CN114038686A - Capacitor wiring device - Google Patents

Capacitor wiring device Download PDF

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Publication number
CN114038686A
CN114038686A CN202111535187.1A CN202111535187A CN114038686A CN 114038686 A CN114038686 A CN 114038686A CN 202111535187 A CN202111535187 A CN 202111535187A CN 114038686 A CN114038686 A CN 114038686A
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CN
China
Prior art keywords
capacitor
electrodeless
circuit board
bridge
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111535187.1A
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Chinese (zh)
Inventor
梁德新
向啟平
孔令伟
李辉
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Huizhou Xianfeng Electroplating Equipment Co ltd
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Huizhou Zhongbang Power Supply Co ltd
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Publication date
Application filed by Huizhou Zhongbang Power Supply Co ltd filed Critical Huizhou Zhongbang Power Supply Co ltd
Priority to CN202111535187.1A priority Critical patent/CN114038686A/en
Publication of CN114038686A publication Critical patent/CN114038686A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inverter Devices (AREA)

Abstract

The application provides a capacitor wiring device. The capacitor wiring device comprises a line board assembly and a capacitor assembly; the wire board assembly comprises a first wire board and a second wire board which are oppositely arranged, and a plurality of conducting wires are arranged in the first wire board and the second wire board; the capacitor assembly comprises a first electrodeless capacitor, a second electrodeless capacitor, a third electrodeless capacitor and a first bridge type conductive piece, wherein the first end of the first electrodeless capacitor is electrically connected with the first end of the second electrodeless capacitor, and the second end of the second electrodeless capacitor is electrically connected with the second end of the third electrodeless capacitor; the first end of the first bridge type conductive piece is connected with the first end of the third electrodeless capacitor, and the second end of the first bridge type conductive piece is connected with the second end of the first electrodeless capacitor. The electrodeless capacitors are connected through the conducting circuit on the circuit board, and the mutual alternate connection through wires is not needed.

Description

Capacitor wiring device
Technical Field
The invention relates to the technical field of wire connectors, in particular to a capacitor wiring device.
Background
Currently, in the industrial high-frequency rectification power supply industry, since the input used is high-frequency alternating current, in order to provide stable direct current, the input usually needs to pass through a rectification circuit and a filter circuit, wherein the filter circuit usually adopts a capacitor with a large capacity to meet the withstand voltage to the external high voltage, and the rectification circuit usually adopts a rectification bridge circuit, for example, an Insulated Gate Bipolar Transistor (IGBT) or a Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) is adopted to form a full-bridge rectification circuit.
However, the connection point of the filter circuit and the full-bridge rectification circuit itself and the connection point between the two circuits are more, and a plurality of wires are needed to be used for alternate connection, and the alternate connection mode of the multi-wire has the following defects: firstly, the whole structure is messy and complex due to numerous connecting points and connecting wires; secondly, because the connecting lines are more and the connecting points are more, the workload of stripping and welding the wire ear sleeve contraction pipe code pipe during connection is large, and the labor cost is directly increased.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides the capacitor wiring device which is simple in structure and convenient to assemble and disassemble.
The purpose of the invention is realized by the following technical scheme:
a capacitor wiring device comprising: a line board assembly and a capacitor assembly; the wire board assembly comprises a first wire board and a second wire board which are oppositely arranged, and a plurality of conducting wires are arranged in the first wire board and the second wire board; the capacitor assembly comprises a first electrodeless capacitor, a second electrodeless capacitor, a third electrodeless capacitor and a first bridge type conductive piece, wherein the first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are positioned between the first circuit board and the second circuit board, the first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are respectively connected with the first circuit board and the second circuit board so that the first end of the first electrodeless capacitor is electrically connected with the first end of the second electrodeless capacitor, the second end of the second electrodeless capacitor is electrically connected with the second end of the third electrodeless capacitor, and the two ends of the first electrodeless capacitor are respectively used for being connected with an external alternating current power supply; the first end of the first bridge type conductive piece is connected with the first end of the third electrodeless capacitor, and the second end of the first bridge type conductive piece is connected with the second end of the first electrodeless capacitor.
In one embodiment, the line board assembly further includes a first voltage dividing resistor and a second voltage dividing resistor, both of which are soldered to the first line board, so that a first end of the first voltage dividing resistor is electrically connected to a first end of the third electrodeless capacitor, a second end of the first voltage dividing resistor is connected to a first end of the second voltage dividing resistor, and a second end of the second voltage dividing resistor is electrically connected to a first end of the second electrodeless capacitor.
In one embodiment, the capacitance of the second electrodeless capacitor is equal to the capacitance of the third electrodeless capacitor, the resistance of the first divider resistor is equal to the resistance of the second divider resistor, and the second end of the first divider resistor is used for outputting the midpoint voltage.
In one embodiment, the line board assembly further includes a second bridge-type conductive member, a first end of the second bridge-type conductive member is electrically connected to the second end of the first voltage dividing resistor, a second end of the second bridge-type conductive member is connected to the second circuit board, and the second bridge-type conductive member is configured to output a detection voltage.
In one embodiment, the first circuit board defines a first bridge via, the second circuit board defines a second bridge via, a first end of the second bridge conductive member is disposed through the first bridge via, and a second end of the second bridge conductive member is disposed through the second bridge via.
In one embodiment, the first circuit board includes a first board body, a first conductive trace, a second conductive trace and a third conductive trace, the first conductive trace, the second conductive trace and the third conductive trace are disposed on the first board body, the first board body has two first receiving spaces and two second receiving spaces, the first bridge-type through hole is disposed corresponding to the first conductive trace, the two first receiving spaces are disposed corresponding to the second conductive trace, the two second receiving spaces are disposed corresponding to the third conductive trace, the first end of the second bridge-type conductive member is inserted into the first bridge-type through hole and connected to the first conductive trace, the first end of the first electrodeless capacitor and the first end of the second electrodeless capacitor are respectively disposed in the first receiving space and connected to the second conductive trace, the first end of the third electrodeless capacitor and the first end of the first bridge-type conductive piece are respectively positioned in the second accommodating space and connected with the third conductive wire, wherein the first conductive wire is also connected with the second end of the first divider resistor and the first end of the second divider resistor; the second circuit board comprises a second board body, a fourth conductive wire and a fifth conductive wire, the second board body is provided with two third accommodating spaces and two fourth accommodating spaces, the two third accommodating spaces correspond to the fourth conductive wire, the two fourth accommodating spaces correspond to the fifth conductive wire, the second end of the first bridge type conductive piece and the second end of the first passive capacitor are respectively located in the third accommodating spaces and connected with the fourth conductive wire, and the second end of the second passive capacitor and the second end of the third passive capacitor are respectively located in the fourth accommodating spaces and connected with the fifth conductive wire.
In one embodiment, the line board assembly further comprises a plurality of tin-leakage conductive members, and each tin-leakage conductive member is connected with one conductive circuit.
In one embodiment, the capacitor wiring device further includes a base, a first mounting bracket and a second mounting bracket, the first mounting bracket and the second mounting bracket are both connected to the base, the first mounting bracket is respectively connected to the first end of each of the electrodeless capacitors and the first circuit board, and the second mounting bracket is respectively connected to the second end of each of the electrodeless capacitors and the second circuit board.
In one embodiment, the first mounting bracket defines a plurality of first mounting holes, the second mounting bracket defines a plurality of second mounting holes, a first end of each of the electrodeless capacitors is disposed in one of the first mounting holes, and a second end of each of the electrodeless capacitors is disposed in one of the first mounting holes.
In one embodiment, the first mounting bracket is provided with a waist-shaped hole, the capacitor wiring device further comprises a positioning pin, the positioning pin is arranged in the waist-shaped hole in a penetrating manner and connected with the base, and the waist-shaped hole is used for adjusting the distance between the positioning pin and the first mounting bracket.
Compared with the prior art, the invention has at least the following advantages:
the capacitor wiring device is characterized in that the electrodeless capacitors are connected through conductive circuits on the circuit boards, the first circuit board and the second circuit board are electrically conducted through the first bridge type conductive pieces, so that the electrical conduction between the electrodeless capacitors is simple and convenient, the mutual alternate connection through wires is not needed, the structure of the capacitor wiring device is simple, meanwhile, when the circuits are disassembled and assembled, only the circuit boards need to be replaced, the disassembling and assembling convenience is improved, in addition, the use of the circuit boards is also convenient for batch and mechanical production of the capacitor wiring device, and the automation level of production and manufacturing of the capacitor wiring device is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a capacitor wiring device in one embodiment;
FIG. 2 is a circuit diagram corresponding to the capacitor wiring device shown in FIG. 1;
FIG. 3 is a schematic view of another perspective of the capacitor wiring device of FIG. 1;
FIG. 4 is a schematic view of a first wiring board of the capacitor wiring device of FIG. 1;
FIG. 5 is a schematic view of a second wiring board of the capacitor wiring device of FIG. 1;
FIG. 6 is a schematic structural diagram of a capacitor wiring device according to another embodiment;
FIG. 7 is a perspective cross-sectional view of the capacitor wiring device shown in FIG. 6;
FIG. 8 is an exploded view of the capacitor wiring device shown in FIG. 6;
fig. 9 is a partially exploded view of the capacitor wiring device of fig. 8.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention relates to a capacitor wiring device. In one embodiment, the capacitor wiring device comprises a base, a line board assembly and a capacitor assembly. The line board subassembly includes two relative first circuit boards and the second circuit board that sets up. The first circuit board and the second circuit board are internally provided with a plurality of conductive circuits. The capacitor assembly comprises a first electrodeless capacitor, a second electrodeless capacitor, a third electrodeless capacitor and a first bridge type conductive piece. The first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are located between the first circuit board and the second circuit board, the first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are respectively connected with the first circuit board and the second circuit board, so that the first end of the first electrodeless capacitor is electrically connected with the first end of the second electrodeless capacitor, the second end of the second electrodeless capacitor is electrically connected with the second end of the third electrodeless capacitor, and two ends of the first electrodeless capacitor are respectively used for being connected with an external alternating current power supply. The first end of the first bridge type conductive piece is connected with the first end of the third electrodeless capacitor, and the second end of the first bridge type conductive piece is connected with the second end of the first electrodeless capacitor. The capacitor wiring device is characterized in that the electrodeless capacitors are connected through conductive circuits on the circuit boards, the first circuit board and the second circuit board are electrically conducted through the first bridge type conductive pieces, so that the electrical conduction between the electrodeless capacitors is simple and convenient, the mutual alternate connection through wires is not needed, the structure of the capacitor wiring device is simple, meanwhile, when the circuits are disassembled and assembled, only the circuit boards need to be replaced, the disassembling and assembling convenience is improved, in addition, the use of the circuit boards is also convenient for batch and mechanical production of the capacitor wiring device, and the automation level of production and manufacturing of the capacitor wiring device is improved.
Please refer to fig. 1, which is a schematic structural diagram of a capacitor wiring device according to an embodiment of the present invention.
The capacitor wiring device 26 of an embodiment includes a base 100, a line board assembly 200, and a capacitance assembly 300. The line board assembly 200 includes two oppositely disposed first line boards 210 and second line boards 220. The first circuit board 210 and the second circuit board 220 are both connected to the base 100, wherein a plurality of conductive traces are disposed in the first circuit board 210 and the second circuit board 220. Referring to fig. 2, the capacitor assembly 300 includes a first passive capacitor 310, a second passive capacitor 320, a third passive capacitor 330, and a first bridge conductor 340. The first electrodeless capacitor 310, the second electrodeless capacitor 320 and the third electrodeless capacitor 330 are located between the first circuit board 210 and the second circuit board 220, the first electrodeless capacitor 310, the second electrodeless capacitor 320 and the third electrodeless capacitor 330 are respectively connected with the first circuit board 210 and the second circuit board 220, so that the first end of the first electrodeless capacitor 310 is electrically connected with the first end of the second electrodeless capacitor 320, the second end of the second electrodeless capacitor 320 is electrically connected with the second end of the third electrodeless capacitor 330, and two ends of the first electrodeless capacitor 310 are respectively used for being connected with an external alternating current power supply. A first end of the first bridge conductor 340 is connected to a first end of the third electrodeless capacitor 330, and a second end of the first bridge conductor 340 is connected to a second end of the first electrodeless capacitor 310.
In this embodiment, the first electrodeless capacitor is used as a dc filter capacitor, and the second electrodeless capacitor and the third electrodeless capacitor form a half-bridge circuit instead of one half-bridge in the full-bridge rectifier circuit, that is, the second electrodeless capacitor and the third electrodeless capacitor replace two electronic switching tubes on one branch in the full-bridge circuit, for example, the electronic switching tubes are Insulated Gate Bipolar Transistors (IGBTs) or Metal-Oxide-Semiconductor Field Effect transistors (MOSFETs). The electrodeless capacitors are connected through the conducting circuits on the circuit boards, the first circuit board 210 and the second circuit board 220 are electrically conducted through the first bridge type conducting pieces 340, so that the electrical conduction between the electrodeless capacitors is simple and convenient, the mutual alternate connection through wires is not needed, the structure of the capacitor wiring device is simple, meanwhile, when the circuit is disassembled and assembled, only the circuit boards need to be replaced, the disassembling and assembling convenience is improved, in addition, the use of the circuit boards is also convenient for batch and mechanical production of the capacitor wiring device, and the automation level of the production and manufacturing of the capacitor wiring device is improved. The conductive traces are copper foil traces on the circuit board, and the end portions of the electrodeless capacitors on the same circuit board are connected by the conductive traces on the circuit board, for example, the first circuit board 210 has a conductive trace connecting the first end of the first electrodeless capacitor 310 with the first end of the second electrodeless capacitor 320, and the second circuit board 220 has a conductive trace connecting the second end of the second electrodeless capacitor 320 with the second end of the third electrodeless capacitor 330.
In another embodiment, the first, second and third electrodeless capacitors 310, 320 and 330 are nonpolar capacitors with equal capacitance values, such that the first, second and third electrodeless capacitors 310, 320 and 330 are connected in series, and no matter which electrodeless capacitor has two ends connected to the positive and negative electrodes of the external ac power source, the other two capacitors automatically form a half-bridge circuit, i.e. when two ends of one of the electrodeless capacitors are connected to the positive and negative electrodes of the external ac power source, respectively, the other two electrodeless capacitors are connected in series, the electrodeless capacitor connected to the external ac power source is connected in parallel with the other two serially connected electrodeless capacitors, the electrodeless capacitor connected to the external ac power source is used as a filter capacitor, and the two serially connected electrodeless capacitors form a half-bridge module, e.g. when the second electrodeless capacitor 320 located in the middle is connected to the external ac power source, i.e. the second electrodeless capacitor 320 is used as a filter capacitor, the first and third passive capacitors 310 and 330 located at two sides of the second passive capacitor 320 are connected in series with each other through the first bridge-type conductive member 340, the conductive circuit on the first circuit board 210, and the conductive circuit on the second circuit board 220 to form a half-bridge circuit, and at this time, the first and third passive capacitors 310 and 330 are half-bridge capacitors.
In one embodiment, referring to fig. 3, the line board assembly 200 further includes a first voltage-dividing resistor 240 and a second voltage-dividing resistor 250, wherein the first voltage-dividing resistor 240 and the second voltage-dividing resistor 250 are both soldered on the first circuit board 210, so that a first end of the first voltage-dividing resistor 240 is electrically connected to a first end of the third electrodeless capacitor 330, a second end of the first voltage-dividing resistor 240 is connected to a first end of the second voltage-dividing resistor 250, and a second end of the second voltage-dividing resistor 250 is electrically connected to a first end of the second electrodeless capacitor 320. In this embodiment, the first terminal of the first voltage-dividing resistor 240 is connected to the first terminal of the third electrodeless capacitor 330 through the conductive trace on the first circuit board 210, the second terminal of the first voltage-dividing resistor 240 is also connected to the first terminal of the second voltage-dividing resistor 250 through the conductive trace on the first circuit board 210, and the second terminal of the second voltage-dividing resistor 250 is also connected to the first terminal of the second electrodeless capacitor 320 through the conductive trace on the first circuit board 210, so that the first voltage-dividing resistor 240 and the second voltage-dividing resistor 250 are connected in series and connected in series between the first terminal of the third electrodeless capacitor 330 and the first terminal of the second electrodeless capacitor 320. Thus, after power is turned on, the first electrodeless capacitor 310 serves as a filter capacitor, voltages of the second electrodeless capacitor 320 and the third electrodeless capacitor 330 are applied to the first voltage dividing resistor 240 and the second voltage dividing resistor 250, and at this time, the second end of the first voltage dividing resistor 240 or the first end of the second voltage dividing resistor 250 is used for outputting divided voltages of the second electrodeless capacitor 320 and the third electrodeless capacitor 330 to obtain corresponding divided voltages.
Further, the capacitance of the second electrodeless capacitor 320 is equal to the capacitance of the third electrodeless capacitor 330, the resistance of the first divider resistor 240 is equal to the resistance of the second divider resistor 250, and the second end of the first divider resistor 240 is used for outputting the midpoint voltage. In this embodiment, the capacitance of the second electrodeless capacitor 320 is equal to that of the third electrodeless capacitor 330, so that the voltage output by the external ac power supply is equally divided, and the function of replacing two switching tubes of one rectifier bridge arm is achieved. The resistance of the first voltage dividing resistor 240 is equal to the resistance of the second voltage dividing resistor 250, so that the voltage division of the first voltage dividing resistor 240 and the second voltage dividing resistor 250 is more balanced, the balance of the midpoint voltage output by the second end of the first voltage dividing resistor 240 is improved, and the midpoint voltage with balanced voltage is conveniently output.
Still further, referring to fig. 3, the line board assembly 200 further includes a second bridge-type conductive member 260, a first end of the second bridge-type conductive member 260 is electrically connected to a second end of the first voltage-dividing resistor 240, a second end of the second bridge-type conductive member 260 is connected to the second circuit board 220, and the second bridge-type conductive member 260 is configured to output a detection voltage. In this embodiment, the second bridge-type conductive member 260 is connected to the first voltage-dividing resistor 240, and the second bridge-type conductive member 260 serves as a lead of the second end of the first voltage-dividing resistor 240, so as to conveniently lead out the divided voltages on the second electrodeless capacitor 320 and the third electrodeless capacitor 330, thereby facilitating the clip of the detection device to clip, that is, the second bridge-type conductive member 260 provides a clamping position for the divided voltage for the second end of the first voltage-dividing resistor 240.
Further, referring to fig. 1 and fig. 3, the first circuit board 210 is provided with a first bridge-type through hole 212, the second circuit board 220 is provided with a second bridge-type through hole 222, a first end of the second bridge-type conductive member 260 is inserted into the first bridge-type through hole 212, and a second end of the second bridge-type conductive member 260 is inserted into the second bridge-type through hole 222. In this embodiment, the first bridge via 212 corresponds to a connection point on the first circuit board 210, and the second bridge via 222 corresponds to a connection point on the second circuit board 220, for example, pads are disposed at positions of the first bridge via 212 and the second bridge via 222, so as to electrically connect end portions of the electrodeless capacitors with conductive traces on the circuit board. Moreover, the first bridge-type through hole 212 penetrates through the first circuit board 210, and the second bridge-type through hole 222 penetrates through the second circuit board 220, so that the end portions of the electrodeless capacitors are conveniently mounted and connected on the circuit board, the detachable connection between the circuit board and the electrodeless capacitors is realized, and the convenience in dismounting and mounting the capacitor wiring device is improved.
In one embodiment, referring to fig. 1 and fig. 4, the first circuit board 210 includes a first board body 214, a first conductive trace 216, a second conductive trace 218 and a third conductive trace 211, the first conductive trace 216, the second conductive trace 218 and the third conductive trace 211 are all disposed on the first board body 214, the first board body 214 has two first receiving spaces 2142 and two second receiving spaces 2144, the first bridge type through hole 212 is disposed corresponding to the first conductive trace 216, the two first receiving spaces 2142 are disposed corresponding to the second conductive trace 218, the two second receiving spaces 2144 are disposed corresponding to the third conductive trace 211, a first end of the second bridge type conductive member is disposed through the first bridge type through hole 212 and connected to the first conductive trace 216, a first end of the first passive capacitor 310 and a first end of the second passive capacitor 320 are respectively disposed at one of the first receiving spaces 260 The space 2142 is connected to the second conductive trace 218, the first end of the third electrodeless capacitor 330 and the first end of the first bridged conductive device 340 are respectively located in the second receiving space 2144 and connected to the third conductive trace 211, wherein the first conductive trace 216 is further connected to the second end of the first voltage divider resistor 240 and the first end of the second voltage divider resistor 250; referring to fig. 5, the second circuit board 220 includes a second board body 224, a fourth conductive trace 226 and a fifth conductive trace 228, the second board body 224 has two third receiving spaces 2242 and two fourth receiving spaces 2244, the two third receiving spaces 2242 correspond to the fourth conductive trace 226, the two fourth receiving spaces 2244 correspond to the fifth conductive trace 228, the second end of the first bridged conductive device 340 and the second end of the first passive capacitor 310 are respectively located in the third receiving space 2242 and connected to the fourth conductive trace 226, and the second end of the second passive capacitor 320 and the second end of the third passive capacitor 330 are respectively located in the fourth receiving space 2244 and connected to the fifth conductive trace 228. In this embodiment, the first conductive trace 216, the second conductive trace 218, the third conductive trace 211, the fourth conductive trace 226 and the fifth conductive trace 228 are conductive traces on a corresponding circuit board, the first bridge-type through hole exposes a portion of copper foil of the first conductive trace 216 for electrically connecting with the second bridge-type conductive component, each receiving space exposes a portion of copper foil of the corresponding conductive trace, and the end of each non-polar capacitor is electrically connected with the corresponding conductive trace, thereby facilitating the formation of a half-bridge filter circuit, so as to replace a half-bridge in a conventional full-bridge filter rectifier circuit formed by an IGBT or an MOS transistor, that is, replace a branch in the full-bridge filter rectifier circuit. In another embodiment, each accommodating space is a through hole penetrating through the corresponding circuit board, so that the end part of the electrodeless capacitor and the end part of each bridge type conductive piece can be conveniently penetrated through the through holes.
In one embodiment, referring to fig. 1 and fig. 2, the line board assembly 200 further includes a plurality of tin-leakage conductive members 230, and each of the tin-leakage conductive members 230 is connected to one of the conductive traces. In this embodiment, since each electrodeless capacitor is an electrolytic capacitor with a large capacitance value, after power is turned on, the current on the conductive circuit of each circuit board is large. In order to enable the circuit board to bear large current, the solder paste is attached to the conductive circuit through a solder leakage process, so that the conductive circuit and the solder leakage conductive parts are arranged between the end parts of the electrodeless capacitor, namely the solder leakage conductive parts and the conductive circuit are arranged in one-to-one correspondence. Therefore, the conductive resistance between the electrodeless capacitors on the same circuit board is increased, so that the conductive circuits on the circuit board can bear larger current conveniently, the normal work of each circuit board is ensured, the probability of circuit board damage is reduced, and the service life of the capacitor wiring device is prolonged. In another embodiment, the tin-leaking conductive member is metallic tin, and after being connected with the conductive circuit, the tin-leaking conductive member also has a function of dissipating heat generated by large current on the conductive circuit, so as to improve the heat dissipation performance of the circuit board. Each of the tin-leakage conductive members 230 communicates the accommodating grooves on the corresponding conductive traces, that is, on the same conductive trace, the tin-leakage conductive members 230 contact with the copper foil exposed from the corresponding accommodating spaces, so as to increase the resistance between the end portions of the non-polar capacitors on the same conductive trace.
In one embodiment, referring to fig. 1 and fig. 3, the capacitor wiring device 26 further includes a first mounting bracket 400 and a second mounting bracket 500 both connected to the base 100, the first mounting bracket 400 is connected to the first end of each electrodeless capacitor and the first circuit board 210, and the second mounting bracket 500 is connected to the second end of each electrodeless capacitor and the second circuit board 220. In this embodiment, the first mounting bracket 400 and the second mounting bracket 500 are disposed opposite to each other, the first mounting bracket 400 serves as a support seat of the first circuit board 210 on the base 100, and the second mounting bracket 500 serves as a support seat of the second circuit board 220 on the base 100, so as to support the first circuit board 210 and the second circuit board 220, thereby supporting the electrodeless capacitors and reducing contact between the electrodeless capacitors and the base 100.
Furthermore, the first mounting bracket is provided with a plurality of first mounting holes, the second mounting bracket is provided with a plurality of second mounting holes, the first end of each electrodeless capacitor penetrates through one first mounting hole, and the second end of each electrodeless capacitor penetrates through one first mounting hole. In this embodiment, each of the electrodeless capacitors is located between the first circuit board and the second circuit board, the first circuit board and the second circuit board clamp each of the electrodeless capacitors, each of the first mounting holes accommodates a first end of one of the electrodeless capacitors, and each of the second mounting holes accommodates a second end of one of the electrodeless capacitors, so that each of the electrodeless capacitors is conveniently clamped on the circuit board, and the detachable connection between each of the electrodeless capacitors and the circuit board is realized, thereby facilitating the disassembly and assembly of each of the circuit boards and the electrodeless capacitors, and improving the convenience in maintenance of the capacitor wiring device.
Still further, referring to fig. 3, the first mounting bracket 400 is provided with a waist-shaped hole 402, the capacitor wiring device further includes a positioning pin, the positioning pin is inserted into the waist-shaped hole 402 and connected to the base 100, and the waist-shaped hole 402 is used for adjusting a distance between the positioning pin and the first mounting bracket 400. In this embodiment, the first circuit board 210 is mounted on the base 100 by the first mounting bracket 400, the positioning pin is inserted into the waist-shaped hole 402, and the positioning pin is further connected to the base 100, so that the first mounting bracket 400 is mounted on the base 100. Waist type hole 402 is rectangular shape through-hole, when the locating pin is worn to locate wherein, through adjusting the locating pin is in the position in waist type hole 402, be convenient for remove first installing support 400 is in the position on base 100 adjusts promptly first installing support 400 with the distance between the second installation to be applicable to the installation of the electrodeless electric capacity of different specifications, improved capacitor termination's installation suitability.
In one embodiment, referring to fig. 6 and 7, the capacitor wiring device further includes a case 12 and a heat dissipation module 14. An accommodating cavity 12a, an air inlet 12b and an air outlet 12c are formed in the case 12, and the air inlet 12b and the air outlet 12c are communicated with the accommodating cavity 12 a. Further, the heat dissipation module 14 includes a mounting heat conduction shell 14a and a heat dissipation assembly 14b, the mounting heat conduction shell 14a is formed with an air inlet 142, a heat dissipation cavity 144 and an air outlet 146, and the air inlet 142 is communicated with the air outlet 146 through the heat dissipation cavity 144. The mounting heat-conducting shell 14a is configured to be disposed in the chassis 12, that is, the mounting heat-conducting shell 14a is located in the accommodating cavity 12a and connected to the chassis 12.
As shown in fig. 7 and 8, further, the air inlet 142 communicates with the outside of the chassis 12 through the air inlet hole 12b, and the air outlet 146 communicates with the outside of the chassis 12 through the air outlet hole 12c, so that the air flow outside the chassis 12 can flow into the air inlet 142 through the air inlet hole 12b, and meanwhile, the air flow inside the heat dissipation cavity 144 can also flow out to the outside of the chassis 12 through the air outlet hole 12 c. Further, the heat dissipation assembly 14b is disposed in the heat dissipation cavity and connected to the mounting heat-conducting shell 14a, and the heat dissipation assembly 14b is configured to dissipate heat of the mounting heat-conducting shell 14 a. In this embodiment, the components generating more heat during the operation of the industrial power supply 10 may be mounted on the mounting heat-conducting shell 14a, so that the heat generated by the components mounted on the mounting heat-conducting shell 14a can be dissipated quickly, thereby improving the heat dissipation efficiency of the industrial power supply 10.
The heat dissipation module 14 is disposed in the chassis 12, because the heat conduction housing 14a is installed to form the air inlet 142, the heat dissipation cavity 144 and the air outlet 146, the air inlet 142 is communicated with the air outlet 146 through the heat dissipation cavity 144, and because the air inlet 142 is used for being communicated with the outside through the air inlet 12b of the chassis 12, and the air outlet 146 is used for being communicated with the outside through the air outlet 12c of the chassis 12, the air flow outside the chassis 12 can flow into the heat dissipation cavity 144 through the air inlet 12b and the air inlet 142 and contact with the inner wall of the heat dissipation cavity 144 for heat dissipation interaction, and the air flow after heat dissipation interaction flows out of the chassis 12 through the air outlet 146 and the air outlet 12c, so that the heat dissipation cavity 144 can dissipate heat, and components generating more heat, such as a positive conductive plate and a negative conductive plate, of the industrial power supply 10 can be installed in the heat conduction housing 14a, so that the heat generated when the industrial power supply 10 operates can be dissipated, the heat dissipation effect of the industrial power supply 10 is improved. Because the heat dissipation assembly 14b is arranged in the heat dissipation cavity and connected with the installation heat conduction shell 14a, the heat dissipation module 14 is used as an independent module for heat dissipation, and the installation heat conduction shell 14a is arranged in the case 12, so that the heat dissipation module 14 has better compatibility and is convenient to maintain. Because the air inlet 142 of the chassis 12 flows out of the air outlet 146 through the heat dissipation cavity 144, the air inlet 142 is communicated with the outside through the air inlet 12b of the chassis 12, and the air outlet 146 is communicated with the outside through the air outlet 12c of the chassis 12, that is, the air inlet 142, the heat dissipation cavity 144 and the air outlet 146 form a heat dissipation air duct for installing the heat conduction shell 14a, and the heat dissipation air duct is directly communicated with the air inlet 142 and the air outlet 146 respectively, the heat dissipation air duct and the components of the industrial power supply 10 are arranged in a separated manner, and the components in the industrial power supply 10 are prevented from being polluted by chemical gas or dust and the like in the use environment.
As shown in fig. 6 and 7, in one embodiment, the industrial power supply 10 further includes a positive conductive plate 16 and a negative conductive plate 18, each of the positive conductive plate 16 and the negative conductive plate 18 being mounted to the mounting conductive cage 14 a. The case 12 is provided with a first avoiding hole 12d and a second avoiding hole 12e, the positive conducting plate 16 is externally connected with the electric conduction through the first avoiding hole 12d, and the negative conducting plate 18 is externally connected with the electric conduction through the second avoiding hole 12e, so that the industrial power supply 10 is reliably and externally connected with the electric conduction. In the present embodiment, the positive conductive plate 16 and the negative conductive plate 18 are both copper plates, so that the positive conductive plate 16 and the negative conductive plate 18 generate a large amount of heat when energized, and the positive conductive plate 16 and the negative conductive plate 18 are both mounted on the mounting heat conductive housing 14a to reliably dissipate the heat on the positive conductive plate 16 and the negative conductive plate 18, thereby improving the heat dissipation performance of the industrial power supply 10.
As shown in fig. 7 and 9, in one embodiment, the industrial power supply 10 further includes a shielding mounting plate 22, and the shielding mounting plate 22 is located in the accommodating cavity 12a and connected to the chassis 12. First via hole 22a and second via hole 22b have been seted up to protection mounting panel 22, first via hole 22a with first hole 12d of keeping away corresponds the intercommunication, second via hole 22b with hole 12e is kept away to the second corresponds the intercommunication, makes positive conducting plate 16 and negative conducting plate 18 homoenergetic external electrically conductive reliably, has avoided the lower problem of the installation reliability of positive conducting plate 16 and negative conducting plate 18, can avoid the situation of positive conducting plate 16 or negative conducting plate 18 and quick-witted case 12 contact electric leakage better simultaneously. In this embodiment, the protection mounting plate 22 is an insulating plate, which avoids the leakage of electricity between the positive conductive plate 16 and the negative conductive plate 18. In order to better connect the protection mounting plate 22 to the chassis 12, the protection mounting plate 22 is further provided with a first flange 221 and a second flange 222 in a protruding manner, the first via hole 22a is opened in the first flange 221, the second via hole 22b is opened in the second flange 222, the first flange 221 is located in the first clearance hole 12d and abuts against the chassis 12, and the second flange 222 is located in the second clearance hole 12e and abuts against the chassis 12, so that the protection mounting plate 22 is better mounted and fixed to the chassis 12. Furthermore, the industrial power supply 10 further includes a fixing member, the protection mounting plate 22 is provided with a through hole, the case 12 is provided with a threaded hole, and the fixing member is respectively inserted into the through hole and the threaded hole, so that the protection mounting plate 22 is better installed and fixed on the case 12. In this embodiment, the fixing member may be a screw or a screw.
As shown in fig. 7 and 9, in one embodiment, the heat conducting shell 14a is detachably connected to the chassis 12, so as to perform periodic disassembly and assembly maintenance on the heat dissipation module 14, thereby improving the convenience of the industrial power supply 10. In one embodiment, the mounting heat-conducting shell 14a is provided with a through hole 141 for passing a locking member, so that the mounting heat-conducting shell 14a is mounted on the chassis 12 through the locking member. In this embodiment, the locking members, through which the heat conductive housing 14a is mounted to the inner wall of the receiving chamber 12a, may be screws or bolts.
In order to reliably communicate the air inlet 142 and the air inlet 12b for guiding air, as shown in fig. 7 and 9, the heat-conducting shell 14a is further attached to and abutted against the inner wall of the accommodating cavity 12a, so that the heat-conducting shell 14a is tightly and fixedly connected with the chassis 12. In one embodiment, the heat-conducting mounting shell 14a includes a shell body 143 and a close-fitting edge 145, the shell body has a first close-fitting surface and a second close-fitting surface, the air inlet 142 is formed on the first close-fitting surface, the air outlet 146 is formed on the second close-fitting surface, and the first close-fitting surface and the second close-fitting surface are both used for being abutted against the inner wall of the chassis 12. The tight attaching edge is convexly arranged on the edge of the shell body, and the tight attaching edge is respectively adjacent to the first attaching surface and the second attaching surface, so that the heat-conducting shell 14a is tightly and fixedly connected with the case 12. In this embodiment, the second attaching surface is fixedly connected to the chassis 12 through the protective mounting plate. The protective mounting plate is provided with an air passing hole, and the air outlet is communicated with the air outlet hole through the air passing hole. Furthermore, the industrial power supply 10 further includes a sealing rubber strip, which is disposed between the attaching edge and the inner wall of the accommodating cavity 12a, so as to further improve the tightness of the connection between the heat-conducting casing 14a and the chassis 12. Furthermore, a positioning groove is formed in the case 12, the sealing rubber strip is arranged in the positioning groove and protrudes out of the inner wall of the case 12, so that the sealing rubber strip is better positioned on the case 12, and the reliability of connection between the heat-conducting shell cover 14a and the case 12 is further improved.
As shown in fig. 7, in one embodiment, the heat dissipation assembly 14b includes a plurality of heat dissipation plates, each of the heat dissipation plates is located in the heat dissipation cavity 144 and connected to the heat conductive housing 14a, and the plurality of heat dissipation plates are spaced apart from each other to enable the heat dissipation assembly 14b to dissipate heat of the heat conductive housing 14 a. In one embodiment, each of the heat dissipation fins is disposed on a side of the heat dissipation plate facing the air inlet 142, so that the heat dissipation assembly 14b can better dissipate heat generated by the heat conduction housing 14a, and the heat dissipation effect of the heat dissipation assembly 14b is improved. In one embodiment, a plurality of the heat dissipation fins are disposed adjacent to the air outlet 146, so that the air flow can rapidly flow out through the air outlet 146 after contacting the heat dissipation fins, thereby improving the heat dissipation efficiency of the heat dissipation assembly 14 b.
As shown in fig. 7, in one embodiment, the industrial power supply 10 further includes a blower fan 24, the blower fan is disposed on the chassis 12, and an air inlet end of the blower fan 24 corresponds to the air inlet hole 12b, and an air outlet end of the blower fan is disposed toward the heat dissipation cavity 144, so that air flow outside the chassis 12 can rapidly flow into the chassis 12 through the blower fan, and the heat dissipation effect of the industrial power supply 10 is improved. In the present embodiment, the blower fan is located in the heat dissipation cavity 144 and connected to the chassis 12, so that the blower fan is disposed on the chassis 12, and the heat dissipation cavity 144 is better ventilated and dissipated.
As shown in fig. 7, in an embodiment, the case 12 includes a case body 12f and a cover plate 12h, the case body 12f is provided with a mounting hole 121, the cover plate is located in the mounting hole and connected with the case body, and the blower fan is disposed on the cover plate to better protect the blower fan, so that the industrial power supply 10 has better safety in use. The accommodating cavity 12a and the air outlet 12c are arranged on the box body, and the air inlet 12b is arranged on the cover plate, so that the accommodating cavity 12a, the air inlet 12b and the air outlet 12c are formed in the case 12. However, in the regular maintenance in the using process, such as the maintenance of the blower fan, the whole machine needs to be detached from the production line to cover the box body for maintenance and then to be reused, the whole maintenance process is complex, time-consuming and labor-consuming, and the industrial power supply 10 is poor in use convenience. For the convenience in use nature that improves industrial power source 10, solve the more loaded down with trivial details and consuming time and power problem of whole maintenance process simultaneously, furthermore, the apron can be dismantled and connect in the box, radiator fan can dismantle and connect in the apron, when carrying out the dismouting to the blast air fan, if when maintaining, can lift the apron earlier, carry out the dismouting to the blast air fan again, need not to open the box and can realize, the convenience in use nature of industrial power source 10 and the maintenance efficiency of blast air fan have been improved, the more loaded down with trivial details and consuming time and power problem of whole maintenance process has been solved. Referring to fig. 4, in this embodiment, the chassis 12 further includes a first locking screw (not shown), the cover plate 12h is provided with a mounting through hole 12h1, the box body 12f is provided with a locking hole 12f1, and the locking screw is respectively inserted into the mounting through hole and the locking hole, so that the cover plate is detachably connected to the box body. It is understood that in other embodiments, the cover plate is not limited to being attached to the housing by locking screws. For example, the cover is snap-fit connected to the housing. Furthermore, the chassis 12 further includes a second locking screw (not shown), the blower fan 24 has a connecting hole 24a, the cover plate has a screw hole (not shown), and the second locking screw is respectively inserted into the connecting hole and the screw hole, so that the heat dissipation fan is detachably connected to the cover plate.
In one embodiment, the present application further provides a half-bridge filtering apparatus including the capacitor wiring device according to any one of the above embodiments. In this embodiment, the capacitor wiring device includes a line board assembly and a capacitor assembly. The line board subassembly includes two relative first circuit boards and the second circuit board that sets up. The first circuit board and the second circuit board are internally provided with a plurality of conductive circuits. The capacitor assembly comprises a first electrodeless capacitor, a second electrodeless capacitor, a third electrodeless capacitor and a first bridge type conductive piece. The first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are located between the first circuit board and the second circuit board, the first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are respectively connected with the first circuit board and the second circuit board, so that the first end of the first electrodeless capacitor is electrically connected with the first end of the second electrodeless capacitor, the second end of the second electrodeless capacitor is electrically connected with the second end of the third electrodeless capacitor, and two ends of the first electrodeless capacitor are respectively used for being connected with an external alternating current power supply. The first end of the first bridge type conductive piece is connected with the first end of the third electrodeless capacitor, and the second end of the first bridge type conductive piece is connected with the second end of the first electrodeless capacitor. The capacitor wiring device is characterized in that the electrodeless capacitors are connected through conductive circuits on the circuit boards, the first circuit board and the second circuit board are electrically conducted through the first bridge type conductive pieces, so that the electrical conduction between the electrodeless capacitors is simple and convenient, the mutual alternate connection through wires is not needed, the structure of the capacitor wiring device is simple, meanwhile, when the circuits are disassembled and assembled, only the circuit boards need to be replaced, the disassembling and assembling convenience is improved, in addition, the use of the circuit boards is also convenient for batch and mechanical production of the capacitor wiring device, and the automation level of production and manufacturing of the capacitor wiring device is improved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A capacitor wiring device, comprising:
the circuit board assembly comprises a first circuit board and a second circuit board which are oppositely arranged, and a plurality of conducting circuits are arranged in the first circuit board and the second circuit board;
the capacitor assembly comprises a first electrodeless capacitor, a second electrodeless capacitor, a third electrodeless capacitor and a first bridge type conductive piece, wherein the first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are positioned between the first circuit board and the second circuit board, the first electrodeless capacitor, the second electrodeless capacitor and the third electrodeless capacitor are respectively connected with the first circuit board and the second circuit board so that the first end of the first electrodeless capacitor is electrically connected with the first end of the second electrodeless capacitor, the second end of the second electrodeless capacitor is electrically connected with the second end of the third electrodeless capacitor, and the two ends of the first electrodeless capacitor are respectively used for being connected with an external alternating current power supply; the first end of the first bridge type conductive piece is connected with the first end of the third electrodeless capacitor, and the second end of the first bridge type conductive piece is connected with the second end of the first electrodeless capacitor.
2. The capacitor wiring device according to claim 1, wherein the line board assembly further comprises a first voltage dividing resistor and a second voltage dividing resistor, both of the first voltage dividing resistor and the second voltage dividing resistor being soldered to the first wiring board such that a first end of the first voltage dividing resistor is electrically connected to a first end of the third electrodeless capacitor, a second end of the first voltage dividing resistor is connected to a first end of the second voltage dividing resistor, and a second end of the second voltage dividing resistor is electrically connected to a first end of the second electrodeless capacitor.
3. The capacitor wiring device according to claim 2, wherein the capacitance of the second electrodeless capacitor is equal to the capacitance of the third electrodeless capacitor, the resistance of the first divider resistor is equal to the resistance of the second divider resistor, and the second end of the first divider resistor is used for outputting the midpoint voltage.
4. The capacitor wiring device according to claim 2, wherein the line board assembly further comprises a second bridge-type conductive member, a first end of the second bridge-type conductive member being electrically connected to a second end of the first voltage dividing resistor, a second end of the second bridge-type conductive member being connected to the second circuit board, the second bridge-type conductive member being configured to output a detection voltage.
5. The capacitor wiring device as defined in claim 4, wherein the first circuit board defines a first bridge via, the second circuit board defines a second bridge via, a first end of the second bridge conductive member is disposed through the first bridge via, and a second end of the second bridge conductive member is disposed through the second bridge via.
6. The capacitor wiring device according to claim 5, wherein the first circuit board includes a first board body, a first conductive trace, a second conductive trace and a third conductive trace, the first conductive trace, the second conductive trace and the third conductive trace are disposed on the first board body, the first board body has two first receiving spaces and two second receiving spaces, the first bridge-type through hole is disposed corresponding to the first conductive trace, the two first receiving spaces are disposed corresponding to the second conductive trace, the two second receiving spaces are disposed corresponding to the third conductive trace, the first end of the second bridge-type conductive member is disposed through the first bridge-type through hole and connected to the first conductive trace, the first end of the first electrodeless capacitor and the first end of the second electrodeless capacitor are disposed in the first receiving space and connected to the second conductive trace, the first end of the third electrodeless capacitor and the first end of the first bridge-type conductive piece are respectively positioned in the second accommodating space and connected with the third conductive wire, wherein the first conductive wire is also connected with the second end of the first divider resistor and the first end of the second divider resistor; the second circuit board comprises a second board body, a fourth conductive wire and a fifth conductive wire, the second board body is provided with two third accommodating spaces and two fourth accommodating spaces, the two third accommodating spaces correspond to the fourth conductive wire, the two fourth accommodating spaces correspond to the fifth conductive wire, the second end of the first bridge type conductive piece and the second end of the first passive capacitor are respectively located in the third accommodating spaces and connected with the fourth conductive wire, and the second end of the second passive capacitor and the second end of the third passive capacitor are respectively located in the fourth accommodating spaces and connected with the fifth conductive wire.
7. The capacitor wiring device according to claim 1, wherein the line board assembly further comprises a plurality of tin-leaking conductive members, each of the tin-leaking conductive members being connected to one of the conductive lines.
8. The capacitor wiring device of claim 1, further comprising a base, a first mounting bracket and a second mounting bracket, the first mounting bracket and the second mounting bracket each coupled to the base, the first mounting bracket coupled to the first end of each of the non-polar capacitors and the first circuit board, respectively, and the second mounting bracket coupled to the second end of each of the non-polar capacitors and the second circuit board, respectively.
9. The capacitor wiring device as defined in claim 8, wherein the first mounting bracket defines a plurality of first mounting holes, the second mounting bracket defines a plurality of second mounting holes, a first end of each of the electrodeless capacitors is disposed through one of the first mounting holes, and a second end of each of the electrodeless capacitors is disposed through one of the first mounting holes.
10. The capacitor wiring device according to claim 8, wherein the first mounting bracket is provided with a kidney-shaped hole, the capacitor wiring device further comprises a positioning pin, the positioning pin is inserted into the kidney-shaped hole and connected with the base, and the kidney-shaped hole is used for adjusting the distance between the positioning pin and the first mounting bracket.
CN202111535187.1A 2021-12-15 2021-12-15 Capacitor wiring device Pending CN114038686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111535187.1A CN114038686A (en) 2021-12-15 2021-12-15 Capacitor wiring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111535187.1A CN114038686A (en) 2021-12-15 2021-12-15 Capacitor wiring device

Publications (1)

Publication Number Publication Date
CN114038686A true CN114038686A (en) 2022-02-11

Family

ID=80146963

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111535187.1A Pending CN114038686A (en) 2021-12-15 2021-12-15 Capacitor wiring device

Country Status (1)

Country Link
CN (1) CN114038686A (en)

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Effective date of registration: 20221212

Address after: 516000 beside Huizhang Road, Dongjiang Village, Dongsheng Development Zone, Chenjiang Street, Zhongkai High tech Zone, Huizhou, Guangdong

Applicant after: Huizhou Xianfeng Electroplating Equipment Co.,Ltd.

Address before: No. 333 Xinhua Avenue, Tongqiao Town, Zhongkai high tech Zone, Huizhou City, Guangdong Province 516000

Applicant before: Huizhou Zhongbang power supply Co.,Ltd.