CN114029609B - Ultraviolet lens and optical system and marking device thereof - Google Patents
Ultraviolet lens and optical system and marking device thereof Download PDFInfo
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- CN114029609B CN114029609B CN202111351349.6A CN202111351349A CN114029609B CN 114029609 B CN114029609 B CN 114029609B CN 202111351349 A CN202111351349 A CN 202111351349A CN 114029609 B CN114029609 B CN 114029609B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
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- Lenses (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides an ultraviolet lens, an optical system thereof and marking equipment, which comprise a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens which are sequentially arranged along the direction of incident light; the first lens and the second lens are negative meniscus lenses which are bent towards the incident light direction; the third lens and the fourth lens are positive meniscus lenses bending towards the incident light direction; the fifth lens and the sixth lens are each a biconvex lens. The ultraviolet laser scanning lens has smaller light spot convergence size, smaller telecentricity, relative distortion and larger front-back working distance, and can be matched with a two-dimensional scanning galvanometer to realize the application of high-precision marking.
Description
Technical Field
The invention belongs to the technical field of optical lenses, and particularly relates to an ultraviolet laser scanning lens for wafer marking and an optical system thereof.
Background
The wafer marking is to perform laser etching character operation on the surface of a finished product chip, and the positioning precision and the size of laser spot directly influence the character fineness. Compared with near-infrared laser (1064 nm), ultraviolet laser (355 nm) has smaller focusing light spot and smaller thermal effect under the same parameters, and is very suitable for application of hyperfine marking.
In a scanning lens in the modern laser processing field, a lens with a non-telecentric structure has more lenses and lower cost, but the spot deformation of an edge field of view is larger; the telecentric lens has the advantages that the exit pupil is positioned at infinity in the image space, so that the chief ray of the focused light beam is vertical to the image plane, and the focusing precision requirement of the workpiece and the lens can be properly relaxed. In addition, the magnitude of the lens aberration also determines the processing accuracy, the field curvature causes the best working surface to be curved, the astigmatism causes the line widths in the X and Y directions to be not constant, the distortion is too large, and the position accuracy of the edge area is reduced. In order to be suitable for two-dimensional galvanometer scanning, the front working distance of the lens is required to be as large as possible so that the diaphragm is positioned between the two-dimensional scanning galvanometers, and the rear working distance is also required to be as large as possible so as to reserve an operation space for the wafer.
Disclosure of Invention
The invention provides an ultraviolet lens, an optical system thereof and marking equipment, aiming at solving the defects in the technology, wherein the ultraviolet lens has smaller light spot convergence size, smaller telecentricity, relative distortion and larger front-back working distance, and can be matched with a two-dimensional scanning galvanometer to realize high-precision marking application. In order to achieve the purpose, the invention adopts the following specific technical scheme:
an ultraviolet lens optical system comprising: the first lens, the second lens, the third lens, the fourth lens, the fifth lens and the sixth lens are arranged in sequence along the incident light direction;
the first lens and the second lens are negative meniscus lenses which are bent towards the incident light direction;
the third lens and the fourth lens are positive meniscus lenses which are bent towards the incident light direction;
the fifth lens and the sixth lens are each a biconvex lens.
Preferably, the lens further comprises a diaphragm arranged in front of the first lens and a parallel flat plate arranged on the light-emitting side of the sixth lens.
Preferably, the ultraviolet lens optical system satisfies the following focal length relationship:
-17.5<f 1 /f<-15.5;
-0.7<f 2 /f<-0.6;
2.2<f 3 /f<2.35;
1.45<f 4 /f<1.6;
2.85<f 5 /f<3.05;
3.35<f 6 /f<3.55;
wherein f is the focal length of the ultraviolet lens optical system;
f 1 is the focal length of the first lens;
f 2 is the focal length of the second lens;
f 3 is the focal length of the third lens;
f 4 is the focal length of the fourth lens;
f 5 is the focal length of the fifth lens;
f 6 is the focal length of the sixth lens.
Preferably, the front working distance of the ultraviolet lens optical system is more than 35mm, and the rear working distance is more than 140mm;
the front working distance is the distance between the diaphragm and the first lens;
the back working distance is the distance between the parallel flat plate and the focal plane of the ultraviolet lens optical system.
Preferably, the ultraviolet lens optical system is an image-side telecentric optical path.
Preferably, the first lens, the second lens, the third lens, the fourth lens, the fifth lens and the sixth lens are all made of fused silica glass.
An ultraviolet laser scanning lens comprises the ultraviolet lens optical system.
A wafer marking device comprises the ultraviolet laser scanning lens.
The invention can obtain the following technical effects:
1. the ultraviolet laser scanning lens has smaller light spot convergence size, smaller telecentricity, relative distortion and larger front-back working distance, and can be matched with a two-dimensional scanning galvanometer to realize the application of high-precision marking.
2. The shape and thickness of the lens are suitable for mass production.
Drawings
Fig. 1 is a schematic structural diagram of an ultraviolet lens optical system according to an embodiment of the present invention;
FIG. 2 is a speckle pattern of one embodiment of the present invention;
FIG. 3 is a graph of field curvature and relative distortion according to one embodiment of the present invention;
FIG. 4 is a graph of the optical transfer function MTF of one embodiment of the present invention;
FIG. 5a is a schematic diagram of a light spot using a telecentric lens according to one embodiment of the invention;
fig. 5b is a schematic diagram of the spots of a non-telecentric lens.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The invention aims to provide an ultraviolet lens, an optical system of the ultraviolet lens and marking equipment. The ultraviolet lens, the optical system thereof and the marking device provided by the invention will be described in detail through specific embodiments.
Fig. 2 is a schematic structural diagram of an ultraviolet lens optical system of the present invention, which mainly includes six lenses, and specifically includes a first lens L1, a second lens L2, a third lens L3, a fourth lens L4, a fifth lens L5, and a sixth lens L6, which are sequentially arranged along an incident light direction, as shown in fig. 2;
the first lens L1 and the second lens L2 are negative meniscus lenses which are bent towards the incident light direction; the third lens L3 and the fourth lens L4 are both positive meniscus lenses which are bent towards the incident light direction; the fifth lens L5 and the sixth lens L6 are double convex lenses.
In a preferred embodiment of the present invention, the present invention further comprises a stop S0 disposed in front of the first lens L1 and a parallel plate L7 disposed behind the sixth lens L6, wherein the stop S0 is an aperture stop for limiting the width of the light beam, and the parallel plate L7 is a cover glass.
The imaging light beam is imaged on a focal plane S after passing through a first lens L1, a second lens L2, a third lens L3, a fourth lens L4, a fifth lens L5, a sixth lens L6 and a parallel flat plate L7.
Specifically, the focal length f1 of the first lens L1, the focal length f2 of the second lens L2, the focal length f3 of the third lens L3, the focal length f4 of the fourth lens L4, the focal length f5 of the fifth lens L5, the focal length f6 of the sixth lens L6, and the focal length f of the optical system formed by the focal lengths f satisfy the following focal length relationships:
-17.5<f 1 /f<-15.5;
-0.7<f 2 /f<-0.6;
2.2<f 3 /f<2.35;
1.45<f 4 /f<1.6;
2.85<f 5 /f<3.05;
3.35<f 6 /f<3.55;
the front working distance of the ultraviolet lens optical system, namely the distance d between the diaphragm S0 and the first lens L1 0 Greater than 35mm; rear working distance, i.e. distance d of parallel plate L7 from focal plane S15 14 Greater than 140mm.
In a preferred embodiment of the present invention, an image-side telecentric optical path is adopted, and referring to the telecentric lens and the non-telecentric lens spot contrast diagram shown in fig. 5a and 5b, as shown in the figure:
each field light beam of the telecentric lens reaches the working surface at an incidence angle close to vertical incidence, and the light spots are close to rotationally symmetrical circles; for the non-central field-of-view light beam, the non-telecentric lens irradiates the working surface at a non-vertical angle, and the light spot is elliptical. For the out-of-focus condition, the telecentric lens can ensure that the diffuse spot is still circular, but the change of the shape of the telecentric lens is more obvious. For high-quality marking requirements, the shape of the diffuse spots in each field of view is related to the uniformity of line width. Thus, the adoption of a telecentric light path has incomparable advantages.
In a preferred embodiment of the present invention, each lens is made of high temperature-resistant fused silica glass, and the fused silica glass (e.g., JGS 1) has higher optical transmittance in the 355nm ultraviolet band than other optical glasses. The absorption of the lens material to the laser energy can be reduced, and the lens heating caused by the high-energy laser in long-time use is avoided.
An ultraviolet laser scanning lens is designed according to the parameters, the ultraviolet laser scanning lens is suitable for a laser with the wavelength of 355nm, the scanning area of 50mm multiplied by 50mm and the beam width of 8mm, and the parameters of each lens are shown in the following table:
table-each lens optical parameter table
Number of noodles | Radius of curvature | Thickness of space | Material |
Diaphragm S0 | ∞ | 35.0 | Air (W) |
S1 | -76.472 | 6.0 | Quartz glass |
S2 | -86.157 | 9.8 | Air (a) |
S3 | -27.092 | 6.0 | Quartz glass |
S4 | 155.591 | 6.8 | Air (a) |
S5 | -73.367 | 11.5 | Quartz glass |
S6 | -47.127 | 0.5 | Air (a) |
S7 | -230.400 | 16 | Quartz glass |
S8 | -58.721 | 0.5 | Air (W) |
S9 | 1581.451 | 12 | Quartz glass |
S10 | -163.784 | 0.5 | Air (a) |
S11 | 226.115 | 12 | Quartz glass |
S12 | -725.238 | 7.8 | Air (W) |
S13 | ∞ | 3.0 | Quartz glass |
S14 | ∞ | 144 | Air (a) |
Working surface S15 | ∞ | - | - |
As can be seen from the above table, the shape and thickness of the designed lens are suitable for mass production.
Further, fig. 2-4 show various test result diagrams of the ultraviolet laser scanning lens of the present invention, from which it can be known that the size of the diffuse spot in each field of view of the optical system is smaller than the size of the airy spot in the optical system; optical system calibration F θ Relative distortion is less than 0.05%; the telecentricity is less than 0.5 deg., and the transfer function of the optical system is close to the diffraction limit.
At this time, the rear working distance d of the optical system 14 =140mm, and an operation space is reserved for marking the wafer; front working distance d 0 =35mm, so that the diaphragm can be placed between the two-dimensional scanning galvanometers used for marking.
A wafer marking device comprises the ultraviolet laser scanning lens and a two-dimensional scanning galvanometer, and can be used for marking characters on the surface of a wafer.
In the description of the specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
The above embodiments of the present invention should not be construed as limiting the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.
Claims (6)
1. An ultraviolet lens optical system, comprising: the lens comprises a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens which are arranged in sequence along the incident light direction;
the first lens and the second lens are negative meniscus lenses which are bent towards the incident light direction;
the third lens and the fourth lens are both positive meniscus lenses which are bent towards the incident light direction;
the fifth lens and the sixth lens are both double-convex lenses;
the distance between the diaphragm and the first lens is 35mm;
the thickness of the first lens is 6mm, the curvature radius of the front surface is-76.472, and the curvature radius of the rear surface is-86.157;
the distance between the first lens and the second lens is 9.8mm;
the thickness of the second lens is 6mm, the curvature radius of the front surface is-27.092, and the curvature radius of the rear surface is 155.591;
the distance between the second lens and the third lens is 6.8mm;
the thickness of the third lens is 11.5mm, the curvature radius of the front surface is-73.367, and the curvature radius of the rear surface is-47.127;
the distance between the third lens and the fourth lens is 0.5mm;
the thickness of the fourth lens is 16mm, the curvature radius of the front surface is-230.400, and the curvature radius of the rear surface is-58.721;
the distance between the fourth lens and the fifth lens is 0.5mm;
the thickness of the fifth lens is 12mm, the curvature radius of the front surface is 1581.451, and the curvature radius of the rear surface is-163.784;
the distance between the fifth lens and the sixth lens is 0.5mm;
the thickness of the sixth lens is 12mm, the curvature radius of the front surface is 226.115, and the curvature radius of the rear surface is-725.238;
the first lens, the second lens, the third lens, the fourth lens, the fifth lens and the sixth lens are all made of fused quartz glass.
2. The ultraviolet lens optical system according to claim 1, further comprising a diaphragm disposed in front of the first lens and a parallel flat plate disposed on a light exit side of the sixth lens.
3. The uv lens optical system of claim 2, wherein the uv lens optical system has a front working distance greater than 35mm and a rear working distance greater than 140mm;
the front working distance is the distance between the diaphragm and the first lens;
the back working distance is the distance between the parallel flat plate and the focal plane of the ultraviolet lens optical system.
4. The ultraviolet lens optical system of claim 1, wherein the ultraviolet lens optical system is an image-side telecentric optical path.
5. An ultraviolet laser scanning lens comprising the ultraviolet lens optical system according to any one of claims 1 to 4.
6. A wafer marking apparatus comprising the ultraviolet laser scanning lens of claim 5.
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US4755030A (en) * | 1985-11-08 | 1988-07-05 | Matsushita Electric Industrial Co., Ltd. | Lens for facsimile or laser printer |
JP5549462B2 (en) * | 2009-08-04 | 2014-07-16 | コニカミノルタ株式会社 | OPTICAL SYSTEM, IMAGE PROJECTION DEVICE AND IMAGING DEVICE EQUIPPED |
JP5510113B2 (en) * | 2010-06-23 | 2014-06-04 | 株式会社ニコン | Photographic lens, optical apparatus equipped with photographic lens, and method of manufacturing photographic lens |
JP6125649B2 (en) * | 2012-10-31 | 2017-05-10 | ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド | Ultraviolet laser marking Fθ lens and laser processing device |
CN109425962A (en) * | 2017-08-30 | 2019-03-05 | 上海微电子装备(集团)股份有限公司 | A kind of F-theta camera lens for laser processing |
CN109633865A (en) * | 2019-01-15 | 2019-04-16 | 淄博海泰新光光学技术有限公司 | A kind of high-precision laser processing telecentricity F-Theta scanning lens |
CN210038305U (en) * | 2019-04-04 | 2020-02-07 | 南京波长光电科技股份有限公司 | 355nm ultraviolet telecentric f-theta lens |
CN211375164U (en) * | 2020-01-19 | 2020-08-28 | 湖北汽车工业学院 | Telecentric F-theta optical lens applied to ultraviolet laser |
CN111123480B (en) * | 2020-01-19 | 2024-08-13 | 湖北汽车工业学院 | Telecentric F-theta optical lens applied to ultraviolet laser |
CN112578538B (en) * | 2020-12-30 | 2022-02-18 | 青岛海泰新光科技股份有限公司 | Telecentric F-Theta scanning lens for blue laser processing |
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