CN114005763A - Can cooperate mould structure on equipment with compression molding - Google Patents
Can cooperate mould structure on equipment with compression molding Download PDFInfo
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- CN114005763A CN114005763A CN202111444371.5A CN202111444371A CN114005763A CN 114005763 A CN114005763 A CN 114005763A CN 202111444371 A CN202111444371 A CN 202111444371A CN 114005763 A CN114005763 A CN 114005763A
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- carrier
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- mold
- core
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- 238000000748 compression moulding Methods 0.000 title claims description 11
- 239000003292 glue Substances 0.000 claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 230000006835 compression Effects 0.000 claims abstract description 12
- 238000007906 compression Methods 0.000 claims abstract description 12
- 238000000197 pyrolysis Methods 0.000 claims description 15
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims 2
- 239000002390 adhesive tape Substances 0.000 abstract description 25
- 239000000758 substrate Substances 0.000 abstract description 16
- 238000003825 pressing Methods 0.000 abstract description 11
- 238000007789 sealing Methods 0.000 abstract description 10
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 239000000084 colloidal system Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000021384 green leafy vegetables Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a matched die structure on compression forming equipment, and relates to the technical field of dies. The invention comprises an upper base, wherein an upper die base, an upper die core cushion block, an upper die core and a carrier are arranged on the lower side of the upper base, pyrolytic gel is adhered to the lower side of the carrier, and the pyrolytic gel is adhered and fixed on the pyrolytic gel. The invention can seal the packaging glue in the die by the plate without a pressing edge or a space where the auxiliary counter cushion column can not be completely pressed, and carry out the packaging of the upper die and the lower die by pressing, and simultaneously, the plate is fixed by a special adhesive tape (thermal dispergation, UV adhesive tape), and the upper die core group and the single-loop or double-loop vacuum flow channel of the support plate absorb the support plate and the substrate to be smooth and firm, so that the glue can not overflow to the back, the substrate can achieve uniform glue thickness filling without deformation and embrittlement, and after the glue sealing is finished, the glue can be easily removed by utilizing the characteristic of the thermal dispergation adhesive tape to finish the gluing of the substrate and the carrier.
Description
Technical Field
The invention belongs to the technical field of dies, and particularly relates to a matched die structure on compression forming equipment.
Background
At present, in the process of packaging a substrate by using a colloid, a flat convex concave surface, an R-shaped surface, an aspheric surface and a microstructure are arranged on a body, but a laminated edge is required to be closed with a lower mold frame on a plate, so that the colloid can be cured and formed after a required area is heated, when the plate is faced with the plate without the laminated edge and 100% of the whole area of the plate is required to be coated to achieve the purpose of packaging, as shown in figure 4, the current sealing process cannot be finished, or the material is a fragile material, the packaging plate deforms when being pressed, and further the plate is cracked, so that the integrity of plate packaging is damaged, and the glue thickness is not uniformly filled.
Disclosure of Invention
The invention aims to provide a structure of a matched mould on compression forming equipment, which solves the technical problem of uneven filling of the thickness of the existing glue.
In order to achieve the purpose, the invention is realized by the following technical scheme:
a compression molding device capable of matching with a mold structure comprises an upper base, wherein an upper mold base, an upper mold core cushion block, an upper mold core and a carrier are arranged on the lower side of the upper base;
the carrier and the upper mold core are provided with single-loop and double-loop vacuum flow channels, and the carrier can be fixed and adsorbed on the upper mold core through the upper adsorption vacuum flow channel, and the pyrolysis adhesive tape can be completely adsorbed, adhered and leveled on the wafer bonding plate;
the lower die base is installed on the upper side of the lower base, the lower die frame is installed on the lower side of the lower die base, the spring is installed between the lower die base and the lower die frame, the lower die core is arranged inside the lower die frame, and the lower die core is fixed on the lower die base.
Optionally, the upper die base is arranged on the lower side of the upper base and located in the single-loop and double-loop vacuum flow channels, the upper die core cushion block and the upper die core correspond to the single-loop and double-loop vacuum flow channel structures in the same mode, and the upper die core cushion block and the upper die core are arranged on the lower side of the upper die base.
Optionally, the carrier of the single-loop and dual-loop vacuum flow channels is pasted with the wafer plate on the carrier after the pyrolytic tape is pasted, so that the wafer plate is called as a semi-finished module.
Optionally, a lower die base is mounted on the upper side of the lower base, a lower die frame is mounted at a distance from the spring for buffering, and a lower die core is arranged inside the lower die frame and fixed on the lower die base.
Optionally, the release film is stretched and leveled by a tension structure and then pressed and flatly pasted to the outer edge of the lower mold frame.
Optionally, the lower mold vacuum runner sucks and attaches the release film to the lower mold core again for compression and packaging.
Optionally, the moving direction of the upper base is downward moving to the lower base.
Optionally, the lower base is moved in the direction of moving the upper base upward.
Optionally, the wafer plate is adhered to the carrier after the carrier of the single-loop and double-loop vacuum flow channels is adhered with the pyrolytic tape.
The embodiment of the invention has the following beneficial effects:
according to one embodiment of the invention, the board has no pressing edge or is provided with a space in which the auxiliary counter cushion column can not be completely pressed, so that the packaging glue can be sealed in the die, the packaging of the upper die and the lower die is carried out, meanwhile, the board is fixed by a special adhesive tape (thermal release adhesive, UV (ultraviolet) adhesive tape), the upper die core group and the carrier plate single-loop or double-loop vacuum flow channel absorb the carrier plate and the substrate to be flat and firm, the glue is not overflowed to the back, the substrate achieves uniform glue thickness filling without deformation and embrittlement, and the adhesion between the substrate and the carrier can be easily finished by using the characteristic of the thermal release adhesive tape after the glue sealing is finished.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a carrier map assembly structure according to an embodiment of the present invention;
FIG. 2 is a schematic top view of an embodiment of the present invention;
FIG. 3 is a schematic front view of an embodiment of the present invention;
FIG. 4 is a schematic view of a compression type process sealant structure according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a dual-circuit vacuum flow channel structure according to an embodiment of the present invention;
fig. 6 is a schematic perspective view of an embodiment of the present invention.
Wherein the figures include the following reference numerals:
the mould comprises an upper base 1, an upper mould base 2, an upper mould cushion block 3, an upper mould core 4, a carrier 5, a pyrolytic adhesive tape 6, a fragile substrate 7, a lower mould frame 8, a lower mould core 9, a spring 10, a lower mould base 11, a lower base 12, a release film 13, a release film reel set 14 and a tie bar 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
To maintain the following description of the embodiments of the present invention clear and concise, a detailed description of known functions and known components of the invention have been omitted.
Referring to fig. 1-6, in this embodiment, a structure of a compression molding apparatus capable of being matched with a mold is provided, which includes: the device comprises an upper base 1, wherein an upper die base 2, an upper die core cushion block 3, an upper die core 4 and a carrier 5 are arranged on the lower side of the upper base 1, pyrolysis glue 6 is attached to the lower side of the carrier 5, and pyrolysis glue 6 is fixedly attached to the pyrolysis glue 6;
the carrier 5 and the upper mold core 4 are provided with single-loop and double-loop vacuum flow passages, and the carrier can be fixedly adsorbed on the upper mold core 4 through the upper adsorption vacuum flow passage, and the pyrolysis adhesive tape 6 can be completely adsorbed, adhered and leveled on the wafer plate 7;
the upper side of the lower base 12 is provided with a lower die holder 11, the lower side of the lower die holder 11 is provided with a lower die frame 8, a spring 10 is arranged between the lower die holder 11 and the lower die frame 8, a lower die core 9 is arranged in the lower die frame 8, and the lower die core 9 is fixed on the lower die holder 11;
after the release film 13 is stretched and leveled by the tension structure 14, the release film is pressed and flatly pasted on the outer side of the lower die frame 8, glue or a glue discharging cake is coated on the upper part of the lower die core 9, the glue can not directly contact with the die core 9 heated to the temperature enough for curing the glue due to the separation of the tension of the release film 13, and then the release film 13 can be sucked and pasted on the lower die core 9 for compression packaging by controlling and moving the upper base 1 or the lower base 12 to open the lower die vacuum flow channel at proper time.
Simultaneously, the heating devices of the upper base 1 and the lower base 12 heat the whole set of dies to the curing temperature required by the glue, the wafer plate 7 is adhered and assembled on the carrier 5 by single-heat-release glue 6 and double-heat-release glue 6 outside the mechanism, the carrier 5 is provided with a mark for marking the range of the plate which can be adhered during adhering, the adhering and assembling finished carrier 5 is placed on the upper die core 4 in a manual or automatic feeding way, and the vacuum is opened to pass through the cushion block 3 of the upper die core and the upper die core 4; the carrier 5 has single and double-loop vacuum flow passages, and can fix the adsorption carrier on the upper mold core 4 and stick the pyrolysis adhesive tape 6 to the wafer plate 7 simultaneously, so that the adsorption and the lamination can be completely smooth.
After a plate is placed on a carrier with a single-loop and double-loop vacuum channel and is adhered and fixed by using a pyrolysis adhesive tape (UV release adhesive tape), equipment can carry out full immersion type packaging on the plate in a mould, can carry out packaging of thermosetting materials such as epoxy glue, silica gel and the like on a substrate without a packaging process edge, is particularly suitable for fragile materials such as glass plates, ceramic plates and the like and is also suitable for spaces where the plate does not have a pressing edge or an auxiliary counter cushion column cannot be completely pressed on common steel and copper materials, except that packaging glue can be used for carrying out up-down mould pressing and sealing packaging in the mould, and meanwhile, the plate is fixed by using a special adhesive tape (thermal release adhesive tape and UV adhesive tape) without glue overflow to the back surface, so that the deformation and the brittle fracture of the plate are reduced, the uniform glue thickness filling can be achieved, the fragile plate can be prevented after a finished product is taken out, and then the special adhesive tape (thermal release adhesive tape, UV tape) to smoothly release the tackiness to the carrier.
After the release film 13 is stretched and leveled by the tension structure 14, the release film is pressed and pasted to the outer side of the lower mold frame 8, glue or a glue cake is coated on the upper part of the lower mold core 9, the glue can not directly contact with the mold core 9 heated to the temperature enough for curing the glue due to the tension separation of the release film 13, the release film 13 can be sucked and pasted to the lower mold core 9 by controlling and moving the upper base 1 or the lower base 12 and opening the lower mold vacuum flow channel at a proper time, when the carrier 5 sucked and fixed by the upper mold core 4 is moved by the upper base 1 or the lower base 12 to contact the lower mold frame 8, the spring 10 has corresponding force resistance to achieve four-side sealing of the carrier. Continuously move upper 1 or lower base 12, lower die frame 8 allows the space to be reduced by the compression and makes glue evenly spread on the wafer board 7 area, stop when lower die frame 8 is pressed the laminating to lower die holder 11 surface through the removal action, when the required solidification of colloid arrives, move upper or lower base 12 promptly and come the die sinking and take out the carrier group, carry out the required pyrolysis temperature of pyrolysis sticky tape 6 after the carrier group takes out and remove and be stained with the stickness, impaired smooth separation accomplishes the encapsulation operation in carrier 5 when not making this wafer board 7 take out.
The immersion type sealing compound is designed by the structure of a mould taking a compression type packaging forming device as a main body, the principle of designing the carrier can also be applied to the structure of a mould taking an injection type and an injection type sealing compound forming device, when a substrate is made of fragile materials or has no pressing edge, the basic principle is that only a plate is subjected to the pressure of uniform diffusion of a colloid, so that the length and width of the carrier are larger than those of the plate, a large area is the pressing edge, the bearing force given by a machine during pressing can be borne, the necessary condition required by perfect sealing compound is further met, the substrate is wholly immersed in the colloid during packaging, at the moment, a pyrolytic adhesive tape plays a first-stage role, the phenomenon that when the glue is in a liquid state before solidification, excellent filling property is carried out to the back of the substrate, the phenomenon can not only cause the thickness of the colloid, is difficult to separate the plate and the carrier, and is slightly cracked if the crack is not uniform and serious, after the encapsulation of the colloid substrate is completed, the characteristic of the thermosetting plastic is irreversible after reaction and solidification, the pyrolysis adhesive tape can play a second-stage role by utilizing the characteristic, after the plate and the carrier are heated together to a temperature area where the pyrolysis adhesive tape is completely sticky (the pyrolysis temperature can not cause the colloid to deteriorate after solidification), the plate and the carrier can be easily separated, the die structure is a device without a pressing edge for the plate, and various dies and tools of required products can be obtained by injection molding, blow molding, extrusion, die casting or forging and pressing molding, smelting, stamping and other methods in the industrial production of the die.
The plate has no pressing edge or space where the auxiliary counter cushion column can not be completely pressed, so that the packaging glue can be sealed in the die, the upper die and the lower die are pressed for packaging, meanwhile, the plate is fixed by a special adhesive tape (thermal release adhesive, UV adhesive tape), an upper die core group and a single-loop or double-loop vacuum flow channel of the support plate are also used for absorbing the support plate and the substrate to be smooth and firm, glue overflow to the back surface is avoided, the substrate achieves uniform glue thickness filling without deformation and embrittlement, and after the glue sealing is finished, the glue sealing can be easily removed by utilizing the characteristic of the thermal decomposition adhesive tape to finish the gluing of the substrate and the carrier.
Referring to fig. 1, in the present embodiment, an upper mold base 2 located in a single-loop vacuum flow channel and a double-loop vacuum flow channel is installed on the lower side of an upper base 1, an upper mold core cushion block 3 and an upper mold core 4 are the same and correspond to a single-loop vacuum flow channel and a double-loop vacuum flow channel structure, the upper mold core cushion block 3 and the upper mold core 4 are both installed on the lower side of the upper mold base 2, a wafer plate 7 is attached to a carrier 5 after a thermal decomposition tape 6 is attached to the carrier 5, so that a semi-finished module is obtained, a lower mold base 11 is installed on the upper side of a lower base 12, a lower mold frame 8 is installed at a distance from a spring 10, a lower mold core 9 is installed inside the lower mold frame 8 and fixed to the lower mold base 11, a release film 13 is stretched and flattened by a tension structure 14 and then attached to the lower mold frame 8, the lower mold vacuum flow channel sucks and attaches the release film 13 to the lower mold core 9 for compression packaging, the upper base 1 moves downwards to the lower base 12, the moving direction of the lower base 12 is to move the upper base 1 upward, after the carriers 5 of the single-loop and double-loop vacuum flow channels are pasted with the pyrolytic adhesive tapes 6, the wafer plates 7 are pasted on the carriers 5, as shown in fig. 5, the automatic upper plate or the manual upper plate is provided with corresponding single-loop and double-loop vacuum flow channel structures on the upper mold core 4 to vacuum adsorb the non-sealed semi-finished product modules of the carriers 5 and the wafer plates 7 which are assembled by the pyrolytic adhesive tapes 6, and simultaneously, the positioning structure and the function of the upper mold core 4 guide the non-sealed semi-finished product modules into the correct position.
Example 1.1 in this example, four greens columns 15 are installed on the lower side of the upper base 1, which is the necessary mechanism of the transmission system, and the guiding precision and moving stability are ensured when moving the upper and lower bases.
In example 1.2, in this example, the release film 13 is pulled to be flat by the tension structure 14, and other tension mechanisms can be added to improve the uniformity of the release film.
The above embodiments may be combined with each other.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Claims (9)
1. A mateable die structure for a compression forming apparatus comprising: the mold comprises an upper base (1), wherein an upper mold base (2), an upper mold core cushion block (3), an upper mold core (4) and a carrier (5) are arranged on the lower side of the upper base (1), pyrolysis glue (6) is adhered to the lower side of the carrier (5), and the pyrolysis glue (6) is adhered and fixed on the pyrolysis glue (6);
the carrier (5) and the upper die core (4) are provided with single and double-loop vacuum flow passages;
the upper side of the lower base (12) is provided with a lower die holder (11), the lower side of the lower die holder (11) is provided with a lower die frame (8), a spring (10) is arranged between the lower die holder (11) and the lower die frame (8), a lower die core (9) is arranged in the lower die frame (8), and the lower die core (9) is fixed on the lower die holder (11).
2. The structure of the matched mold on the compression forming equipment according to claim 1, wherein the lower side of the upper base (1) is provided with an upper mold base (2) positioned in the single-loop and double-loop vacuum flow channels, the upper mold core cushion block (3) and the upper mold core (4) are the same and correspond to the single-loop and double-loop vacuum flow channel structure, and the upper mold core cushion block (3) and the upper mold core (4) are both arranged on the lower side of the upper mold base (2).
3. The apparatus for compression molding of a mateable mold structure according to claim 1 wherein the carrier (5) of the single and dual circuit vacuum channels is attached with the thermal release tape (6) and then the wafer plate (7) is attached to the carrier (5).
4. The structure of a fittable mold for compression molding apparatus according to claim 1, wherein the lower base (12) is provided at an upper side thereof with a lower die holder (11), the lower die frame (8) is mounted at a buffering space from the spring (10), and the lower die frame (8) is provided at an inner portion thereof with a lower die core (9) fixed to the lower die holder (11).
5. A matched mold structure on a compression molding apparatus as claimed in claim 1, wherein the release film (13) is stretched and flattened by the tension structure (14) and then pressed down and attached to the outer side of the lower mold frame (8).
6. The structure of a matchable mold on a compression molding apparatus according to claim 1, wherein the lower mold vacuum flow channel sucks the release film (13) again to the lower mold core (9) for compression packaging.
7. A fittable mould structure for compression moulding apparatus according to claim 1, characterised in that the upper base (1) is moved downwards to the lower base (12).
8. A fittable mould structure in an apparatus for compression moulding according to claim 1, characterised in that the lower base (12) is moved in the direction of the upper base (1) upwards.
9. The apparatus for compression molding of a mateable mold structure according to claim 1 wherein the carrier (5) is attached with the thermal decomposition tape (6) after completing the single and dual circuit vacuum flow path and the wafer plate (7) is attached to the carrier (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111444371.5A CN114005763A (en) | 2021-11-30 | 2021-11-30 | Can cooperate mould structure on equipment with compression molding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111444371.5A CN114005763A (en) | 2021-11-30 | 2021-11-30 | Can cooperate mould structure on equipment with compression molding |
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