal to the isopropanol solvent interface;
(E) And setting process parameters for ultrasonic cleaning.
2. The method for removing silicone oil sticky dirt on the surface of a chip according to claim 1, wherein the method comprises the following steps: in the step (B), the metal device is a steel needle, is not easy to rust, and ensures that the UV film is tight.
3. The method for removing silicone oil sticky dirt on the surface of a chip according to claim 1, wherein the method comprises the following steps: in the step (E), in the ultrasonic cleaning process, the ultrasonic power is 150-280W, the ultrasonic frequency is 15-28KHz, and the ultrasonic time is 3-7min.
4. The method for removing silicone oil sticky dirt on the surface of a chip according to claim 1, wherein the method comprises the following steps: in the step (E), in the ultrasonic cleaning process, the ultrasonic power is 270W, the ultrasonic frequency is 26.4KHz, and the ultrasonic time is 5min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111245352.XA CN114054420B (en) | 2021-10-26 | 2021-10-26 | Method for removing silicone oil sticky dirt on surface of silicon-based chip |
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| CN202111245352.XA CN114054420B (en) | 2021-10-26 | 2021-10-26 | Method for removing silicone oil sticky dirt on surface of silicon-based chip |
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| CN114054420B true CN114054420B (en) | 2023-07-18 |
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