CN114002786B - High-density multi-channel satellite-borne optical transmission equipment - Google Patents
High-density multi-channel satellite-borne optical transmission equipment Download PDFInfo
- Publication number
- CN114002786B CN114002786B CN202111266028.6A CN202111266028A CN114002786B CN 114002786 B CN114002786 B CN 114002786B CN 202111266028 A CN202111266028 A CN 202111266028A CN 114002786 B CN114002786 B CN 114002786B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- optical
- backup
- borne
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to high-density multichannel satellite-borne optical transmission equipment, which comprises a shell, a main printed circuit board and a backup printed circuit board, wherein the printed circuit boards are respectively integrated with a power circuit, a management circuit and a plurality of photoelectric conversion/electro-optical conversion circuits; the shell is also provided with a power connector which is simultaneously connected with the power circuits on the main printed circuit board and the backup printed circuit board and a control connector which is simultaneously connected with the management circuits on the main printed circuit board and the backup printed circuit board; the control connector monitors and detects the state information of each photoelectric conversion/photoelectric conversion circuit of the main printed circuit board and the backup printed circuit board and adjusts the output index through the management circuit, and the control connector also realizes the switching of the power supply circuit of the main printed circuit board and the backup printed circuit board through the management circuit.
Description
Technical Field
The invention belongs to the technical field of satellite-borne optical transmission equipment, and particularly relates to high-density multi-channel satellite-borne optical transmission equipment.
Background
The optical interconnection based on the optical fiber has the advantages of high bandwidth, low loss, no crosstalk, good electromagnetic compatibility, small volume, light weight and the like, obtains wide application exhibition in the aspect of high-speed data transmission, and along with the requirements of increasing the observation range of information-based wars, improving the image resolution, improving the communication bandwidth and lightening the weight and the like, the optical communication technology is gradually applied in the aerospace field so as to improve the anti-interference capability, the communication bandwidth, the signal transmission rate and the like of equipment. However, the new generation satellite communication system is subject to massive information processing, optical transmission channels are increased, optical modules are adopted to realize optical transmission at present, and the transmission density does not meet the use requirements under the requirement of large-scale optical transmission.
Disclosure of Invention
In order to solve the problem that the existing satellite-borne optical transmission equipment is insufficient in transmission density, the invention provides the high-density multi-channel satellite-borne optical transmission equipment with a novel structure, so that the high-density multi-channel satellite-borne optical transmission equipment adopts a separator integrated design, the integration level is improved, the size is effectively reduced, the reliability is further enhanced by arranging independent main backup transmission channels, and the use requirement of a satellite-borne environment is met.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The invention provides high-density multichannel satellite-borne optical transmission equipment, which comprises a shell, a main printed circuit board and a backup printed circuit board, wherein the main printed circuit board and the backup printed circuit board are arranged in the shell in a layered mode, a power supply circuit, a management circuit and a plurality of photoelectric conversion/electro-optical conversion circuits are integrated on the printed circuit boards, two wavelength division multiplexers in the shell are respectively connected with optical interfaces of the photoelectric conversion/electro-optical conversion circuits on the main printed circuit board and the backup printed circuit board, and multiplex optical signals converted by the photoelectric conversion/electro-optical conversion circuits on the main printed circuit board and the backup printed circuit board into one path of output or demultiplex externally input multiplex optical waves into single optical signals and transmit the single optical signals to each photoelectric conversion/electro-optical conversion circuit; the shell is also provided with a power connector which is simultaneously connected with the power circuits on the main printed circuit board and the backup printed circuit board and a control connector which is simultaneously connected with the management circuits on the main printed circuit board and the backup printed circuit board; the control connector monitors and detects the state information of each photoelectric conversion/photoelectric conversion circuit of the main printed circuit board and the backup printed circuit board and adjusts the output index through the management circuit, and the control connector also realizes the switching of the power supply circuit of the main printed circuit board and the backup printed circuit board through the management circuit.
The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
In the high-density multi-channel satellite-borne optical transmission device, the main printed circuit board and the backup printed circuit board are further integrated with a plurality of control circuits, each control circuit respectively controls two paths of photoelectric conversion/electro-optical conversion circuits in an analog serial port mode, and the control circuits receive and execute control commands of the management circuits on the printed circuit boards on which the control circuits are located.
The electro-optical conversion part of the photoelectric conversion/electro-optical conversion circuit comprises a high-speed electrical interface for converting an electrical signal into an optical signal, a laser driver, a laser bias circuit, a laser modulation circuit, an automatic temperature control circuit and a TEC control circuit, wherein the automatic temperature control circuit and the TEC control circuit are connected in series on the laser and used for controlling the internal working temperature of the laser.
In the high-density multi-channel satellite-borne optical transmission device, the control circuit is connected with the laser driver, the limiting amplifier and the automatic temperature control circuit through a serial port, and the output optical power and the optical wavelength of the laser can be adjusted by controlling the amplitude of the output signal; the number of transmission channels of the main printed circuit board and the backup printed circuit board is adjusted by controlling whether the laser emits light or not.
According to the high-density multi-channel satellite-borne optical transmission equipment, the heat dissipation structures for realizing heat transfer are arranged between the main printed circuit board and the shell, and between the standby printed circuit board and the shell.
In the high-density multi-channel satellite-borne optical transmission device, the heat dissipation structure includes a heat dissipation plate for pressing the optical device and the heating device in the electrical/electro-optical conversion circuit onto the printed circuit board, and a heat conduction rubber pad for realizing heat conduction between the heat dissipation plate and the optical device, between the heating device and the casing.
According to the high-density multi-channel satellite-borne optical transmission equipment, one side, deviating from the printed circuit board, of the heat dissipation plate is provided with the step-shaped groove for the optical fibers to penetrate through, and the middle of the step-shaped groove is provided with the through hole for the optical fibers to penetrate through.
In the high-density multi-channel satellite-borne optical transmission device, when the printed circuit board in the housing and the optical fiber of the wavelength division multiplexer are in butt joint, a flexible board strip technology is firstly adopted to synthesize multi-channel 12-core/24-core high-density micro optical fiber elastic contact elements, and then a micro connector is adopted to realize butt joint of the two high-density micro optical fiber elastic contact elements.
The casing form with lower casing lock by last casing wherein, and go up casing and lower casing and be the stable triangle state of constituteing by three face.
According to the high-density multi-channel satellite-borne optical transmission equipment, the electromagnetic shielding resistance is enhanced at the joint of the upper shell and the lower shell in a mode that the groove and the protrusion are matched or the surrounding edge is arranged on the outer side of the contact surface at one end of the upper shell and the lower shell.
Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the invention can achieve considerable technical progress and practicability, has wide industrial utilization value and at least has the following advantages:
the high-density multi-channel satellite-borne optical transmission design adopts a double-layer board design for improving the density, each printed board realizes complete and independent functions, one printed board is a main backup channel, the other printed board is a backup channel, the two printed boards are physically separated and double backed up, no single point exists, and the reliability and the maintainability are improved.
The laser, the laser driver, the laser bias circuit, the laser modulation circuit, the automatic temperature control circuit, the TEC controller circuit, the detector, the limiting amplifier, the control circuit, the management circuit, the power supply circuit and the high-speed electrical interface are directly integrated on the printed board, multi-channel transmission is realized, multiplexing is carried out through the wavelength division multiplexer to form multiplexing optical transmission, and the transmission equipment is small in size and high in density.
The upper shell and the lower shell respectively form a stable triangular state by three surfaces, so that the matching surface is reduced, the thermal resistance is reduced, the heat conduction in a vacuum environment is facilitated, the visual degree is high in the assembly process, and the assembly convenience is improved.
The invention adopts the optical flexible plate ribbon combination technology to combine and combine multiple paths of optical fibers into multiple paths of 12-core/24-core high-density micro optical fiber elastic contact elements, and then uses the micro connector to realize the butt joint of two high-density micro optical fiber elastic contact elements.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a high-density multi-channel satellite-borne optical transmission device according to the present invention;
FIG. 2 is a cross-sectional view of the high-density multi-channel satellite-borne optical transmission device of the present invention;
FIG. 3 is a schematic view of an upper housing of the high-density multi-channel satellite-borne optical transmission apparatus of the present invention;
FIG. 4 is a schematic view of a lower housing of the high-density multi-channel satellite-borne optical transmission apparatus of the present invention;
FIG. 5 is a schematic view of a heat dissipation portion of the high-density multi-channel satellite-borne optical transmission apparatus of the present invention;
fig. 6 is a schematic diagram of a heat dissipation plate structure of the high-density multi-channel satellite-borne optical transmission device according to the present invention.
FIG. 7 is a functional block diagram of the high-density multi-channel satellite-borne optical transmission apparatus of the present invention;
fig. 8 is a working schematic diagram of the photoelectric conversion/electro-optical conversion circuit of the high-density multi-channel satellite-borne optical transmission device.
[ description of main element symbols ]
1: shell body
2: electrical connector with improved contact arrangement
3: optical fiber connector
4: power supply connector
5: printed circuit board
6: wavelength division multiplexer
7: photoelectric conversion/photoelectric conversion circuit
8: heat radiation structure
9: heat radiation plate
10: heat-conducting rubber pad
11: upper shell
12: lower casing
13: optical device
14: heating element
15: surrounding edge
16: projection
17: groove
18: support column
19: fixing bolt
20: trough
21: control connector
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be given to specific embodiments, structures, features and effects of a high-density multi-channel satellite-borne optical transmission device according to the present invention with reference to the accompanying drawings and preferred embodiments.
Please refer to fig. 1-8, which are schematic structural diagrams of various parts of the high-density multichannel satellite-borne optical transmission device of the present invention, the transmission device includes a housing 1 and a printed circuit board 5 located in the housing 1, the printed circuit board 5 is integrated with multiple photoelectric conversion/electro-optical conversion circuits 7 for realizing conversion between optical signals and electrical signals, the printed circuit board 5 integrated with the photoelectric conversion/electro-optical conversion circuits 7 has two blocks, which are layered in the housing 1, the two printed circuit boards 5 and the circuits integrated thereon are completely identical and can realize complete and independent functions, one block is a main backup channel, and the other block is a backup channel, which are physically separated, double backup and have no single point, thereby improving reliability and maintainability.
The optical signal output by the optical interface of the single-channel photoelectric conversion/electro-optical conversion circuit 7 on the printed circuit board 5 is the optical signal with fixed wavelength, in order to reduce the number of optical fibers in the link and optimize the system transmission architecture, the shell 1 of the invention is also internally provided with a wavelength division multiplexer 6 for multiplexing the multi-channel optical signal converted by the printed circuit board 5 of the main backup channel into one output and another wavelength division multiplexer 6 for multiplexing the multi-channel optical signal converted by the printed circuit board 5 of the backup channel into one output.
That is, the optical interfaces of the photoelectric conversion/electro-optical conversion circuit 7 on the printed circuit board 5 of the main channel and the backup channel are respectively connected to a wavelength division multiplexer 6, the multiple optical signals on the printed circuit board are multiplexed into one path for transmission through the wavelength division multiplexer 6, and the interaction with the external optical signals is realized through the optical fiber connector 3 fixed on the shell 1. The optical fiber connector is characterized in that the shell 1 is provided with a plurality of optical fiber connectors 3, and two optical fiber connectors 3 connected with one wavelength division multiplexer 6 are respectively used for realizing the output of optical signals multiplexed into one path and the input of external multiplexing optical waves. The multiplex light wave input from outside is demultiplexed into single light by the wavelength division multiplexer 6, and then transmitted to the printed circuit board for photoelectric conversion and converted into electric signal for output. The housing 1 of the present invention is also provided with a spare fiber optic connector 3. The wavelength division multiplexer 6 of the present invention adopts an integrated design, and integrates multiplexing and demultiplexing to reduce the size.
The housing 1 is also provided with two electrical connectors 2 which are connected to high-speed electrical interfaces of photoelectric/electro-optical conversion circuits 7 integrated on the upper and lower printed circuit boards 5, respectively.
The shell 1 is provided with a power interface 4 for providing power and a management connector 21 for monitoring and controlling the states of the main channel and the backup channel.
Due to the high power and heat dissipation of the optical devices in the electrical/electro-optical conversion circuit 7, the heat needs to be efficiently conducted to the housing when used in a satellite environment. In order to solve the problem, a heat dissipation structure 8 for realizing the support of the two printed circuit boards 5 in the shell 1 is also arranged between the printed circuit boards 5 and the shell 1, the heat dissipation structure 8 comprises a heat dissipation plate 9 and a heat conduction rubber mat 10, wherein the heat dissipation plate 9 is positioned between the inner wall of the shell 1 and an optical device 13 (such as a laser and a detector) and a heating device 14 (such as a laser driver) in the electric conversion/electro-optical conversion circuit 7, and not only can the optical device 13 and the heating device 14 be tightly pressed on the printed circuit boards to enhance the fixation thereof, so that the optical device meets the mechanical property requirement of a satellite-borne environment; and the heat emitted from the optical device 13 and the heat generating device 14 can be transferred to the housing 1, thereby accelerating the heat dissipation of the printed circuit board. And heat conducting rubber pads 10 are arranged between the heat radiating plate 9 and the shell 1 and between the optical device 13 and the heating device 14 so as to enhance the heat conducting effect.
In the embodiment of the present invention, a groove 20 for passing an optical fiber is further provided on a side of the heat dissipation plate 9 away from the printed circuit board 5, and a through hole for passing an optical fiber to the printed circuit board side is further provided on the heat dissipation plate 9. In the embodiment of the present invention, the groove 20 on the heat dissipation plate 9 is a stepped groove, and a through hole for passing through an optical fiber is formed in the middle of the stepped groove. The design of the stepped groove can enable a large number of optical fibers to smoothly pass through the heat dissipation plate, and avoid the optical fibers from being excessively bent and damaged due to small space. In order to keep the contact area of the heat dissipation plate and the shell and ensure that heat is effectively conducted to the shell, the width of the stepped groove is as small as possible.
In order to realize the connection of the photoelectric conversion/photoelectric conversion circuit and the wavelength division multiplexer 6, a large number of optical fibers are led out for interconnection, an optical flexible plate ribbon combining technology is adopted, the multi-path optical fibers at the printed circuit board end and the wavelength division multiplexer end are combined to form a multi-path 12-core/24-core high-density micro optical fiber elastic contact element, and then a micro connector is used for realizing the butt joint of the two high-density micro optical fiber elastic contact elements.
In the embodiment of the invention, after the two printed circuit boards 5 are fixed at intervals by the fixing bolts 19, the two printed circuit boards are supported and fixed on the supporting columns 18 in the shell. The heat dissipation structure 8 can realize heat dissipation in the housing and enhance the fixation of the printed circuit board 5 and the integrated circuit thereon in the housing.
The photoelectric conversion/photoelectric conversion circuit 7 comprises an photoelectric conversion part and a photoelectric conversion part, wherein the photoelectric conversion part comprises a high-speed electrical interface, a laser driver, a laser bias circuit and a laser modulation circuit, the high-speed electrical interface is connected with an electrical connector 2 on a shell 1 and receives a high-speed electrical signal transmitted from the outside, the input end of the laser driver receives the high-speed electrical signal, and a bias current output by the laser driver is connected with the laser through the laser bias circuit and drives the laser to emit light; the modulation signal output by the laser driver is connected with the laser through the laser modulation circuit, the electrical signal is modulated on the output light in an amplitude modulation mode, the output end of the laser is connected with the wavelength division multiplexer 6, and the light integrated by the wavelength division multiplexer is output to the outside through the optical fiber connector 3, so that the conversion of the electrical signal to the optical signal is completed.
In the embodiment of the invention, the electro-optical conversion part further comprises an automatic temperature control circuit and a TEC control circuit, the output end of a temperature sensor in the laser is connected with the automatic temperature control circuit, the output end of the automatic temperature control circuit is connected with the TEC control circuit, and the output end of the TEC control circuit is connected with the laser. The automatic temperature control circuit and the TEC control circuit are used for controlling the internal working temperature of the laser, so that the stability of the output light wavelength of the laser is ensured, and the wavelength interval can reach 200GHz.
The photoelectric conversion part comprises a detector and a limiting amplifier, wherein the input end of the detector is connected with a wavelength division multiplexer 6, the optical signal transmitted by the optical fiber connector 3 is received and demultiplexed through the wavelength division multiplexer, the optical signal is converted into an electric signal, the electric signal is output to the limiting amplifier after being subjected to primary amplification, the electric signal is subjected to secondary amplification and shaping through the limiting amplifier, and finally a high-speed differential signal is output through the electric connector 2, so that the conversion from the optical signal to the electric signal is completed.
In the embodiment of the invention, the photoelectric conversion/photoelectric conversion circuit 7 has 8 circuits, the transmission rate of the photoelectric conversion part reaches 10.3125Gbps, the master backup has 16 circuits in total, and 165G transmission capacity is realized.
In order to improve the integration level, a plurality of control circuits for controlling the photoelectric conversion/electro-optical conversion circuits 7 are further integrated on the printed circuit board 5, each control circuit respectively controls two paths of photoelectric conversion/electro-optical conversion circuits 7 in an analog serial port mode, and the printed circuit board 5 minimizes a circuit unit of multi-channel optical transmission realized by the multi-path photoelectric conversion/electro-optical conversion circuits 7 according to two channels through the multi-path control circuits on the printed circuit board, so that the integration level is improved. In the embodiment of the present invention, each printed circuit board 5 is provided with 4 control circuits, and the 4 control circuits are used for controlling 8 photoelectric conversion/electro-optical conversion circuits 7.
The control circuit is connected with the laser driver, the limiting amplifier and the automatic temperature control circuit through a serial port to control the amplitude of the output signal, so that the output optical power and the optical wavelength of the laser can be adjusted, the laser can be controlled to emit light, and the number of product transmission channels can be changed through configuration, so that the power consumption under different application conditions is reduced. The control circuit is connected with each part to enable, can design the enabling time sequence of a product, effectively reduces overshoot current, improves working stability, reduces the requirement on a power supply system, and improves product adaptability.
The printed circuit board 5 is further integrated with a power circuit and a management circuit, wherein the power circuit is used for providing power for the electro-optical conversion/photoelectric conversion circuit 7 and the control circuit, and the power circuit can process a secondary power supply provided by the satellite-borne equipment and has a main backup power supply switching function. The power circuits of the two printed circuit boards 5 are connected with the same power connector on the shell 1, and the switching of the power supplies of the main printed circuit board and the standby printed circuit board is realized through the power circuits.
The management circuit is used for collecting state information of each photoelectric conversion/photoelectric conversion circuit and each control circuit, packaging and processing the state information, reporting the state information through a serial port, detecting and reporting the working temperature, the working voltage, the laser configuration parameter, the laser luminous power and the detector receiving optical power in the equipment, and providing detailed parameters for system health management; meanwhile, the management circuit can issue control commands to each photoelectric conversion/electro-optical conversion circuit, the control circuit and the power supply circuit through the serial port to adjust output indexes and switch off channels.
In the embodiment of the present invention, the housing 1 is formed by fastening an upper housing 11 and a lower housing 12, the upper housing 11 and the lower housing 12 are both in a stable triangular state composed of three surfaces, wherein the upper housing 1 includes an upper surface, a rear panel and a left side panel; the lower case 12 includes a lower bottom surface, a front panel and a right side plate, wherein the front panel and the right side surface are required to be mounted with connectors. Since the upper case 11 is in a stable triangular state, is firm and stable, and has a large surface area, since there is no need to fix a connector and only plays a role of heat conduction, the inside of the product is assembled before the upper case is assembled, and the assembly is performed as the last step. The three surfaces of the lower shell form a stable triangular state, the lower bottom surface is tightly attached to the product mounting plate, and heat can be directly conducted to the product mounting plate through the lower bottom plate.
The heat of the photoelectric conversion/photoelectric conversion circuit 7 distributed on the main printed circuit board and the backup printed circuit board in high density is conducted and radiated through the upper surface of the upper shell 11 and the lower surface of the lower shell 12 of the product respectively.
The joint of the upper shell 11 and the lower shell 12 is provided with a mechanical structure for improving the electromagnetic shielding resistance of the product. Because the front panel and the right side board of casing need install the connector down, and the connector is the installation behind the board, have the requirement to installing the panel thickness to combine the mounted position of connector, can't realize the electromagnetic shielding nature of product through mechanical structure on the casing down, only can increase the arch on the upper cover plate and realize the electromagnetic shielding. That is, the present invention can enhance the electromagnetic shielding resistance at the junction of the upper surface and the front panel and the right side by providing the outer edge of the junction of the upper surface of the upper case 11 and the lower case 12 with the surrounding edge 15 for blocking the outside of the junction of the upper surface and the front panel and the right side panel, and the surrounding edge 15.
The electromagnetic shielding resistance is realized at other joint positions of the upper shell and the lower shell through the matching of the grooves and the protrusions. Specifically, the rear edge of bottom surface and the rear edge of left edge and right side board all are equipped with recess 17 down, the relevant position of left side board and rear panel be equipped with the arch 16 of this recess adaptation, the anti electromagnetic shielding nature of linking department is realized through the cooperation of arch 16 and recess 17 between left side board, right side board, rear panel and the bottom surface down. The upper housing 11 and the lower housing 12 are fixed by the connection of lugs provided thereon with screw holes.
The invention is different from the single-layer board design of the common satellite-borne equipment, the high-density multi-channel satellite-borne optical transmission is designed to improve the density, the double-layer board design is adopted, each printed board realizes the complete and independent functions, one is a main channel, the other is a backup channel, the physical separation and double backup are realized, the single point is not available, and the reliability is improved. The product has maintainability, and when any one of the main and spare printed board parts is damaged, the quick replacement can be carried out.
Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.
Claims (10)
1. A high-density multi-channel satellite-borne optical transmission device is characterized by comprising a shell, a main printed circuit board and a backup printed circuit board which are arranged in the shell in a layered mode, wherein a power supply circuit, a management circuit and a plurality of photoelectric conversion circuits/photoelectric conversion circuits are integrated on the printed circuit boards; the shell is also provided with a power connector which is simultaneously connected with the power circuits on the main printed circuit board and the backup printed circuit board and a control connector which is simultaneously connected with the management circuits on the main printed circuit board and the backup printed circuit board; the control connector monitors and detects the state information of each photoelectric conversion/photoelectric conversion circuit of the main printed circuit board and the backup printed circuit board and adjusts the output index through the management circuit, and realizes the switching of the power supply circuit of the main printed circuit board and the backup printed circuit board through the management circuit.
2. The high-density multi-channel satellite-borne optical transmission equipment according to claim 1, wherein a plurality of control circuits are further integrated on the main printed circuit board and the backup printed circuit board, each control circuit respectively controls two paths of photoelectric conversion/photoelectric conversion circuits in an analog serial port mode, and the control circuits receive and execute control commands of the management circuits on the printed circuit boards on which the control circuits are located.
3. The high-density multi-channel satellite-borne optical transmission device according to claim 2, wherein the electro-optical conversion part of the electro-optical conversion/electro-optical conversion circuit comprises a high-speed electrical interface for converting an electrical signal into an optical signal, a laser driver, a laser bias circuit and a laser modulation circuit, and further comprises an automatic temperature control circuit and a TEC control circuit which are connected to the laser in series and used for controlling the internal operating temperature of the laser.
4. The high-density multi-channel satellite-borne optical transmission equipment according to claim 3, wherein the control circuit is connected with the laser driver, the limiting amplifier and the automatic temperature control circuit through serial ports, and the output optical power and the optical wavelength of the laser can be adjusted by controlling the amplitude of the output signal; the number of transmission channels of the main printed circuit board and the backup printed circuit board is adjusted by controlling whether the laser emits light or not.
5. The high-density multi-channel satellite-borne optical transmission device according to claim 1, wherein a heat dissipation structure for realizing heat transfer is arranged between the main printed circuit board and the standby printed circuit board and the shell.
6. The high-density multi-channel satellite-borne optical transmission equipment according to claim 5, wherein the heat dissipation structure comprises a heat dissipation plate for pressing the optical device and the heating device in the electrical/electro-optical conversion circuit onto the printed circuit board, and a heat conduction rubber pad for realizing heat conduction between the heat dissipation plate and the optical device, between the heat dissipation plate and the casing, and between the heat dissipation plate and the optical device, between the heat dissipation plate and the casing.
7. The high-density multi-channel satellite-borne optical transmission equipment according to claim 6, wherein a side of the heat dissipation plate, which faces away from the printed circuit board, is provided with a stepped groove for passing through the optical fiber, and a through hole for passing through the optical fiber is formed in the middle of the stepped groove.
8. The high-density multi-channel satellite-borne optical transmission equipment according to claim 7, wherein when the optical fibers on the printed circuit board and the wavelength division multiplexer are butted, a flexible board ribbon combining technology is adopted to synthesize multiple 12-core/24-core high-density micro optical fiber elastic contact elements, and then a micro connector is adopted to realize the butting of the two high-density micro optical fiber elastic contact elements.
9. The high-density multi-channel satellite-borne optical transmission device according to claim 1, wherein the housing is formed by buckling an upper housing and a lower housing, and the upper housing and the lower housing are in a stable triangular state consisting of three surfaces.
10. The high-density multi-channel satellite-borne optical transmission device according to claim 9, wherein the upper housing and the lower housing are enhanced in electromagnetic shielding resistance at the joint by matching grooves and protrusions or arranging a surrounding edge outside the contact surface at one end of the upper housing and the lower housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111266028.6A CN114002786B (en) | 2021-10-28 | 2021-10-28 | High-density multi-channel satellite-borne optical transmission equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111266028.6A CN114002786B (en) | 2021-10-28 | 2021-10-28 | High-density multi-channel satellite-borne optical transmission equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114002786A CN114002786A (en) | 2022-02-01 |
| CN114002786B true CN114002786B (en) | 2023-04-18 |
Family
ID=79924847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111266028.6A Active CN114002786B (en) | 2021-10-28 | 2021-10-28 | High-density multi-channel satellite-borne optical transmission equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114002786B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101895337A (en) * | 2010-07-07 | 2010-11-24 | 东莞市铭普实业有限公司 | Double-fiber hot backup radio-frequency intelligent optical module |
| CN102148678A (en) * | 2011-03-29 | 2011-08-10 | 中航光电科技股份有限公司 | Dual-path automatic full-redundancy transparent light transmission system |
| CN207081862U (en) * | 2017-03-31 | 2018-03-09 | 武汉博昇光电股份有限公司 | A kind of multichannel integrated module of optical transceiver |
| CN111061018A (en) * | 2018-10-16 | 2020-04-24 | 上海欣诺通信技术股份有限公司 | Optical transmission apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203859769U (en) * | 2014-04-08 | 2014-10-01 | 国家电网公司 | Multi-wavelength isolating optical switch device of process layer of intelligent transformer station |
| CN113114367B (en) * | 2021-03-30 | 2023-12-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Modularized high-density digital optical fiber satellite-borne receiving and transmitting equipment |
| CN113507305B (en) * | 2021-07-31 | 2023-06-23 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Digital array beam forming device |
-
2021
- 2021-10-28 CN CN202111266028.6A patent/CN114002786B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101895337A (en) * | 2010-07-07 | 2010-11-24 | 东莞市铭普实业有限公司 | Double-fiber hot backup radio-frequency intelligent optical module |
| CN102148678A (en) * | 2011-03-29 | 2011-08-10 | 中航光电科技股份有限公司 | Dual-path automatic full-redundancy transparent light transmission system |
| CN207081862U (en) * | 2017-03-31 | 2018-03-09 | 武汉博昇光电股份有限公司 | A kind of multichannel integrated module of optical transceiver |
| CN111061018A (en) * | 2018-10-16 | 2020-04-24 | 上海欣诺通信技术股份有限公司 | Optical transmission apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114002786A (en) | 2022-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7465105B2 (en) | Flexible substrate for routing fibers in an optical transceiver | |
| EP2919050B1 (en) | Replaceable transmitting module and optical transceiver having a replaceable transmitting module | |
| CN103814313B (en) | Optical module | |
| CN105247400A (en) | Compact multi-channel optical transceiver module | |
| CN111147130B (en) | Light source backup method, device and system | |
| CN103995324A (en) | Light receiving and emitting module and assembly method thereof | |
| CN114545564A (en) | Optical module | |
| CN113114367B (en) | Modularized high-density digital optical fiber satellite-borne receiving and transmitting equipment | |
| WO2020088507A1 (en) | Pluggable light source module | |
| US20190129112A1 (en) | Laser module system and pluggable laser module for optical telecommunications switching apparatus | |
| CN113885143A (en) | Optical module | |
| CN114002786B (en) | High-density multi-channel satellite-borne optical transmission equipment | |
| CN215678864U (en) | Optical module | |
| CN102025439B (en) | Coarse wavelength division device and system based on photonic integrated circuit | |
| JP2705853B2 (en) | Optical signal connection device for rack insertable device | |
| CN116938344A (en) | Optical module and baseband processing unit | |
| CN217133428U (en) | Wavelength division integrated CPO device | |
| CN114667051B (en) | Anti-interference optical module | |
| CN116413866A (en) | Optical module | |
| CN105340204A (en) | Thermally shielded multi-channel transmitter optical subassembly and optical transceiver module including same | |
| WO2023185308A1 (en) | Optical apparatus and optical communication device | |
| CN217469964U (en) | XGSPON ONU Triplexer module | |
| CN217183299U (en) | Optical module | |
| CN114172578B (en) | DWDM optical module and optical fiber communication system | |
| US20240210635A1 (en) | Optical emission assembly and optical module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |