CN113977113A - Processing method for blind hole of gem measuring head - Google Patents
Processing method for blind hole of gem measuring head Download PDFInfo
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- CN113977113A CN113977113A CN202111451045.7A CN202111451045A CN113977113A CN 113977113 A CN113977113 A CN 113977113A CN 202111451045 A CN202111451045 A CN 202111451045A CN 113977113 A CN113977113 A CN 113977113A
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- laser
- gem
- measuring head
- blind hole
- pneumatic suspension
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- 238000003672 processing method Methods 0.000 title description 3
- 239000000725 suspension Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000003754 machining Methods 0.000 claims abstract description 17
- 238000007648 laser printing Methods 0.000 claims abstract description 8
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 238000004513 sizing Methods 0.000 claims description 4
- 239000010437 gem Substances 0.000 description 43
- 238000005516 engineering process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- 210000000080 chela (arthropods) Anatomy 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
Abstract
A blind hole machining process of a gem measuring head comprises the following steps: 1) adjusting a laser transmitter of a laser machine to enable laser pulses to form an included angle with the vertical direction; 2) fixing the gem measuring head with the platform surface in a clamping tool; 3) installing a clamping tool fixed with a gem measuring head on a clamp of a laser machine, and enabling the gem measuring head to be positioned at the rotating center of a pneumatic suspension shaft; 4) setting laser power, and adjusting the center of a display of a laser machine to coincide with a laser printing point; 5) setting the rotation speed of the pneumatic suspension shaft, then adjusting X, Y shaft of the pneumatic suspension shaft in the rotation state, and enabling the center of the red cross line of the display to coincide with the laser printing point; 6) setting processing parameters for the laser machine according to the aperture and the depth of the blind hole, and starting to process the blind hole; 7) and after the processing is finished, checking whether the blind hole of the gem measuring head meets the process requirements.
Description
Technical Field
The invention relates to the technical field of blind hole processing, in particular to a blind hole processing technology of a gem measuring head.
Background
Measuring heads made of superhard materials such as jewels, tungsten steel, silicon nitride and the like have the characteristics of high hardness, good rigidity, wear resistance and the like, are commonly used for measuring instruments, precision measuring instruments and meters and the like, but the blind holes of the measuring heads are difficult to process due to the high wear resistance and high hardness of the superhard materials.
At present, a method of drilling a grinding rod is generally adopted to process a blind hole of a gem measuring head. The grinding rod is a cylindrical consolidation grinding tool, the bonding agent is melted by heating, the artificial diamond drilling powder is added into the bonding agent, the mixture is uniformly mixed, and the grinding rod is pressed according to the processing aperture. When the grinding rod is used for punching, a tool provided with the gem ball needs to be clamped by the three-jaw chuck, the tool is connected through the belt to rotate, the grinding rod is contacted with the gem ball to generate a cutting effect, and then the grinding rod is enabled to drill downwards slowly.
The principle of grinding rod punching processing is a forming method, namely the diameter of the grinding rod is related to the aperture, the diameter of the grinding rod must be smaller than the aperture, the blind hole processing precision of the gem ball can be influenced by the tolerance of the diameter of the grinding rod, the sintering precision of the grinding rod and the abrasion degree of the grinding rod, and for the blind hole with the aperture within the range of phi 0.15-0.60 mm, if the method for grinding rod punching processing is adopted, the following defects exist:
1. the aperture of the blind hole is very small, so that the observation is inconvenient for naked eyes, and the center of the gem ball is difficult to accurately position;
2. the diameter of the grinding rod is too small, so that the grinding rod is very easy to break during sintering and is not easy to sinter to the center of the upper shaft;
3. the diameter tolerance of the grinding rod, the sintering precision is difficult to guarantee, and the wear of the grinding rod can influence the aperture tolerance of the processed blind hole.
4. The existing grinding rod punching processing method mainly depends on manual debugging equipment, the positions of the grinding rod and a chuck are manually adjusted, the contact position of the grinding rod and a gem ball is easy to change, the platform surface of the grinding rod and the gem ball is not in a vertical relation, and the processing coaxiality is poor;
5. factors such as grinding rod jumping, grinding tool quality and the like in the machining process easily cause poor consistency of the depth and the aperture of the broken opening and the blind hole, so that the machining tolerance of the blind hole is large, the machining tolerance is usually more than 0.10mm, and the machining requirement of the blind hole with the small aperture cannot be met.
Disclosure of Invention
The invention aims to provide a blind hole processing technology of a gem measuring head, aiming at the defects of the prior art, which utilizes the laser pulse of a laser machine to process the blind hole of the gem measuring head, solves the problem that the processing of the blind hole with small diameter and small tolerance can not be realized by the punching of a grinding rod, and can improve the processing precision of the blind hole.
The technical scheme of the invention is as follows: a blind hole machining process of a gem measuring head comprises the following steps:
1) adjusting a laser transmitter of a laser machine to enable laser pulses to form an included angle with the vertical direction;
2) fixing the gem measuring head with the platform surface in a clamping tool;
3) installing a clamping tool fixed with a gem measuring head on a clamp of a laser machine, and enabling the gem measuring head to be positioned at the rotating center of a pneumatic suspension shaft;
4) setting laser power, emitting laser, and adjusting the center of a laser machine display to coincide with a laser printing point;
5) setting the rotation speed of the pneumatic suspension shaft, enabling the gem measuring head to rotate along with the pneumatic suspension shaft, then adjusting X, Y shaft of the pneumatic suspension shaft in a rotation state, and enabling the center of the red cross line of the display to coincide with the laser printing point;
6) setting processing parameters for the laser machine according to the aperture and the depth of the blind hole, and starting to process the blind hole;
7) and after the processing is finished, checking whether the blind hole of the gem measuring head meets the process requirements.
Furthermore, the included angle between the laser pulse and the vertical direction is 12-15 degrees.
Further, the processing parameters include processing depth, sizing, blind hole angle, displacement step distance of laser focus, horizontal moving speed of the pneumatic suspension shaft, laser emission frequency, laser emission pulse width, suspension time of the pneumatic suspension shaft and laser power.
Furthermore, the displacement step distance of the laser focus is 0.001-0.015 mm.
Further, the horizontal moving speed of the pneumatic suspension shaft is 1-15 mm/min.
Furthermore, the laser emission frequency is 1400-1600 Hz.
Furthermore, the pulse width of the laser emission is 30000-45000.
Further, the pause time of the pneumatic suspension shaft is 0-400 ms.
Furthermore, the power of laser emission is 0-20W.
Furthermore, the rotating speed of the pneumatic suspension shaft is 100-400 r/s.
Adopt above-mentioned technical scheme: the processing technology adopts the laser machine as processing equipment, utilizes the characteristics of high precision and high magnification of the laser machine, and can adjust the focusing condition and the positioning condition of laser through observation on a display, so that the shaft positioning precision of the X, Y, Z shaft can reach 0.001mm at most, and the tolerance range can be controlled within 0.03mm, therefore, the blind hole processing can be accurately realized on the small-diameter gem measuring head with the diameter below 1mm, and the accurate positioning can be realized when small-diameter blind holes are processed, and high-requirement products such as small tolerance and the like are processed. Moreover, the laser energy emitted by the laser machine is stable, the laser focus can be automatically focused along with the processing depth of the blind hole, and the qualification rate of workpiece processing is improved. In addition, the processing technology can also be used for processing the blind holes of the superhard materials such as tungsten steel, silicon nitride and the like, and has wide applicability.
The invention is further described with reference to the drawings and the specific embodiments in the following description.
Drawings
FIG. 1 is a schematic view of the process of the present invention.
Detailed Description
Referring to fig. 1, a blind hole processing technology of a gem measuring head comprises the following steps:
1) the laser emitter of adjustment laser machine makes laser pulse and vertical direction form the contained angle, laser pulse is 12 ~ 15 with the contained angle of vertical direction, reduces the dark ratio in footpath of blind hole 5 processing from this, can clear up the pore wall and the hole bottom of blind hole 5 cleaner, avoids appearing unevenness's problem because of the material gets rid of incompletely leads to pore wall and hole bottom to guarantee the machining effect of blind hole 5, improve the product percent of pass.
2) In the clamping tool 3 for fixing the gem measuring head 4 with the processed platform surface, the clamping tool 3 is placed on a horizontal table surface firstly, then the platform surface of the gem measuring head 4 is placed downwards in the clamping tool 3, the platform surface of the gem measuring head 4 and the clamping tool 3 are on the same horizontal plane, then the gem measuring head 4 and the clamping tool 3 are heated, and the gem measuring head 4 is bonded and fixed in the clamping tool 3 in a dispensing mode.
3) And opening an air supply system of the laser machine, starting the laser machine and the computer, and sequentially operating 'SerialPortoperator' software and 'CNC laser drilling software'.
4) A clamping tool 3 fixed with a gem measuring head 4 is arranged on a clamp 2 of a laser machine fixed by a triangular chuck by tweezers pincers, the Z-axis direction in CNC laser drilling software is debugged to ensure that the clear gem measuring head 4 appears in a display, then the adjusting screw on the triangular chuck of the laser machine is screwed to ensure that the platform surface of the gem measuring head 4 is positioned at the center of the display, i.e., the red cross square frame line in the display, since the jig 2 is mounted on the air-operated levitation shaft 1 by the triangular chuck, therefore, the pneumatic suspension shaft 1 of the laser machine is poked, so that the gem measuring head 4 rotates along with the pneumatic suspension shaft 1, and the adjusting screw is screwed again, so that the gem measuring head 4 is positioned at the rotating center of the pneumatic suspension shaft 1, the positioning precision of the gem measuring head 4 on the Z axis is ensured, the initial Z axis position of laser processing is determined, and the processing precision of the hole depth of the blind hole 5 is ensured.
5) Setting laser power, namely the size of laser energy, generally setting the laser power to be 0-20W, clicking a 'power ok' key, emitting laser, and adjusting the center of a red cross square frame line in a laser machine display to coincide with a printing point of the laser on the gem measuring head 4.
6) The rotation speed of the pneumatic suspension shaft 1 is set, the rotation speed of the pneumatic suspension shaft 1 is set to be 100-400 r/s generally, the gem measuring head 4 is made to rotate along with the pneumatic suspension shaft 1, then the X, Y shaft of the pneumatic suspension shaft 1 in the rotation state is adjusted, the center of the display is made to coincide with the laser printing point again, namely the center of the red cross square frame line of the display coincides with the laser printing point, the state of three-in-one is achieved, namely the rotation center of the pneumatic suspension shaft 1, the platform center of the gem measuring head 4 and the focus center of laser are located on the same straight line, and the positioning accuracy of the gem measuring head 4 on the X, Y shaft is guaranteed.
7) Processing parameters are set for the laser machine, the processing parameters comprise processing depth, sizing, blind hole angle, displacement step pitch of laser focus, horizontal moving speed of the pneumatic suspension shaft, laser emission frequency, laser emission pulse width, pause time of the pneumatic suspension shaft 1 and laser power, and each processing parameter can be adjusted according to different apertures and depths of the blind holes 5 as shown in table 1,
the processing depth is the hole depth of the blind hole 5, and the sizing is the aperture of the blind hole 5;
the angle of the blind hole is 0, namely the blind hole 5 is a vertical round hole;
the displacement step pitch of the laser focus is the displacement amount of the laser focus changed every time, namely the hole depth of the blind hole 5 is divided into n parts, 1/n is the displacement step pitch of the laser focus, the displacement step pitch is usually set to be 0.001-0.015 mm, the laser beam processes the blind hole 5 downwards step by step according to the displacement step pitch, and the laser focus can be automatically focused in the processing process;
the horizontal moving speed of the pneumatic suspension shaft is the speed of the pneumatic suspension shaft 1 moving horizontally in the X axis and the Y axis, namely the speed of the pneumatic suspension shaft driving the gem measuring head 4 to move horizontally is usually set to be 1-15 mm/min, and the processing precision of the aperture of the blind hole is guaranteed.
The laser emission frequency is the frequency of emitting laser pulses by a laser in one period, and is usually set to be 1400-1600 Hz;
the pulse width of the laser emission is the duration of the laser power at a certain value, and is generally set to be 30000-45000;
when the pause time of the pneumatic suspension shaft 1 is that the laser beam moves to the set aperture edge, the pneumatic suspension shaft 1 stops moving in the horizontal direction and only rotates, the pause time is usually set to be 0-400 ms, residues on the wall of the blind hole 5 are cleaned through the laser beam, and the smoothness and burr-free performance of the wall of the blind hole 5 are guaranteed.
When the processing parameter setting is completed, the pneumatic suspension shaft 1 drives the gem measuring head 4 to rotate and do horizontal linear reciprocating motion, and the laser starts to process the blind hole 5 of the gem measuring head 4.
8) After the processing is finished, taking down the clamping tool 3 from the clamp 2 by using pincer pliers, checking whether the aperture and the hole depth of the blind hole 5 processed on the gem measuring head 4 meet the technological requirements by using a feeler gauge and a dial indicator, observing whether the surface of the gem measuring head 4 is burnt under a microscope, and if the size reaches the standard and no burn is generated, the processing is qualified, otherwise, repeating the steps 5) -7) until the technological requirements are met.
TABLE 1
The processing technology adopts a laser machine as processing equipment, the gem measuring head 4 is driven to rotate through the pneumatic suspension shaft 1 and performs horizontal linear reciprocating motion, the laser emits laser pulses to form a laser pulse spiral line, the laser focus performs automatic focusing and downward processing according to displacement step distance in the processing process until the blind hole 5 is finally processed, and the processed blind hole has small tolerance, large precision, smooth inner wall and no burr.
The processing technology utilizes the characteristics of high precision and high magnification of a laser machine, and can observe the focusing condition and the positioning condition of laser through a display and adjust, so that the shaft positioning precision of an X, Y, Z shaft can reach 0.001mm at most, and the tolerance range can be controlled within 0.03mm, therefore, the blind hole 5 can be accurately processed for a small-diameter gem measuring head 4 with the diameter below 1mm, the accurate positioning can be realized when the small-diameter blind hole 5 is processed and high-requirement products such as small tolerance and the like are processed, and the problem that the small-diameter blind hole is difficult to process on the small-diameter gem measuring head is effectively solved. Moreover, the laser energy emitted by the laser machine is stable, the laser focus can automatically focus along with the processing depth of the blind hole 5, and the blind hole is processed downwards step by step according to the displacement, so that the qualified rate of workpiece processing is improved. In addition, the processing technology can also be used for processing the blind holes 5 of the superhard materials such as tungsten steel, silicon nitride and the like, and has wide applicability.
Claims (10)
1. A blind hole machining process of a gem measuring head is characterized by comprising the following steps:
1) adjusting a laser transmitter of a laser machine to enable laser pulses to form an included angle with the vertical direction;
2) fixing the gem measuring head with the platform surface in a clamping tool;
3) installing a clamping tool fixed with a gem measuring head on a clamp of a laser machine, and enabling the gem measuring head to be positioned at the rotating center of a pneumatic suspension shaft;
4) setting laser power, emitting laser, and adjusting the center of a laser machine display to coincide with a laser printing point;
5) setting the rotation speed of the pneumatic suspension shaft, enabling the gem measuring head to rotate along with the pneumatic suspension shaft, emitting laser again, then adjusting X, Y shaft of the pneumatic suspension shaft in a rotation state, and enabling the center of the red cross line of the display to coincide with the laser printing point again;
6) setting processing parameters for the laser machine according to the aperture and the depth of the blind hole, and starting to process the blind hole;
7) and after the processing is finished, checking whether the blind hole of the gem measuring head meets the process requirements.
2. The blind hole machining process for the gem measuring head according to claim 1, characterized in that: the included angle between the laser pulse and the vertical direction is 12-15 degrees.
3. The blind hole machining process for the gem measuring head according to claim 1, characterized in that: the processing parameters comprise processing depth, sizing, blind hole angle, displacement step distance of a laser focus, horizontal moving speed of the pneumatic suspension shaft, laser emission frequency, laser emission pulse width, pause time of the pneumatic suspension shaft and laser power.
4. The blind hole machining process for the gem measuring head according to claim 3, characterized in that: the displacement step pitch of the laser focus is 0.001-0.015 mm.
5. The blind hole machining process for the gem measuring head according to claim 3, characterized in that: the horizontal moving speed of the pneumatic suspension shaft is 1-15 mm/min.
6. The blind hole machining process for the gem measuring head according to claim 3, characterized in that: the laser emission frequency is 1400-1600 Hz.
7. The blind hole machining process for the gem measuring head according to claim 3, characterized in that: the pulse width of the laser emission is 30000-45000.
8. The blind hole machining process for the gem measuring head according to claim 3, characterized in that: the suspension time of the pneumatic suspension shaft is 0-400 ms.
9. The blind hole machining process for the gem measuring head according to claim 3, characterized in that: the power of laser emission is 0-20W.
10. The blind hole machining process for the gem measuring head according to claim 1, characterized in that: the rotating speed of the pneumatic suspension shaft is 100-400 r/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111451045.7A CN113977113A (en) | 2021-11-30 | 2021-11-30 | Processing method for blind hole of gem measuring head |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111451045.7A CN113977113A (en) | 2021-11-30 | 2021-11-30 | Processing method for blind hole of gem measuring head |
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| CN113977113A true CN113977113A (en) | 2022-01-28 |
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Family Applications (1)
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| CN202111451045.7A Pending CN113977113A (en) | 2021-11-30 | 2021-11-30 | Processing method for blind hole of gem measuring head |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| US20040089642A1 (en) * | 2002-01-15 | 2004-05-13 | Christensen C. Paul | Method and system for laser marking a gemstone |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
| CN101670486A (en) * | 2009-09-23 | 2010-03-17 | 上海市激光技术研究所 | Laser micropore processor of rotating double-optical wedge |
| CN108098147A (en) * | 2017-12-01 | 2018-06-01 | 广东工业大学 | A kind of double-sided laser processing method for PCB array micropores |
| CN108176928A (en) * | 2017-12-01 | 2018-06-19 | 广东工业大学 | A kind of array micropore laser processing of adjustable angle |
| CN110052714A (en) * | 2019-03-29 | 2019-07-26 | 江苏大学 | A kind of Laser Surface Treatment technique improving interface binding power |
| CN110977205A (en) * | 2019-12-20 | 2020-04-10 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
| CN113441852A (en) * | 2021-06-24 | 2021-09-28 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
-
2021
- 2021-11-30 CN CN202111451045.7A patent/CN113977113A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| US20040089642A1 (en) * | 2002-01-15 | 2004-05-13 | Christensen C. Paul | Method and system for laser marking a gemstone |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
| CN101670486A (en) * | 2009-09-23 | 2010-03-17 | 上海市激光技术研究所 | Laser micropore processor of rotating double-optical wedge |
| CN108098147A (en) * | 2017-12-01 | 2018-06-01 | 广东工业大学 | A kind of double-sided laser processing method for PCB array micropores |
| CN108176928A (en) * | 2017-12-01 | 2018-06-19 | 广东工业大学 | A kind of array micropore laser processing of adjustable angle |
| CN110052714A (en) * | 2019-03-29 | 2019-07-26 | 江苏大学 | A kind of Laser Surface Treatment technique improving interface binding power |
| CN110977205A (en) * | 2019-12-20 | 2020-04-10 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
| CN113441852A (en) * | 2021-06-24 | 2021-09-28 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
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