CN113966149A - Heat dissipation unit and electronic device - Google Patents
Heat dissipation unit and electronic device Download PDFInfo
- Publication number
- CN113966149A CN113966149A CN202111227528.9A CN202111227528A CN113966149A CN 113966149 A CN113966149 A CN 113966149A CN 202111227528 A CN202111227528 A CN 202111227528A CN 113966149 A CN113966149 A CN 113966149A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- bending part
- fin structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 226
- 238000005452 bending Methods 0.000 claims abstract description 109
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 238000000034 method Methods 0.000 claims abstract description 49
- 238000004080 punching Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000004512 die casting Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The application discloses radiating unit and electronic equipment, radiating unit includes heat dissipation base plate, heat dissipation boss and fin structure. The heat dissipation boss is formed on the heat dissipation substrate through a stamping process and protrudes out of the heat dissipation substrate towards one side of the heat dissipation substrate, and the heat dissipation boss is used for installing an electronic device. The fin structure and the heat dissipation base plate are of an integrated structure and are formed on the heat dissipation base plate through a stamping and/or bending process, and the fin structure is bent towards one side departing from the heat dissipation boss relative to the heat dissipation base plate. In the heat dissipation unit of the embodiment of the application, the heat dissipation boss is formed on the heat dissipation substrate through a stamping process, the fin structure can also be formed on the heat dissipation substrate through a stamping and/or bending process, and the processing process is simpler.
Description
Technical Field
The present application relates to the field of household electrical appliances, and more particularly, to a heat dissipation unit and an electronic device.
Background
With the rapid increase of power consumption density of electronic products such as Customer Premise Equipment (CPE), routers, etc., the operating temperature of related electronic devices faces a severe over-temperature risk. At present, a heat sink is usually provided to dissipate heat of the electronic device to ensure the operating temperature thereof.
In the related art, the heat sink is usually manufactured by using die casting and aluminum extrusion processes, however, the fins of the heat sink manufactured by using the die casting process are thick, the mass of the heat sink is large, and the cost is high. Meanwhile, the radiator formed by the aluminum extrusion process is generally processed by adding a CNC (computerized numerical control) machining procedure in order to adapt to the complicated structural shape, and the cost is high.
Disclosure of Invention
The embodiment of the application provides a heat dissipation unit and electronic equipment.
The heat dissipation unit of the embodiment of the present application includes:
a heat-dissipating substrate;
the heat dissipation boss is formed on the heat dissipation substrate through a stamping process and protrudes out of the heat dissipation substrate towards one side of the heat dissipation substrate, and the heat dissipation boss is used for mounting an electronic device;
the fin structure and the heat dissipation base plate are of an integrated structure and are formed on the heat dissipation base plate through a stamping and/or bending process, and the fin structure is bent towards one side, which deviates from the heat dissipation boss, of the heat dissipation base plate.
The electronic equipment of the embodiment of the application comprises:
a plurality of electronic devices; and
in the heat dissipation unit of the above embodiment, each of the heat dissipation units corresponds to at least one of the electronic devices, and each of the electronic devices is connected to the heat dissipation boss through a heat conduction element in a heat conduction manner.
In the heat dissipation unit and the electronic device of the embodiment of the application, the heat dissipation boss is formed on the heat dissipation substrate through a stamping process, the fin structure can also be formed on the heat dissipation substrate through a stamping and/or bending process, and the processing process is simpler.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic perspective view of a heat dissipating unit according to an embodiment of the present disclosure;
fig. 2 is another schematic perspective view of a heat dissipating unit according to an embodiment of the present disclosure;
fig. 3 is a schematic plan view of a heat dissipating unit according to an embodiment of the present application;
FIG. 4 is a schematic view of an electronic device of an embodiment of the present application;
fig. 5 is another schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 6 is a schematic structural view of a heat sink according to an embodiment of the present application;
FIG. 7 is another schematic view of a heat sink according to an embodiment of the present application;
FIG. 8 is a schematic view of another structure of a heat sink according to an embodiment of the present application;
FIG. 9 is a schematic view of another structure of a heat sink according to an embodiment of the present application;
fig. 10 is a schematic perspective view of a heat dissipating unit according to an embodiment of the present application;
fig. 11 is another schematic plan view of the heat dissipating unit according to the embodiment of the present application;
fig. 12 is a schematic perspective view of a heat dissipating unit according to an embodiment of the present disclosure;
fig. 13 is a schematic view of another plan structure of the heat dissipating unit according to the embodiment of the present application;
fig. 14 is a schematic flow chart illustrating a method for manufacturing a heat dissipating unit according to an embodiment of the present disclosure.
Description of the main element symbols:
a heat dissipating unit 100;
the heat dissipation substrate 10, the heat dissipation boss 20, the fin structure 30, the first fin structure 31, the first bent portion 311, the second bent portion 312, the third bent portion 313, the eighth bent portion 314, the second fin structure 32, the fourth bent portion 321, the fifth bent portion 322, the sixth bent portion 323, the seventh bent portion 324, the ninth bent portion 325, the first heat dissipation channel 33, the second heat dissipation channel 34, the third heat dissipation channel 35, the heat sink 200, the electronic device 300, the electronic device 301, and the heat conducting element 302.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.
Referring to fig. 1 to 3, a heat dissipation unit 100 according to an embodiment of the present invention includes a heat dissipation substrate 10, a heat dissipation boss 20, and a fin structure 30. The heat dissipating protrusion 20 is formed on the heat dissipating substrate 10 by a stamping process and protrudes from the heat dissipating substrate 10 toward one side of the heat dissipating substrate 10, and the heat dissipating protrusion 20 is used for mounting the electronic device 301. The fin structure 30 and the heat dissipation substrate 10 are an integral structure and formed on the heat dissipation substrate 10 through a stamping and/or bending process, and the fin structure 30 is bent towards a side away from the heat dissipation boss 20 relative to the heat dissipation substrate 10.
Referring to fig. 4, a heat sink 200 according to an embodiment of the present disclosure includes a plurality of heat dissipation units 100 according to any of the above embodiments, and the plurality of heat dissipation units 100 are arranged in an array.
Referring to fig. 4 and 5, an electronic apparatus 300 according to an embodiment of the present disclosure includes a plurality of electronic devices 301 and the heat sink 200 according to the above embodiment, each heat dissipation unit 100 of the heat sink 200 corresponds to at least one electronic device 301, and each electronic device 301 is thermally connected to the heat dissipation boss 20 through a heat conduction element 302. The electronic device 300 includes, but is not limited to, a Customer Premise Equipment (CPE), a router, and other electronic products.
It can be appreciated that as the power consumption density of the electronic device 300 rapidly increases (e.g., Customer Premise Equipment (CPE), routers, etc.), the operating temperature of the associated electronic device 301 is exposed to a severe over-temperature risk. At present, the heat sink 200 is usually provided to dissipate heat of the electronic device 301 to ensure the operating temperature thereof.
In the related art, the heat sink is generally manufactured by using die casting and aluminum extrusion processes, however, the heat sink manufactured by using the die casting process has a heavy weight and a high cost after the fins of the heat sink are thicker. Meanwhile, the radiator formed by the aluminum extrusion process is generally processed by adding a CNC (computerized numerical control) machining procedure in order to adapt to the complicated structural shape, and the cost is high.
In the heat dissipating unit 100, the heat sink 200, and the electronic device 300 according to the embodiment of the present application, the heat dissipating bosses 20 are formed on the heat dissipating substrate 10 by a stamping process, and the fin structures 30 may also be formed on the heat dissipating substrate 10 by a stamping and/or bending process, which is a relatively simple process.
It can be understood that, during the use of the electronic apparatus 300, the electronic device 301 in the electronic apparatus 300 generates heat continuously, and the heat accumulation of the electronic device 301 may cause the electronic device 301 to fail, so that the performance of the electronic apparatus 300 is reduced, and the use experience of the user on the electronic apparatus 300 is affected. Therefore, the heat dissipation unit 100 needs to be correspondingly disposed on different electronic devices 301 in the electronic apparatus 300, and the heat dissipation unit 100 can lead out heat of the electronic devices 301 through the heat conducting element 302, so as to ensure that heat that can be generated by the electronic devices 301 is not accumulated, thereby ensuring performance of the electronic apparatus 300.
In the embodiment of the present application, the heat sink 200 may be formed by a plurality of heat dissipation units 100, and the arrangement of the plurality of heat dissipation units 100 in an array may increase the heat dissipation channels of the heat sink 200, thereby ensuring the heat conduction speed. By disposing the heat sink 200 in the electronic apparatus 300, the heat dissipating unit 100 may be connected to the heat conducting unit of the electronic device 301, and thus, the heat sink 200 may perform a function of dissipating heat for the electronic apparatus 300.
It should be noted that the electronic devices 301 in the electronic apparatus 300 often have different heights, for example, different chips on a motherboard have different heights, and thus the heat dissipating bosses 20 of different heat dissipating units 100 of the heat sink 200 may have different depths, so that the heat of the electronic devices 301 with different heights can be in contact with the heat dissipating bosses 20 with different depths to conduct heat. Of course, in some embodiments, the thickness of the heat conducting element 302 may also be changed to ensure that the electronic device 301 is connected with the heat dissipation boss 20 through the heat conducting element 302 in a heat conducting manner, so as to ensure the heat dissipation effect.
Specifically, the heat dissipation unit 100 includes a heat dissipation substrate 10, a heat dissipation boss 20 and a fin structure 30, the heat dissipation boss 20 may contact the heat conducting element 302, so that heat generated by the electronic device 301 may be transferred to the heat dissipation substrate 10 through the heat dissipation boss 20, the heat dissipation substrate 10 transfers the heat to the fin structure 30, a contact area between the fin structure 30 and air is larger, the fin structure 30 may dissipate the heat in the air, thereby transferring the heat of the electronic device 300 to the air, and thereby achieving a heat dissipation effect.
Further, the heat dissipating protrusion 20 is formed on the heat dissipating substrate 10 by a stamping process, that is, the heat dissipating protrusion 20 and the heat dissipating substrate 10 are integrally formed, so that heat can be better transferred. The fin structure 30 may also be formed on the heat dissipating substrate 10 by a stamping process, or by a bending process, or by a stamping and bending process at the same time, on the basis of the heat dissipating substrate 10, so that the heat dissipating unit 100 has a simple processing process and a low cost, and can also be applied to a complex structure of the electronic device 300, thereby ensuring the heat dissipating efficiency of the electronic device 300.
In the embodiment of the present application, the type of the heat conducting element 302 is not limited, for example, the heat conducting element 302 may be a heat conducting silicone grease, which is sufficient. In addition, in the embodiment of the present application, the material of the heat dissipation unit 100 is not limited, for example, the heat dissipation unit 100 may be a metal alloy such as an aluminum alloy and a copper alloy to meet various requirements.
The electronic device 300 in the embodiment of the present application may be a mobile terminal device such as a smart phone and a tablet computer, or may be a device that can be equipped with a display device such as a game device, a vehicle-mounted computer, a notebook computer, and a video player, and is not particularly limited herein.
Referring to fig. 1 to 3, in some embodiments, the fin structure 30 includes a first fin structure 31 and a second fin structure 32, the first fin structure 31 and the second fin structure 32 are respectively formed at two ends of the heat dissipation substrate 10 through a stamping and/or bending process, and a first heat dissipation channel 33 is formed between the first fin structure 31 and the second fin structure 32.
Thus, two fin structures 30 may be formed on one heat dissipation unit 100 to further increase the contact area between the heat dissipation unit 100 and the air, and meanwhile, the airflow may flow through the first heat dissipation channel 33 formed between the first fin structure 31 and the second fin structure 32, so as to enhance the heat dissipation capability of the heat dissipation unit 100 and ensure the performance of the electronic device 300.
Specifically, the fin structures 30 are formed on two sides of the heat dissipation substrate 10 at the same time, so that on one hand, the contact area between the heat dissipation unit 100 and the air can be ensured, and on the other hand, the first heat dissipation channel 33 is formed between the first fin structure 31 and the second fin structure 32, so that the airflow can be relatively concentrated, the flow velocity of the airflow can be increased, and the heat dissipation effect of the heat dissipation unit 100 can be further increased.
In addition, the heat sink 200 of the present embodiment may arrange a plurality of heat dissipation units 100 in an array to enhance the heat dissipation effect of the heat sink 200. In an example, referring to fig. 6, the heat sink 200 may transversely array a plurality of heat dissipating units 100 in a single row, so that an air flow may pass through the side-by-side heat dissipating channels of the plurality of heat dissipating units 100 to take away heat of the plurality of heat dissipating units 100, thereby ensuring the heat dissipating efficiency of the heat sink 200. In another example, referring to fig. 7, the heat sink 200 may be formed by longitudinally arraying a plurality of heat dissipating units 100 in a single row, so that the airflow may continuously pass through a plurality of heat dissipating channels to remove heat from the plurality of heat dissipating units 100, thereby ensuring the heat dissipating efficiency of the heat sink 200. In another example, referring to fig. 8, the heat sink 200 may be configured to bidirectionally array a plurality of heat dissipating units 100, that is, the plurality of heat dissipating units 100 may be arranged in a rectangular shape, and when an air flow passes through the heat dissipating channel, the heat in the plurality of heat dissipating units 100 may be taken away, so as to ensure the heat dissipating efficiency of the heat sink 200. In another example, referring to fig. 9, the heat sink 200 may be configured to bidirectionally and randomly array a plurality of heat dissipation units 100, so that the plurality of heat dissipation units 100 may be correspondingly disposed on the electronic devices 301 distributed irregularly, thereby ensuring the heat dissipation effect of the heat sink 200.
It should be noted that, the arrangement of the heat dissipation units 100 often keeps the directions of the heat dissipation channels consistent, so that the airflow can smoothly pass through the heat dissipation units, and the problem of air non-circulation caused by the mutual blockage of the heat dissipation channels is avoided. Of course, the specific distribution structure of the heat dissipation units 100 in the heat sink 200 may be determined according to the structural shape of the electronic device 300, so as to ensure the heat dissipation effect of the heat sink 200 on the electronic device 300.
Referring to fig. 1 to 3, in some embodiments, the first fin structure 31 includes a first bent portion 311, a second bent portion 312, and a third bent portion 313.
The first bending portion 311 is bent toward a side away from the heat dissipating protrusion 20 with respect to the heat dissipating substrate 10 by a stamping and/or bending process.
The second bending portion 312 is connected to the first bending portion 311 and is bent toward a side of the second fin structure 32 corresponding to the first bending portion 311.
The third bending portion 313 is connected to the second bending portion 312 and bends toward the substrate side relative to the second bending portion 312.
The second bending portion 312 is connected between the first bending portion 311 and the third bending portion 313, and the first bending portion 311, the second bending portion 312 and the third bending portion 313 together enclose the second heat dissipation channel 34.
In this way, the first bent portion 311, the second bent portion 312 and the third bent portion 313 may form the second heat dissipation channel 34, and the second heat dissipation channel 34 is arranged in parallel with the first heat dissipation channel 33, so that the airflow can flow through the first heat dissipation channel 33 and the second heat dissipation channel 34 to take away the heat on the first bent portion 311, the second bent portion 312, the third bent portion 313 and the heat dissipation substrate 10, thereby ensuring the heat dissipation efficiency of the heat dissipation unit 100.
Specifically, the first fin structure 31 is formed by a stamping process, a bending process, or by a stamping and bending process to form a first bent portion 311, a second bent portion 312, and a third bent portion 313, the first bent portion 311, the second bent portion 312, and the third bent portion 313 together form a second heat dissipation channel 34, and a first heat dissipation channel 33 is formed between the third bent portion 313 and the second fin structure 32, so that the two heat dissipation channels can relatively concentrate the airflow and increase the flow rate, thereby improving the heat dissipation efficiency of the heat dissipation unit 100.
Referring to fig. 1 to 3, in some embodiments, the first bending portion 311 and the third bending portion 313 are parallel to each other and perpendicular to the heat dissipation substrate 10, and the second bending portion 312 is parallel to the heat dissipation substrate 10.
Therefore, the heat dissipation units 100 are regular and complete in structure, the space occupied by a single heat dissipation unit 100 is small, the plurality of heat dissipation units 100 can be arranged in an array, the geometric compatibility is high, the electronic device 300 is reasonable in spatial distribution, and the heat dissipation effect is good.
It is understood that the electronic device 300 is being developed to be thinner and lighter, and the heat sink 200 and other structures need to be as lightweight as possible, and occupy as little space as possible inside the electronic device 300. Therefore, the first bending portion 311 and the third bending portion 313 are parallel to each other and perpendicular to the heat dissipation substrate 10, and the second bending portion 312 is parallel to the heat dissipation substrate 10, so that the heat dissipation unit 100 has a regular structure, and the occupied space is rectangular, which is beneficial to the spatial distribution of the electronic device 300, and the electronic device 300 can be made thinner and lighter on the premise of ensuring the heat dissipation efficiency.
Referring to fig. 1 to 3, in some embodiments, the second fin structure 32 is disposed symmetrically to the first fin structure 31, and the second fin structure 32 includes a fourth bending portion 321, a fifth bending portion 322, and a sixth bending portion 323.
The fourth bending portion 321 is bent toward a side away from the heat dissipating protrusion 20 relative to the heat dissipating substrate 10 by a stamping and/or bending process.
The fifth bending portion 322 is connected to the fourth bending portion 321 and is bent toward a side of the first sheet structure relative to the fourth bending portion 321.
The sixth bending portion 323 is connected to the fifth bending portion 322 and bends toward the substrate side with respect to the fifth bending portion 322.
The fifth bending portion 322 is connected between the fourth bending portion 321 and the sixth bending portion 323, the fourth bending portion 321, the fifth bending portion 322 and the sixth bending portion 323 together enclose a third heat dissipation channel 35, and the first heat dissipation channel 33 is formed between the third bending portion 313 and the sixth bending portion 323.
Thus, the fourth bending portion 321, the fifth bending portion 322 and the sixth bending portion 323 can jointly form the third heat dissipation channel 35, and the third heat dissipation channel 35 can be arranged in parallel with the second heat dissipation channel 34 and the first heat dissipation channel 33, so that the airflow can flow through the first heat dissipation channel 33, the second heat dissipation channel 34 and the third heat dissipation channel 35 to take away the heat on the second fin structure 32, the first fin structure 31 and the heat dissipation substrate 10, thereby ensuring the heat dissipation efficiency of the heat dissipation unit 100.
Specifically, the second fin structure 32 is symmetrically disposed with respect to the first fin structure 31, and the fourth bent portion 321, the fifth bent portion 322, and the sixth bent portion 323 are also symmetrically disposed with respect to the first bent portion 311, the second bent portion 312, and the third bent portion 313, so that the structure of the heat dissipation unit 100 is more regular and the occupied space is smaller. Meanwhile, the fourth bent portion 321, the fifth bent portion 322 and the sixth bent portion 323 together enclose a third heat dissipation channel 35, the first bent portion 311, the second bent portion 312 and the third bent portion 313 together enclose a second heat dissipation channel 34, and a first heat dissipation channel 33 is formed between the third bent portion 313 and the sixth bent portion 323, that is, three heat dissipation channels arranged in parallel may be formed in one heat dissipation unit 100. The three heat dissipation channels can gather the airflow to ensure the flow rate of the airflow, and increase the contact area between the heat dissipation unit 100 and the air, so that the heat of the heat dissipation unit 100 can be conveniently led out, and the heat dissipation efficiency of the heat dissipation unit 100 can be ensured.
Referring to fig. 1 to 3, in some embodiments, a distance between the first bent portion 311 and the fourth bent portion 321 is 27mm to 33mm, a distance between the first bent portion 311 and the third bent portion 313 is 9mm to 11mm, and a distance between the third bent portion 313 and the sixth bent portion 323 is 9mm to 11 mm. For example, the first bent portion 311 and the fourth bent portion 321 may be spaced apart by 27mm, 28mm, 29mm, 30mm, 31mm, 32mm, 33 mm; the first bent portion 311 and the third bent portion 313 may be spaced apart by 9mm, 10mm, and 11mm, and the third bent portion 313 and the sixth bent portion 323 may be spaced apart by 9mm, 10mm, and 11 mm.
So, can guarantee on the one hand that radiating unit 100 can realize processing through the technology of buckling and punching press, avoid different kinks to hinder each other, cause the problem of unable processing, on the other hand can guarantee that radiating unit 100 can set up on electronic equipment 300 to be connected with electronic device 301 heat conduction, shared electronic equipment 300's inner space also still less.
For example, the distance between the first bent part 311 and the fourth bent part 321 may be 30 mm; a distance between the first bent portion 311 and the third bent portion 313 may be 10mm, and a distance between the third bent portion 313 and the sixth bent portion 323 may be 10 mm. Under this size distance, convenient processing, the ability that the first heat dissipation channel 33, second heat dissipation channel 34 and the third heat dissipation channel 35 that form simultaneously gathered the air current is stronger, and then has promoted the radiating efficiency.
Referring to fig. 10 and 11, in some embodiments, the second fin structure 32 includes a seventh bending portion 324, the seventh bending portion 324 is bent toward a side away from the heat dissipating protrusion 20 relative to the heat dissipating substrate 10 by a stamping and/or bending process, and a first heat dissipating channel 33 is formed between the seventh bending portion 324 and the third bending portion 313.
Thus, the second fin structure 32 is simplified, so that the heat dissipation unit 100 can include two heat dissipation channels, namely the first heat dissipation channel 33 and the second heat dissipation channel 34, thereby reducing the weight of the heat dissipation unit 100 while ensuring the heat dissipation efficiency, further reducing the weight of the heat sink 200, and realizing the lightness and thinness of the electronic device 300.
In particular, in such an embodiment, the heat dissipation unit 100 includes two heat dissipation channels, simplifying the second fin structure 32 to further reduce the difficulty of machining. On the premise that the two heat dissipation channels ensure the heat dissipation efficiency, the structure of the heat dissipation unit 100 can be reduced, and the light-weight design of the electronic device 300 is realized.
Referring to fig. 10 and 11, in some embodiments, a distance between the first bending portion 311 and the third bending portion 313 is 9mm to 11mm, a distance between the seventh bending portion 324 and the first bending portion 311 is 18mm to 22mm, and a distance between the seventh bending portion 324 and the third bending portion 313 is 9mm to 11 mm. For example, the first bent portion 311 and the third bent portion 313 may be spaced apart by 9mm, 10mm, and 11mm, the seventh bent portion 324 and the first bent portion 311 may be spaced apart by 18mm, 19mm, 20mm, 21mm, and 22mm, and the seventh bent portion 324 and the third bent portion 313 may be spaced apart by 9mm, 10mm, and 11 mm.
So, can guarantee on the one hand that radiating element 100 can realize processing through the technology of buckling and punching press, avoid different kinks to hinder each other, cause the problem of unable processing, on the other hand can guarantee that radiating element 100 can set up on electronic equipment 300 to be connected with electronic device 301 heat conduction, realized electronic equipment 300's lightweight, frivolousization simultaneously.
For example, the distance between the first bent portion 311 and the third bent portion 313 may be 10mm, the distance between the seventh bent portion 324 and the first bent portion 311 is 20mm, and the distance between the seventh bent portion 324 and the third bent portion 313 may be 10 mm. Under this size distance, further reduce the processing degree of difficulty, the first heat dissipation channel 33 and the second heat dissipation channel 34 that form simultaneously have the ability of stronger aggregate air current, and then have promoted the radiating efficiency.
Referring to fig. 12 and 13, in some embodiments, the first fin structure 31 includes an eighth kink portion 314, and the second fin structure 32 includes a ninth kink portion 325.
The eighth bending portion 314 is connected to one end of the heat dissipating substrate 10 and is bent toward a side away from the heat dissipating protrusion 20 relative to the heat dissipating substrate 10 through a stamping and/or bending process.
The ninth bending portion 325 is connected to the other end of the heat dissipating substrate 10, and is bent toward a side away from the heat dissipating protrusion 20 relative to the heat dissipating substrate 10 through a stamping and/or bending process, and is disposed opposite to the eighth bending portion 314 at an interval.
Therefore, the first fin structure 31 and the second fin structure 32 are simplified at the same time, so that the heat dissipation unit 100 only includes the first heat dissipation channel 33, the weight of the heat dissipation unit 100 is further reduced while the heat dissipation efficiency is ensured, the weight of the heat sink 200 is further reduced, and the electronic device 300 is light and thin.
Specifically, in such an embodiment, the heat dissipation unit 100 includes only one heat dissipation channel, while simplifying the first fin structure 31 and the second fin structure 32 to further reduce the difficulty of processing. On the premise that the first heat dissipation channel 33 ensures the heat dissipation efficiency, the structure of the heat dissipation unit 100 can be further reduced, and the light-weight design of the electronic device 300 is realized.
Referring to fig. 12 and 13, in some embodiments, the distance between the eighth bent portion 314 and the ninth bent portion 325 is 9mm to 11 mm. For example, the spacing distance between the eighth kink portion 314 and the ninth kink portion 325 may be 9mm, 10mm, 11 mm.
So, can guarantee on the one hand that radiating element 100 can realize processing through the technology of buckling and punching press, avoid different kinks to hinder each other, cause the problem of unable processing, on the other hand can guarantee that radiating element 100 can set up on electronic equipment 300 to be connected with electronic device 301 heat conduction, realized electronic equipment 300's lightweight, frivolousization simultaneously.
For example, the spacing distance between the eighth bent portion 314 and the ninth bent portion 325 may be 10 mm. Under this size distance, the processing difficulty is further reduced, the weight of the heat dissipation unit 100 is lighter, and the formed first heat dissipation channel 33 has a stronger ability of gathering air flow, thereby improving the heat dissipation efficiency.
Referring to fig. 5, in some embodiments, the number of the heat dissipating bosses 20 is multiple, and at least two of the heat dissipating bosses 20 have different heights.
Thus, a plurality of heat dissipation bosses 20 can be correspondingly disposed on one heat dissipation unit 100 to correspond to a plurality of electronic devices 301, so that one heat dissipation unit 100 can dissipate heat for the plurality of electronic devices 301. When the heights of the electronic devices 301 are different, the heights of the corresponding heat dissipation bosses 20 are also different, so that the heat dissipation bosses 20 can correspondingly contact the electronic devices 301, and the heat dissipation effect of the heat dissipation unit 100 is ensured.
It will be appreciated that the shape and height of different electronic devices 301 of the electronic apparatus 300 will tend to be different, while the locations at which multiple electronic devices 301 may be located are relatively concentrated. Thus, one heat dissipation unit 100 can be used, a plurality of heat dissipation bosses 20 are arranged on the heat dissipation unit 100, the heights of at least two of the plurality of heat dissipation bosses 20 are different so as to correspond to the electronic devices 301 with different heights, and one heat dissipation unit 100 serves as a plurality of electronic devices 301 with different heights, so that the heat dissipation effect of the heat dissipation unit 100 is improved.
Referring to fig. 14, a method for manufacturing a heat dissipation unit 100 according to an embodiment of the present disclosure includes:
01, providing a metal plate;
02, stamping a metal plate to form a heat dissipation boss 20 on the metal plate;
03, stamping and/or bending a metal plate to form the heat dissipation substrate 10 and the fin structure 30 connected with the heat dissipation substrate 10;
the heat dissipation boss 20 is located on the heat dissipation substrate 10 and protrudes from the heat dissipation substrate 10 toward one side of the heat dissipation substrate 10, and the fin structure 30 is bent toward one side away from the heat dissipation boss 20 relative to the heat dissipation substrate 10.
In the manufacturing method of the heat dissipating unit 100 according to the embodiment of the present application, the heat dissipating protrusion 20 is formed on the heat dissipating substrate 10 by a stamping process, and the fin structure 30 is also formed on the heat dissipating substrate 10 by a stamping and/or bending process, so that the manufacturing process is simple, the cost is low, and a complex structure can be handled.
Specifically, the restrictive step 01, then step 02 and step 03 are performed, steps 02 and 03 may be exchanged. That is, a metal plate is provided through step 01, a heat dissipation boss 20 is formed on the metal plate through step 02, and a heat dissipation substrate 10 and a fin structure 30 connected to the heat dissipation substrate 10 are formed through step 03, so as to form the heat dissipation unit 100 of the present application. Alternatively, a metal plate is provided in step 01, and then the heat dissipation substrate 10 and the fin structure 30 connected to the heat dissipation substrate 10 are formed in step 03, and finally the heat dissipation boss 20 is formed on the metal plate in step 02, so as to form the heat dissipation unit 100 of the present application.
In the description of the embodiments of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically defined otherwise.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A heat dissipating unit, comprising:
a heat-dissipating substrate;
the heat dissipation boss is formed on the heat dissipation substrate through a stamping process and protrudes out of the heat dissipation substrate towards one side of the heat dissipation substrate, and the heat dissipation boss is used for mounting an electronic device;
the fin structure and the heat dissipation base plate are of an integrated structure and are formed on the heat dissipation base plate through a stamping and/or bending process, and the fin structure is bent towards one side, which deviates from the heat dissipation boss, of the heat dissipation base plate.
2. The heat dissipation unit according to claim 1, wherein the fin structures include a first fin structure and a second fin structure, the first fin structure and the second fin structure are respectively formed at both ends of the heat dissipation substrate through a punching and/or bending process, and a first heat dissipation channel is formed between the first fin structure and the second fin structure.
3. The heat dissipation unit of claim 2, wherein the first fin structure comprises a first bend, a second bend, and a third bend;
the first bending part is bent towards one side, away from the heat dissipation boss, of the heat dissipation substrate through a stamping and/or bending process;
the second bent part is connected with the first bent part and bent towards one side of the second fin structure relative to the first bent part;
the third bending part is connected with the second bending part and bends towards one side of the substrate relative to the second bending part;
the second bending part is connected between the first bending part and the third bending part, and the first bending part, the second bending part and the third bending part enclose a second heat dissipation channel together.
4. The heat dissipating unit of claim 3, wherein the first bending portion and the third bending portion are parallel to each other and perpendicular to the heat dissipating substrate, and the second bending portion is parallel to the heat dissipating substrate.
5. The heat dissipation unit according to claim 3, wherein the second fin structure is disposed symmetrically to the first fin structure, and the second fin structure includes a fourth bent portion, a fifth bent portion, and a sixth bent portion;
the fourth bending part is bent towards one side, away from the heat dissipation boss, of the heat dissipation substrate through a stamping and/or bending process;
the fifth bending part is connected with the fourth bending part and is bent towards one side of the first sheet structure relative to the fourth bending part;
the sixth bending part is connected with the fifth bending part and bends towards one side of the substrate relative to the fifth bending part;
the fifth bending part is connected between the fourth bending part and the sixth bending part, the fourth bending part, the fifth bending part and the sixth bending part enclose a third heat dissipation channel together, and the first heat dissipation channel is formed between the third bending part and the sixth bending part.
6. The heat dissipating unit according to claim 5, wherein a distance between the first bent portion and the fourth bent portion is 27mm to 33mm, a distance between the first bent portion and the third bent portion is 9mm to 11mm, and a distance between the third bent portion and the sixth bent portion is 9mm to 11 mm.
7. The heat dissipating unit according to claim 3, wherein the second fin structure includes a seventh bent portion, the seventh bent portion is bent toward a side away from the heat dissipating protrusion with respect to the heat dissipating substrate by a stamping and/or bending process, and the first heat dissipating channel is formed between the seventh bent portion and the third bent portion.
8. The heat dissipating unit of claim 1, wherein the first fin structure comprises an eighth bend and the second fin structure comprises a ninth bend;
the eighth bending part is connected to one end of the heat dissipation substrate and bends towards one side, away from the heat dissipation boss, of the heat dissipation substrate through a stamping and/or bending process;
the ninth bending part is connected to the other end of the heat dissipation substrate, bends towards one side away from the heat dissipation boss relative to the heat dissipation substrate through a stamping and/or bending process, and is arranged opposite to the eighth bending part at an interval.
9. The heat dissipating unit of claim 1, wherein the number of the heat dissipating bosses is plural, and at least two of the plurality of the heat dissipating bosses have different heights.
10. An electronic device, comprising:
a plurality of electronic devices; and
the heat dissipating unit of any of claims 1-9, each of the heat dissipating units corresponding to at least one of the electronic devices, each of the electronic devices being thermally coupled to the heat dissipating boss via a thermally conductive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111227528.9A CN113966149A (en) | 2021-10-21 | 2021-10-21 | Heat dissipation unit and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111227528.9A CN113966149A (en) | 2021-10-21 | 2021-10-21 | Heat dissipation unit and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113966149A true CN113966149A (en) | 2022-01-21 |
Family
ID=79465403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111227528.9A Pending CN113966149A (en) | 2021-10-21 | 2021-10-21 | Heat dissipation unit and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113966149A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115297674A (en) * | 2022-06-30 | 2022-11-04 | 杭州逗酷软件科技有限公司 | Radiator, manufacturing method of radiator and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686958A (en) * | 2017-03-07 | 2017-05-17 | 上海嘉熙科技有限公司 | Heat superconducting fin type radiator and electrical device case |
| CN207555497U (en) * | 2017-11-06 | 2018-06-29 | 海纳川海拉（三河）车灯有限公司 | A kind of Vehicle lamp structure with radiating fin |
| CN112188792A (en) * | 2019-07-03 | 2021-01-05 | 伊顿智能动力有限公司 | Heat radiator |
| CN112911893A (en) * | 2020-12-25 | 2021-06-04 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
-
2021
- 2021-10-21 CN CN202111227528.9A patent/CN113966149A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686958A (en) * | 2017-03-07 | 2017-05-17 | 上海嘉熙科技有限公司 | Heat superconducting fin type radiator and electrical device case |
| CN207555497U (en) * | 2017-11-06 | 2018-06-29 | 海纳川海拉（三河）车灯有限公司 | A kind of Vehicle lamp structure with radiating fin |
| CN112188792A (en) * | 2019-07-03 | 2021-01-05 | 伊顿智能动力有限公司 | Heat radiator |
| CN112911893A (en) * | 2020-12-25 | 2021-06-04 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115297674A (en) * | 2022-06-30 | 2022-11-04 | 杭州逗酷软件科技有限公司 | Radiator, manufacturing method of radiator and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6731501B1 (en) | Heat dissipating device for dissipating heat generated by a disk drive module inside a computer housing | |
| EP1353376B1 (en) | Heat sink with multiple surface enhancements | |
| US20030011990A1 (en) | Heat dissipating assembly with heat pipes | |
| KR200448519Y1 (en) | Heat sink for protrusion type ic package | |
| US7690418B2 (en) | Heat sink | |
| JP5522066B2 (en) | Optical communication card module | |
| US20080101027A1 (en) | Heat dissipation device | |
| CN113966149A (en) | Heat dissipation unit and electronic device | |
| US8579016B2 (en) | Heat dissipation device with heat pipe | |
| EP3787387A1 (en) | Inverter and heat dissipation device thereof | |
| CN115119464A (en) | Heat abstractor and communication equipment | |
| CN215301269U (en) | Radiator, electronic component and electronic equipment | |
| CN216250709U (en) | Uniform temperature heat dissipation device | |
| CN214481964U (en) | Vapor chamber and electronic apparatus | |
| CN210168291U (en) | Power management circuit board, battery pack, electric equipment and movable platform | |
| CN217932631U (en) | Heat dissipation device and server | |
| CN212341822U (en) | CPU heat dissipation device and CPU server | |
| CN211792594U (en) | Electronic equipment | |
| CN212344335U (en) | Heat dissipation device and plug box | |
| CN220274122U (en) | Multi-heat source heat dissipation module | |
| CN220528278U (en) | Circuit board assembly | |
| CN217719572U (en) | Power device heat radiation structure and power module | |
| CN213207360U (en) | LED bar light source is with high-efficient heat dissipation aluminum alloy structure subassembly | |
| CN216852647U (en) | Upper shell structure of inverter for improving heat dissipation efficiency | |
| CN212436200U (en) | Heat dissipation device for LED screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |