CN114005925B - Space-apart disassembling and welding integrated equipment for MiniLED lamp bead chip and use method - Google Patents
Space-apart disassembling and welding integrated equipment for MiniLED lamp bead chip and use method Download PDFInfo
- Publication number
- CN114005925B CN114005925B CN202111235502.9A CN202111235502A CN114005925B CN 114005925 B CN114005925 B CN 114005925B CN 202111235502 A CN202111235502 A CN 202111235502A CN 114005925 B CN114005925 B CN 114005925B
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- Prior art keywords
- main body
- laser
- patch element
- suction pipe
- air blowing
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- 238000003466 welding Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000011324 bead Substances 0.000 title claims abstract description 22
- 238000007664 blowing Methods 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 32
- 238000001723 curing Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 8
- 238000003848 UV Light-Curing Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a separate and detachable welding/integrated device of a MiniLED lamp bead chip and a use method thereof, and relates to the technical field of semiconductor processing equipment. The laser comprises a laser main body, wherein the laser main body is used for heating a patch element to be repaired, a laser head is arranged at the bottom of the laser main body and used for calibrating a laser spot and the patch element to be repaired, and an air suction device is used for transferring the heated patch element and comprises an air suction pipe mounting seat, an air suction pipe clamping block and an air suction pipe main body. Through setting up laser instrument main part, getter device, gas blowing device and height adjusting device, the device is automatic to accomplish the separate empty dismantlement welding/welding to the paster component, and is efficient, and dismantles and peel off/welding process and do not contact with the paster component base plate, just can accomplish once dismantles welding, reduces the damage to the paster component base plate to minimum, adjusts the size of laser facula simultaneously, can adapt to the paster component that the specification is littleer, accords with economic benefits, has wide application prospect.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to space-apart disassembling/welding integrated equipment for a MiniLED lamp bead chip and a use method thereof.
Background
Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion.
The MiniLED lamp bead chip needs to be peeled off from the substrate and is welded with a new lamp bead chip again when repairing, most of conventional peeling equipment is mechanical, some supporting structures are required to be physically peeled off, the efficiency is low, the substrate is easy to damage when peeled off, the substrate and other mounted patch elements are scrapped, and the use requirement of mass production cannot be met.
Disclosure of Invention
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a separate space unpeeing/welding integrated device of MiniLED lamp pearl chip and a use method thereof, comprising:
the laser device comprises a laser main body, a laser head and a laser module, wherein the laser main body is used for heating a patch element to be repaired;
the suction device is used for transferring heated patch elements and comprises a suction pipe mounting seat, a suction pipe clamping block and a suction pipe main body, and one side of the laser main body is provided with the suction pipe main body;
the air blowing device is used for disassembling the heated patch element and comprises an air blowing pipe mounting seat, an air blowing pipe clamping block and an air blowing pipe main body, and one side, far away from the air suction pipe main body, of the laser main body is provided with the air blowing pipe main body;
and the height adjusting device is used for supporting and adjusting the height of the laser main body to realize the adjustment of laser spots.
As a preferable technical scheme of the invention, a chip element substrate is arranged at the bottom of the laser head and is used as a carrier of the chip element.
As a preferable technical scheme of the invention, the two sides of the laser main body are provided with the curing device mounting seats, and the UV curing device is arranged in the curing device mounting seats and used for curing and forming solder paste or glue.
As a preferable mode of the present invention, the air suction pipe body is mounted on an air suction pipe mounting seat through an air suction pipe clamping block, and the air suction pipe mounting seat is arranged at one side of the laser body.
As a preferable technical scheme of the invention, the air blowing pipe main body is arranged on the air blowing pipe installation seat through the air blowing pipe clamping block, and the air blowing pipe installation seat is arranged on one side of the laser main body far away from the air suction pipe installation seat.
The application method of the integrated equipment for separating and disassembling and welding the MiniLED lamp bead chip comprises the following steps:
s1, adjusting the height of a laser main body, and adjusting the height of the laser main body through a height adjusting device to calibrate laser spots and patch elements;
s2, heating the patch element, and starting the laser main body to heat the patch element after the calibration between the laser light spot and the patch element is completed, so that solder paste between the patch element and the patch element substrate is melted;
s3, stripping the patch element, melting solder paste between the patch element and the patch element substrate, and blowing air out through the air blowing pipe body to enable the patch element and the patch element substrate to be disconnected;
s4, transferring the patch element, and after the patch element is disconnected with the patch element substrate, generating negative pressure through the air blowing pipe body to adsorb the released patch element.
As a preferable technical scheme of the invention, the height adjusting device in the S1 is arranged on the bearing device, the height adjusting device comprises a cylinder for adjusting the height of the laser main body, and the cylinder is started to realize the height adjustment of the laser main body.
In a preferred embodiment of the present invention, in S1, after the height adjustment of the laser main body is completed, the outer frame of the chip element substrate is positioned by using a jig.
Compared with the prior art, the invention provides the space-apart disassembling and welding integrated equipment for the MiniLED lamp bead chip and the use method thereof, and has the following beneficial effects:
according to the space-apart disassembling/welding integrated device and the use method of the MiniLED lamp bead chip, the space-apart disassembling/welding of the patch element is automatically completed by arranging the laser main body, the air suction device, the air blowing device and the height adjusting device, the efficiency is high, the disassembling/welding can be completed once without contacting the patch element substrate in the disassembling/peeling process, the damage to the patch element substrate is reduced to the minimum, the size of a laser spot is adjusted, the patch element with smaller specification can be adapted, the economic benefit is met, and the application prospect is wide.
When the device welds the paster component, can produce temperature curve, the temperature can be adjusted according to the difference of product, for example RGB lamp pearl or chip reflection of light degree difference can make the welding temperature different, paster component edge and centre can be different, and aluminium base board and glass substrate's welding temperature also can be different.
Drawings
FIG. 1 is a schematic diagram of a device integrating space-apart disassembling and welding of a MiniLED lamp bead chip and a using method thereof;
FIG. 2 is a front view of a laser main body structure of a device integrating space-apart disassembling and welding of a MiniLED lamp bead chip and a using method thereof;
FIG. 3 is a side view of a laser main body structure of a separate and detachable welding/soldering integrated device for a MiniLED lamp bead chip and a use method thereof;
FIG. 4 is a side view of a laser main body structure of a separate and detachable welding/soldering integrated device for a MiniLED lamp bead chip and a use method thereof;
FIG. 5 is a schematic diagram of a laser main body structure of a device integrating space-apart disassembling and welding of a MiniLED lamp bead chip and a using method thereof;
fig. 6 is an operation flow chart of the integrated device for separating and disassembling/welding the MiniLED lamp bead chip and the use method thereof.
In the figure: 1. a laser body; 11. a laser head; 12. a UV curing device; 13. a curing device mounting base; 2. an air suction device; 21. an air suction pipe mounting seat; 22. a suction pipe clamping block; 23. an air suction pipe body; 3. an air blowing device; 31. a blowing pipe mounting seat; 32. a blowing pipe clamping block; 33. a blowing pipe body; 4. a height adjusting device; 5. a chip element substrate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, a device for separating, detaching and welding a miniled lamp bead chip and a method for using the same, comprising:
the laser device comprises a laser main body 1 for heating a patch element to be repaired, wherein a laser head 11 is arranged at the bottom of the laser main body 1 and used for calibrating a laser spot and the patch element to be repaired.
The suction device 2 is used for transferring heated patch elements, the suction device 2 comprises a suction pipe mounting seat 21, a suction pipe clamping block 22 and a suction pipe main body 23, and the suction pipe main body 23 is arranged on one side of the laser main body 1.
The blowing device 3 is used for disassembling the heated patch element, the blowing device 3 comprises a blowing pipe mounting seat 31, a blowing pipe clamping block 32 and a blowing pipe main body 33, and one side, far away from the air suction pipe main body 23, of the laser main body 1 is provided with the blowing pipe main body 33.
The height adjusting device 4 is used for supporting and adjusting the height of the laser main body 1, so as to adjust laser spots, the height adjusting device 4 is installed on bearing equipment, the bearing equipment adopts a portal frame with double-shaft movement (front, back, left and right) function, and other portal frames with three-shaft or four-shaft movement function can be adopted.
As a specific technical scheme of this embodiment, the bottom of the laser head 11 is provided with the chip component substrate 5, which is used as a carrier of the chip component, and when in use, the chip component substrate 5 is placed under the laser head 11, and is positioned by using a fixture, so that the stability of the chip component substrate 5 is ensured.
As a specific technical scheme of this embodiment, both sides of the laser main body 1 are provided with a curing device mounting seat 13, the inside of the curing device mounting seat 13 is provided with a UV curing device 12 for curing and forming solder paste or glue, and when the solder paste on the patch element substrate 5 and the patch element need to be cured, the UV curing device 12 is started to align with the patch element.
As a specific technical scheme of this embodiment, the air suction pipe main body 23 is mounted on the air suction pipe mounting seat 21 through the air suction pipe clamping block 22, the air suction pipe mounting seat 21 is arranged on one side of the laser main body 1, the air blowing pipe main body 33 is mounted on the air blowing pipe mounting seat 31 through the air blowing pipe clamping block 32, the air blowing pipe mounting seat 31 is arranged on one side of the laser main body 1 far away from the air suction pipe mounting seat 21, two sides of the laser main body 1 are respectively provided with an air cylinder for mounting the air suction pipe mounting seat 21 and the air blowing pipe mounting seat 31, and the air cylinders are used for adjusting the heights of the air blowing pipe mounting seat 31 and the air suction pipe mounting seat 21, so that the distance between the air blowing pipe main body 33 and the air suction pipe main body 23 and the patch elements is adjusted, and the patch elements are stripped and transferred smoothly.
The application method of the integrated equipment for separating and disassembling and welding the MiniLED lamp bead chip comprises the following steps:
s1, adjusting the height of a laser main body 1, adjusting the height of the laser main body 1 through a height adjusting device 4, realizing the calibration between a laser spot and a patch element, adjusting the height of the laser main body 1, and adjusting the size of the laser spot so as to adapt to the size of a lamp bead or a chip of the patch element to be repaired, wherein the light spot can be adjusted to be very small, so that smaller products can be manufactured, and the patch element with the minimum repairing capacity of 2 x 4mil can be repaired;
s2, heating the patch element, and starting the laser main body 1 to heat the patch element after the calibration between the laser spot and the patch element is completed, so that solder paste between the patch element and the patch element substrate 5 is melted;
s3, stripping the patch element, melting solder paste between the patch element and the patch element substrate 5, blowing air out through the air blowing pipe main body 33, enabling the patch element and the patch element substrate 5 to be disconnected, starting an air cylinder corresponding to the air blowing pipe mounting seat 31, enabling the air blowing pipe main body 33 to descend to be close to the patch element, connecting the air blowing pipe main body 33 with air generating equipment (a fan or other air generating equipment) in advance, and conveying air to the air blowing pipe main body 33, so that the patch element can be blown down;
s4, transferring the patch element, after the patch element is disconnected from the patch element substrate 5, generating negative pressure through the air blowing pipe body 33 to adsorb the detached patch element, starting the cylinder corresponding to the air suction pipe body 23, lowering the air suction pipe body 23 to approach the patch element, connecting the air suction pipe body 23 with negative pressure generating equipment (an exhaust fan or other negative pressure equipment) in advance, generating suction force by the air suction pipe body 23, moving to the stripped patch element in cooperation with the portal frame, and adsorbing the patch element for transferring.
As a specific technical scheme of this embodiment, the height adjusting device 4 in S1 is mounted on a carrying device, the carrying device is a gantry with a dual-axis moving (front-back-left-right) function, the inside of the height adjusting device 4 includes a cylinder for adjusting the height of the laser main body 1, and the cylinder is started to implement height adjustment of the laser main body 1.
As a specific technical scheme of this embodiment, in S1, after the height adjustment of the laser main body 1 is completed, a fixture is used to position the outer frame of the patch element substrate 5, and an elastomer (rubber block or other elastic material) is adopted at the connection position of the fixture and the patch element clamping plate, so that the stability of the patch element substrate 5 is mainly ensured, meanwhile, the damage to the patch element substrate 5 is avoided, and the subsequent patch element stripping and transferring work is facilitated.
In summary, the device automatically completes the space-apart disassembling/welding of the patch element by arranging the laser main body 1, the air suction device 2, the air blowing device 3 and the height adjusting device 4, has high efficiency, and the disassembling, stripping and welding process is not contacted with the patch element substrate 5, so that one-time disassembling/welding can be completed, the damage to the patch element substrate 5 is reduced to the minimum, the size of a laser spot is adjusted, the patch element with smaller specification can be adapted, the economic benefit is met, and the application prospect is wide.
It should be noted that in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
- Separate welding/disassembling integrated equipment of MiniLED lamp bead chip, which is characterized by comprising:the laser device comprises a laser main body (1) for heating a patch element to be repaired, wherein a laser head (11) is arranged at the bottom of the laser main body (1) and used for calibrating a laser spot and the patch element to be repaired;the suction device (2) is used for transferring heated patch elements, the suction device (2) comprises a suction pipe mounting seat (21), a suction pipe clamping block (22) and a suction pipe main body (23), and one side of the laser main body (1) is provided with the suction pipe main body (23);the air blowing device (3) is used for disassembling the heated patch element, the air blowing device (3) comprises an air blowing pipe mounting seat (31), an air blowing pipe clamping block (32) and an air blowing pipe main body (33), and one side, far away from the air suction pipe main body (23), of the laser main body (1) is provided with the air blowing pipe main body (33);the height adjusting device (4) is used for supporting and adjusting the height of the laser main body (1) so as to realize adjustment of laser spots;a patch element substrate (5) is arranged at the bottom of the laser head (11) and is used as a carrier of a patch element;the device comprises a laser main body (1), wherein both sides of the laser main body (1) are provided with a curing device mounting seat (13), and a UV curing device (12) is arranged in the curing device mounting seat (13) and used for carrying out curing forming operation on solder paste or glue;the air suction pipe main body (23) is arranged on the air suction pipe installation seat (21) through an air suction pipe clamping block (22), and the air suction pipe installation seat (21) is arranged on one side of the laser main body (1);the air blowing pipe main body (33) is arranged on the air blowing pipe installation seat (31) through the air blowing pipe clamping block (32), and the air blowing pipe installation seat (31) is arranged on one side, far away from the air suction pipe installation seat (21), of the laser main body (1).
- 2. The method for using the integrated device for space-apart disassembling/welding based on the MiniLED lamp bead chip as claimed in claim 1 is characterized by comprising the following steps:s1, adjusting the height of a laser main body (1), and adjusting the height of the laser main body (1) through a height adjusting device (4) to calibrate a laser spot and a patch element;s2, heating the patch element, and starting the laser main body (1) to heat the patch element after the calibration between the laser light spot and the patch element is completed, so that solder paste between the patch element and the patch element substrate (5) is melted;s3, stripping the patch element, melting solder paste between the patch element and the patch element substrate (5), and blowing air out through the air blowing pipe main body (33) so as to disconnect the patch element from the patch element substrate (5);s4, transferring the patch element, and after the patch element is disconnected with the patch element substrate (5), generating negative pressure through the air suction pipe main body (23) to adsorb the released patch element.
- 3. The method for using the integrated device for space-apart disassembling/welding of the MiniLED lamp bead chip according to claim 2, wherein the method comprises the following steps: the height adjusting device (4) in the S1 is arranged on the bearing equipment, the inside of the height adjusting device (4) comprises a cylinder for adjusting the height of the laser main body (1), and the cylinder is started to realize the height adjustment of the laser main body (1).
- 4. The method for using the integrated device for space-apart disassembling/welding of the MiniLED lamp bead chip according to claim 2, wherein the method comprises the following steps: in the step S1, after the height of the laser main body (1) is adjusted, a clamp is used for positioning the outer frame of the patch element substrate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111235502.9A CN114005925B (en) | 2021-10-22 | 2021-10-22 | Space-apart disassembling and welding integrated equipment for MiniLED lamp bead chip and use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111235502.9A CN114005925B (en) | 2021-10-22 | 2021-10-22 | Space-apart disassembling and welding integrated equipment for MiniLED lamp bead chip and use method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114005925A CN114005925A (en) | 2022-02-01 |
| CN114005925B true CN114005925B (en) | 2023-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111235502.9A Active CN114005925B (en) | 2021-10-22 | 2021-10-22 | Space-apart disassembling and welding integrated equipment for MiniLED lamp bead chip and use method |
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| Country | Link |
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| CN (1) | CN114005925B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105892108A (en) * | 2016-04-22 | 2016-08-24 | 深圳市卓茂科技有限公司 | Semi-automatic liquid crystal screen repairing machine |
| CN108237282A (en) * | 2018-01-30 | 2018-07-03 | 深圳市牧激科技有限公司 | Laser sealing-off all-in-one machine and its processing method |
| CN212093528U (en) * | 2019-12-12 | 2020-12-08 | 东信和平科技股份有限公司 | Waste conductive column removing mechanism |
-
2021
- 2021-10-22 CN CN202111235502.9A patent/CN114005925B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105892108A (en) * | 2016-04-22 | 2016-08-24 | 深圳市卓茂科技有限公司 | Semi-automatic liquid crystal screen repairing machine |
| CN108237282A (en) * | 2018-01-30 | 2018-07-03 | 深圳市牧激科技有限公司 | Laser sealing-off all-in-one machine and its processing method |
| CN212093528U (en) * | 2019-12-12 | 2020-12-08 | 东信和平科技股份有限公司 | Waste conductive column removing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114005925A (en) | 2022-02-01 |
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