CN114029626A - Cutting processing method and device for optical film - Google Patents
Cutting processing method and device for optical film Download PDFInfo
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- CN114029626A CN114029626A CN202111282922.2A CN202111282922A CN114029626A CN 114029626 A CN114029626 A CN 114029626A CN 202111282922 A CN202111282922 A CN 202111282922A CN 114029626 A CN114029626 A CN 114029626A
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- Prior art keywords
- cutting
- paths
- path
- film
- lines
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/005—Computer numerical control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D2005/002—Performing a pattern matching operation
Abstract
The application discloses a cutting processing method and a device of an optical film, wherein the method comprises the following steps: obtaining the shape and the size of a part to be cut, and splitting the shape into a plurality of lines, wherein the plurality of lines surround the shape; determining the length of each line in the plurality of lines according to the size; combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected; the paths are paths for the operation of the cutting knife; arranging the multiple paths to obtain multiple groups of paths, wherein the paths in each group of paths are different in sequence; and acquiring the cutting-to-running distance when cutting is carried out according to each group of paths, and selecting a group of paths with the shortest running distance as cutting paths used in cutting. The problem caused by manually planning and cutting the path is solved through the method and the device, and therefore scientificity and efficiency of path cutting planning are improved.
Description
Technical Field
The application relates to the field of optical films, in particular to a method and a device for cutting an optical film.
Background
The optical composite film (abbreviated as "edp") may be classified into a diffusion-prism composite film (DOP), a diffusion-prism composite film (DOPP), a prism-prism composite film (POP), a microlens-prism composite film (MOP), a prism-microlens composite film (POM), etc., and the optical film is cut to adjust the size of the film when in use.
The optical film is firstly planned during the cutting process, and after the cutting shape is planned, the cutting path of a cutting tool needs to be planned, and the planning of the cutting path is currently performed by means of manual input into the cutting tool.
Disclosure of Invention
The embodiment of the application provides a cutting processing method and device of an optical film, and aims to at least solve the problem caused by manually planning a cutting path.
According to an aspect of the present application, there is provided a method of cutting an optical film, including: obtaining the shape and the size of a part to be cut, and splitting the shape into a plurality of lines, wherein the plurality of lines surround the shape; determining the length of each line in the plurality of lines according to the size; combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected; the paths are paths for the operation of the cutting knife; arranging the multiple paths to obtain multiple groups of paths, wherein the paths in each group of paths are different in sequence; and acquiring the cutting-to-running distance when cutting is carried out according to each group of paths, and selecting a group of paths with the shortest running distance as cutting paths used in cutting.
Further, still include: and sending the cutting path to cutting equipment, wherein the cutting path is used for indicating the cutting equipment to operate the cutting knife according to the cutting path.
Further, sending the clipping path to the clipping device includes: sending the cutting path to a user, wherein the user is used for confirming the cutting path; and after receiving the confirmation information of the user to the cutting path, sending the cutting path to the cutting equipment.
Further, the cutting path also carries position information of the part to be cut in the optical film, wherein the position information is used for determining a starting point of the cutting path in the optical film.
Further, the optical film includes at least one of: reflecting film, antireflection film, light filtering film, optical protective film, polarizing film, light splitting film and phase film.
According to another aspect of the present application, there is also provided a cutting processing apparatus of an optical film, including: the device comprises an acquisition module, a cutting module and a cutting module, wherein the acquisition module is used for acquiring the shape and the size of a part to be cut and splitting the shape into a plurality of lines, and the plurality of lines surround the shape; the determining module is used for determining the length of each line in the plurality of lines according to the size; the combination module is used for combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected with each other; the paths are paths for the operation of the cutting knife; the arrangement module is used for arranging the paths to obtain a plurality of groups of paths, wherein the paths in each group of paths have different sequences; and the selection module is used for acquiring the distance from cutting to operation when cutting is carried out according to each group of paths, and selecting a group of paths with the shortest operation distance as cutting paths used when cutting.
Further, still include: and the sending module is used for sending the cutting path to cutting equipment, wherein the cutting path is used for indicating the cutting equipment to operate the cutting knife according to the cutting path.
Further, the sending module is configured to: sending the cutting path to a user, wherein the user is used for confirming the cutting path; and after receiving the confirmation information of the user to the cutting path, sending the cutting path to the cutting equipment.
Further, the cutting path also carries position information of the part to be cut in the optical film, wherein the position information is used for determining a starting point of the cutting path in the optical film.
Further, the optical film includes at least one of: reflecting film, antireflection film, light filtering film, optical protective film, polarizing film, light splitting film and phase film.
In the embodiment of the application, the shape and the size of a part to be cut are obtained, and the shape is split into a plurality of lines, wherein the plurality of lines surround the shape; determining the length of each line in the plurality of lines according to the size; combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected; the paths are paths for the operation of the cutting knife; arranging the multiple paths to obtain multiple groups of paths, wherein the paths in each group of paths are different in sequence; and acquiring the cutting-to-running distance when cutting is carried out according to each group of paths, and selecting a group of paths with the shortest running distance as cutting paths used in cutting. The problem caused by manually planning and cutting the path is solved through the method and the device, and therefore scientificity and efficiency of path cutting planning are improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:
fig. 1 is a flowchart of a trimming processing method of an optical film according to an embodiment of the present application.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
It should be noted that the steps illustrated in the flowcharts of the figures may be performed in a computer system such as a set of computer-executable instructions and that, although a logical order is illustrated in the flowcharts, in some cases, the steps illustrated or described may be performed in an order different than presented herein.
In the present embodiment, a method for cutting an optical film is provided, and fig. 1 is a flowchart of a method for cutting an optical film according to an embodiment of the present application, where the flowchart includes the following steps, as shown in fig. 1:
step S102, obtaining the shape and the size of a part to be cut, and splitting the shape into a plurality of lines, wherein the plurality of lines surround the shape;
the shape of the portion to be cut can be planned by: obtaining a shape of a plurality of parts to be manufactured, wherein a material from which the parts are manufactured includes an optical film; selecting a first component from the plurality of components, wherein a first space exists in a planar shape of the first component; selecting a second component from the plurality of components, wherein a component portion in a planar shape of the second component is capable of partially or fully occupying the first space; disposing a part or all of the component part of the second component in the first space, and the component part of the second component does not overlap with the component part of the first component in a plane; and taking the shapes of the first component and the second component which are configured as the shapes to be subjected to optical film cutting. Optionally, selecting the second component from the plurality of components comprises: selecting, as the second component, a component that satisfies the following condition: the component part in the planar shape of the second component can partially or fully occupy the first space, and the component part in the planar shape of the first component can partially or fully occupy a second space present in the second component shape.
Step S104, determining the length of each line in the plurality of lines according to the size;
step S106, combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected; the paths are paths for the operation of the cutting knife;
step S108, arranging the multiple paths to obtain multiple groups of paths, wherein the paths in each group of paths are in different orders;
step S110, obtaining the distance from cutting to operation when cutting is performed according to each group of paths, and selecting a group of paths with the shortest operation distance as the cutting path used when cutting. Optionally, the cutting path may further carry position information of the portion to be cut in the optical film, where the position information is used to determine a starting point of the cutting path in the optical film.
As an alternative embodiment, if the two sets of paths travel the same distance, the sum of the angles that the cutter rotates when the cutter is running is obtained for each of the two sets of paths with the same distance, and the set of paths with smaller sum of angles is selected as the cutting path. For example, when the scissors move from one line to another line, the included angle between the two lines is the angle that the scissors rotate.
The problems caused by manually planning and cutting the path are solved through the steps, so that the scientificity and the efficiency of path cutting planning are improved.
In this embodiment, the cutting path may also be sent to a cutting device, where the cutting path is used to instruct the cutting device to operate the cutting knife (also referred to as a cutting knife) according to the cutting path. A confirmation step can be added before sending, and the cutting path is sent to a user, wherein the user is used for confirming the cutting path; and after receiving the confirmation information of the user on the cutting path, sending the cutting path to the cutting equipment for cutting (or called cutting).
In this embodiment, the optical film can be rolled up using the following cutting device: a feeding unit for providing the optical film; conveying the optical film to a cutting unit, wherein the cutting unit comprises a cutting knife, the cutting knife cuts the optical film according to the cutting path to form a main body part and a side material part, and the main body part comprises the part to be cut; the part to be cut is conveyed to a finished product collecting position along a first direction by a conveying belt, and the edge material part is conveyed to a rolling unit along a second direction, wherein the included angle between the first direction and the second direction is 0-100 degrees.
The cutting knife can be: the cutting device comprises a laser cutting knife or a circular knife, wherein the number of the laser cutting knife or the circular knife can be one or more.
When a laser cutting knife is used for cutting, the temperature of a cut part is obtained through an infrared temperature sensor, cutting of the optical film is stopped when the temperature exceeds a preset first temperature, and cutting of the optical film is restarted when the temperature of the cut part is lower than a preset second temperature, wherein the second temperature is lower than the first temperature. This embodiment can ensure that the optical film properties change due to excessive temperature during the cutting process.
In this embodiment, an electronic device is provided, comprising a memory in which a computer program is stored and a processor configured to run the computer program to perform the method in the above embodiments.
The programs described above may be run on a processor or may also be stored in memory (or referred to as computer-readable media), which includes both non-transitory and non-transitory, removable and non-removable media, that implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.
These computer programs may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks, and corresponding steps may be implemented by different modules.
Such an apparatus or system is provided in this embodiment. The device is called a cutting processing device of the optical film, and comprises: the device comprises an acquisition module, a cutting module and a cutting module, wherein the acquisition module is used for acquiring the shape and the size of a part to be cut and splitting the shape into a plurality of lines, and the plurality of lines surround the shape; the determining module is used for determining the length of each line in the plurality of lines according to the size; the combination module is used for combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected with each other; the paths are paths for the operation of the cutting knife; the arrangement module is used for arranging the paths to obtain a plurality of groups of paths, wherein the paths in each group of paths have different sequences; and the selection module is used for acquiring the distance from cutting to operation when cutting is carried out according to each group of paths, and selecting a group of paths with the shortest operation distance as cutting paths used when cutting.
The system or the apparatus is used for implementing the functions of the method in the foregoing embodiments, and each module in the system or the apparatus corresponds to each step in the method, which has been described in the method and is not described herein again.
For example, it also includes: and the sending module is used for sending the cutting path to cutting equipment, wherein the cutting path is used for indicating the cutting equipment to operate the cutting knife according to the cutting path. Optionally, the sending module is configured to: sending the cutting path to a user, wherein the user is used for confirming the cutting path; and after receiving the confirmation information of the user to the cutting path, sending the cutting path to the cutting equipment.
For another example, the cutting path further carries position information of the portion to be cut in the optical film, where the position information is used to determine a starting point of the cutting path in the optical film. Optionally, the optical film comprises at least one of: reflecting film, antireflection film, light filtering film, optical protective film, polarizing film, light splitting film and phase film.
The problem caused by manually planning and cutting the path is solved through the embodiment, so that the scientificity and the efficiency of path planning are improved.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A method for cutting an optical film, comprising:
obtaining the shape and the size of a part to be cut, and splitting the shape into a plurality of lines, wherein the plurality of lines surround the shape;
determining the length of each line in the plurality of lines according to the size;
combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected; the paths are paths for the operation of the cutting knife;
arranging the multiple paths to obtain multiple groups of paths, wherein the paths in each group of paths are different in sequence;
and acquiring the cutting-to-running distance when cutting is carried out according to each group of paths, and selecting a group of paths with the shortest running distance as cutting paths used in cutting.
2. The method of claim 1, further comprising:
and sending the cutting path to cutting equipment, wherein the cutting path is used for indicating the cutting equipment to operate the cutting knife according to the cutting path.
3. The method of claim 2, wherein sending the clipping path to the clipping device comprises:
sending the cutting path to a user, wherein the user is used for confirming the cutting path;
and after receiving the confirmation information of the user to the cutting path, sending the cutting path to the cutting equipment.
4. The method according to claim 1, wherein the cutting path further carries position information of the portion to be cut in the optical film, wherein the position information is used for determining a starting point of the cutting path in the optical film.
5. The method of any of claims 1-4, wherein the optical film comprises at least one of: reflecting film, antireflection film, light filtering film, optical protective film, polarizing film, light splitting film and phase film.
6. An optical film cutting apparatus, comprising:
the device comprises an acquisition module, a cutting module and a cutting module, wherein the acquisition module is used for acquiring the shape and the size of a part to be cut and splitting the shape into a plurality of lines, and the plurality of lines surround the shape;
the determining module is used for determining the length of each line in the plurality of lines according to the size;
the combination module is used for combining the lines to obtain a plurality of paths, wherein each path comprises a plurality of continuous line segments, and each path is not connected with each other; the paths are paths for the operation of the cutting knife;
the arrangement module is used for arranging the paths to obtain a plurality of groups of paths, wherein the paths in each group of paths have different sequences;
and the selection module is used for acquiring the distance from cutting to operation when cutting is carried out according to each group of paths, and selecting a group of paths with the shortest operation distance as cutting paths used when cutting.
7. The apparatus of claim 6, further comprising:
and the sending module is used for sending the cutting path to cutting equipment, wherein the cutting path is used for indicating the cutting equipment to operate the cutting knife according to the cutting path.
8. The apparatus of claim 7, wherein the sending module is configured to:
sending the cutting path to a user, wherein the user is used for confirming the cutting path;
and after receiving the confirmation information of the user to the cutting path, sending the cutting path to the cutting equipment.
9. The apparatus according to claim 6, wherein the cutting path further carries position information of the portion to be cut in the optical film, wherein the position information is used for determining a starting point of the cutting path in the optical film.
10. The device of any of claims 6 to 9, wherein the optical film comprises at least one of: reflecting film, antireflection film, light filtering film, optical protective film, polarizing film, light splitting film and phase film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111282922.2A CN114029626A (en) | 2021-11-01 | 2021-11-01 | Cutting processing method and device for optical film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111282922.2A CN114029626A (en) | 2021-11-01 | 2021-11-01 | Cutting processing method and device for optical film |
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| Publication Number | Publication Date |
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| CN114029626A true CN114029626A (en) | 2022-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111282922.2A Pending CN114029626A (en) | 2021-11-01 | 2021-11-01 | Cutting processing method and device for optical film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4230496A1 (en) * | 1992-09-11 | 1994-03-17 | Bergmann Hans Wilhelm | Precision working of sheet with pulsed laser beam - using the amplified low divergent portion of the beam |
| US20050172764A1 (en) * | 2004-02-10 | 2005-08-11 | Matthew Fagan | Method and system for eliminating external piercing in NC cutting of nested parts |
| CN101608244A (en) * | 2008-06-16 | 2009-12-23 | 株式会社岛精机制作所 | Adopt the method for cutting out and the Scissoring device of emulsion sheet |
| CN107650196A (en) * | 2017-08-07 | 2018-02-02 | 住华科技股份有限公司 | Optical film cutting and winding method and cutting knife used by same |
| CN108608125A (en) * | 2018-05-14 | 2018-10-02 | 西南民族大学 | A kind of mechanical cutting machine of electrical control |
| CN108857092A (en) * | 2018-07-17 | 2018-11-23 | 大族激光科技产业集团股份有限公司 | It is cut by laser paths planning method, device, storage medium and computer equipment |
| CN109841559A (en) * | 2019-03-11 | 2019-06-04 | 浙江荷清柔性电子技术有限公司 | The preparation method of ultra-thin wafers |
| CN110153567A (en) * | 2019-04-04 | 2019-08-23 | 江苏大学 | A kind of laser cutting system based on image recognition |
-
2021
- 2021-11-01 CN CN202111282922.2A patent/CN114029626A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4230496A1 (en) * | 1992-09-11 | 1994-03-17 | Bergmann Hans Wilhelm | Precision working of sheet with pulsed laser beam - using the amplified low divergent portion of the beam |
| US20050172764A1 (en) * | 2004-02-10 | 2005-08-11 | Matthew Fagan | Method and system for eliminating external piercing in NC cutting of nested parts |
| CN101608244A (en) * | 2008-06-16 | 2009-12-23 | 株式会社岛精机制作所 | Adopt the method for cutting out and the Scissoring device of emulsion sheet |
| CN107650196A (en) * | 2017-08-07 | 2018-02-02 | 住华科技股份有限公司 | Optical film cutting and winding method and cutting knife used by same |
| CN108608125A (en) * | 2018-05-14 | 2018-10-02 | 西南民族大学 | A kind of mechanical cutting machine of electrical control |
| CN108857092A (en) * | 2018-07-17 | 2018-11-23 | 大族激光科技产业集团股份有限公司 | It is cut by laser paths planning method, device, storage medium and computer equipment |
| CN109841559A (en) * | 2019-03-11 | 2019-06-04 | 浙江荷清柔性电子技术有限公司 | The preparation method of ultra-thin wafers |
| CN110153567A (en) * | 2019-04-04 | 2019-08-23 | 江苏大学 | A kind of laser cutting system based on image recognition |
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Application publication date: 20220211 |