CN114040593A - Circuit board non-pressure plate paster device - Google Patents
Circuit board non-pressure plate paster device Download PDFInfo
- Publication number
- CN114040593A CN114040593A CN202111330229.8A CN202111330229A CN114040593A CN 114040593 A CN114040593 A CN 114040593A CN 202111330229 A CN202111330229 A CN 202111330229A CN 114040593 A CN114040593 A CN 114040593A
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- fixedly connected
- mounting
- side wall
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- 230000007704 transition Effects 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 8
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 7
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 7
- 241001330002 Bambuseae Species 0.000 claims description 7
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 7
- 239000011425 bamboo Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 230000001105 regulatory effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 101100441413 Caenorhabditis elegans cup-15 gene Proteins 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a circuit board pressing plate-free chip mounting device, which relates to the technical field of circuit board processing and comprises an electric slide rail for conveying a circuit board, wherein two sides of the electric slide rail are fixedly connected with mounting platforms, the upper ends of the mounting platforms are fixedly connected with mounting seats, a mounting shaft is rotatably connected between the two mounting seats, a chip mounting barrel positioned above the electric slide rail is fixedly connected onto the mounting shaft, the side wall of the mounting seat is fixedly connected with a motor, the tail end of an output shaft of the motor is fixedly connected with the mounting shaft, a blanking barrel positioned above the chip mounting barrel is fixedly connected onto the mounting platforms, the side wall of the chip mounting barrel is provided with a plurality of clamping grooves distributed at equal intervals, two clamping sheets are arranged in the clamping grooves, and an adjusting cavity is arranged in the chip mounting barrel. The invention solves the technical problem of how to efficiently mount the chip on the plate-shaped electronic device on the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board non-pressure board chip mounting device.
Background
The circuit board is one of very important electronic devices, and circuit boards with various sizes and styles are installed inside the electronic devices from airplanes and automobiles to mobile phone watches, wherein the circuit boards are divided into a single panel, a double panel and the like according to the devices to be installed and the functions to be realized.
The circuit board that wherein installation among the industrial production equipment is traditional model mostly, and its size is great, and the installation is simple, low in manufacturing cost, and the electronic component linear arrangement on most circuit boards only needs manual installation, and such circuit board is the manual paster production of workshop formula usually, but manual not only the accuracy is lower, efficiency is slower to the process of electronic component paster to still there is the problem of damaging the circuit board, consequently, needs a circuit board pressureless board paster device.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a circuit board pressure-plate-free chip mounting device which solves the technical problem of how to efficiently mount a plate-shaped electronic device on a circuit board.
In order to achieve the purpose, the invention adopts the following technical scheme:
a circuit board non-pressure plate paster device comprises an electric slide rail for conveying a circuit board, wherein mounting platforms are fixedly connected to two sides of the electric slide rail, a mounting seat is fixedly connected to the upper end of each mounting platform, a mounting shaft is rotatably connected between the two mounting seats, a paster barrel positioned above the electric slide rail is fixedly connected to the mounting shaft, a motor is fixedly connected to the side wall of each mounting seat, the tail end of the output shaft of the motor is fixedly connected with the mounting shaft, a blanking barrel positioned above the paster barrel is fixedly connected to the mounting platforms, a plurality of clamping grooves distributed at equal intervals are formed in the side wall of the paster barrel, two clamping sheets are arranged in the clamping grooves, an adjusting cavity is formed in the paster barrel, a first adjusting rod and a second adjusting rod are arranged in the adjusting cavity, the first adjusting rod is elastically connected with the second adjusting rod, the tail end of the first adjusting rod penetrates through the adjusting cavity and is fixedly connected with the first clamping sheet, the adjusting chamber is run through and regulation cavity and sliding connection with it to the second regulation pole end, the first the adjustable ring is installed to mount pad one side, the adjustable ring lateral wall is equipped with clamping part, and wherein clamping part can change the position of first regulation pole through the extrusion second regulation pole, the first be equipped with on the mount pad can adjustment mechanism, wherein adjustment mechanism can change the position of adjustable ring.
Preferably, the clamping component is an arc-shaped abutting ring, two ends of the abutting ring are inclined transition edges, the transition edge at the upper end is located at the highest point of the side wall of the adjusting ring, the transition edge at the lower end is located at the lowest point of the side wall of the adjusting ring, and the second adjusting rod is elastically connected with the inner wall of the adjusting chamber.
Preferably, in order to solve the problem that the second adjusting rod slides more smoothly on the side wall of the abutting ring, a rotatable ball is embedded at the tail end of the second adjusting rod.
Preferably, for can let electron device be more stable at pivoted process to and dispel the problem of surface spot sliding connection has the piston in the regulation cavity, the piston will adjust the cavity and cut apart into first cavity and second cavity, the clamping groove bottom inlays and is equipped with the sucking disc, the clamping groove lateral wall inlays and is equipped with the air cock, communicate through first pipeline between first cavity and the sucking disc, communicate through the second pipeline between second cavity and the air cock.
Preferably, in order to let the problem that the tight piece of the clamp of being connected with first regulation pole resets more fast pass through spring elastic connection between piston and the first regulation pole, a plurality of first brushes that correspond with the tight groove of clamp of a paster section of thick bamboo lateral wall fixedly connected with, fixedly connected with and first brush complex second brush on the mounting platform, be equipped with DC power supply on the mounting platform, electric connection between DC power supply, first brush, second brush and the spring.
Preferably, in order to change the position of the adjusting ring and adapt to the problems of electronic components with different sizes, the adjusting mechanism comprises a first threaded rod which is rotatably connected with the side wall of the adjusting ring, and the first threaded rod penetrates through a first mounting seat and is in threaded connection with the mounting seat.
Preferably, in order to make the adjusting ring more stable in the sliding process, a limiting rod is fixedly connected to a side wall of the adjusting ring, and the limiting rod penetrates through the first mounting seat and is in sliding connection with the first mounting seat.
Preferably, in order to be able to change the position of the clamping plate and thus adapt it to electronic components of different sizes, a second threaded rod is rotatably connected to the second side wall of the clamping plate, said second threaded rod penetrating the wafer sleeve and being in threaded connection therewith.
Compared with the prior art, the invention has the beneficial effects that:
1. the paster section of thick bamboo is in the middle of the pivoted process, and the second is adjusted the pole and is cooperated with the tight ring that supports of regulating ring lateral wall, and then promotes the corresponding tight piece of clamp through first regulation pole and move towards another tight piece of clamp, realizes pressing from both sides tight of the platelike electronic components who drops in pressing from both sides tight inslot to when it rotates to the bottommost, two tight pieces of clamp loosen, realize platelike electronic components's paster installation.
2. The piston is in the in-process of activity, and the sucking disc can be siphoned away the air on every side, forms the negative pressure between sucking disc and the platelike electron component of its top, realizes the supplementary clamp to electron component, guarantees its stability in the middle of the rotation process.
3. The first brush of a paster section of thick bamboo in the middle of the pivoted process cooperates with the second brush of bottom, can make the spring electrically conductive flexible, and the first regulation pole of pulling that can be quick resets, lets its and electronic components break away from the contact, lets the paster process of electronic components sensitive rapidly more.
Drawings
Fig. 1 is a schematic perspective view of a circuit board non-pressure plate chip mounting device according to the present invention;
fig. 2 is an enlarged schematic structural diagram of a position a of the circuit board non-pressure plate chip mounting device provided by the invention;
fig. 3 is a schematic side view of a first side of a circuit board non-platen chip mounting device according to the present invention;
fig. 4 is a schematic cross-sectional view taken along line a-a of fig. 3 of a circuit board no-board chip mounting device according to the present invention;
fig. 5 is an enlarged schematic structural diagram of a portion B of the circuit board non-pressure plate chip mounting device provided by the invention;
fig. 6 is a schematic side view of a second side of the circuit board non-board mounting device according to the present invention;
fig. 7 is an enlarged schematic structural diagram of a circuit board non-pressure plate chip device according to the present invention at position C.
In the figure: the electric welding machine comprises an electric sliding rail 1, an installation platform 2, an installation base 3, a motor 4, a charging barrel 5, a mounting shaft 6, a patch barrel 7, a clamping groove 8, a regulating ring 9, a first threaded rod 10, a clamping piece 11, a second threaded rod 12, a first regulating rod 13, an air nozzle 14, a suction cup 15, a regulating cavity 16, a piston 17, a first pipeline 18, a second pipeline 19, a spring 20, a second regulating rod 21, a transition edge 22, a abutting ring 23, a ball 24 and a first electric brush 25.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1-7, a circuit board non-pressure plate chip mounting device comprises an electric slide rail 1 for conveying a circuit board, wherein two sides of the electric slide rail 1 are fixedly connected with mounting platforms 2, the upper end of each mounting platform 2 is fixedly connected with a mounting seat 3, a mounting shaft 6 is rotatably connected between the two mounting seats 3, a chip mounting barrel 7 positioned above the electric slide rail 1 is fixedly connected to the mounting shaft 6, the side wall of each mounting seat 3 is fixedly connected with a motor 4, the tail end of the output shaft of each motor 4 is fixedly connected with the mounting shaft 6, a lower barrel 5 positioned above the chip mounting barrel 7 is fixedly connected to the mounting platform 2, a plurality of clamping grooves 8 are equidistantly distributed on the side wall of the chip mounting barrel 7, the lower end of the lower barrel 5 is positioned at the upper end of the clamping groove 8, the first graph shows an internal structure with larger space for more clearly, wherein a plate-shaped electronic element needing chip mounting is positioned in the lower barrel 5 and regularly drops in the clamping grooves 8 along with the rotation of the chip mounting barrel 7, the stitch part of the electronic element faces upwards, the flat ground of the electronic element is positioned below, and when the electronic element rotates to the other side, the electronic element corresponds to the position of the circuit board transported on the electric sliding rail 1, and the process of mounting the electronic element patch on the circuit board is completed.
Two clamping sheets 11 are arranged in the clamping groove 8, an adjusting cavity 16 is arranged in the patch cylinder 7, a first adjusting rod 13 and a second adjusting rod 21 are arranged in the adjusting cavity 16, the first adjusting rod 13 is elastically connected with the second adjusting rod 21, the tail end of the first adjusting rod 13 penetrates through the adjusting cavity 16 and is fixedly connected with the first clamping sheet 11, the tail end of the second adjusting rod 21 penetrates through the adjusting cavity 16 and is in sliding connection with the adjusting cavity, an adjusting ring 9 is arranged on one side of the first mounting seat 3, a clamping part is arranged on the side wall of the adjusting ring 9, the clamping part can change the position of the first adjusting rod 13 by extruding the second adjusting rod 21, an adjusting mechanism is arranged on the first mounting seat 3, the adjusting mechanism can change the position of the adjusting ring 9, the position of the adjusting ring 9 can be changed according to the electronic element of the patch, the moving distance of the first adjusting rod 13 can be changed, and the position state between the second adjusting rod 21 and the patch cylinder 7 is changed, finally, the purpose of changing the position of the first adjusting rod 13 is achieved, the position of the first clamping piece 11 is changed, the side wall of the second clamping piece 11 is rotatably connected with a second threaded rod 12, the second threaded rod 12 penetrates through the patch barrel 7 and is in threaded connection with the patch barrel, the position of the second clamping piece 11 can be adjusted by rotating the second threaded rod 12, the positions of the two clamping pieces 11 are changed, and the electronic elements with different sizes are matched and clamped.
The clamping part is an arc-shaped abutting ring 23, two ends of the abutting ring 23 are oblique transition edges 22, the transition edge 22 at the upper end is located at the highest point of the side wall of the adjusting ring 9, the transition edge 22 at the lower end is located at the lowest point of the side wall of the adjusting ring 9, the second adjusting rod 21 is elastically connected with the inner wall of the adjusting cavity 16, a rotatable ball 24 is embedded at the tail end of the second adjusting rod 21, the abutting ring 23 has a certain thickness, the second adjusting rod 21 can slide into one side of the abutting ring 23 through the transition edge 22 in the rotating process, the process that the second adjusting rod 21 drives the first adjusting rod 13 to move is further realized, the ball 24 can reduce the friction force of the contact of the two, and the sliding connection of the two is more smooth.
A piston 17 is connected in the adjusting cavity 16 in a sliding manner, the adjusting cavity 16 is divided into a first cavity and a second cavity by the piston 17, a sucker 15 is embedded at the bottom in the clamping groove 8, an air tap 14 is embedded in the side wall of the clamping groove 8, the first cavity is communicated with the sucker 15 through a first pipeline 18, the second cavity is communicated with the air tap 14 through a second pipeline 19, the second adjusting rod 21 drives the piston 17 to move, the space in the first cavity and the space in the second cavity change, when the second adjusting rod 21 contacts with the abutting ring 23, the space in the first cavity is enlarged, the air around the sucker 15 is sucked away, the patch on the sucker 15 is stably positioned on the sucker 15 under the action of negative pressure, the stable state of the patch is ensured, the space in the second cavity is reduced, the air inside the second cavity is blown out to the electronic element, and the dirt falling off the electronic element in the transportation process can be removed, avoiding influencing the subsequent welding.
Piston 17 and first regulation pole 13 between through spring 20 elastic connection, a plurality of first brushes 25 that correspond with clamping groove 8 of paster section of thick bamboo 7 lateral wall fixedly connected with, fixedly connected with and first brush 25 complex second brush on mounting platform 2, be equipped with DC power supply on mounting platform 2, DC power supply, first brush 25, electric connection between second brush and the spring 20, paster section of thick bamboo 7 is in the middle of the pivoted process, when corresponding first brush 25 rotates to the bottommost, first brush 25 switches on with the second brush electrical property this moment, spring 20 forms closed circuit with DC power supply this moment, spring 20 contracts, first regulation pole 13 can be quick this moment take corresponding clamping piece 11 to leave electronic component, electronic component can break away from clamping groove 8 and install on the circuit board, realize the paster installation process.
Adjustment mechanism includes and rotates the first threaded rod 10 of being connected with adjustable ring 9 lateral wall, and first threaded rod 10 runs through first mount pad 3 and threaded connection with it, and adjustable ring 9 lateral wall fixedly connected with gag lever post, the gag lever post run through first mount pad 3 and sliding connection with it, rotate the position that first threaded rod 10 can adjust adjustable ring 9, and the gag lever post can guarantee that it remains stable in the middle of the removal process.
When the electronic component clamping device is used, a circuit board is transported on the electric slide rail 1, electronic components needing to be pasted regularly fall in the clamping groove 8 along with the rotation of the pasting sheet cylinder 7 in the lower material cylinder 5, and in the rotating process of the pasting sheet cylinder 7, the second adjusting rod 21 corresponding to one side of the pasting sheet cylinder moves to one side of the abutting ring 23, is extruded and drives the clamping sheet 11 to move through the first adjusting rod 13, so that the electronic components are clamped.
And during this process the space in the first chamber changes, creating a negative pressure around the suction cup 15, which further stabilizes the electronic components in the clamping groove 8.
When the electronic component rotates to the lowest point, the second adjusting rod 21 is separated from the adjusting ring 9, the moving directions of the mechanisms are opposite, the electronic component in the corresponding clamping groove 8 is located at the lowest end, the electronic component is separated from extrusion, and the process of tabletting installation is completed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The utility model provides a circuit board non-pressure plate paster device, is including electronic slide rail (1) of carrying the circuit board, electronic slide rail (1) both sides fixedly connected with mounting platform (2), mounting platform (2) upper end fixedly connected with mount pad (3), two rotate between mount pad (3) and be connected with installation axle (6), fixedly connected with is located paster section of thick bamboo (7) of electronic slide rail (1) top on installation axle (6), mount pad (3) lateral wall fixedly connected with motor (4), motor (4) output shaft end and installation axle (6) fixed connection, fixedly connected with is located lower feed cylinder (5) of paster section of thick bamboo (7) top on mounting platform (2), its characterized in that:
the side wall of the patch cylinder (7) is provided with a plurality of clamping grooves (8) which are distributed at equal intervals, two clamping sheets (11) are arranged in the clamping grooves (8), an adjusting cavity (16) is arranged in the patch cylinder (7), a first adjusting rod (13) and a second adjusting rod (21) are arranged in the adjusting cavity (16), the first adjusting rod (13) is elastically connected with the second adjusting rod (21), the tail end of the first adjusting rod (13) penetrates through the adjusting chamber (16) and is fixedly connected with the first clamping sheet (11), the tail end of the second adjusting rod (21) penetrates through the adjusting chamber (16) and is in sliding connection with the adjusting chamber, one side of the first mounting seat (3) is provided with an adjusting ring (9), the side wall of the adjusting ring (9) is provided with a clamping part, wherein the clamping member is capable of changing the position of the first adjustment lever (13) by squeezing the second adjustment lever (21);
the first mounting seat (3) is provided with an adjustable mechanism, wherein the adjustable mechanism can change the position of the adjusting ring (9).
2. The circuit board no-pressure-plate chip device according to claim 1, wherein the clamping component is an arc-shaped abutting ring (23), two ends of the abutting ring (23) are inclined transition edges (22), the transition edge (22) at the upper end is located at the highest point of the side wall of the adjusting ring (9), the transition edge (22) at the lower end is located at the lowest point of the side wall of the adjusting ring (9), and the second adjusting rod (21) is elastically connected with the inner wall of the adjusting chamber (16).
3. The circuit board no-board paster device of claim 2, wherein the second adjusting lever (21) is embedded with a rotatable ball (24) at the end.
4. The circuit board no-pressure-plate chip device as claimed in claim 2, wherein a piston (17) is slidably connected in the adjusting chamber (16), the piston (17) divides the adjusting chamber (16) into a first chamber and a second chamber, a suction cup (15) is embedded in the bottom of the clamping groove (8), an air nozzle (14) is embedded in the side wall of the clamping groove (8), the first chamber is communicated with the suction cup (15) through a first pipeline (18), and the second chamber is communicated with the air nozzle (14) through a second pipeline (19).
5. The circuit board no-board paster device according to claim 4, wherein the piston (17) is elastically connected with the first adjusting rod (13) through a spring (20), the side wall of the paster tube (7) is fixedly connected with a plurality of first brushes (25) corresponding to the clamping grooves (8), the mounting platform (2) is fixedly connected with a second brush matched with the first brushes (25), the mounting platform (2) is provided with a direct current power supply, and the direct current power supply, the first brushes (25), the second brushes and the spring (20) are electrically connected.
6. A circuit board no-pressure-plate paster device according to claim 1, wherein said adjustment mechanism comprises a first threaded rod (10) rotatably connected to the side wall of the adjustment ring (9), said first threaded rod (10) extending through and being threadedly connected to a first one of said mounting seats (3).
7. The circuit board no-pressure-plate chip mounting device according to claim 6, wherein a limiting rod is fixedly connected to a side wall of the adjusting ring (9), and the limiting rod penetrates through and is slidably connected with a first one of the mounting seats (3).
8. The circuit board no-board paster device of claim 1, wherein a second threaded rod (12) is rotatably connected to the side wall of the second clamping piece (11), and the second threaded rod (12) penetrates through the paster tube (7) and is in threaded connection with the paster tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111330229.8A CN114040593B (en) | 2021-11-11 | 2021-11-11 | Circuit board non-pressing plate paster device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111330229.8A CN114040593B (en) | 2021-11-11 | 2021-11-11 | Circuit board non-pressing plate paster device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114040593A true CN114040593A (en) | 2022-02-11 |
| CN114040593B CN114040593B (en) | 2023-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111330229.8A Active CN114040593B (en) | 2021-11-11 | 2021-11-11 | Circuit board non-pressing plate paster device |
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| Country | Link |
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| CN (1) | CN114040593B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117956700A (en) * | 2024-03-26 | 2024-04-30 | 晋江市小芯电子科技有限公司 | Circuit board paster device |
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|---|---|---|---|---|
| WO2018120244A1 (en) * | 2016-12-31 | 2018-07-05 | 深圳市配天机器人技术有限公司 | Sandblasting production line system for flexible printed circuit board and feeding device |
| CN208657176U (en) * | 2018-07-18 | 2019-03-26 | 深圳市长源兴科技有限公司 | The automated exchanged cutter mechanism of chip mounter |
| CN211210366U (en) * | 2019-10-18 | 2020-08-07 | 赣州隆星科技有限公司 | Automatic chip mounter of PCB board |
| CN213280549U (en) * | 2020-08-04 | 2021-05-25 | 上海潇恒电子科技有限公司 | Paster device for integrated circuit processing |
-
2021
- 2021-11-11 CN CN202111330229.8A patent/CN114040593B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018120244A1 (en) * | 2016-12-31 | 2018-07-05 | 深圳市配天机器人技术有限公司 | Sandblasting production line system for flexible printed circuit board and feeding device |
| CN208657176U (en) * | 2018-07-18 | 2019-03-26 | 深圳市长源兴科技有限公司 | The automated exchanged cutter mechanism of chip mounter |
| CN211210366U (en) * | 2019-10-18 | 2020-08-07 | 赣州隆星科技有限公司 | Automatic chip mounter of PCB board |
| CN213280549U (en) * | 2020-08-04 | 2021-05-25 | 上海潇恒电子科技有限公司 | Paster device for integrated circuit processing |
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| 巢佳;: "贴片机气动控制系统的设计", 职业技术, no. 01 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117956700A (en) * | 2024-03-26 | 2024-04-30 | 晋江市小芯电子科技有限公司 | Circuit board paster device |
| CN117956700B (en) * | 2024-03-26 | 2024-06-21 | 晋江市小芯电子科技有限公司 | Circuit board paster device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114040593B (en) | 2023-11-21 |
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