CN114012249A - Device for longitudinally and invisibly cutting brittle material by multifocal laser and processing method - Google Patents
Device for longitudinally and invisibly cutting brittle material by multifocal laser and processing method Download PDFInfo
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- CN114012249A CN114012249A CN202111215485.2A CN202111215485A CN114012249A CN 114012249 A CN114012249 A CN 114012249A CN 202111215485 A CN202111215485 A CN 202111215485A CN 114012249 A CN114012249 A CN 114012249A
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- brittle material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The invention provides a device and a processing method for stealthy cutting of a brittle material by longitudinal multi-focus laser, comprising a machine tool working platform, an ultrashort pulse laser and a laser beam spatial light modulator, wherein the machine tool working platform is used for installing the brittle material to be cut and enabling the brittle material to be cut to move in the horizontal direction; the laser beam space modulator is used for carrying out space shaping and beam splitting on a laser beam emitted by the ultrashort pulse laser to form ultrashort pulse laser sub-beams with staggered positions in the X or Y direction and different focuses in the Z direction, a plurality of ultrashort pulse laser sub-beams are reflected to the ultrafast laser cutting head through the first reflecting mirror, and the ultrafast laser cutting head focuses the plurality of ultrashort pulse laser sub-beams inside the brittle material to be cut. The invention utilizes the laser beam spatial light modulator to carry out Z-axis beam splitting on the ultrashort pulse laser and cut the brittle material in parallel, thereby realizing the processing efficiency and the processing quality.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a device for longitudinally and invisibly cutting a brittle material by multifocal laser and a processing method.
Background
With the development of the microelectronic industry, devices are more and more miniaturized and portable, and a lot of cracks, damages and residual stress are easy to occur on the cross section, so that the cross section needs to be subjected to post-treatment, such as grinding, polishing, heat treatment and the like, the loss of materials is increased, and the production cost is increased. In the conventional laser cutting, laser is focused on the surface of a material, and due to edge absorption of the laser, micro-cracks or heat affected zones are generated by laser processing. In addition, the material is wasted due to the laser-generated kerf, and the contamination caused by the deposition of the sputtered material on the material surface requires additional subsequent processes for treatment.
At present, the semiconductor processing industry provides a new processing means, namely an ultrafast laser invisible cutting technology, namely a cutting technology which focuses laser beams with high penetration rate inside materials, changes the internal material structure through laser scanning to form a modified layer and then applies external force to the materials to separate the materials. Compared with the traditional laser cutting technology, the laser concealed cutting technology has the advantages that the laser focus is limited in the material, no heat damage is generated on the surface and the bottom surface of the material, the problems of a heat affected zone, micro cracks and the like caused by the traditional laser are effectively solved, meanwhile, the laser focus adopted by the laser concealed cutting technology is extremely small, a cutting channel formed in the material is extremely fine, the processing precision can be greatly improved, and the material waste is avoided. However, in the actual processing process, if a thicker material needs to be processed, multiple times of cutting are needed, and the efficiency is low. Therefore, the problem to be solved urgently in the current semiconductor processing industry is to improve the efficiency of laser invisible cutting.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a device and a processing method for longitudinally and invisibly cutting a brittle material by multifocal laser.
The present invention achieves the above-described object by the following technical means.
A device for longitudinal multifocal laser stealth cutting of brittle materials, comprising:
the machine tool working platform is used for installing the brittle material to be cut and enabling the brittle material to be cut to move in the horizontal direction;
an ultrashort pulse laser;
the laser beam space modulator is used for carrying out space shaping and beam splitting on a laser beam emitted by the ultrashort pulse laser to form ultrashort pulse laser sub-beams with staggered positions in the X or Y direction and different focuses in the Z direction, a plurality of ultrashort pulse laser sub-beams are reflected to the ultrafast laser cutting head through the first reflecting mirror, and the ultrafast laser cutting head focuses the plurality of ultrashort pulse laser sub-beams inside the brittle material to be cut.
Further, the machine tool working platform comprises a first moving platform and a second moving platform, the first moving platform is installed on the bed base, the second moving platform is installed on the first moving platform, the first moving platform is used for enabling the second moving platform to move along the X direction, and the second moving platform is used for enabling the brittle material to be cut to move along the Y direction.
Furthermore, the laser beam spatial light modulator is installed on a modulator installation support, the first reflecting mirror is installed on a cutting head installation support, the ultrafast laser cutting head is fixed on a Z-axis moving platform, the Z-axis moving platform is installed on the cutting head installation support, and the cutting head installation support and the modulator installation support are installed on the bed base.
Furthermore, the ultrashort pulse laser, the laser beam spatial light modulator and the Z-axis moving platform are respectively connected with a control system and are controlled by the control system.
A processing method of a device for longitudinally and invisibly cutting a brittle material by multifocal laser comprises the following steps:
placing a brittle material to be processed on a machine tool working platform;
inputting an output light beam of an ultra-short pulse laser to a laser beam spatial light modulator, wherein the laser beam spatial light modulator shapes and splits the output light beam of the ultra-short pulse laser into ultra-short pulse laser sub-beams with staggered positions in an X or Y direction and different focal points in a Z direction, and a plurality of ultra-short pulse laser sub-beam pairs are focused on a brittle material to be processed;
adjusting the machine tool working platform to enable the focuses of the multiple ultrashort pulse laser photon beams to be positioned inside the brittle material to be processed;
and moving the machine tool working platform in the cutting process, and moving the brittle material to be processed according to the cutting path so that the ultrashort pulse laser sub-beam finishes the cutting of the brittle material.
Furthermore, a CCD camera arranged in the laser beam spatial light modulator is connected with a control system, and the control system adjusts the intensity of the multiple ultra-short pulse laser photon beams according to the feedback of the CCD camera.
Further, the control system obtains a light intensity distribution pixel map of a plurality of ultra-short pulse laser sub-beams through a CCD camera, obtains the light intensity of the plurality of ultra-short pulse laser sub-beams through identifying the pixel map, and calculates the difference value between the light intensity of the plurality of ultra-short pulse laser sub-beams and preset light intensity;
if the difference is more than or equal to 5% of the preset light intensity, the control system controls the laser beam spatial light modulator to readjust the beam splitting; if the difference value is less than 5% of the preset light intensity, the control system controls the laser beam spatial light modulator to focus a plurality of ultra-short pulse laser beam pairs to the brittle material to be processed.
Further, the preset light intensity is an isocandela intensity or an isocandela intensity.
The invention has the beneficial effects that:
1. according to the device and the processing method for stealth cutting of the brittle material by the longitudinal multi-focus laser, the laser beam spatial light modulator is used for splitting the ultrashort pulse laser and cutting the brittle material in parallel, so that both the processing efficiency and the processing quality are achieved.
2. According to the device and the processing method for longitudinally and invisibly cutting the brittle material by the multifocal laser, the high-power laser beam is divided into the ultra-short pulse laser beam with adjustable energy distribution and spatial distribution by the laser beam spatial light modulator according to the difference of the brittle material to be processed, so that the processing process has very good flexibility and designability, high-efficiency high-quality brittle material laser precision processing is realized, and the application range is wider.
Drawings
Fig. 1 is a schematic structural diagram of a longitudinal multifocal laser stealth cutting brittle material according to the present invention.
Fig. 2 is a schematic structural diagram of an internal device of the spatial light modulator for laser beams according to the present invention.
Fig. 3 is a modulation flow chart of the spatial light modulator for laser beams according to the present invention.
FIG. 4 is a schematic diagram of parallel processing of longitudinal multi-focus ultrashort pulse laser sub-beams according to the present invention.
Fig. 5 is a cross-sectional view of the parallel application of the longitudinal equal-power equidistant multifocal ultrashort pulse laser beam to the inside of the brittle material in embodiment 1 of the present invention.
Fig. 6 is a cross-sectional view of parallel application of longitudinal unequal power and unequal distance multifocal ultrashort pulse laser sub-beams to the inside of a brittle material in embodiment 2 of the present invention.
In the figure:
1-an ultrashort pulse laser; 2-laser beam spatial light modulator; 3-a first mirror; 4-ultrafast laser cutting head; 5-Z axis moving platform; 6-a bed body base; 7-a cutting head mounting bracket; 8-modulator mounting bracket; 9-a lathe bed; 10-a first motion platform; 11-a second motion platform; 12-brittle material to be cut; 13-ultrashort pulse laser beam; 14-a control system; 15-a polarizer; a 16-liquid crystal on silicon spatial light modulator; 17-driving the board card; 18-a movable mirror; 19-a second mirror; 20-a CCD camera; 21-optical bench.
Detailed Description
The invention will be further described with reference to the following figures and specific examples, but the scope of the invention is not limited thereto.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1, the device for stealthy cutting of brittle materials by longitudinal multifocal laser comprises a machine tool working platform, an ultrashort pulse laser 1, a laser beam spatial light modulator 2, a second reflecting mirror 3, an ultrafast laser cutting head 4, a Z-axis moving platform 5, a machine tool base 6, a cutting head mounting support 7, a modulator mounting support 8 and a machine tool 9; the lathe bed base 6 is used for providing a supporting function, and the lathe bed 9, the cutting head mounting support 7 and the modulator mounting support 8 are fixedly mounted on the lathe bed base 6. The machine tool working platform is used for installing the brittle material 12 to be cut and enabling the brittle material 12 to be cut to move in the horizontal direction; the ultra-short pulse laser 1 is used for generating laser beams, the laser beams emitted by the ultra-short pulse laser 1 are subjected to spatial shaping and beam splitting through the ultra-short pulse laser beam spatial modulator 2 to form ultra-short pulse laser beams 13 with staggered positions in the X or Y direction and different focal points in the Z direction, a plurality of ultra-short pulse laser beams 13 are reflected to an ultra-fast laser cutting head 4 through a first reflecting mirror 3, and the ultra-short pulse laser beams 13 are focused inside a brittle material to be cut 12 by the ultra-fast laser cutting head 4.
The machine tool working platform comprises a first moving platform 10 and a second moving platform 11, the first moving platform 10 is installed on the machine tool base 6, the second moving platform 11 is installed on the first moving platform 10, the first moving platform 10 is used for enabling the second moving platform to move along the X direction, the second moving platform 11 is used for enabling the brittle material to be cut 12 to move along the Y direction, the movement of the composite board to be cut 12 in the horizontal direction is achieved through the work of the first moving platform 10 and the second moving platform 11, the first moving platform 10 and the second moving platform 11 can control the ultrashort pulse laser beam 13 to move in space relative to the brittle material to be cut 12, the cutting of the fragile material of the ultrashort pulse laser beam is achieved, and the cutting speed is determined by the first moving platform 10 and the second moving platform 11.
The laser beam spatial light modulator 2 is installed on a modulator installing support 8, the first reflecting mirror 3 is installed on a cutting head installing support 7, the ultrafast laser cutting head 4 is fixed on a Z-axis moving platform 5, the Z-axis moving platform 5 is installed on the cutting head installing support 7, and the cutting head installing support 7 and the modulator installing support 8 are installed on a lathe bed base 6. The ultrashort pulse laser 1, the laser beam spatial light modulator 2 and the Z-axis moving platform 5 are respectively connected with a control system 12 and controlled by the control system 12.
As shown in fig. 2, the internal structure of the laser beam spatial light modulator 2, the laser beam spatial light modulator 2 includes an optical platform 21, a polarizer 15, a liquid crystal on silicon spatial light modulator 16, a driving board 17, a second reflector 19, and a CCD camera 20; the laser beam is emitted into a polaroid 15 and a silicon-based liquid crystal spatial light modulator 16 in sequence, and the polaroid 15 adjusts the polarization direction of the laser beam into the polarization direction which can be identified by the silicon-based liquid crystal spatial light modulator 16; the control system 14 loads the beam spatial distribution phase information of the ultrashort pulse laser beam with staggered position in the X or Y direction and different focal point in the Z direction onto the silicon-based liquid crystal spatial light modulator 16 through the driving board card 17 according to the processing material and the process parameters; the liquid crystal on silicon spatial light modulator 16 analyzes the laser beam phase information into beam spatial distribution phase information of the laser beam, and outputs the ultra-short pulse laser beam 13 with a position shift in the X or Y direction and a different focal point in the Z direction. The light beams of the light beam space distribution phase diagram are reflected to a first reflecting mirror 19 through a movable reflecting mirror 18 and then reflected to the CCD camera 20; judging whether the spatial energy distribution of the light beam meets the requirement or not by the CCD camera 20; if the beam spatial energy distribution is not satisfactory, the redirection of the beam to the LCOS spatial light modulator 16 is reset by the control system 14, as shown in FIG. 3. The silicon-based liquid crystal spatial light modulator 16, the driving board card 17 and the ccd camera 20 are all connected with the control system 14 and controlled by the control system 14.
The processing method of the device for stealthy cutting of the brittle material by the longitudinal multi-focus laser comprises the following steps:
placing the brittle material 12 to be processed on a machine tool working platform;
inputting an output light beam of an ultra-short pulse laser 1 to a laser beam spatial light modulator 2, shaping and splitting the output light beam of the ultra-short pulse laser 1 by the laser beam spatial light modulator 2 to form an ultra-short pulse laser beam 13 with staggered position in the X or Y direction and different focal point in the Z direction, connecting a CCD camera 20 built in the laser beam spatial light modulator 2 with a control system 14, and adjusting the intensity of a plurality of ultra-short pulse laser beams 13 by the control system 14 according to the feedback of the CCD camera, wherein the method specifically comprises the following steps:
the control system 14 obtains a light intensity distribution pixel map of the plurality of ultrashort pulse laser sub-beams 13 through the CCD camera 20, the control system 14 obtains the light intensity of the plurality of ultrashort pulse laser sub-beams 13 by recognizing the pixel map, and calculates the difference between the light intensity of the plurality of ultrashort pulse laser sub-beams 13 and a preset light intensity; the preset light intensity is isocandela or isocandela.
If the difference is greater than or equal to 5% of the preset light intensity, the control system 14 controls the laser beam spatial light modulator 2 to readjust the beam splitting; if the difference is less than 5% of the preset light intensity, the control system 14 controls the laser beam spatial light modulator 2 to focus a plurality of ultra-short pulse laser beam pairs 13 on the brittle material 12 to be processed.
Adjusting the machine tool working platform to enable the focuses of the multiple ultrashort pulse laser photon beams 13 to be located inside the brittle material 12 to be processed, as shown in fig. 4; and moving the machine tool working platform in the cutting process, and moving the brittle material 12 to be processed according to the cutting path, so that the ultrashort pulse laser sub-beam 13 finishes the cutting of the brittle material 12.
Example 1:
the device for stealthy cutting of the brittle material by the longitudinal multifocal laser is used for cutting a brittle material plate with the length of 40mm, the width of 40mm and the thickness of 1 mm.
Preparing a brittle material 12 to be processed with the length of 10mm, the width of 10mm and the thickness of 1mm, wherein the brittle material 12 to be processed can be semiconductor materials such as Si, SiC, AlN, GaN, GaAs, diamond, sapphire and the like, and can also be other suitable materials, and clamping the brittle material 12 to be processed on the second moving platform 11. The ultrashort pulse laser 1 is started, the power of the ultrashort pulse laser 1 is set to be 15W, the output laser beam passes through a polarizing film 15 in the laser beam spatial light modulator 2, the control system 14 loads laser sub-beam information with the set interval of 100 micrometers in the X direction and the set interval of 250 micrometers in the Z direction according to materials and processing technology, the sub-beam power is 5W, the laser sub-beam information with the pulse width of 10ps is loaded on the silicon-based liquid crystal spatial light modulator 16 through the driving board card 17, the silicon-based liquid crystal spatial light modulator 16 changes the phase information of the entering light beam, the modulated laser sub-beam is output to the movable reflecting mirror 18 and then is reflected to the CCD camera 20 after passing through the second reflecting mirror 19. The CCD camera 20 receives the light intensity distribution information of the ultra-short pulse laser beam 13, generates a pixel map with grid division, identifies the pixel map by using the control system 14, and judges the difference value of the optical device information with preset isocandela intensity (namely, the light intensity of each beam is 5w, 5w and 5 w); if the actual difference value exceeds 5%, the light beam is guided into the LCOS spatial light modulator 16 again and recalculated through the control system 14; if the actual difference value is less than 5%, the movable reflector 18 is moved away, and the modulated laser sub-beam 13 is output and reflected to the first reflector 3 and then passes through the laser cutting head 4 to be focused on the brittle material 12.
And the Z-axis moving platform 5 drives the ultrafast laser cutting head 4 to move along the Z axis, so that the ultrashort pulse laser sub-beam 13 is completely focused inside the brittle material to be cut 12, and the ultrashort pulse laser sub-beam 13 is positioned at the edge of the brittle material to be cut 12. The layout of the ultra-short pulse laser beam 13 on the brittle material 12 to be cut in the present embodiment is shown in fig. 5. The second moving platform 11 drives the brittle material 12 to be cut to move at the speed of 150mm/s along the positive direction x. The three ultra-short pulse laser beams 12 are used for carrying out invisible cutting in parallel, and brittle materials with the thickness of 1mm can be cut. Therefore, the method for stealthy cutting of the brittle material by the longitudinal multi-focus laser can realize high-efficiency and high-quality cutting of the brittle material.
Example 2:
the device for stealthy cutting of the brittle material by the longitudinal multifocal laser is used for cutting a brittle material plate with the length of 40mm, the width of 40mm and the thickness of 3.5 mm.
Preparing a brittle material 12 to be processed with a length of 10mm, a width of 10mm and a thickness of 3.5mm, wherein the brittle material 12 to be processed can be semiconductor materials such as Si, SiC, AlN, GaN, GaAs, diamond, sapphire and the like, or can be other suitable materials, and clamping the brittle material 12 to be processed on the second motion platform 11. The ultrashort pulse laser 1 is started, the power of the ultrashort pulse laser is set to be 30W, the output light beam passes through a polarizing film 15 in the laser beam spatial light modulator 2, the control system 14 loads laser sub-beam information with the pulse width of 10ps to the silicon-based liquid crystal spatial light modulator 16 through a driving board card 17 at intervals of 100 μm in the X direction and at intervals of 500 μm, 1000 μm and 1500 μm in the Z direction, the power of each sub-beam is 5W, 10W and 15W in sequence, and the modulated laser sub-beam information is output to the movable reflecting mirror 18 through the second reflecting mirror 19 and then reflected to the CCD camera 20. The CCD camera 20 receives the light intensity distribution information of the laser beam 13, generates a pixel map with grid division, the control system 14 identifies the pixel map, and the difference value of the light intensity information with preset unequal light intensity (namely the light intensity of the three beams is 5w, 10w and 15w in sequence) is judged; if the actual difference value exceeds 5%, the light beam is guided into the LCOS spatial light modulator 16 again and recalculated through the control system 14; if the actual difference value is less than 5%, the movable reflector 18 is moved away, and the modulated laser sub-beam 13 is output and reflected to the first reflector 3 and then passes through the laser cutting head 4 to be focused on the brittle material 12.
And the Z-axis moving platform 5 drives the ultrafast laser cutting head 4 to move along the Z axis, so that the ultrashort pulse laser sub-beam 13 is completely focused inside the brittle material to be cut 12, and the ultrashort pulse laser sub-beam 13 is positioned at the edge of the brittle material to be cut 12. The layout of the ultra-short pulse laser beam 13 on the brittle material 12 to be cut in the present embodiment is shown in fig. 6. The second moving platform 11 drives the brittle material 12 to be cut to move at the speed of 150mm/s along the positive direction x. The three ultra-short pulse laser beams 12 are used for carrying out invisible cutting in parallel, and brittle materials with the thickness of 3.5mm can be cut. Therefore, the method for stealthy cutting of the brittle material by the longitudinal multifocal laser can realize high-efficiency and high-quality cutting of the brittle material.
It should be understood that although the present description has been described in terms of various embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and those skilled in the art will recognize that the embodiments described herein may be combined as suitable to form other embodiments, as will be appreciated by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (8)
1. A device for longitudinally and invisibly cutting brittle materials by multi-focus laser, which is characterized by comprising:
the machine tool working platform is used for installing the brittle material (12) to be cut and enabling the brittle material to be cut to move in the horizontal direction;
an ultrashort pulse laser (1);
the laser beam spatial light modulator (2), the laser beam that ultrashort pulse laser (1) sent carries out the space plastic beam splitting through ultrashort pulse laser beam spatial light modulator (2), forms the position on X or Y direction and staggers and the different ultrashort pulse laser beamlet (13) of focus on the Z direction, and the how much ultrashort pulse laser beamlet (13) reflect to ultrafast laser cutting head (4) through first speculum (3), ultrafast laser cutting head (4) with how much ultrashort pulse laser beamlet (13) focus inside waiting to cut brittle material (12).
2. The device for longitudinal multifocal laser stealth cutting of brittle materials according to claim 1, characterized in that said machine tool working platform comprises a first motion platform (10) and a second motion platform (11), said first motion platform (10) being mounted on the bed base (6), said second motion platform (11) being mounted on the first motion platform (10), said first motion platform (10) being used for moving said second motion platform in the X direction, said second motion platform (11) being used for moving the brittle material to be cut (12) in the Y direction.
3. The device for longitudinally and invisibly cutting brittle materials with multifocal laser according to claim 1, characterized in that the laser beam spatial light modulator (2) is installed on a modulator mounting bracket (8), the first reflector (3) is installed on a cutting head mounting bracket (7), the ultrafast laser cutting head (4) is fixed on a Z-axis moving platform (5), the Z-axis moving platform (5) is installed on the cutting head mounting bracket (7), and the cutting head mounting bracket (7) and the modulator mounting bracket (8) are installed on a lathe bed base (6).
4. The device for longitudinally and invisibly cutting the brittle material by the multifocal laser according to claim 1, characterized in that the ultrashort pulse laser (1), the laser beam spatial light modulator (2) and the Z-axis moving platform (5) are respectively connected with a control system (12) and are controlled by the control system (12).
5. The processing method of the device for longitudinal multifocal laser invisible cutting of brittle materials according to claim 1, characterized by comprising the following steps:
placing a brittle material (12) to be processed on a machine tool working platform;
inputting an output light beam of an ultra-short pulse laser (1) to a laser beam spatial light modulator (2), wherein the laser beam spatial light modulator (2) shapes and splits the output light beam of the ultra-short pulse laser (1) into ultra-short pulse laser sub-beams (13) which are staggered in position in an X or Y direction and different in focal point in the Z direction, and a plurality of ultra-short pulse laser sub-beams (13) are focused on a brittle material (12) to be processed;
adjusting the machine tool working platform to enable the focuses of the multiple ultrashort pulse laser photon beams (13) to be positioned inside the brittle material (12) to be processed;
and moving the machine tool working platform in the cutting process, and moving the brittle material (12) to be processed according to the cutting path, so that the ultra-short pulse laser beam (13) finishes the cutting of the brittle material (12).
6. The processing method of the device for stealthy cutting of brittle materials by longitudinal multifocal laser according to claim 5, characterized in that the CCD camera (20) built in the laser beam spatial light modulator (2) is connected with the control system (14), and the control system (14) adjusts the intensity of the plurality of ultrashort pulse laser beams (13) according to the feedback of the CCD camera.
7. The processing method of the device for stealthy cutting of brittle materials by longitudinal multifocal laser according to claim 6, characterized in that said control system (14) obtains a pixel map of light intensity distribution of a plurality of said ultrashort pulse laser sub-beams (13) by means of a CCD camera (20), said control system (14) obtains the light intensity of said plurality of said ultrashort pulse laser sub-beams (13) by identifying said pixel map, and calculates the difference between the light intensity of said plurality of said ultrashort pulse laser sub-beams (13) and a preset light intensity;
if the difference is more than or equal to 5% of the preset light intensity, the control system (14) controls the laser beam spatial light modulator (2) to readjust the beam splitting; if the difference value is less than 5% of the preset light intensity, the control system (14) controls the laser beam spatial light modulator (2) to focus a plurality of ultra-short pulse laser beam pairs (13) on the brittle material (12) to be processed.
8. The processing method of the device for longitudinally stealthily cutting brittle materials by multifocal laser according to claim 7, characterized in that the preset light intensity is an isocandela intensity or a non-isocandela intensity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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