JP2007327914A - Ultrasonic inspection method - Google Patents

Ultrasonic inspection method Download PDF

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JP2007327914A
JP2007327914A JP2006161241A JP2006161241A JP2007327914A JP 2007327914 A JP2007327914 A JP 2007327914A JP 2006161241 A JP2006161241 A JP 2006161241A JP 2006161241 A JP2006161241 A JP 2006161241A JP 2007327914 A JP2007327914 A JP 2007327914A
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electronic component
type electronic
water
chip
ultrasonic inspection
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Hirotomo Sakusabe
博朋 作左部
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TDK Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic inspection method capable of inspecting accurately a defect on a work by suppressing generation of bubbles on the work surface. <P>SOLUTION: In this ultrasonic inspection method, ethyl alcohol 50 is dropped onto a chip type electronic component 30 which is an inspection object, to thereby remove air from the surface of the chip type electronic component 30. In this case, since the surface tension of ethyl alcohol 50 is smaller than that of water 15, wraparound of ethyl alcohol 50 on the surface of the chip type electronic component 30 hardly occurs, and the surface of the chip type electronic component 30 is covered with the ethyl alcohol 50 in the state where bubble generation is suppressed. In the ultrasonic inspection method, since the chip type electronic component 30 is dipped into water 15, while keeping the state where the surface of the chip type electronic component 30 is covered with the ethyl alcohol 50, bubble generation on the surface of the chip type electronic component 30 can be suppressed even in the water 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、超音波によってワークの欠陥を検査する超音波検査方法に関する。   The present invention relates to an ultrasonic inspection method for inspecting a defect of a workpiece by ultrasonic waves.

この種の分野に関連する技術として、例えば特許文献１に記載の軸受リングの超音波探傷検査方法がある。この従来の軸受リングの超音波探傷検査方法を始めとして、多くの超音波検査方法では、水などの超音波伝達媒体の中に配置した被検査対象物（以下、「ワーク」と記す）に向けて超音波を伝達させる。そして、ワークから反射してくる超音波のエコーを検出することで、ワークの割れや欠けといった欠陥の有無を検査する。
特開平１１−３３７５３０号公報 As a technique related to this type of field, for example, there is an ultrasonic flaw detection inspection method for a bearing ring described in Patent Document 1. Many of the ultrasonic inspection methods, including the conventional ultrasonic inspection method for bearing rings, are directed toward an object to be inspected (hereinafter referred to as “work”) placed in an ultrasonic transmission medium such as water. To transmit ultrasonic waves. And the presence or absence of defects, such as a crack of a work and a chip, is inspected by detecting the echo of the ultrasonic wave reflected from the work.
JP-A-11-337530

ところで、上述したような従来の超音波検査方法では、ワークを水に浸漬する際に表面張力による水の回り込みが生じ、図５に示すように、ワークの表面に気泡が発生することがある。このような気泡が発生すると、気泡に当たった超音波の大部分がワークまで伝達せずに反射してしまい、ワークの欠陥の検査精度が十分に得られなくなるおそれがある。   By the way, in the conventional ultrasonic inspection method as described above, water wraps around due to surface tension when the work is immersed in water, and bubbles may be generated on the surface of the work as shown in FIG. When such bubbles are generated, most of the ultrasonic waves hitting the bubbles are reflected without being transmitted to the workpiece, and there is a possibility that the inspection accuracy of the workpiece defect cannot be sufficiently obtained.

本発明は、上記課題の解決のためになされたものであり、ワークの表面での気泡の発生を抑えることにより、ワークの欠陥を精度良く検査することができる超音波検査方法を提供することを目的とする。   The present invention has been made to solve the above problems, and provides an ultrasonic inspection method capable of accurately inspecting a defect of a workpiece by suppressing generation of bubbles on the surface of the workpiece. Objective.

上記課題の解決のため、本発明に係る超音波検査方法は、超音波によってワークの欠陥を検査する超音波検査方法であって、ワークを水よりも表面張力の小さな水溶性の液体に浸し、ワークの表面を水溶性の液体で覆う工程と、水溶性の液体で前記表面を覆った状態で、ワークを水中に浸漬させる工程と、水中に浸漬されたワークに向けて超音波を発振させる工程とを備えたことを特徴としている。   In order to solve the above problems, an ultrasonic inspection method according to the present invention is an ultrasonic inspection method for inspecting a defect of a workpiece by ultrasonic waves, and the workpiece is immersed in a water-soluble liquid having a surface tension smaller than that of water, A step of covering the surface of the workpiece with a water-soluble liquid, a step of immersing the workpiece in water with the surface covered with the water-soluble liquid, and a step of oscillating ultrasonic waves toward the workpiece immersed in water It is characterized by having.

この超音波検査方法では、まずワークを水溶性の液体に浸すことにより、ワークの表面から空気を除去する。このとき、水溶性の液体の表面張力は水よりも小さいことから、ワークの表面での水溶性の液体の回り込みが生じにくく、ワークの表面は、気泡の発生が抑制された状態で水溶性の液体によって覆われる。そして、この超音波検査方法では、ワークの表面を水溶性の液体で覆った状態を保ったままワークを水中に浸漬するので、水中においてもワークの表面での気泡の発生を抑制できる。これにより、検査用の超音波をワークに向けて発振させた際に、気泡によってワークに到達する前に超音波が反射してしまうことが抑えられ、ワークの欠陥を精度良く検査することができる。また、ワークの表面を覆う水溶性の液体は、ワークを水中に浸漬する際に溶けて拡散するため、その取り扱いは容易であり、検査精度に影響することも殆どない。   In this ultrasonic inspection method, air is first removed from the surface of the workpiece by immersing the workpiece in a water-soluble liquid. At this time, since the surface tension of the water-soluble liquid is smaller than that of water, it is difficult for the water-soluble liquid to wrap around the surface of the workpiece, and the surface of the workpiece is water-soluble in a state where the generation of bubbles is suppressed. Covered with liquid. In this ultrasonic inspection method, since the work is immersed in water while keeping the surface of the work covered with a water-soluble liquid, generation of bubbles on the surface of the work can be suppressed even in water. As a result, when the ultrasonic wave for inspection is oscillated toward the workpiece, the ultrasonic wave is prevented from being reflected by the bubbles before reaching the workpiece, and the defect of the workpiece can be inspected with high accuracy. . In addition, since the water-soluble liquid covering the surface of the work dissolves and diffuses when the work is immersed in water, its handling is easy and it hardly affects the inspection accuracy.

また、水溶性の液体は、アルコールであることが好ましい。この場合、上述した気泡の発生を好適に抑制できる。また、水中への拡散もより確実となり、その取り扱いも容易である。   The water-soluble liquid is preferably alcohol. In this case, generation | occurrence | production of the bubble mentioned above can be suppressed suitably. In addition, diffusion into water is more reliable and easy to handle.

本発明に係る超音波検査方法によれば、ワークの表面での気泡の発生を抑えることができ、ワークの欠陥を精度良く検査することができる。   According to the ultrasonic inspection method according to the present invention, it is possible to suppress the generation of bubbles on the surface of the workpiece, and it is possible to accurately inspect defects of the workpiece.

以下、図面を参照しながら、本発明に係る超音波検査方法の好適な実施形態について詳細に説明する。   Hereinafter, preferred embodiments of an ultrasonic inspection method according to the present invention will be described in detail with reference to the drawings.

図１は、本発明に係る超音波検査方法の一実施形態に用いられる超音波検査システムを示す図である。図１に示すように、超音波検査システム１は、超音波Ｐを発振するプローブ１１を有する超音波検査装置１０と、超音波Ｐの伝達媒体である水１５で満たされた卓上サイズの水槽２０とを備え、水槽２０内に配置されたチップ型電子部品（ワーク）３０の欠陥を非破壊で検査するための、いわゆる水浸式の超音波検査システムとして構成されている。このような超音波検査システム１としては、例えばソニックス株式会社製のＩｎＳｉｇｈｔ−２００を用いることができる。   FIG. 1 is a diagram showing an ultrasonic inspection system used in an embodiment of an ultrasonic inspection method according to the present invention. As shown in FIG. 1, an ultrasonic inspection system 1 includes an ultrasonic inspection apparatus 10 having a probe 11 that oscillates an ultrasonic wave P, and a table-size water tank 20 filled with water 15 that is a transmission medium of the ultrasonic wave P. The chip-type electronic component (work) 30 disposed in the water tank 20 is configured as a so-called water immersion type ultrasonic inspection system for non-destructive inspection of defects. As such an ultrasonic inspection system 1, for example, InSight-200 manufactured by Sonics Corporation can be used.

検査対象物であるチップ型電子部品３０について、図２に例示する。図２に示すチップ型電子部品３０は、導電パターンが形成されたセラミック層を積層してなる本体部３１と、この本体部３１の両端にそれぞれ形成された外部電極３２，３２とからなる積層型電子部品である。このようなチップ型電子部品３０としては、チップコンデンサ、チップバリスタ、チップインダクタ、チップビーズなどが挙げられる。チップ型電子部品３０は、図１に示すように、例えばパレット１２上にマトリクス状に配列された状態で水槽２０の底部に配置される。   A chip-type electronic component 30 that is an inspection object is illustrated in FIG. A chip-type electronic component 30 shown in FIG. 2 is a laminated type comprising a main body portion 31 formed by laminating ceramic layers on which conductive patterns are formed, and external electrodes 32 and 32 formed on both ends of the main body portion 31, respectively. It is an electronic component. Examples of such chip-type electronic component 30 include a chip capacitor, a chip varistor, a chip inductor, and a chip bead. As shown in FIG. 1, the chip-type electronic components 30 are arranged at the bottom of the water tank 20 in a state of being arranged in a matrix on the pallet 12, for example.

超音波検査装置１０は、超音波Ｐのエコーの信号波形を測定するオシロスコープや、得られた測定データの画像処理や格納等を行うパーソナルコンピュータなどを備えている。超音波検査装置１０のプローブ１１は、水槽２０の上部に配置されており、プローブ１１の先端は、水槽２０の底部に配置されたチップ型電子部品３０に向けられている。超音波検査装置１０は、検査を行う作業者による所定の操作を契機として、プローブ１１の先端から超音波Ｐを発振させ、チップ型電子部品３０に向けて超音波Ｐを伝達させる。そして、超音波検査装置１０は、チップ型電子部品３０から反射してくる超音波Ｐのエコーをプローブ１１で検出し、検出した超音波Ｐのエコーの反射深さに基づいて画像処理を行うことにより、チップ型電子部品３０の割れや欠けといった欠陥の有無を判別する。   The ultrasonic inspection apparatus 10 includes an oscilloscope that measures the signal waveform of an echo of the ultrasonic wave P, a personal computer that performs image processing, storage, and the like of the obtained measurement data. The probe 11 of the ultrasonic inspection apparatus 10 is disposed at the upper part of the water tank 20, and the tip of the probe 11 is directed to the chip-type electronic component 30 disposed at the bottom of the water tank 20. The ultrasonic inspection apparatus 10 oscillates the ultrasonic wave P from the tip of the probe 11 and transmits the ultrasonic wave P toward the chip-type electronic component 30 in response to a predetermined operation by an operator who performs the inspection. The ultrasonic inspection apparatus 10 detects the echo of the ultrasonic wave P reflected from the chip-type electronic component 30 by the probe 11 and performs image processing based on the detected reflection depth of the echo of the ultrasonic wave P. Thus, the presence or absence of a defect such as a crack or chip in the chip-type electronic component 30 is determined.

次に、上述した構成を有する超音波検査システム１を用いた超音波検査の手順について説明する。   Next, an ultrasonic inspection procedure using the ultrasonic inspection system 1 having the above-described configuration will be described.

まず、図３（ａ）に示すように、パレット１２上にチップ型電子部品３０をマトリクス状に配列する。次に、パレット１２上のチップ型電子部品３０に、水１５よりも表面張力の小さな水溶性の液体であるエチルアルコール５０を適量滴下する。これにより、チップ型電子部品３０の表面、及びチップ型電子部品３０，３０間の隙間から空気が除去され、チップ型電子部品３０の全体がエチルアルコール５０によって覆われる。   First, as shown in FIG. 3A, chip-type electronic components 30 are arranged in a matrix on the pallet 12. Next, an appropriate amount of ethyl alcohol 50 which is a water-soluble liquid having a surface tension smaller than that of water 15 is dropped onto the chip-type electronic component 30 on the pallet 12. Thereby, air is removed from the surface of the chip-type electronic component 30 and the gap between the chip-type electronic components 30, 30, and the entire chip-type electronic component 30 is covered with the ethyl alcohol 50.

チップ型電子部品３０をエチルアルコール５０で覆った後、直ちにパレット１２を水槽２０に沈め、図３（ｂ）に示すように、チップ型電子部品３０を水１５中に浸漬させる。このとき、チップ型電子部品３０の周りの空気は、エチルアルコール５０によって既に除去されているので、チップ型電子部品３０の表面に気泡が生じることは殆どない。そして、チップ型電子部品３０を覆うエチルアルコール５０は水１５中に溶けて拡散し、その代わりに、チップ型電子部品３０の表面は、水１５によって覆われる。   After covering the chip-type electronic component 30 with the ethyl alcohol 50, the pallet 12 is immediately submerged in the water tank 20, and the chip-type electronic component 30 is immersed in the water 15 as shown in FIG. At this time, since the air around the chip-type electronic component 30 has already been removed by the ethyl alcohol 50, bubbles are hardly generated on the surface of the chip-type electronic component 30. Then, the ethyl alcohol 50 covering the chip type electronic component 30 is dissolved and diffused in the water 15. Instead, the surface of the chip type electronic component 30 is covered with the water 15.

チップ型電子部品３０の水１５中への浸漬が完了した後、超音波検査装置１０のプローブ１１を水槽２０におけるチップ型電子部品３０の真上の位置に配置し、プローブ１１の先端を水面下に位置させる。次に、プローブ１１から超音波Ｐ（図１参照）を発振させ、超音波Ｐをチップ型電子部品３０に伝達させる。そして、チップ型電子部品３０から反射してくる超音波Ｐのエコーをプローブ１１で検出し、検出した超音波Ｐのエコーの反射深さに基づく画像処理を行うことにより、チップ型電子部品３０の割れや欠けといった欠陥の有無を判別する。   After the immersion of the chip-type electronic component 30 in the water 15 is completed, the probe 11 of the ultrasonic inspection apparatus 10 is placed at a position directly above the chip-type electronic component 30 in the water tank 20, and the tip of the probe 11 is below the water surface. To be located. Next, an ultrasonic wave P (see FIG. 1) is oscillated from the probe 11, and the ultrasonic wave P is transmitted to the chip-type electronic component 30. Then, the echo of the ultrasonic wave P reflected from the chip-type electronic component 30 is detected by the probe 11 and image processing based on the reflection depth of the detected echo of the ultrasonic wave P is performed. Determine the presence or absence of defects such as cracks and chips.

以上説明したように、この超音波検査方法では、検査対象物であるチップ型電子部品３０にエチルアルコール５０を滴下し、チップ型電子部品３０の表面から空気を除去する。このとき、エチルアルコール５０の表面張力は水１５よりも小さいことから、チップ型電子部品３０の表面でのエチルアルコール５０の回り込みは生じにくく、チップ型電子部品３０の表面は、気泡の発生が抑制された状態でエチルアルコール５０によって覆われる。そして、この超音波検査方法では、チップ型電子部品３０の表面をエチルアルコール５０で覆った状態を保ったままチップ型電子部品３０を水１５中に浸漬するので、水１５中においてもチップ型電子部品３０の表面での気泡の発生を抑制できる。   As described above, in this ultrasonic inspection method, ethyl alcohol 50 is dropped on the chip-type electronic component 30 that is the inspection target, and air is removed from the surface of the chip-type electronic component 30. At this time, since the surface tension of the ethyl alcohol 50 is smaller than that of the water 15, the ethyl alcohol 50 hardly wraps around the surface of the chip-type electronic component 30, and the surface of the chip-type electronic component 30 suppresses the generation of bubbles. In this state, it is covered with ethyl alcohol 50. In this ultrasonic inspection method, since the chip-type electronic component 30 is immersed in the water 15 while the surface of the chip-type electronic component 30 is covered with the ethyl alcohol 50, the chip-type electronic also in the water 15. Generation of bubbles on the surface of the component 30 can be suppressed.

これにより、プローブ１１から超音波Ｐをチップ型電子部品３０に向けて伝達させた際に、気泡によってチップ型電子部品３０に到達する前に超音波Ｐが反射してしまうことが抑えられ、チップ型電子部品３０の欠陥を精度良く検査することができる。また、チップ型電子部品３０の空気の除去に用いるエチルアルコール５０自体は、チップ型電子部品３０を水１５中に浸漬する際に溶けて拡散するため、その取り扱いは容易であり、検査精度に影響することも殆どない。   Thereby, when the ultrasonic wave P is transmitted from the probe 11 toward the chip-type electronic component 30, it is suppressed that the ultrasonic wave P is reflected before reaching the chip-type electronic component 30 due to bubbles. A defect of the mold electronic component 30 can be inspected with high accuracy. In addition, since the ethyl alcohol 50 itself used for removing air from the chip-type electronic component 30 is dissolved and diffused when the chip-type electronic component 30 is immersed in the water 15, its handling is easy and affects the inspection accuracy. There is little to do.

続いて、本発明に係る超音波検査方法における気泡の発生の抑制効果を検証するために行った実験について説明する。   Subsequently, an experiment conducted to verify the effect of suppressing the generation of bubbles in the ultrasonic inspection method according to the present invention will be described.

本実験は、パレット１２上に配列したチップ型電子部品３０を水１５中に浸漬した時のチップ型電子部品３０の表面への気泡の付着の様子を調べたものである。実験条件として、パレット１２上には４×７のマトリクス状にチップ型電子部品３０を配列した。実施例においては、上述した図３（ａ）及び図３（ｂ）のように、チップ型電子部品３０に予め適量のエチルアルコール５０を滴下し、チップ型電子部品３０の表面をエチルアルコール５０で覆ってからパレット１２を水１５中に浸漬した。また、比較例においては、パレット１２上のチップ型電子部品３０にエチルアルコール５０を滴下せず、そのままの状態でパレット１２を水１５中に浸漬した。   In this experiment, the state of bubbles adhering to the surface of the chip-type electronic component 30 when the chip-type electronic components 30 arranged on the pallet 12 are immersed in the water 15 is examined. As experimental conditions, chip-type electronic components 30 were arranged on the pallet 12 in a 4 × 7 matrix. In the embodiment, as shown in FIGS. 3A and 3B described above, an appropriate amount of ethyl alcohol 50 is dropped in advance on the chip-type electronic component 30, and the surface of the chip-type electronic component 30 is made of ethyl alcohol 50. After covering, the pallet 12 was immersed in water 15. In the comparative example, the pallet 12 was immersed in the water 15 as it was without dropping the ethyl alcohol 50 onto the chip-type electronic component 30 on the pallet 12.

図４は、その実験結果を示す図である。図４（ａ）に示すように、実施例では、水１５中に浸漬したチップ型電子部品３０への気泡の付着は見られなかった。一方、図４（ｂ）に示すように、比較例では、チップ型電子部品３０の表面に数個の気泡６０が付着していた。このような気泡６０は、チップ型電子部品３０とパレット１２との間に付着する場合もあった。以上の実験結果から、チップ型電子部品３０の表面をエチルアルコール５０で覆うことにより、気泡の発生を抑制できることが確認された。   FIG. 4 is a diagram showing the experimental results. As shown in FIG. 4A, in the example, no bubble was observed on the chip-type electronic component 30 immersed in the water 15. On the other hand, as shown in FIG. 4B, in the comparative example, several bubbles 60 adhered to the surface of the chip type electronic component 30. Such a bubble 60 may adhere between the chip-type electronic component 30 and the pallet 12 in some cases. From the above experimental results, it was confirmed that the generation of bubbles can be suppressed by covering the surface of the chip-type electronic component 30 with the ethyl alcohol 50.

本発明は、上記実施形態に限られるものではない。例えば、上述した実施形態では、水溶性の液体としてエチルアルコールを用いているが、水より表面張力の小さいものであれば、メチルアルコールやイソプロピルアルコールといった他のアルコールを用いてもよい。また、このような水溶性の液体を滴下する量は、ワークの数に応じて適宜増減してもよい。   The present invention is not limited to the above embodiment. For example, in the embodiment described above, ethyl alcohol is used as the water-soluble liquid, but other alcohols such as methyl alcohol and isopropyl alcohol may be used as long as the surface tension is smaller than that of water. Further, the amount of such a water-soluble liquid dropped may be appropriately increased or decreased depending on the number of workpieces.

本発明の一実施形態に係る超音波検査方法に用いる超音波検査システムを示す図である。It is a figure which shows the ultrasonic inspection system used for the ultrasonic inspection method which concerns on one Embodiment of this invention. チップ型電子部品の一例を示す斜視図である。It is a perspective view which shows an example of a chip-type electronic component. 図１に示した超音波検査システムを用いて行う超音波検査方法を示す図である。It is a figure which shows the ultrasonic inspection method performed using the ultrasonic inspection system shown in FIG. チップ型電子部品の表面での気泡の抑制効果を検証した実験の実験結果を示す図である。It is a figure which shows the experimental result of the experiment which verified the suppression effect of the bubble on the surface of a chip-type electronic component. 従来の超音波検査方法を示す図である。It is a figure which shows the conventional ultrasonic inspection method.

符号の説明Explanation of symbols

１…超音波検査システム、１５…水、３０…チップ型電子部品（ワーク）、５０…エチルアルコール（水溶性の液体）、Ｗ…超音波。   DESCRIPTION OF SYMBOLS 1 ... Ultrasonic inspection system, 15 ... Water, 30 ... Chip-type electronic component (workpiece), 50 ... Ethyl alcohol (water-soluble liquid), W ... Ultrasonic.

Claims (2)

超音波によってワークの欠陥を検査する超音波検査方法であって、
前記ワークを水よりも表面張力の小さな水溶性の液体に浸し、前記ワークの表面を前記水溶性の液体で覆う工程と、
前記水溶性の液体で前記表面を覆った状態で、前記ワークを水中に浸漬させる工程と、
前記水中に浸漬されたワークに向けて前記超音波を発振させる工程とを備えたことを特徴とする超音波検査方法。 An ultrasonic inspection method for inspecting a defect of a workpiece by ultrasonic waves,
Immersing the workpiece in a water-soluble liquid having a smaller surface tension than water, and covering the surface of the workpiece with the water-soluble liquid;
A step of immersing the workpiece in water while covering the surface with the water-soluble liquid;
And a step of oscillating the ultrasonic wave toward the work immersed in the water. 前記水溶性の液体は、アルコールであることを特徴とする請求項１記載の超音波検査方法。   The ultrasonic inspection method according to claim 1, wherein the water-soluble liquid is alcohol.
JP2006161241A 2006-06-09 2006-06-09 Ultrasonic inspection method Withdrawn JP2007327914A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010223840A (en) * 2009-03-25 2010-10-07 Neomax Material:Kk Flaw detection device
JP2010223842A (en) * 2009-03-25 2010-10-07 Neomax Material:Kk Flaw detector
JP2011237372A (en) * 2010-05-13 2011-11-24 Jtekt Corp Circuit board unit manufacturing method and ultrasonic inspection method
CN109406626A (en) * 2018-09-10 2019-03-01 中国电子科技集团公司第五十五研究所 Ultrasonic scanning detection device and the method that sample to be tested is fixed using it
KR102071174B1 (en) * 2019-05-08 2020-01-29 한전케이피에스 주식회사 Probe of ultrasonic waves for measuring container liner plate thickness and system using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010223840A (en) * 2009-03-25 2010-10-07 Neomax Material:Kk Flaw detection device
JP2010223842A (en) * 2009-03-25 2010-10-07 Neomax Material:Kk Flaw detector
JP2011237372A (en) * 2010-05-13 2011-11-24 Jtekt Corp Circuit board unit manufacturing method and ultrasonic inspection method
CN109406626A (en) * 2018-09-10 2019-03-01 中国电子科技集团公司第五十五研究所 Ultrasonic scanning detection device and the method that sample to be tested is fixed using it
KR102071174B1 (en) * 2019-05-08 2020-01-29 한전케이피에스 주식회사 Probe of ultrasonic waves for measuring container liner plate thickness and system using the same

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