CN114039273B - 一种InP基激光器与薄膜铌酸锂光波导异质集成结构 - Google Patents
一种InP基激光器与薄膜铌酸锂光波导异质集成结构 Download PDFInfo
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- CN114039273B CN114039273B CN202111279069.9A CN202111279069A CN114039273B CN 114039273 B CN114039273 B CN 114039273B CN 202111279069 A CN202111279069 A CN 202111279069A CN 114039273 B CN114039273 B CN 114039273B
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- Prior art keywords
- optical waveguide
- lithium niobate
- layer
- film lithium
- inp
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- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 230000003287 optical effect Effects 0.000 title claims abstract description 73
- 239000010409 thin film Substances 0.000 title claims abstract description 61
- 239000010408 film Substances 0.000 claims abstract description 24
- 230000008878 coupling Effects 0.000 claims abstract description 19
- 238000010168 coupling process Methods 0.000 claims abstract description 19
- 238000005859 coupling reaction Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 73
- 239000012792 core layer Substances 0.000 claims description 21
- 238000005253 cladding Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0268—Integrated waveguide grating router, e.g. emission of a multi-wavelength laser array is combined by a "dragon router"
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
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CN202111279069.9A CN114039273B (zh) | 2021-10-31 | 2021-10-31 | 一种InP基激光器与薄膜铌酸锂光波导异质集成结构 |
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CN202111279069.9A CN114039273B (zh) | 2021-10-31 | 2021-10-31 | 一种InP基激光器与薄膜铌酸锂光波导异质集成结构 |
Publications (2)
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CN114039273A CN114039273A (zh) | 2022-02-11 |
CN114039273B true CN114039273B (zh) | 2024-03-22 |
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CN202111279069.9A Active CN114039273B (zh) | 2021-10-31 | 2021-10-31 | 一种InP基激光器与薄膜铌酸锂光波导异质集成结构 |
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Families Citing this family (3)
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CN114966979B (zh) * | 2022-05-07 | 2023-07-18 | 上海图灵智算量子科技有限公司 | 光学组件及光电异质集成方法 |
CN115951454B (zh) * | 2023-03-13 | 2023-05-30 | 中科鑫通微电子技术(北京)有限公司 | 铌酸锂-氮化硅波导与激光器异质集成结构及其制备方法 |
CN116540356B (zh) * | 2023-03-27 | 2024-05-17 | 上海铭锟半导体有限公司 | 一种集成铌酸锂薄膜和量子光源的光芯片及其制备方法 |
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US5576879A (en) * | 1994-01-14 | 1996-11-19 | Fuji Xerox Co., Ltd. | Composite optical modulator |
US5787105A (en) * | 1995-01-20 | 1998-07-28 | Nikon Corporation | Integrated semiconductor laser apparatus |
CN107430297A (zh) * | 2015-04-01 | 2017-12-01 | Eth苏黎世公司 | 电光调制器 |
CN109560462A (zh) * | 2017-09-27 | 2019-04-02 | 中国科学院半导体研究所 | 硅基混合集成激光器阵列及其制备方法 |
CN110729630A (zh) * | 2019-10-11 | 2020-01-24 | 浙江大学 | 一种采用铌酸锂材料制成的波长高速调谐的激光器 |
CN110954998A (zh) * | 2018-09-27 | 2020-04-03 | 上海新微技术研发中心有限公司 | 激光器与硅光芯片集成结构及其制备方法 |
CN111585166A (zh) * | 2020-02-13 | 2020-08-25 | 南京中电芯谷高频器件产业技术研究院有限公司 | 一种半导体激光器芯片与lnoi光芯片的异构集成结构 |
CN111917482A (zh) * | 2020-06-30 | 2020-11-10 | 中国电子科技集团公司第五十五研究所 | 薄膜铌酸锂基异构集成微波光子收发芯片 |
CN112290385A (zh) * | 2020-10-30 | 2021-01-29 | 中国科学院半导体研究所 | 多波长硅基iii-v族混合集成激光器阵列单元及制作方法 |
CN112965166A (zh) * | 2021-03-08 | 2021-06-15 | 天津大学 | 一种z切铌酸锂锥形波导及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11204535B2 (en) * | 2019-05-17 | 2021-12-21 | Shanghai Jiao Tong University | Silicon-based lithium niobate film electro-optic modulator array and integration method thereof |
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2021
- 2021-10-31 CN CN202111279069.9A patent/CN114039273B/zh active Active
Patent Citations (12)
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US3868589A (en) * | 1972-10-10 | 1975-02-25 | Univ California | Thin film devices and lasers |
US5576879A (en) * | 1994-01-14 | 1996-11-19 | Fuji Xerox Co., Ltd. | Composite optical modulator |
JPH08255949A (ja) * | 1995-01-20 | 1996-10-01 | Nikon Corp | 集積型半導体レーザ装置 |
US5787105A (en) * | 1995-01-20 | 1998-07-28 | Nikon Corporation | Integrated semiconductor laser apparatus |
CN107430297A (zh) * | 2015-04-01 | 2017-12-01 | Eth苏黎世公司 | 电光调制器 |
CN109560462A (zh) * | 2017-09-27 | 2019-04-02 | 中国科学院半导体研究所 | 硅基混合集成激光器阵列及其制备方法 |
CN110954998A (zh) * | 2018-09-27 | 2020-04-03 | 上海新微技术研发中心有限公司 | 激光器与硅光芯片集成结构及其制备方法 |
CN110729630A (zh) * | 2019-10-11 | 2020-01-24 | 浙江大学 | 一种采用铌酸锂材料制成的波长高速调谐的激光器 |
CN111585166A (zh) * | 2020-02-13 | 2020-08-25 | 南京中电芯谷高频器件产业技术研究院有限公司 | 一种半导体激光器芯片与lnoi光芯片的异构集成结构 |
CN111917482A (zh) * | 2020-06-30 | 2020-11-10 | 中国电子科技集团公司第五十五研究所 | 薄膜铌酸锂基异构集成微波光子收发芯片 |
CN112290385A (zh) * | 2020-10-30 | 2021-01-29 | 中国科学院半导体研究所 | 多波长硅基iii-v族混合集成激光器阵列单元及制作方法 |
CN112965166A (zh) * | 2021-03-08 | 2021-06-15 | 天津大学 | 一种z切铌酸锂锥形波导及其制备方法 |
Non-Patent Citations (2)
Title |
---|
CL-TWE Mach–Zehnder electro-optic modulator based on InP-MQW optical waveguides;Guang Qian et al.;CHINESE OPTICS LETTERS;20190630;第17卷(第6期);第1页-第5页 * |
SOI基微环滤波器的可调谐性研究;周奉杰等;光电子技术;20190331;第39卷(第1期);第1页-第6页 * |
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Effective date of registration: 20231221 Address after: Room 1006, Building 4, Nanjing Baixia High tech Industrial Park, No. 6 Yongzhi Road, Qinhuai District, Nanjing City, Jiangsu Province, 210016 Applicant after: NANJING ZHONGDIAN XINGU HIGH FREQUENCY DEVICE INDUSTRY TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. Applicant after: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.55 Research Institute Address before: Room 1006, building 4, Nanjing Baixia high tech Industrial Park, No.6 Yongzhi Road, Qinhuai District, Nanjing City, Jiangsu Province, 210000 Applicant before: NANJING ZHONGDIAN XINGU HIGH FREQUENCY DEVICE INDUSTRY TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |
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