CN114040672A - Radio frequency chip shielding device and manufacturing method thereof - Google Patents
Radio frequency chip shielding device and manufacturing method thereof Download PDFInfo
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- CN114040672A CN114040672A CN202111450788.2A CN202111450788A CN114040672A CN 114040672 A CN114040672 A CN 114040672A CN 202111450788 A CN202111450788 A CN 202111450788A CN 114040672 A CN114040672 A CN 114040672A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0049—Casings being metallic containers
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Abstract
The invention discloses a radio frequency chip shielding device and a manufacturing method thereof, wherein the radio frequency chip shielding device comprises a substrate wafer, at least two radio frequency chips arranged on the substrate wafer, at least two shielding boxes and a micro-coaxial transmission line; the at least two radio frequency chips are interconnected through a micro-coaxial transmission line, the at least two radio frequency chips correspond to the at least two shielding boxes one by one, each shielding box covers the corresponding radio frequency chip and part of the micro-coaxial transmission line, and the shielding boxes are provided with through holes for the micro-coaxial transmission line to pass through; the micro-coaxial transmission line comprises an inner conductor and an outer conductor which are coaxially arranged, wherein the outer conductor is a rectangular wire with a hollow inner part, the inner conductor is a solid rectangular wire, the inner conductor is arranged in the outer conductor and is insulated from the outer conductor, and the shape and the size of the outer conductor are matched with those of the through hole. The radio frequency chip shielding device can reduce the problem of electromagnetic leakage when the transmission line enters or exits the shielding box.
Description
Technical Field
The invention relates to the technical field of radio frequency transmission, in particular to a radio frequency chip shielding device and a manufacturing method thereof.
Background
The rapid development of wireless communication technology and the wide application of high-speed circuits make the electromagnetic environment more and more complex. Almost all electronic devices are inevitably under the potential influence of surrounding electromagnetic fields. Therefore, the problem of protection against electromagnetic interference is receiving a great deal of attention.
Electromagnetic shielding is one of the most basic methods of suppressing electromagnetic interference. It is now common to suppress electromagnetic interference by adding shielding enclosures outside the chips and devices of the radio frequency system. Different chips or devices in a radio frequency system are interconnected through planar transmission lines such as microstrips, coplanar waveguides and the like, so that the shielding case is generally required to be provided with openings for the planar transmission lines to pass through so as to meet the working condition of a semi-open field.
However, in order to prevent short circuit, when the planar transmission lines pass through the openings and enter the shielding case, gaps exist between the planar transmission lines and the openings, electromagnetic leakage is easily generated at the gaps, and when the operating wavelength is shorter and shorter, the electromagnetic leakage is more and more serious, which causes significant degradation of the performance of the chip, so that the shielding case cannot achieve a good electromagnetic shielding effect.
Disclosure of Invention
In view of the above, the present invention has been made to provide a radio frequency chip shielding device and a method of manufacturing the same that overcome or at least partially solve the above problems.
In a first aspect, a radio frequency chip shielding device is provided, which includes a substrate wafer, and at least two radio frequency chips, at least two shielding boxes and a micro-coaxial transmission line arranged on the substrate wafer;
the at least two radio frequency chips are interconnected through the micro-coaxial transmission line, the at least two radio frequency chips correspond to the at least two shielding boxes one by one, each shielding box covers the corresponding radio frequency chip and part of the micro-coaxial transmission line, and the shielding boxes are provided with through holes for the micro-coaxial transmission line to pass through;
the micro-coaxial transmission line comprises an inner conductor and an outer conductor which are coaxially arranged, the outer conductor is a rectangular line with a hollow inner part, the inner conductor is a solid rectangular line, the inner conductor is arranged in the outer conductor, the inner conductor is insulated from the outer conductor, and the shape and the size of the outer conductor are matched with those of the through hole.
Optionally, a distance between the upper surface of the inner conductor and the top of the outer conductor is equal to a distance between the lower surface of the inner conductor and the bottom of the outer conductor.
Optionally, a distance between the outer sidewall of the inner conductor and the inner sidewall of the outer conductor is greater than 30 um.
Optionally, the inner conductor and the outer conductor are both copper conductors.
Optionally, the micro-coaxial transmission line further includes a support member for supporting the inner conductor, and the support member is located in the outer conductor.
Optionally, support piece includes a plurality of support bars, a plurality of support bars are followed the axial interval arrangement of outer conductor, and every the both ends of support bar are all inlayed and are established on two relative inner walls of outer conductor, the inner conductor sets up on a plurality of support bars.
Optionally, the support member includes a plurality of support blocks, the support blocks are arranged at intervals along the axial direction of the outer conductor, each support block is located on the bottom layer of the outer conductor and arranged at intervals with the side wall of the outer conductor, and the inner conductor is disposed on the support blocks.
Optionally, the radio frequency chip shielding device further includes a connecting member, the inner conductor is electrically connected to the radio frequency chip through the connecting member, and the connecting member is a solder ball, a copper pillar, or a tin-containing alloy member.
Optionally, the shielding box is composed of a metal cover plate and a plurality of shielding side plates, a shielding cavity is formed between the metal cover plate and the shielding side plates and between the substrate wafers, the radio frequency chip is located in the shielding cavity, and the radio frequency chip and the shielding box are arranged at intervals.
In a second aspect, there is provided a method for manufacturing a radio frequency chip shielding device, for manufacturing the radio frequency chip shielding device according to the first aspect, the method including:
arranging at least two radio frequency chips on a substrate wafer;
forming a micro-coaxial transmission line on the substrate wafer, and enabling the at least two radio frequency chips to be interconnected through the micro-coaxial transmission line;
forming at least two shielding boxes on the substrate wafer, wherein the at least two radio frequency chips correspond to the at least two shielding boxes one to one, each shielding box covers the corresponding radio frequency chip and part of the micro-coaxial transmission line, and the shielding boxes are provided with through holes for the micro-coaxial transmission line to pass through;
the micro-coaxial transmission line comprises an inner conductor and an outer conductor which are coaxially arranged, the outer conductor is a rectangular wire with a hollow inner part, the inner conductor is a solid rectangular wire, the inner conductor is arranged in the outer conductor, the inner conductor and the outer conductor are insulated, and the shape and the size of the outer conductor are matched with those of the through hole.
The technical scheme provided by the embodiment of the invention at least has the following technical effects or advantages:
according to the radio frequency chip shielding device and the manufacturing method thereof provided by the embodiment of the invention, the shielding box is covered outside each radio frequency chip, so that a single electromagnetic shielding environment is provided for each radio frequency chip, and the electromagnetic shielding among the radio frequency chips and between the radio frequency chips and other modules is realized. Meanwhile, the micro-coaxial transmission line is adopted to realize the interconnection between the radio frequency chips. The micro-coaxial transmission line comprises an inner conductor and an outer conductor, wherein the inner conductor and the outer conductor are insulated. On one hand, the outer conductor has a shielding function, and can isolate the electromagnetic field generated by the inner conductor from the electromagnetic field generated outside, so that mutual interference between signals is prevented. On the other hand, the shape and the size of the outer conductor are matched with the shape and the size of the through hole, so that when the micro-coaxial transmission line passes through the through hole and enters and exits the shielding case, the micro-coaxial transmission line can be closely matched with the through hole, short circuit cannot be caused, the problem of electromagnetic leakage of the transmission line when the transmission line enters and exits the shielding case can be reduced, and finally the electromagnetic shielding effect between the radio frequency chips is better.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram of a radio frequency chip shielding apparatus according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a micro-coaxial transmission line according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of another micro-coaxial transmission line according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a shielding box according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a shielding device of a radio frequency chip according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed. In the context of the present disclosure, similar or identical components may be referred to by the same or similar reference numerals.
In order to better understand the technical solutions, the technical solutions will be described in detail below with reference to specific embodiments, and it should be understood that the specific features in the examples and examples of the present disclosure are detailed descriptions of the technical solutions of the present application, but not limitations of the technical solutions of the present application, and the technical features in the examples and examples of the present application may be combined with each other without conflict.
Fig. 1 is a schematic structural diagram of an rf chip shielding apparatus according to an embodiment of the present invention, as shown in fig. 1, the rf chip shielding apparatus includes a substrate wafer 10, at least two rf chips 20 disposed on the substrate wafer 10, at least two shielding boxes 30, and a micro-coaxial transmission line 40.
The at least two radio frequency chips 20 are interconnected through the micro-coaxial transmission line 40, and the at least two radio frequency chips 20 correspond to the at least two shielding boxes 30 one by one. Each shielding box 30 covers the corresponding radio frequency chip 20 and a part of the micro-coaxial transmission line 40, and the shielding box 30 is provided with a through hole for the micro-coaxial transmission line 40 to pass through.
The micro-coaxial transmission line 40 includes an inner conductor 41 and an outer conductor 42 arranged coaxially. The outer conductor 42 is a rectangular wire with a hollow inside, the inner conductor 41 is a solid rectangular wire, the inner conductor 41 is disposed in the outer conductor 42, and the inner conductor 41 and the outer conductor 42 are insulated from each other. The shape and size of the outer conductor 42 matches the shape and size of the via.
In the embodiment of the present invention, the Micro-coaxial transmission line 40 is a three-dimensional electromagnetic wave transmission structure based on a Micro-Electro-Mechanical System (MEMS) surface Micro-machining process. As shown in fig. 1, in the embodiment of the present invention, the rf chips 20 may be interconnected by a dc signal line S.
In the related art, the characteristic impedance is an important parameter of the micro-coaxial transmission cable, and the impedance standard is usually set to 50 Ω, i.e., an inflection value selected from impedances satisfying minimum loss and maximum power capacity.
Fig. 2 is a schematic cross-sectional view of a micro-coaxial transmission line according to an embodiment of the present invention, where a distance d1 between an upper surface of the inner conductor 41 and a top of the outer conductor 42 is equal to a distance d2 between a lower surface of the inner conductor 41 and a bottom of the outer conductor 42, that is, d1 is d 2. At this time, it is advantageous to minimize the loss of the finally formed micro-coaxial transmission line.
Illustratively, d1 ═ d2 ═ 10 um.
Optionally, the distance D between the outer sidewall of the inner conductor 41 and the inner sidewall of the outer conductor 42 is greater than 30 um. At this time, it is advantageous to make the characteristic impedance of the finally formed micro-coaxial transmission line approach to the standard impedance of 50 Ω.
Illustratively, D ═ 50 um.
In the present embodiment, the cross section of the inner conductor 41 is a solid rectangle, and the cross section of the outer conductor 42 is a hollow rectangle. In other implementations, the cross-section of the inner conductor 41 and the outer conductor 42 may also be circular or other irregular shapes.
In fact, the inner conductor 41 in the micro-coaxial transmission structure is suspended, i.e. the outer conductor 42 and the inner conductor 41 are not in contact, and most of the surface area of the inner conductor 41 is in direct contact with the air. The outer conductor 42 may be formed by a multilayer conductor stack. As shown in fig. 2, the outer conductor 42 may be built up from a bottom conductor 421, three layers of sidewall conductors 422, 423, 424, and a top conductor 425. Both the bottom conductors 421 and the top conductors 425 are plate conductors. In the present embodiment, the inner conductor 41 and the outer conductor 42 are both copper conductors.
Referring to fig. 2, in one implementation of the embodiment of the present invention, the cross-section of the inner conductor 41 is a first rectangle, the length a1 of the first rectangle is 40um, and the width b1 of the first rectangle is 10 um. The length a2 of the sidewall formed by the three- layer sidewall conductors 422, 423, 424 in the outer conductor 42 is 80um, and the width b2 is 30 um. D is 50um, D1 is D2 is 10um, so that the characteristic impedance of the micro-coaxial transmission line approaches the standard impedance of 50 Ω.
Optionally, the micro-coaxial transmission line further comprises a support for supporting the inner conductor 41, the support being located within the outer conductor 42. By providing the support member to support the inner conductor 41, the inner conductor 41 can be suspended in the outer conductor 42.
Referring to fig. 2, in one implementation of the invention, the support member includes a plurality of support bars 43, the plurality of support bars 43 being spaced apart along the axial direction of the outer conductor 42. Both ends of each support bar 43 are embedded on two opposite inner walls of the outer conductor 42, and the inner conductor 41 is disposed on the plurality of support bars 43. In this implementation, the thickness of the support bar 43 can be set to be thinner, the volume is smaller, and the effect of reducing the loss is better.
Fig. 3 is a schematic cross-sectional view of another micro-coaxial transmission line according to an embodiment of the present invention, and as shown in fig. 3, the supporting member includes a plurality of supporting blocks 43, the plurality of supporting blocks 43 are arranged at intervals along an axial direction of the outer conductor 42, each supporting block 43 is located on a bottom layer of the outer conductor 42 and is arranged at intervals from a sidewall of the outer conductor 42, and the inner conductor 41 is disposed on the plurality of supporting blocks 43. In this implementation, the plurality of supporting blocks 43 has a better supporting effect on the inner conductor 41.
Optionally, the supporting bars 43 are insulating bars to ensure insulation between the inner conductor 41 and the outer conductor 42.
Optionally, as shown in fig. 1, the rf chip shielding apparatus further includes a connecting member 50, the inner conductor 41 is electrically connected to the rf chip 20 through the connecting member 50, and the connecting member 50 is a solder ball, a copper pillar, or a tin-containing alloy member. In particular, the inner conductor 41 may be soldered to the rf chip 20 by, for example, a solder ball, so as to be electrically connected. The connecting member 50 of the present invention can also provide a supporting effect to support the rf chip 20.
Fig. 4 is a schematic structural diagram of a shielding box according to an embodiment of the present invention, and as shown in fig. 4, the shielding box 10 is composed of a metal cover plate 11 and a plurality of shielding side plates 12. A shielding cavity 10a is formed among the metal cover plate 11, the shielding side plate 12 and the substrate wafer 10. The rf chip 20 is located in the shielding cavity 10a, and the rf chip 20 and the shielding box 10 are spaced apart from each other, so as to provide a single electromagnetic shielding environment for each rf chip 20, thereby implementing electromagnetic shielding between the rf chips and between the rf chip and other modules. Meanwhile, the shielding box 10 may also function to protect the rf chip 20.
In the embodiment of the present invention, the rf chip 20 may be a power amplifier chip or a low noise amplifier chip. The micro-coaxial transmission line is used for replacing planar transmission lines such as a micro-strip and a coplanar waveguide, the power amplifier chip or the low-noise amplifier chip is respectively and electrically shielded, and the problem of mutual interference between the two chips can be well solved.
The present invention provides a method for manufacturing a radio frequency chip shielding device, which is used for manufacturing the radio frequency chip shielding device according to the above embodiment, and fig. 5 is a flowchart of a method for manufacturing a radio frequency chip shielding device according to an embodiment of the present invention, and as shown in fig. 5, the method includes:
step S510, at least two rf chips are disposed on the substrate wafer.
Step S520, forming a micro-coaxial transmission line on the substrate wafer, so that the at least two rf chips are interconnected through the micro-coaxial transmission line.
The micro-coaxial transmission line comprises an inner conductor and an outer conductor which are coaxially arranged, the outer conductor is a rectangular wire with a hollow inner part, the inner conductor is a solid rectangular wire, the inner conductor is arranged in the outer conductor, and the inner conductor and the outer conductor are insulated. The shape and size of the outer conductor matches the shape and size of the via.
In the embodiment of the present invention, Micro-coaxial transmission lines may be formed by using a Micro-Electro-Mechanical Systems (MEMS) Micro-machining process.
Step S530, at least two shielding boxes are formed on the substrate wafer, the at least two radio frequency chips correspond to the at least two shielding boxes one to one, each shielding box covers the corresponding radio frequency chip and a part of the micro-coaxial transmission line, and a through hole for the micro-coaxial transmission line to pass through is formed in the shielding box.
In the embodiment of the present invention, the metal shielding box may be formed by wet chemical plating, dry sputtering, or the like. The metal shielding box can also be made of copper material, and the cost is low.
Through one or more embodiments of the present invention, the present invention has the following advantageous effects or advantages:
according to the radio frequency chip shielding device and the manufacturing method thereof provided by the embodiment of the invention, the shielding box is covered outside each radio frequency chip, so that a single electromagnetic shielding environment is provided for each radio frequency chip, and the electromagnetic shielding among the radio frequency chips and between the radio frequency chips and other modules is realized. Meanwhile, the micro-coaxial transmission line is adopted to realize the interconnection between the radio frequency chips. The micro-coaxial transmission line comprises an inner conductor and an outer conductor, wherein the inner conductor and the outer conductor are insulated. On one hand, the outer conductor has a shielding function, and can isolate the electromagnetic field generated by the inner conductor from the electromagnetic field generated outside, so that mutual interference between signals is prevented. On the other hand, the shape and the size of the outer conductor are matched with the shape and the size of the through hole, so that when the micro-coaxial transmission line passes through the through hole and enters and exits the shielding case, the micro-coaxial transmission line can be closely matched with the through hole, short circuit cannot be caused, the problem of electromagnetic leakage of the transmission line when the transmission line enters and exits the shielding case can be reduced, and finally the electromagnetic shielding effect between the radio frequency chips is better.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed method should not be interpreted as reflecting an intention that: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.
Claims (10)
1. A radio frequency chip shielding device is characterized by comprising a substrate wafer, at least two radio frequency chips arranged on the substrate wafer, at least two shielding boxes and a micro-coaxial transmission line, wherein the at least two shielding boxes are arranged on the substrate wafer;
the at least two radio frequency chips are interconnected through the micro-coaxial transmission line, the at least two radio frequency chips correspond to the at least two shielding boxes one by one, each shielding box covers the corresponding radio frequency chip and part of the micro-coaxial transmission line, and the shielding boxes are provided with through holes for the micro-coaxial transmission line to pass through;
the micro-coaxial transmission line comprises an inner conductor and an outer conductor which are coaxially arranged, the outer conductor is a rectangular line with a hollow inner part, the inner conductor is a solid rectangular line, the inner conductor is arranged in the outer conductor, the inner conductor is insulated from the outer conductor, and the shape and the size of the outer conductor are matched with those of the through hole.
2. The radio frequency chip shielding device according to claim 1, wherein a distance between an upper surface of the inner conductor to a top of the outer conductor is equal to a distance between a lower surface of the inner conductor to a bottom of the outer conductor.
3. The radio frequency chip shielding device according to claim 2, wherein a distance between an outer sidewall of the inner conductor to an inner sidewall of the outer conductor is greater than 30 um.
4. The radio frequency chip shielding device according to claim 1, wherein the inner conductor and the outer conductor are both copper conductors.
5. The radio frequency chip shielding device according to any one of claims 1 to 4, wherein the micro-coaxial transmission line further comprises a support member for supporting the inner conductor, the support member being located within the outer conductor.
6. The radio frequency chip shielding device according to claim 5, wherein the supporting member comprises a plurality of supporting bars, the supporting bars are arranged at intervals along the axial direction of the outer conductor, two ends of each supporting bar are embedded on two opposite inner walls of the outer conductor, and the inner conductors are arranged on the supporting bars.
7. The radio frequency chip shielding device according to claim 5, wherein the supporting member comprises a plurality of supporting blocks, the supporting blocks are arranged at intervals along the axial direction of the outer conductor, each supporting block is located on the bottom layer of the outer conductor and is arranged at intervals with the side wall of the outer conductor, and the inner conductor is arranged on the supporting blocks.
8. The RF chip shielding device according to any one of claims 1 to 4, further comprising a connecting member, wherein the inner conductor is electrically connected to the RF chip through the connecting member, and the connecting member is a solder ball, a copper pillar or a tin-containing alloy member.
9. The shielding device according to any one of claims 1 to 4, wherein the shielding box is composed of a metal cover plate and a plurality of shielding side plates, a shielding cavity is formed between the metal cover plate, the shielding side plates and the substrate wafer, the radio frequency chip is located in the shielding cavity, and the radio frequency chip and the shielding box are arranged at intervals.
10. A method for manufacturing a radio frequency chip shielding device according to any one of claims 1 to 9, the method comprising:
arranging at least two radio frequency chips on a substrate wafer;
forming a micro-coaxial transmission line on the substrate wafer, and enabling the at least two radio frequency chips to be interconnected through the micro-coaxial transmission line;
forming at least two shielding boxes on the substrate wafer, wherein the at least two radio frequency chips correspond to the at least two shielding boxes one to one, each shielding box covers the corresponding radio frequency chip and part of the micro-coaxial transmission line, and the shielding boxes are provided with through holes for the micro-coaxial transmission line to pass through;
the micro-coaxial transmission line comprises an inner conductor and an outer conductor which are coaxially arranged, the outer conductor is a rectangular wire with a hollow inner part, the inner conductor is a solid rectangular wire, the inner conductor is arranged in the outer conductor, the inner conductor and the outer conductor are insulated, and the shape and the size of the outer conductor are matched with those of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111450788.2A CN114040672A (en) | 2021-11-30 | 2021-11-30 | Radio frequency chip shielding device and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111450788.2A CN114040672A (en) | 2021-11-30 | 2021-11-30 | Radio frequency chip shielding device and manufacturing method thereof |
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| CN114040672A true CN114040672A (en) | 2022-02-11 |
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| CN202111450788.2A Pending CN114040672A (en) | 2021-11-30 | 2021-11-30 | Radio frequency chip shielding device and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114792881A (en) * | 2022-05-18 | 2022-07-26 | 赛莱克斯微系统科技（北京）有限公司 | Micro-electromechanical millimeter wave antenna |
| WO2023221872A1 (en) * | 2022-05-19 | 2023-11-23 | 华为技术有限公司 | Transmission line, transmission cable, manufacturing method for transmission line, and electronic apparatus |
-
2021
- 2021-11-30 CN CN202111450788.2A patent/CN114040672A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114792881A (en) * | 2022-05-18 | 2022-07-26 | 赛莱克斯微系统科技（北京）有限公司 | Micro-electromechanical millimeter wave antenna |
| CN114792881B (en) * | 2022-05-18 | 2024-02-13 | 赛莱克斯微系统科技（北京）有限公司 | Micro-electromechanical millimeter wave antenna |
| WO2023221872A1 (en) * | 2022-05-19 | 2023-11-23 | 华为技术有限公司 | Transmission line, transmission cable, manufacturing method for transmission line, and electronic apparatus |
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