CN114023735A - Power module for hybrid vehicle - Google Patents
Power module for hybrid vehicle Download PDFInfo
- Publication number
- CN114023735A CN114023735A CN202111159033.7A CN202111159033A CN114023735A CN 114023735 A CN114023735 A CN 114023735A CN 202111159033 A CN202111159033 A CN 202111159033A CN 114023735 A CN114023735 A CN 114023735A
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- insulating substrate
- power
- power terminal
- terminal
- power terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
The invention discloses a power module for a hybrid vehicle, which comprises a power module body, wherein the power module body comprises an insulating substrate, and a power terminal, a signal terminal, a thermistor, an insulated gate bipolar transistor and a chip part of a diode which are arranged on a conductive copper layer on the top of the insulating substrate; the power terminals comprise a plurality of groups of input end power terminals and output end power terminals which are respectively arranged on an insulating substrate, the input end power terminals and the output end power terminals of each phase form a group, the input end power terminals and the output end power terminals are connected with the insulating substrate at corresponding positions through forked rectangular array pins, the input end power terminals comprise positive power terminals and negative power terminals which are arranged in a matched mode, and the adjacent positive and negative power terminals are led out by adopting a staggered distribution structure in high-low staggered arrangement; and a layer of injection molding shell is arranged outside the insulating substrate.
Description
Technical Field
The invention relates to the technical field of electronic devices, in particular to a power module for a hybrid vehicle.
Background
The power module is a power driving device combining power electronics and integrated circuit technology, and due to the advantages of high integration level, high reliability and the like, the intelligent power module gains a bigger and bigger market, is particularly suitable for frequency converters and various inverter power supplies of driving motors, and is a power electronic device commonly used by variable-frequency speed regulation, metallurgical machinery, electric traction, servo drive and variable-frequency household appliances. With the development of new energy vehicles and the popularization and application of large areas, a hybrid mode with stronger applicability gradually becomes a trend, a power module with higher reliability and lower stray inductance is developed according to market demands, and the vehicle power module has extremely high requirements on module heat dissipation, internal inductance, structure and reliability and also has strict requirements on volume.
Disclosure of Invention
The invention aims to solve the technical problem of providing a power module for a hybrid vehicle, which has small volume, strong stability and high integration level, aiming at the defects in the prior art.
The power module for the hybrid vehicle comprises a power module body used in the hybrid new energy vehicle, wherein the power module body comprises an insulating substrate, and a power terminal, a signal terminal, a thermistor, an insulated gate bipolar transistor and a diode chip part which are arranged on a conductive copper layer on the top of the insulating substrate; the power terminals comprise a plurality of groups of input end power terminals and output end power terminals which are respectively arranged on two sides of the insulating substrate along the length direction and are matched with each other, the input end power terminal and the output end power terminal of each phase form a group, the input end power terminal and the output end power terminal are connected with the insulating substrate at the corresponding position through forked rectangular array pins, the input end power terminal comprises a positive power terminal and a negative power terminal which are arranged in a matched mode, and a staggered distribution structure with high-low staggered arrangement is adopted between every two adjacent positive and negative power terminals for leading out; the insulation substrate is externally provided with a layer of injection molding shell, and gaps among the chip part, the signal terminal, the power terminal and the thermistor on the insulation substrate are covered with a silica gel filling layer to realize electrical isolation.
Furthermore, the chip part, the signal terminal and the thermistor are all welded on a conductive copper layer of an insulating substrate through soldering, the insulating substrate and the heat dissipation substrate are welded through soldering, and the power terminal is welded on the conductive copper layer of the insulating substrate through ultrasonic welding or soldering; the chips and the power parts of the chips and the corresponding conductive copper layers of the insulating substrate are electrically connected through aluminum wire bonding.
Furthermore, the injection molding shell comprises a shell body with a frame-shaped structure and an upper cover arranged at the top of the shell body, a rectangular groove which corresponds to the power terminal and is used for increasing creepage distance is arranged on the side wall of the shell body, a guide post which penetrates through the heat dissipation substrate is arranged on the shell, and the top height of the guide post is higher than that of the signal terminal.
Furthermore, the power terminal is manufactured in a punch forming mode, the power terminal is made of pure copper or copper alloy materials, and the surface layer of the power terminal is made of bare copper or is electroplated with a layer of gold, nickel or tin materials.
Furthermore, one of SnSb, SnAg, PbSnAg or SnAgCu solders is adopted for soldering, and the soldering temperature is controlled to be between 100 and 400 ℃.
The invention has the beneficial technical effects that: the power terminal is directly injected into the injection molding shell, so that vibration impact resistance and installation stress resistance of the power terminal are effectively improved, and module reliability is improved. Meanwhile, the signal terminals are directly welded on the corresponding conductive copper layers of the insulating substrate, so that the module inductance is reduced, the module volume is reduced, and the module integration level is improved; the outside of the shell of moulding plastics still is provided with the multiplicable creepage distance of rectangular channel, and its is small and integrated degree is high, more suitable application on the new forms of energy that require severer volume and stability mix the automobile.
Drawings
FIG. 1 is a schematic diagram of the circuit structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic bottom view of the present invention;
FIG. 4 is a schematic diagram of the internal layout of the present invention;
FIG. 5 is a schematic diagram of a side view of the power module body of the present invention along the length direction;
FIG. 6 is a schematic diagram of a side view of the power module body of the present invention along the width direction;
fig. 7 is a schematic structural view of a rectangular groove on the housing body according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood by those skilled in the art, the present invention is further described with reference to the accompanying drawings and examples.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "inside", "outside", "lateral", "vertical", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, and thus, should not be construed as limiting the present invention.
As shown in fig. 1 to 7, the power module for a hybrid vehicle according to the present invention includes a power module body used in a hybrid new energy vehicle, the power module body includes an insulating substrate 2a, and a power terminal 3a, a signal terminal 4a, a thermistor 5a, and a chip portion 1a of an insulated gate bipolar transistor and a diode, which are disposed on a conductive copper layer on a top of the insulating substrate 2a, a heat dissipation substrate 8a is disposed at a bottom of the insulating substrate 2a, a plurality of heat dissipation pins are disposed at a bottom of the heat dissipation substrate 8a, and the heat dissipation pins are in a shape of one of a rectangle, a cylinder, a truncated cone, or an elliptic cylinder. The power terminal 3a includes a plurality of groups of input power terminals 31a and output power terminals 32a that set up respectively in insulating substrate 2a along length direction both sides and match each other, and every looks input power terminal 31a and output power terminal 32a constitute a set ofly, and power terminal 3a is total 4 groups or 5 groups, just input power terminal 31a and output power terminal 32a all are connected with the insulating substrate 2a of corresponding position through forked rectangular array foot 33a, and the connection piece of cuboid structure is drawn forth and is connected with the module application end through welding or bolted connection's mode to the other end of input power terminal 31a and output power terminal 32 a.
The power terminal 3a is manufactured by a punch forming mode, the power terminal 3a is made of pure copper or copper alloy materials, and the surface layer of the power terminal 3a is made of bare copper or is electroplated with one of gold, nickel or tin and other weldable metal materials. The input end power terminal 31a comprises a positive power terminal and a negative power terminal which are matched, a staggered distribution structure with staggered height is adopted between two adjacent positive and negative power terminals for leading out, the positive and negative power terminals adopt a laminated structure, and the terminal lamination gap is between 1 and 4 mm; the leading-out ends at the outer side are led out in a staggered distribution mode, and the staggered distance is 1-4 mm. A layer of injection molding shell 7a is arranged outside the insulating substrate 2a, and gaps among the chip part 1a, the signal terminal 4a, the power terminal 3a and the thermistor 5a on the insulating substrate 2a are covered with a silica gel layer to realize electrical isolation.
Referring to fig. 1 to 7, the chip portion 1a, the signal terminal 4a and the thermistor 5a are soldered on a conductive copper layer of an insulating substrate by soldering, the insulating substrate 2a and the heat dissipation substrate 8a are soldered by soldering, the power terminal 3a is soldered on the conductive copper layer of the insulating substrate 2a by ultrasonic welding or soldering, the soldering is performed by using one of Sn-containing solders such as SnSb, SnAg, PbSnAg or SnAgCu, and the soldering temperature is controlled between 100 ℃ and 400 ℃. The chips 1a, the power part of each chip 1a and the corresponding conductive copper layer of the insulating substrate 2a are electrically connected through aluminum wire bonding.
Referring to fig. 1 to 7, the injection molding housing 7a includes a housing body having a frame structure and an upper cover 71a disposed at the top of the housing body, a rectangular groove 6a corresponding to the power terminal 3a for increasing a creepage distance is disposed on a side wall of the housing body, a guide post 9a penetrating through the heat dissipation substrate 8a is disposed on the housing 7a, a top height of the guide post 9a is higher than a top height of the signal terminal, and an included angle between a connection line of the guide post 9a and a long side of the housing body 7a is 30 to 45 degrees.
The power terminal is directly injected into the injection molding shell, so that vibration impact resistance and installation stress resistance of the power terminal are effectively improved, and module reliability is improved. Meanwhile, the signal terminals are directly welded on the corresponding conductive copper layers of the insulating substrate, so that the module inductance is reduced, the module volume is reduced, and the module integration level is improved; the outside of the shell of moulding plastics still is provided with the multiplicable creepage distance of rectangular channel, and its is small and integrated degree is high, more suitable application on the new forms of energy that require severer volume and stability mix the automobile.
The specific embodiments described herein are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (5)
1. The utility model provides a power module for hybrid vehicle, includes the power module body that is used for in the hybrid new energy automobile, its characterized in that: the power module body comprises an insulating substrate, and a power terminal, a signal terminal, a thermistor, an insulated gate bipolar transistor and a chip part of a diode which are arranged on a conductive copper layer on the top of the insulating substrate, wherein a heat dissipation substrate is arranged at the bottom of the insulating substrate; the power terminals comprise a plurality of groups of input end power terminals and output end power terminals which are respectively arranged on two sides of the insulating substrate along the length direction and are matched with each other, the input end power terminal and the output end power terminal of each phase form a group, the input end power terminal and the output end power terminal are connected with the insulating substrate at the corresponding position through forked rectangular array pins, the input end power terminal comprises a positive power terminal and a negative power terminal which are arranged in a matched mode, and a staggered distribution structure with high-low staggered arrangement is adopted between every two adjacent positive and negative power terminals for leading out; the insulation substrate is externally provided with a layer of injection molding shell, and gaps among the chip part, the signal terminal, the power terminal and the thermistor on the insulation substrate are covered with a silica gel filling layer to realize electrical isolation.
2. The power module for a hybrid vehicle according to claim 1, characterized in that: the chip part, the signal terminal and the thermistor are all welded on a conductive copper layer of the insulating substrate through soldering, the insulating substrate and the heat dissipation substrate are welded through soldering, and the power terminal is welded on the conductive copper layer of the insulating substrate through ultrasonic welding or soldering; the chips and the power parts of the chips and the corresponding conductive copper layers of the insulating substrate are electrically connected through aluminum wire bonding.
3. The power module for a hybrid vehicle according to claim 1 or 2, characterized in that: the injection molding shell comprises a shell body with a frame-shaped structure and an upper cover arranged at the top of the shell body, wherein a rectangular groove which corresponds to the position of the power terminal and is used for increasing the creepage distance is arranged on the side wall of the shell body, a guide post which runs through the heat dissipation substrate is arranged on the shell, and the top of the guide post is higher than the top of the signal terminal.
4. The power module for a hybrid vehicle according to claim 3, characterized in that: the power terminal is manufactured in a punch forming mode, the power terminal is made of pure copper or copper alloy materials, and the surface layer of the power terminal is made of bare copper or is electroplated with a layer of gold, nickel or tin materials.
5. The power module for a hybrid vehicle according to claim 2, characterized in that: the tin soldering welding adopts one of SnSb, SnAg, PbSnAg or SnAgCu solders, and the welding temperature is controlled between 100 ℃ and 400 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111159033.7A CN114023735A (en) | 2021-09-30 | 2021-09-30 | Power module for hybrid vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111159033.7A CN114023735A (en) | 2021-09-30 | 2021-09-30 | Power module for hybrid vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114023735A true CN114023735A (en) | 2022-02-08 |
Family
ID=80055371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111159033.7A Pending CN114023735A (en) | 2021-09-30 | 2021-09-30 | Power module for hybrid vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114023735A (en) |
-
2021
- 2021-09-30 CN CN202111159033.7A patent/CN114023735A/en active Pending
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