CN113973435A - Seamless splicing and die cutting process for large-size flexible circuit board - Google Patents
Seamless splicing and die cutting process for large-size flexible circuit board Download PDFInfo
- Publication number
- CN113973435A CN113973435A CN202111234616.1A CN202111234616A CN113973435A CN 113973435 A CN113973435 A CN 113973435A CN 202111234616 A CN202111234616 A CN 202111234616A CN 113973435 A CN113973435 A CN 113973435A
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- knife
- material belt
- die cutting
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- base film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a seamless splicing die-cutting process of a large-size flexible circuit board, which is applied to multi-roller flexible circuit board pressing equipment, wherein at least three groups of roller cutters are sequentially arranged when a material belt is subjected to die cutting, and the first group of roller cutters is used for carrying out first-step die cutting on the material belt; when the material belt is sent to the second group of knife rollers, the first group of knife rollers and the second group of knife rollers simultaneously carry out the second-step die cutting on the material belt; when the material belt is conveyed to the third group of knife rollers, the third group of knife rollers independently carry out the third step of die cutting on the material belt; because the circumferential length of the section of the knife roll is less than the distance between two adjacent knife rolls, the first group of knife rolls and the second group of knife rolls have interval gaps for the die cutting knife tracks in the material belt, the third group of knife rolls works independently during the third step of die cutting to perform independent die cutting on the gaps in the material belt, so that the knife tracks can be connected, the size of the knife rolls is reduced, operators can conveniently replace the knife rolls, and meanwhile, the seamless splicing of the flexible circuit board can be realized.
Description
Technical Field
The invention belongs to the field of flexible circuit board processing, and particularly relates to a seamless splicing and die-cutting process for a large-size flexible circuit board.
Background
The Flexible Printed Circuit (FPC) is a Flexible die-cutting Circuit which is made of polyimide or polyester film as base material and has high reliability and excellent performance. The FPC can be utilized to greatly reduce the volume of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability; therefore, the FPC is widely applied to the fields of spaceflight, military, movement, communication, automobiles and the like.
In the prior art, a copper foil is pressed into a base material through a plurality of groups of rollers, and then the etched copper foil is adopted to carry out flexible circuit preparation; the running roller is responsible for carrying out the pressfitting with copper foil and substrate, the rotor carries out the shape cross cutting that corresponds to the product, in preparing the large size flexible line way board, the great rotor of the demand that corresponds carries out the cross cutting, distance between two adjacent rotors equals the girth of rotor cross-section circle, guarantee that the line of cut can seamless concatenation, nevertheless because of the change of cross cutting technology and production demand, technical staff is because of the too big inconvenient change of rotor, if adopt the multiunit small-size rotor then the incremental cost, consequently, urgent need for a seamless concatenation cross cutting process of large size flexible line way board to solve the problem in the current.
Disclosure of Invention
Aiming at the defects in the technology, the invention provides a seamless splicing and die-cutting process for a large-size flexible circuit board, which is applied to multi-roller flexible circuit board pressing equipment, when a material belt is subjected to die cutting, at least three groups of roller cutters are sequentially arranged, and the first group of roller cutters is used for carrying out first-step die cutting on the material belt; when the material belt is sent to the second group of knife rollers, the first group of knife rollers and the second group of knife rollers simultaneously carry out the second-step die cutting on the material belt; when the material belt is conveyed to the third group of knife rollers, the third group of knife rollers independently carry out the third step of die cutting on the material belt; because the circumference of the section of the knife roll is smaller than the distance between two adjacent knife rolls, the first group of knife rolls and the second group of knife rolls have interval gaps for the die cutting knife tracks in the material belt, the third group of knife rolls works independently during the die cutting of the third part, and the gap in the material belt is subjected to independent die cutting, so that the knife tracks can be connected, the size of the knife rolls is reduced, operators can conveniently replace the knife rolls, and meanwhile, the seamless splicing of the flexible circuit board can be realized.
In order to achieve the purpose, the invention provides a seamless splicing and die cutting process for a large-size flexible circuit board, which is applied to a flexible circuit board rolling device with multiple rollers, and comprises the following steps:
s1: selecting a thermosetting adhesive coiled material as a base film, and performing die cutting on the base film to obtain a first base film and a second base film;
s2, arranging a plurality of groups of knife rolls, wherein the circumferences of the circular cross sections of the knife rolls are smaller than the distance between adjacent knife rolls, and after the material belt is subjected to independent die cutting and combined die cutting by the plurality of groups of knife rolls, the material belt and the first base film are rolled and pressed to obtain a preliminary pressed circuit board;
s3: and rolling and laminating the second base film to the surface of the material belt far away from the first base film to obtain the formed flexible circuit board.
Preferably, in steps S1 and S3, a plurality of layers of the first low-viscosity film are provided as a base layer of the first base film, and a second low-viscosity film is provided as a protective layer on a side of the second base film away from the tape.
Preferably, the material of the first and second low adhesive films is one of PET, PE, and OPP.
Preferably, the first base film and the second base film have a thickness of 0.02 to 0.05mm, and the first low-adhesive film and the second low-adhesive film have a thickness of 0.01 to 0.05 mm.
Preferably, in step S2, at least three sets of roller knives are sequentially arranged, and the first set of roller knives performs the first step die cutting on the tape; when the material belt is sent to the second group of knife rollers, the first group of knife rollers and the second group of knife rollers simultaneously carry out die cutting on the material belt; when the material belt is sent to the third group of knife rollers, the third group of knife rollers singly carry out die cutting on the material belt.
Preferably, in step S2, a first heating unit is provided, and the first heating unit presses and bonds the first base material and the tape.
Preferably, in step S3, a second heating unit is provided, and the second heating unit roll-presses the preliminary flexible wiring board and the second base film.
Preferably, the first heating unit and the second heating unit respectively comprise a toothed roller and a heating roller, and the toothed roller and the heating roller are respectively positioned on the front side and the back side of the material belt and are used for rolling and pressing the material belt.
Preferably, the temperature range of the heating roller is 150-.
Preferably, in step S3, a position following mechanism is provided for die-cutting the second base film into a clearance position corresponding to the preliminary press-fit wiring board.
The invention has the beneficial effects that: compared with the prior art, the seamless splicing and die-cutting process for the large-size flexible circuit board is applied to multi-roller flexible circuit board pressing equipment, at least three groups of roller cutters are sequentially arranged when a material belt is subjected to die cutting, and the first group of roller cutters are used for carrying out first-step die cutting on the material belt; when the material belt is sent to the second group of knife rollers, the first group of knife rollers and the second group of knife rollers simultaneously carry out the second-step die cutting on the material belt; when the material belt is conveyed to the third group of knife rollers, the third group of knife rollers independently carry out the third step of die cutting on the material belt; because the circumference of the section of the knife roll is smaller than the distance between two adjacent knife rolls, the first group of knife rolls and the second group of knife rolls have interval gaps for the die cutting knife tracks in the material belt, the third group of knife rolls works independently during the die cutting of the third part, and the gap in the material belt is subjected to independent die cutting, so that the knife tracks can be connected, the size of the knife rolls is reduced, operators can conveniently replace the knife rolls, and meanwhile, the seamless splicing of the flexible circuit board can be realized.
Drawings
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.
In the prior art, a copper foil is pressed into a base material through a plurality of groups of rollers, and then the etched copper foil is adopted to carry out flexible circuit preparation; the running roller is responsible for carrying out the pressfitting with copper foil and substrate, the rotor carries out the shape cross cutting that corresponds to the product, in preparing the large size flexible line way board, the great rotor of the demand that corresponds carries out the cross cutting, distance between two adjacent rotors equals the girth of rotor cross-section circle, guarantee that the line of cut can seamless concatenation, nevertheless because of the change of cross cutting technology and production demand, technical staff is because of the too big inconvenient change of rotor, if adopt the multiunit small-size rotor then the incremental cost, consequently, urgent need for a seamless concatenation cross cutting process of large size flexible line way board to solve the problem in the current.
In view of the above disadvantages, the present invention provides a seamless splicing and die cutting process for a large-sized flexible circuit board, which is applied to a multi-roller flexible circuit board pressing device, and referring to fig. 1, the seamless splicing and die cutting process for a large-sized flexible circuit board is applied to a multi-roller flexible circuit board pressing device, and comprises the following steps:
s1: selecting a thermosetting adhesive coiled material as a base film, and performing die cutting on the base film to obtain a first base film and a second base film;
s2, arranging a plurality of groups of knife rolls, wherein the circumferences of the circular cross sections of the knife rolls are smaller than the distance between adjacent knife rolls, and after the material belt is subjected to independent die cutting and combined die cutting by the plurality of groups of knife rolls, the material belt and the first base film are rolled and pressed to obtain a preliminary pressed circuit board;
s3: rolling and attaching the second base film to one surface of the material belt, which is far away from the first base film, so as to obtain a formed flexible circuit board; in the embodiment, the material belt is a copper foil or a silver foil, the copper foil is selected as a conductive layer, the material belt has good flexural stress and conductive capacity, the material cost is low, the surface is smooth, the material belt is prone to tilting on a base material due to insufficient adhesive force during running of a roller, a coiled material which can be cured by heating is selected as a first base film, the material belt is adhered to the surface of the first base film with viscosity and is not prone to shifting and breaking off, a thermosetting adhesive coiled material is selected as a second base film to coat the other surface of the primary press circuit board, so that the two surfaces of the material belt can be coated with the base film, the two surfaces of the material belt are coated with thermosetting adhesive, and the thermosetting adhesive is subjected to shrinkage adhesion after being heated, so that the copper foil is isolated from air and prevented from being oxidized, and the influence of copper oxide on the product quality cannot occur in a subsequent process; in step S2, at least three sets of roller knives are sequentially arranged, and the first set of roller knives performs a first step of die cutting on the tape; when the material belt is sent to the second group of knife rollers, the first group of knife rollers and the second group of knife rollers simultaneously carry out the second-step die cutting on the material belt; when the material belt is sent to a third group of knife rolls, the third group of knife rolls independently carry out third-step die cutting on the material belt, and because the circumference of the cross section of the knife rolls is smaller than the distance between two adjacent knife rolls, the first group of knife rolls and the second group of knife rolls have interval gaps for die cutting knife tracks of the material belt, the third group of knife rolls independently work during the third-step die cutting to carry out independent die cutting on the gaps of the material belt, so that the knife tracks can be connected, the size of the knife rolls is reduced, operators can conveniently replace the knife rolls, and meanwhile, seamless splicing of the flexible circuit board can be realized, thereby solving the problems in the prior art; compared with the large cutter roller for die cutting of the material belt, the die cutting process provided by the invention occupies a small area in a production space, and the seamless splicing die cutting process enables the utilization rate of the material belt to be improved.
In the present embodiment, in steps S1 and S3, a plurality of layers of the first low-viscosity film are provided as the bottom supporting layer of the first base film, and a second low-viscosity film is provided as the protective layer on the side of the second base film away from the tape; the first low-viscosity film is provided with a plurality of layers as a bottom supporting film, and in the production, the marking and the imprinting are carried out on the plurality of layers of the first low-viscosity film, so that the accuracy of operation on a special position of a product in subsequent processing is improved; the second low-viscosity film is used as a protective layer to protect the second base film pair from scratching and damage of the material belt serving as the conductive layer caused by breakage of the second base film in the process of transportation or perhaps processing.
In this embodiment, the first low-adhesive film and the second low-adhesive film are made of one of PET, PE, and OPP; can feel specific technology, customer's demand and adjust the material of first low mucosa and second low mucosa and select, this embodiment adopts the PET material after the glass fiber reinforcement, and this material has mechanical properties excellence, and the high thermal ageing resistance performance of thermal change temperature is good, and the first base film of collocation and second base film also can not appear thermal deformation in the heating process and lead to the damage and the deformation of material area.
In this embodiment, the thickness of the first base film and the second base film is 0.02 to 0.05mm, and the thickness of the first low-adhesive film and the second low-adhesive film is 0.01 to 0.05 mm; the thickness can be changed according to product technology and customer requirements, in the embodiment, the thickness parameter of the first base film and the second base film is selected to be 0.03mm, the thickness of the first low-adhesive film and the second low-adhesive film is 0.05mm, the first base film and the second base film can be selected to realize quick thermosetting and sizing, the stability of the material belt is guaranteed, and the first base film and the second base film can guarantee that scratches of daily contact cannot break through the base film layer under the thickness of 0.05 mm.
In this embodiment, in step S2, a first heating unit is disposed, and the first heating unit rolls and presses the first substrate and the tape; in the step S3, a second heating unit is provided, and the second heating unit rolls and presses the preliminary flexible circuit board and the second base film; the first heating unit and the second heating unit respectively comprise a toothed roller and a heating roller, and the toothed roller and the heating roller are respectively positioned on the front side and the back side of the material belt and are used for rolling and pressing the material belt; the temperature range of the heating roller is 150-180 ℃; the toothed roller provides better adhesive force to the material belt and the base film, so that the roller is firmer in rolling, and the material belt is not easy to separate from the base film due to uneven adhesive force; the heating roller can realize the regulation and control of the heating temperature range between 150 ℃ and 180 ℃, conveniently heat the pressure-sensitive adhesive coiled materials of different varieties, and provide certain convenient conditions for the improvement of the base materials in the later period.
In this embodiment, in step S3, a position tracking mechanism is provided for die-cutting the second substrate film into a clearance position adapted to the preliminary circuit board to be laminated; the position tracking mechanism comprises a CCD, the clearance position is calculated through an image sensor, the second base film is subjected to die cutting, the die cutting position is matched with the primary press circuit board, and the second base film is subsequently rolled through a roller; the mechanism that follows up directly passes through the second heating unit after working, and the second heating unit carries out the pressfitting with second floor base film and preliminary pressfitting circuit board for the material area can both obtain inseparable laminating with the base film of thermosetting adhesive coiled material.
The specific process steps are as follows:
selecting a thermosetting adhesive coiled material as a base film, wherein the thickness of the base film is 0.03mm, and performing die cutting on the base film to obtain a first base film and a second base film; the first base film is provided with two layers of first low-viscosity film carrier base films, the second base film is provided with one layer of second low-viscosity film serving as a protective film, the first low-viscosity film and the second low-viscosity film are both made of PET materials reinforced by glass fibers and are 0.05mm in thickness, and the first low-viscosity film on the surface layer is marked; at least three groups of roller cutters are sequentially arranged in the feeding direction of a copper foil material belt, and the first group of roller cutters perform first-step die cutting on the material belt; when the material belt is sent to the second group of knife rollers, the first group of knife rollers and the second group of knife rollers simultaneously carry out the second-step die cutting on the material belt; when the material belt is conveyed to the third group of knife rolls, the third group of knife rolls independently carry out third-step die cutting on the material belt, the material belt is conveyed to the first heating unit after the die cutting, a toothed roller and a heating roller in the first heating unit carry out heating rolling on the material belt to enable the material belt to be pressed, and the temperature of the heating roller is 160 ℃, so that a preliminary pressing circuit board is obtained; the second base film is subjected to die cutting through a position tracing mechanism to form a clearance position matched with the preliminary press-fit circuit board, the second base film is attached to the preliminary press-fit circuit board, two sides of the material belt are respectively coated on the first base film and the second base film and are conveyed to a second heating unit, a toothed roller and a heating roller in the second heating unit are used for heating and rolling the material belt to press the material belt, the temperature of the heating roller is 160 ℃, and the material belt enters a rolling stage to obtain the formed flexible circuit board.
The invention has the advantages that:
1) because the circumference of the section of the knife roll is smaller than the distance between two adjacent knife rolls, the first group of knife rolls and the second group of knife rolls have interval gaps for the die cutting knife tracks in the material belt, the third group of knife rolls works independently during the die cutting of the third part, and the gap in the material belt is subjected to independent die cutting, so that the knife tracks can be connected, the size of the knife rolls is reduced, operators can conveniently replace the knife rolls, and meanwhile, the seamless splicing of the flexible circuit board can be realized.
2) Adopt the thermosetting to glue at the both ends degree in material area and carry out the tectorial membrane, the thermosetting glue is to carrying out the shrink bonding after being heated for the copper foil is isolated with the air, prevents the oxidation, can not appear the influence of copper oxide to product quality in follow-up technology.
The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (10)
1. A seamless splicing and die cutting process for a large-size flexible circuit board is applied to a flexible circuit board rolling device with multiple rollers, and is characterized by comprising the following steps:
s1: selecting a thermosetting adhesive coiled material as a base film, and performing die cutting on the base film to obtain a first base film and a second base film;
s2, arranging a plurality of groups of knife rolls, wherein the circumferences of the circular cross sections of the knife rolls are smaller than the distance between adjacent knife rolls, and after the material belt is subjected to independent die cutting and combined die cutting by the plurality of groups of knife rolls, the material belt and the first base film are rolled and pressed to obtain a preliminary pressed circuit board;
s3: and rolling and laminating the second base film to the surface of the material belt far away from the first base film to obtain the formed flexible circuit board.
2. The die-cutting process for seamless splicing of large-size flexible printed circuit board as claimed in claim 1, wherein in steps S1 and S3, a plurality of layers of the first low-adhesion film are provided as a base layer of the first base film, and a second low-adhesion film is provided as a protective layer on a side of the second base film away from the tape.
3. The process of claim 2, wherein the first low-adhesive film and the second low-adhesive film are made of one of PET, PE, and OPP.
4. The process of claim 2, wherein the first and second base films have a thickness of 0.02 to 0.05mm and the first and second low-adhesion films have a thickness of 0.01 to 0.05 mm.
5. The process of claim 1, wherein at least three sets of roller knives are sequentially disposed in step S2, and the first set of roller knives performs the first step die cutting on the tape; when the material belt is sent to the second group of knife rollers, the first group of knife rollers and the second group of knife rollers simultaneously carry out the second-step die cutting on the material belt; and when the material belt is sent to the third group of knife rollers, the third group of knife rollers independently carry out the third step of die cutting on the material belt.
6. The process of claim 1, wherein in step S2, a first heating unit is provided, and the first heating unit presses the first substrate and the tape together.
7. The process of claim 1, wherein a second heating unit is provided in step S3, and the second heating unit rolls and presses the preliminary flexible printed circuit board and the second base film.
8. The process of claim 6 and 7, wherein the first heating unit and the second heating unit comprise a cogged roller and a heated roller, respectively, and the cogged roller and the heated roller are respectively disposed on the front and back sides of the tape and roll-press the tape.
9. The process of claim 8, wherein the temperature of the heating roller is in the range of 150 ℃ to 180 ℃.
10. The process of claim 1, wherein a position-following mechanism is provided to die-cut the second substrate into the clearance suitable for the preliminary press-fit circuit board in step S3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111234616.1A CN113973435B (en) | 2021-10-22 | 2021-10-22 | Seamless splicing die-cutting process of large-size flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111234616.1A CN113973435B (en) | 2021-10-22 | 2021-10-22 | Seamless splicing die-cutting process of large-size flexible circuit board |
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| Publication Number | Publication Date |
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| CN113973435A true CN113973435A (en) | 2022-01-25 |
| CN113973435B CN113973435B (en) | 2023-08-22 |
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| CN202111234616.1A Active CN113973435B (en) | 2021-10-22 | 2021-10-22 | Seamless splicing die-cutting process of large-size flexible circuit board |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104441046A (en) * | 2014-10-31 | 2015-03-25 | 深圳市飞荣达科技股份有限公司 | Automatic die cutting and splicing process and equipment of frame type die cutting pieces |
| CN104647472A (en) * | 2015-02-15 | 2015-05-27 | 深圳市飞荣达科技股份有限公司 | Frame type die cutting element automatic die cutting seamless splicing process and automatic die cutting splicing equipment thereof |
| CN109079913A (en) * | 2018-08-03 | 2018-12-25 | 盐城维信电子有限公司 | A kind of automobile flexible circuit board auxiliary material die-cutting device and its technique |
-
2021
- 2021-10-22 CN CN202111234616.1A patent/CN113973435B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104441046A (en) * | 2014-10-31 | 2015-03-25 | 深圳市飞荣达科技股份有限公司 | Automatic die cutting and splicing process and equipment of frame type die cutting pieces |
| CN104647472A (en) * | 2015-02-15 | 2015-05-27 | 深圳市飞荣达科技股份有限公司 | Frame type die cutting element automatic die cutting seamless splicing process and automatic die cutting splicing equipment thereof |
| CN109079913A (en) * | 2018-08-03 | 2018-12-25 | 盐城维信电子有限公司 | A kind of automobile flexible circuit board auxiliary material die-cutting device and its technique |
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| CN113973435B (en) | 2023-08-22 |
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