CN114012200A - Integrated circuit board tin soldering device convenient to take and place - Google Patents
Integrated circuit board tin soldering device convenient to take and place Download PDFInfo
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- CN114012200A CN114012200A CN202111391189.8A CN202111391189A CN114012200A CN 114012200 A CN114012200 A CN 114012200A CN 202111391189 A CN202111391189 A CN 202111391189A CN 114012200 A CN114012200 A CN 114012200A
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- tin
- soldering
- circuit board
- rotating rod
- block
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
The invention relates to a soldering device, in particular to a soldering device convenient for taking and placing an integrated circuit board. The technical problem of the invention is that: the soldering tin device which is convenient for taking and placing the integrated circuit board and can be adjusted without a handheld soldering tin tool is provided. The technical implementation scheme of the invention is as follows: a tin soldering device convenient for taking and placing an integrated circuit board comprises a connecting frame, a tin soldering mechanism, a material pushing mechanism and a clamping mechanism, wherein the material pushing mechanism is arranged on one side of the connecting frame; the tin soldering mechanism comprises a tin material frame, a first fixing rod, a welding head and a first spring, wherein an electric heating wire is arranged on the outer wall of the tin material frame, and the welding head is connected to one side inside the tin material frame in a sliding mode. According to the invention, the pressing mechanism is arranged, the first rack drives the second gear to rotate, and the third gear and the second gear drive the tin material frame to move downwards, so that tin flows onto the circuit board, therefore, people do not need to hold the tin material frame to solder the circuit board, and the operation difficulty of people can be reduced.
Description
Technical Field
The invention relates to a soldering device, in particular to a soldering device convenient for taking and placing an integrated circuit board.
Background
An integrated circuit board is a carrier on which an integrated circuit is mounted. Present electronic equipment all has the circuit board, and in the actual production, most electronic component of circuit board all welds above that through the soldering technique, and present soldering tin is mostly that the manual work is held welding tool and is carried out soldering tin, and the soldering tin instrument is heavy, leads to the soldering tin difficulty, and the circuit board has different length, integrated circuit board of thickness specification size, and general soldering tin platform is inconvenient carries out the operation of soldering tin electronic component according to the integrated circuit board of different specification sizes.
Therefore, there is a need to develop a soldering device for conveniently taking and placing an ic board, which does not need a handheld soldering tool and can be adjusted.
Disclosure of Invention
In order to overcome the defects that the prior welding technology needs to manually hold a tin soldering tool to perform tin soldering on a circuit board, the tin soldering tool is heavy, the tin soldering is difficult, and a tin soldering table cannot be adjusted, the technical problems of the invention are as follows: the soldering tin device which is convenient for taking and placing the integrated circuit board and can be adjusted without a handheld soldering tin tool is provided.
The technical implementation scheme of the invention is as follows: a tin soldering device convenient for taking and placing an integrated circuit board comprises a connecting frame, a tin soldering mechanism, a material pushing mechanism and a clamping mechanism, wherein the material pushing mechanism is arranged on one side of the connecting frame, and the clamping mechanism is arranged on one side of the connecting frame;
soldering tin mechanism is equipped with the heating wire including tin material frame, first dead lever, bonding tool and first spring, tin material frame outer wall, and inside one side slidingtype of tin material frame is connected with the bonding tool, and inside one side of tin material frame is connected with first dead lever, is connected with first spring between bonding tool top and the first dead lever upper portion.
More preferably, pushing equipment is including first fixed plate, the second dead lever, first linkage block, promote the handle, the blowing board, second spring and first rack, the bottom is equipped with first fixed plate in the link frame, first fixed plate upper portion symmetry is equipped with the second dead lever, slidingtype connection has first linkage block between second dead lever one side, first linkage block one side is equipped with promotes the handle, it is connected with the blowing board to promote handle upper portion slidingtype, first linkage block both sides all are connected with the second spring with between the second dead lever one side of homonymy, first linkage block top one side is equipped with first rack.
More preferably, clamping mechanism is including the second connecting block, the third dead lever, press from both sides tight piece, the third spring, first sliding block and second sliding block, first connecting block top symmetry is equipped with the second connecting block, second connecting block upper portion one side all is equipped with the third dead lever, the equal slidingtype connection in third dead lever middle part has tight piece, press from both sides the tight piece outside all with be connected with the third spring between the third dead lever outside of homonymy, press from both sides tight piece bottom and all be equipped with first sliding block, first fixed plate inboard is equipped with the second sliding block.
More preferably, still including the pushing down mechanism, the pushing down mechanism is including the second linking bridge, the fourth dwang, the second gear, the fourth dead lever, the fourth spring, third gear and second rack, be connected with the second linking bridge between bottom one side in first fixed plate one side and the linking frame, second linking bridge upper portion one side rotary type is connected with the fourth dwang, fourth dwang one side is connected with the second gear, second linking bridge upper portion one side is equipped with the fourth dead lever, be connected with the fourth spring between tin material frame bottom one side and the second linking bridge, fourth dwang middle part all is connected with the third gear with one side, tin material frame bilateral symmetry is equipped with the second rack.
More preferably, still including adjustment mechanism, adjustment mechanism is including second fixed plate, rotation handle and threaded rod, promotes the inside rotary type in handle one side and is connected with the threaded rod, and the threaded rod top is equipped with the rotation handle, and threaded rod upper portion threaded connection has the second fixed plate.
More preferably, still including placing rosin powder mechanism, place rosin powder mechanism including first linking bridge, powder case, first pivot pole, first single gear and rotate and put the powder cylinder, first fixed plate middle part symmetry is equipped with first linking bridge, is connected with the powder case between the first linking bridge upper portion, and the rotary type is connected with first pivot pole between the first linking bridge upper portion, and first pivot pole one side is connected with first single gear, and first pivot pole middle part is connected with rotates and puts the powder cylinder.
More preferably, still including rabbling mechanism, rabbling mechanism is including bevel gear, the second dwang, the third dwang, belt and stirring piece, first linking bridge upper portion one side rotary type of one side is connected with the second dwang, second dwang one side all is connected with bevel gear with first dwang one side, the inside upside rotary type of powder case is connected with the third dwang, there is the belt through the drive wheel wraparound between third dwang upper portion and the second dwang upper portion, third dwang one side is connected with the stirring piece.
More preferably, the outer wall of the tin frame is provided with an electric heating wire, and the electric heating wire can heat the tin to melt the tin.
Compared with the prior art, the invention has the following advantages: 1. according to the invention, the pressing mechanism is arranged, the first rack drives the second gear to rotate, and the third gear and the second gear drive the tin material frame to move downwards, so that tin flows onto the circuit board, therefore, people do not need to hold the tin material frame to solder the circuit board, and the operation difficulty of people can be reduced.
2. Drive first one-way gear through first rack and rotate for first rotation pole drives to rotate and puts the powder cylinder and rotate 180 degrees, makes to rotate and puts the powder cylinder and transfer the rosin powder to the circuit board on, so, just need not the manual rosin powder of adding of people to the circuit board.
3. First dwang drives bevel gear and rotates, and then drives second dwang, drive wheel and belt and rotate, and then makes the third dwang drive and rotate than the plate for the stirring piece stirs the rosin powder, can avoid the rosin powder to ste for a long time and lead to the caking.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic sectional perspective view of the present invention.
Fig. 3 is a schematic perspective view of a soldering mechanism according to the present invention.
Fig. 4 is a schematic perspective view of the pushing mechanism of the present invention.
Fig. 5 is a schematic perspective view of a first clamping mechanism according to the present invention.
Fig. 6 is a schematic perspective view of a second clamping mechanism of the present invention.
Fig. 7 is a schematic perspective view of an adjusting mechanism according to the present invention.
FIG. 8 is a schematic view of a first three-dimensional structure of the rosin powder placing mechanism of the present invention.
FIG. 9 is a schematic diagram of a second three-dimensional structure of the rosin powder placing mechanism of the present invention.
Fig. 10 is a schematic perspective view of a first stirring mechanism of the present invention.
Fig. 11 is a schematic perspective view of a second stirring mechanism of the present invention.
Fig. 12 is a schematic perspective view of a first pressing mechanism according to the present invention.
Fig. 13 is a schematic perspective view of a second pressing mechanism according to the present invention.
The parts are labeled as follows: 1. a connecting frame, 2, a soldering mechanism, 21, a solder frame, 22, a first fixing rod, 23, a welding head, 24, a first spring, 3, a material pushing mechanism, 31, a first fixing plate, 32, a second fixing rod, 33, a first connecting block, 34, a pushing handle, 35, a material discharging plate, 36, a second spring, 37, a first rack, 4, a clamping mechanism, 41, a second connecting block, 42, a third fixing rod, 43, a clamping block, 44, a third spring, 45, a first sliding block, 46, a second sliding block, 5, an adjusting mechanism, 51, a second fixing plate, 52, a rotating handle, 53, a threaded rod, 6, a rosin powder placing mechanism, 61, a first connecting bracket, 62, a powder box, 63, a first rotating rod, 64, a first one-way gear, 65, a rotating powder placing roller, 7, a stirring mechanism, 71, a bevel gear, 72, a second one-way gear, 73, and a third fixing rod, 74. the belt, 75, stirring piece, 8, pushing down mechanism, 81, second linking bridge, 82, fourth dwang, 83, second gear, 84, fourth dead lever, 85, fourth spring, 86, third gear, 87, second rack.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A tin soldering device convenient for taking and placing an integrated circuit board is shown in figures 1-13 and comprises a connecting frame 1, a tin soldering mechanism 2, a pushing mechanism 3 and a clamping mechanism 4, wherein the pushing mechanism 3 is arranged on the left side of the connecting frame 1, the clamping mechanism 4 is arranged on the left side of the connecting frame 1, a part of the clamping mechanism 4 is connected with a part of the pushing mechanism 3, the tin soldering mechanism 2 comprises a tin material frame 21, a first fixing rod 22, a welding head 23 and a first spring 24, an electric heating wire is arranged on the outer wall of the tin material frame 21, the welding head 23 is connected with the lower side inside the tin material frame 21 in a sliding mode, the first fixing rod 22 is connected with the lower side of the first fixing rod 22 in a sliding mode, and the first spring 24 is connected between the top of the welding head 23 and the upper portion of the first fixing rod 22.
The pushing mechanism 3 comprises a first fixing plate 31, a second fixing rod 32, a first connecting block 33, a pushing handle 34, a discharging plate 35, a second spring 36 and a first rack 37, the bottom of the connecting frame 1 is provided with the first fixing plate 31, the first fixing plate 31 is symmetrically provided with the second fixing rod 32 in the front and back direction on the upper portion, the first connecting block 33 is connected between the left sides of the second fixing rod 32 in a sliding mode, the pushing handle 34 is arranged on the left side of the first connecting block 33, the discharging plate 35 is connected on the upper portion of the pushing handle 34 in a sliding mode, the second spring 36 is connected between the front side and the back side of the right side of the first connecting block 33 and the right side of the second fixing rod 32 on the same side, and the first rack 37 is arranged on the right front side of the top of the first connecting block 33.
Clamping mechanism 4 is including second connecting block 41, third dead lever 42, press from both sides tight piece 43, third spring 44, first sliding block 45 and second sliding block 46, first connecting block 33 top longitudinal symmetry is equipped with second connecting block 41, second connecting block 41 upper portion outside all is equipped with third dead lever 42, third dead lever 42 middle part all is slidingly connected with presss from both sides tight piece 43, press from both sides and be connected with third spring 44 between the third dead lever 42 outside of tight piece 43 outside and homonymy, third spring 44 overlaps respectively in the third dead lever 42 outside of homonymy, it all is equipped with first sliding block 45 to press from both sides tight piece 43 bottom, the left side is equipped with second sliding block 46 in the first fixed plate 31, second sliding block 46 and first sliding block 45 cooperation.
When people need to solder the circuit board, the equipment can be used, people hold the tin material frame 21 manually, firstly, tin is filled in the tin material frame 21, the electric heating wire heats the tin to melt the tin, the circuit board is distributed on the material placing plate 35, the pushing handle 34 is pushed by moving the handle 34 to the right manually, the pushing handle 34 drives the first connecting block 33, the material placing plate 35, the first rack 37 and the circuit board to move to the right, at the moment, the second spring 36 is compressed, the first connecting block 33 further drives the second connecting block 41, the third fixing rod 42, the clamping block 43 and the first sliding block 45 to move to the right, when the first sliding block 45 moves to the right to be separated from the second sliding block 46, the third spring 44 extends to drive the clamping block 43 and the first sliding block 45 to move to the inner side, so that the clamping block 43 clamps the circuit board, the circuit board is prevented from position deviation, and rosin powder is sprinkled on the circuit board, when the circuit board moves to the right below the tin frame 21, people manually move the tin frame 21 down to enable the welding head 23 to be in contact with the circuit board, the welding head 23 moves up, at the moment, the first spring 24 is compressed to enable molten tin to flow down to the circuit board, the bonding capacity is very strong after rosin powder is preheated and molten, the heated tin flows down to be in contact with the rosin powder to melt the rosin powder, soldering is further carried out on the circuit board, after soldering is finished, the tin frame 21 is manually taken away to enable the welding head 23 to be separated from the circuit board, at the moment, the first spring 24 resets to drive the welding head 23 to reset, the welding head 23 enables the bottom of the tin frame 21 to be blocked by the welding head 23, then the pushing handle 34 is released, the second spring 36 resets to drive the first connecting block 33, the pushing handle 34, the discharging plate 35, the first rack 37, the circuit board, the second connecting block 41, the third fixing rod 42, the clamping block 43 and the first sliding block 45 to reset, when the first sliding block 45 moves to the left and contacts with the second sliding block 46, the first sliding block 45 moves to the outside, the third spring 44 resets accordingly, the clamping block 43 is driven to move to the outside and reset, the circuit board is loosened by the clamping block 43, and people take away the circuit board with the soldering finished.
The tin solder material pressing device further comprises a pressing mechanism 8, the pressing mechanism 8 comprises a second connecting support 81, a fourth rotating rod 82, a second gear 83, a fourth fixing rod 84, a fourth spring 85, a third gear 86 and a second rack 87, the second connecting support 81 is connected between the right side of the first fixing plate 31 and the right side of the bottom in the connecting frame 1, the fourth rotating rod 82 is rotatably connected to the left side of the upper portion of the second connecting support 81, the second gear 83 is connected to the front side of the fourth rotating rod 82, the second gear 83 is matched with the first rack 37, the fourth fixing rod 84 is arranged on the inner side of the upper portion of the second connecting support 81, the fourth fixing rod 84 is slidably connected to the upper right side of the tin solder frame 21, the fourth spring 85 is connected between the upper right side of the bottom of the tin solder frame 21 and the second connecting support 81, the third gear 86 is connected to the middle portion and the rear side of the fourth rotating rod 82, the second racks 87 are symmetrically arranged on the front side and the rear side of the right side of the tin solder frame 21, the second racks 87 are all engaged with the third gear 86 on the same side.
When the first rack 37 moves right to be meshed with the second gear 83, the circuit board just moves to be in contact with the welding head 23, the second gear 83 is driven to rotate, the fourth rotating rod 82 drives the third gear 86 to rotate, the second rack 87 is driven to move downwards, the second rack 87 drives the tin frame 21 to move downwards, the fourth spring 85 is compressed at the moment, the welding head 23 moves downwards, the welding head 23 moves upwards under the reaction force of the circuit board, the tin flows downwards onto the circuit board, the circuit board is welded on the circuit board through rosin powder, when the first rack 37 moves leftwards to reset, the gear is driven to rotate reversely, the fourth rotating rod 82 and the third gear 86 are driven to rotate reversely, the second rack 87 and the tin frame 21 move upwards to reset, the fourth spring 85 also resets at the same time, and therefore, people do not need to hold the tin frame 21 by hands to solder the circuit board, the operation difficulty of people can be reduced.
Still including adjustment mechanism 5, adjustment mechanism 5 is including second fixed plate 51, rotation handle 52 and threaded rod 53, and the inside rotary type in promotion handle 34 left side is connected with threaded rod 53, and threaded rod 53 top is equipped with rotation handle 52, and threaded rod 53 upper portion screw thread formula is connected with second fixed plate 51, and second fixed plate 51 bottom is connected with blowing board 35 left side.
People can rotate rotation handle 52 according to the thin and thick degree of circuit board, and then adjust the height degree of blowing board 35, when the circuit board is too thick, rotate rotation handle 52, it drives threaded rod 53 and rotates to rotate handle 52, and then drive second fixed plate 51 and move down, second fixed plate 51 drives blowing board 35 and moves down, and then drive the circuit board and move down, avoid the circuit board to cross the back, lead to follow-up bonding tool 23 can't be located the circuit board top, otherwise, the circuit board is too thin, handle 52 is rotated in the reversal, and then drive the reversal of threaded rod 53, make second fixed plate 51, blowing board 35 and circuit board move up can.
Still including placing rosin powder mechanism 6, place rosin powder mechanism 6 including first linking bridge 61, powder case 62, first rotation pole 63, powder cylinder 65 is put with rotating to first one-way gear 64, the symmetry is equipped with first linking bridge 61 around first fixed plate 31 middle part, be connected with powder case 62 between the first linking bridge 61 upper portion, the rotary type is connected with first rotation pole 63 between first linking bridge 61 upper portion, first rotation pole 63 front side is connected with first one-way gear 64, first one-way gear 64 and first rack 37 cooperation, first rotation pole 63 middle part is connected with rotates powder cylinder 65 of putting, rotate powder cylinder 65 and the cooperation of powder case 62 downside of putting.
People put the rosin powder into the powder bin 62, when the first rack 37 moves rightwards to be meshed with the first one-way gear 64, the first one-way gear 64 is driven to rotate, the first one-way gear 64 drives the first rotating rod 63 to rotate, the first rotating rod 63 drives the rotating powder-putting roller 65 to rotate, so that the rotating powder-putting roller 65 puts the rosin powder onto the circuit board, when the first rack 37 moves rightwards to be separated from the first one-way gear 64, at the moment, the first one-way gear 64, the rotating powder-putting roller 65 and the first rotating rod 63 just rotate 180 degrees, so that people do not need to manually add the rosin powder to the circuit board, when the first rack 37 moves leftwards to reset, the first one-way gear 64 idles.
Still including rabbling mechanism 7, rabbling mechanism 7 is including bevel gear 71, second dwang 72, third dwang 73, belt 74 and stirring piece 75, the first linking bridge 61 upper portion front side rotation of rear side is connected with second dwang 72, second dwang 72 downside and first dwang 63 rear side all are connected with bevel gear 71, two bevel gear 71 intermeshing, the inside upside rotation type of powder case 62 is connected with third dwang 73, it has belt 74 to have the wire-wrap through the drive wheel between third dwang 73 upper portion and the second dwang 72 upper portion, third dwang 73 downside is connected with stirring piece 75.
When first dwang 63 rotated, first dwang 63 drove bevel gear 71 and rotates, and then drove second dwang 72 and rotate, and second dwang 72 drove drive wheel and belt 74 and rotates, and then drove third dwang 73 and rotate, and third dwang 73 drove more the plate and rotates for stirring piece 75 stirs the rosin powder, can avoid the rosin powder to ste for a long time and lead to the caking.
The technical principle of the embodiment of the present invention is described above in conjunction with the specific embodiments. The description is only intended to explain the principles of embodiments of the invention and should not be taken in any way as limiting the scope of the embodiments of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive step, and these embodiments will fall within the scope of the present invention.
Claims (8)
1. A tin soldering device convenient for taking and placing an integrated circuit board is characterized by comprising a connecting frame (1), a tin soldering mechanism (2), a pushing mechanism (3) and a clamping mechanism (4), wherein the pushing mechanism (3) is arranged on one side of the connecting frame (1), and the clamping mechanism (4) is arranged on one side of the connecting frame (1);
soldering tin mechanism (2) is equipped with the heating wire including tin material frame (21), first dead lever (22), bonding tool (23) and first spring (24) including tin material frame (21), tin material frame (21) outer wall, and inside one side sliding connection of tin material frame (21) has bonding tool (23), and inside one side of tin material frame (21) is connected with first dead lever (22), is connected with first spring (24) between bonding tool (23) top and first dead lever (22) upper portion.
2. The soldering tin device for conveniently taking and putting the integrated circuit board as claimed in claim 1, wherein the pushing mechanism (3) comprises a first fixing plate (31), a second fixing rod (32) and a first connecting block (33), promote handle (34), blowing board (35), second spring (36) and first rack (37), the bottom is equipped with first fixed plate (31) in connecting frame (1), first fixed plate (31) upper portion symmetry is equipped with second dead lever (32), sliding connection has first connecting block (33) between second dead lever (32) one side, first connecting block (33) one side is equipped with promotes handle (34), it has blowing board (35) to promote handle (34) upper portion sliding connection, first connecting block (33) both sides all are connected with second spring (36) between second dead lever (32) one side of homonymy, first connecting block (33) top one side is equipped with first rack (37).
3. The soldering tin device for conveniently taking and placing the integrated circuit board as claimed in claim 2, wherein the clamping mechanism (4) comprises a second connecting block (41), a third fixing rod (42), a clamping block (43), a third spring (44), a first sliding block (45) and a second sliding block (46), the second connecting block (41) is symmetrically arranged at the top of the first connecting block (33), the third fixing rod (42) is arranged on one side of the upper part of the second connecting block (41), the clamping block (43) is slidably connected to the middle part of the third fixing rod (42), the third spring (44) is connected between the outer side of the clamping block (43) and the outer side of the third fixing rod (42) on the same side, the first sliding block (45) is arranged at the bottom of the clamping block (43), and the second sliding block (46) is arranged on the inner side of the first fixing plate (31).
4. The integrated circuit board soldering device convenient for taking and placing as claimed in claim 3, further comprising a pressing mechanism (8), wherein the pressing mechanism (8) comprises a second connecting bracket (81), a fourth rotating rod (82), a second gear (83), a fourth fixing rod (84), a fourth spring (85), a third gear (86) and a second rack (87), the second connecting bracket (81) is connected between one side of the first fixing plate (31) and one side of the bottom in the connecting frame (1), the fourth rotating rod (82) is rotatably connected to one side of the upper portion of the second connecting bracket (81), the second gear (83) is connected to one side of the fourth rotating rod (82), the fourth fixing rod (84) is arranged on one side of the upper portion of the second connecting bracket (81), and the fourth spring (85) is connected between one side of the bottom of the solder frame (21) and the second connecting bracket (81), the middle part and one side of the fourth rotating rod (82) are both connected with a third gear (86), and second racks (87) are symmetrically arranged on two sides of the tin material frame (21).
5. The device for soldering the IC board with easy access as claimed in claim 4, further comprising an adjusting mechanism (5), wherein the adjusting mechanism (5) comprises a second fixing plate (51), a rotating handle (52) and a threaded rod (53), the threaded rod (53) is rotatably connected to one side of the pushing handle (34), the rotating handle (52) is arranged at the top of the threaded rod (53), and the second fixing plate (51) is threadedly connected to the upper part of the threaded rod (53).
6. The device for soldering the integrated circuit board convenient to pick and place as claimed in claim 5, further comprising a rosin powder placing mechanism (6), wherein the rosin powder placing mechanism (6) comprises a first connecting support (61), a powder box (62), a first rotating rod (63), a first one-way gear (64) and a rotating powder placing roller (65), the first connecting support (61) is symmetrically arranged in the middle of the first fixing plate (31), the powder box (62) is connected between the upper portions of the first connecting support (61), the first rotating rod (63) is rotatably connected between the upper portions of the first connecting support (61), the first one-way gear (64) is connected to one side of the first rotating rod (63), and the rotating powder placing roller (65) is connected to the middle portion of the first rotating rod (63).
7. The device for soldering the IC board with convenient pick-and-place as claimed in claim 6, further comprising a stirring mechanism (7), wherein the stirring mechanism (7) comprises a bevel gear (71), a second rotating rod (72), a third rotating rod (73), a belt (74) and a stirring block (75), one side of the upper portion of the first connecting bracket (61) on one side is rotatably connected with the second rotating rod (72), one side of the second rotating rod (72) and one side of the first rotating rod (63) are both connected with the bevel gear (71), the upper side of the interior of the powder box (62) is rotatably connected with the third rotating rod (73), the belt (74) is rotatably connected between the upper portion of the third rotating rod (73) and the upper portion of the second rotating rod (72) through a driving wheel, and one side of the third rotating rod (73) is connected with the stirring block (75).
8. A device for soldering IC boards with easy access according to claim 1, characterized in that the outer wall of the solder frame (21) is provided with heating wires which heat the solder to melt it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111391189.8A CN114012200B (en) | 2021-11-23 | 2021-11-23 | Soldering tin device convenient for taking and placing integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111391189.8A CN114012200B (en) | 2021-11-23 | 2021-11-23 | Soldering tin device convenient for taking and placing integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114012200A true CN114012200A (en) | 2022-02-08 |
| CN114012200B CN114012200B (en) | 2023-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111391189.8A Active CN114012200B (en) | 2021-11-23 | 2021-11-23 | Soldering tin device convenient for taking and placing integrated circuit board |
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| JP2005000982A (en) * | 2003-06-16 | 2005-01-06 | Matsushita Electric Ind Co Ltd | Device and method for applying flux, and flux used therefor |
| CN104526101A (en) * | 2014-12-29 | 2015-04-22 | 湖北工业大学 | Press type automatic tin supply electric soldering iron |
| CN107520518A (en) * | 2017-08-28 | 2017-12-29 | 钟光文 | A kind of circuit board soldering tin servicing unit |
| CN107745169A (en) * | 2017-12-01 | 2018-03-02 | 钟苡苇 | A kind of wiring board portable welder |
| CN208427809U (en) * | 2018-06-06 | 2019-01-25 | 河海大学 | A kind of operated electric iron of simplicity |
| CN211759061U (en) * | 2020-03-27 | 2020-10-27 | 胡东辉 | Electric soldering iron |
-
2021
- 2021-11-23 CN CN202111391189.8A patent/CN114012200B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005000982A (en) * | 2003-06-16 | 2005-01-06 | Matsushita Electric Ind Co Ltd | Device and method for applying flux, and flux used therefor |
| CN104526101A (en) * | 2014-12-29 | 2015-04-22 | 湖北工业大学 | Press type automatic tin supply electric soldering iron |
| CN107520518A (en) * | 2017-08-28 | 2017-12-29 | 钟光文 | A kind of circuit board soldering tin servicing unit |
| CN107745169A (en) * | 2017-12-01 | 2018-03-02 | 钟苡苇 | A kind of wiring board portable welder |
| CN208427809U (en) * | 2018-06-06 | 2019-01-25 | 河海大学 | A kind of operated electric iron of simplicity |
| CN211759061U (en) * | 2020-03-27 | 2020-10-27 | 胡东辉 | Electric soldering iron |
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|---|---|
| CN114012200B (en) | 2023-09-15 |
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