CN113964151A - Full-color micro display device and preparation method thereof - Google Patents
Full-color micro display device and preparation method thereof Download PDFInfo
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Abstract
The application relates to the technical field of display, and discloses a full-color micro display device and a preparation method thereof, wherein the full-color micro display device comprises a light-emitting substrate and a driving substrate, the light-emitting substrate is bonded with the driving substrate, a full-color display array is formed on the light-emitting substrate, and the light-emitting substrate comprises a red light LED light-emitting substrate, a green light LED light-emitting substrate and a blue light LED light-emitting substrate; red LED chip pixels and a first polarizer are arranged on the red LED light-emitting substrate; the green LED light-emitting substrate is provided with green LED chip pixels and a second polarizer; the blue LED light-emitting substrate is provided with blue LED chip pixels and a third polarizer; the polarization directions of the adjacent first polarizer, the second polarizer and the third polarizer are mutually vertical. The polarizers which form an angle of 90 degrees with each other are arranged above the LED chip pixels with different colors, so that the polarized light emitted by the LED chip pixels with different colors can not generate crosstalk.
Description
Technical Field
The application relates to the technical field of display, and mainly relates to a full-color micro display device and a preparation method thereof.
Background
An LED (light Emitting Diode, abbreviated as LED) is a solid semiconductor device capable of converting electric energy into visible light, and as a novel and efficient solid light source, semiconductor Lighting has the significant advantages of long service time, energy saving, environmental protection, safety and the like, and is widely applied to the fields of display, Lighting, signal indicator lamps and the like.
When the size of the LED chip pixel is reduced to several tens of micrometers or even several micrometers, the Micro-LED chip pixel is called as a Micro-LED chip pixel, and Micro-LED display is an array display technology composed of micron-sized semiconductor light emitting units, and compared with the conventional OLED and LCD display technologies, the Micro-LED display has the advantages of high brightness, wide color gamut, low energy consumption, fast response time, high reliability and the like, so the Micro-LED display has a very wide application prospect in the fields of wearable equipment, Augmented Reality (AR), Virtual Reality (VR), visible light communication and the like, and is also considered as a next generation display technology.
If the full-color LED is completely used, RGB three-primary-color LED chip pixels need to be respectively integrated on the same substrate. In the Micro-LED display device in the prior art, the Micro-LED chip pixels generally adopt an inverted structure, namely, the cathode/anode of the Micro-LED is arranged on the same side of the chip, so that the Micro-LED display device has the advantages of easy transfer and packaging and simple subsequent processing, but because the Micro-LED side surface has obvious light emitting and small distance, the problem of optical crosstalk is easy to occur among the RGB three-primary-color LED chip pixels on the same substrate, and the display performance of the Micro-LED can be reduced. To solve the problem of optical crosstalk, optical Isolation (Isolation) is typically provided between the pixels of the RGB three primary LED chips. However, since quantum wells emitting three colors of red, green and blue cannot be grown on the same substrate at one time, if LEDs are completely used to realize full-color, three times of hybrid bonding (hybrid bonding) is required, and if the pixel substrate of an LED chip of each color is optically isolated and then is subjected to hybrid bonding, the problem of optical crosstalk still cannot be avoided; if the mixed bonding is performed before the isolation is performed, the problem of pixel crosstalk in the off-position process cannot be solved, and the process difficulty is high.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present application aims to provide a full-color micro display device and a method for fabricating the same, and aims to provide a new pixel isolation structure, which can not only solve the problem of optical crosstalk between pixels, but also improve the definition and contrast of the image.
The technical scheme of the application is as follows:
a full-color micro display device comprises a light-emitting substrate and a driving substrate, wherein the light-emitting substrate is bonded with the driving substrate, and a full-color display array is formed on the light-emitting substrate, wherein the light-emitting substrate comprises a red light LED light-emitting substrate, a green light LED light-emitting substrate and a blue light LED light-emitting substrate;
the red LED light-emitting substrate is provided with at least one red LED chip pixel, the light-emitting side of the red LED light-emitting substrate is provided with a first polarizer, and the first polarizer is arranged right above the red LED chip pixel;
the green light LED light-emitting substrate is provided with at least one green light LED chip pixel, the light-emitting side of the green light LED light-emitting substrate is provided with a second polarizer, and the second polarizer is arranged right above the green light LED chip pixel;
the blue light LED light-emitting substrate is provided with at least one blue light LED chip pixel, the light-emitting side of the blue light LED light-emitting substrate is provided with a third polarizer, and the third polarizer is arranged right above the blue light LED chip pixel;
the light emitting sides of the red light LED light emitting substrate, the green light LED light emitting substrate and the blue light LED light emitting substrate face upwards and are arranged on the driving substrate in an overlapping mode;
the red LED chip pixels, the green LED chip pixels and the blue LED chip pixels are distributed at intervals, so that the red LED chip pixels, the green LED chip pixels and the blue LED chip pixels form a full-color display array after the red LED light-emitting substrate, the green LED light-emitting substrate and the blue LED light-emitting substrate are superposed;
the polarization directions of the adjacent first polarizer, the second polarizer and the third polarizer are mutually vertical.
Because the red light LED chip pixels, the green light LED chip pixels and the blue light LED chip pixels are respectively integrated on different LED light-emitting substrates, and the polarizers which mutually form 90 degrees are arranged above the LED chip pixels with different colors, the polarized light emitted by the LED chip pixels with different colors can not generate crosstalk.
The full-color micro display device is characterized in that the light-emitting substrate and the driving substrate are bonded in a mixed bonding mode;
and the red light LED light-emitting substrate, the green light LED light-emitting substrate and the blue light LED light-emitting substrate are bonded in a mixed bonding mode. And the bonding mode of hybrid bonding is adopted, so that the size of the full-color micro display device can be reduced.
The full-color micro display device is characterized in that the first polarizer, the second polarizer and the third polarizer are metal wire grids.
The full-color micro display device comprises a metal wire grid, wherein the thickness of the metal wire grid is 100 nm-500 nm, the width of the wire grid of the metal wire grid is 100-300 nm, and the wire grid interval of the metal wire grid is 100-300 nm.
The full-color micro display device is characterized in that the thicknesses of the red light LED light-emitting substrate, the green light LED light-emitting substrate and the blue light LED light-emitting substrate are respectively 5-10 micrometers.
Full-color miniature display device, wherein, on the LED luminescent substrate of difference and adjacent the pixel pitch of LED chip pixel is 0.8um ~5 um.
The full-color micro display device, wherein, in one of the metal wire grids, the first metal wire grid on one side of the metal wire grid is a widening wire grid, and the width of the widening wire grid is greater than the width of other wire grids.
A preparation method of the full-color micro display device comprises the following steps:
step (1): preparing a red light LED light-emitting substrate, and manufacturing a first polarizer on the red light LED light-emitting substrate;
step (2): preparing a green light LED light-emitting substrate, and manufacturing a second polarizer on the green light LED light-emitting substrate;
and (3): preparing a blue light LED light-emitting substrate, and manufacturing a third polarizer on the blue light LED light-emitting substrate;
and (4): and the light emitting sides of the red light LED light emitting substrate, the green light LED light emitting substrate and the blue light LED light emitting substrate face upwards and are bonded with the driving substrate.
The preparation method of the full-color micro display device comprises the following steps of, when the first polarizer is a metal wire grid, manufacturing the first polarizer on the red LED light-emitting substrate:
depositing a metal layer on the light-emitting side of the red light LED light-emitting substrate, and forming a metal wire grid above the red light LED chip pixel through photoetching and etching;
when the second polarizer is a metal wire grid, the process for manufacturing the second polarizer on the green light LED light-emitting substrate comprises the following steps:
depositing a metal layer on the light-emitting side of the green LED light-emitting substrate, and forming a metal wire grid above the green LED chip pixel through photoetching and etching;
when the third polarizer is a metal wire grid, the process of manufacturing the third polarizer on the blue light LED light-emitting substrate includes the following steps:
and depositing a metal layer on the light-emitting side of the blue light LED light-emitting substrate, and forming a metal wire grid above the blue light LED chip pixel by photoetching and etching.
The preparation method of the full-color micro display device comprises the following steps before the first polarizer is manufactured on the red LED light-emitting substrate:
thinning the light emitting side of the red light LED light emitting substrate, and etching to remove stress;
before the second polarizer is manufactured on the green LED light-emitting substrate, the method further comprises the following steps:
thinning the light emitting side of the green light LED light emitting substrate, and etching to remove stress;
before the third polarizer is manufactured on the blue LED light-emitting substrate, the method further comprises the following steps:
and thinning the light emitting side of the blue light LED light emitting substrate, and etching to remove stress.
Has the advantages that: the utility model provides a full-color miniature display device provides a new pixel isolation structure, with ruddiness LED, green glow LED, blue light LED integrate respectively on the base plate of difference to set up into 90 polarizers each other through the LED chip pixel top at adjacent different colours, make the polarized light that the LED chip pixel of adjacent different colours sent can not take place to crosstalk, not only can solve the light crosstalk problem between the pixel, can also promote the definition and the contrast of picture.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a full-color micro display device according to an embodiment of the present application.
Fig. 2 is a schematic top view of a full-color micro display device according to an embodiment of the present disclosure.
Description of reference numerals: 1. a drive substrate; 10. a red LED light-emitting substrate; 20. a green LED light-emitting substrate; 30. a blue LED light-emitting substrate; 11. a first polarizer; 12. a second polarizer; 13. a third polarizer.
Detailed Description
The present application provides a full-color micro display device and a method for manufacturing the same, which are further described in detail below in order to make the purpose, technical scheme and effect of the present application clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
In this application, a full-color display array includes at least one pixel, each pixel consisting of a red LED chip pixel, a green LED chip pixel, and a blue LED chip pixel.
The application provides a full-color micro display device, which comprises a light-emitting substrate and a driving substrate, wherein the light-emitting substrate is bonded with the driving substrate, and a full-color display array is formed on the light-emitting substrate;
the light-emitting substrate comprises a red light LED light-emitting substrate, a green light LED light-emitting substrate and a blue light LED light-emitting substrate;
the red LED light-emitting substrate is provided with at least one red LED chip pixel, the light-emitting side of the red LED light-emitting substrate is provided with a first polarizer, and the first polarizer is arranged right above the red LED chip pixel;
the green light LED light-emitting substrate is provided with at least one green light LED chip pixel, the light-emitting side of the green light LED light-emitting substrate is provided with a second polarizer, and the second polarizer is arranged right above the green light LED chip pixel;
the blue light LED light-emitting substrate is provided with at least one blue light LED chip pixel, the light-emitting side of the blue light LED light-emitting substrate is provided with a third polarizer, and the third polarizer is arranged right above the blue light LED chip pixel;
the light emitting sides of the red light LED light emitting substrate, the green light LED light emitting substrate and the blue light LED light emitting substrate face upwards and are arranged on the driving substrate in an overlapping mode;
the red LED chip pixels, the green LED chip pixels and the blue LED chip pixels are distributed at intervals, so that the red LED chip pixels, the green LED chip pixels and the blue LED chip pixels form a full-color display array after the red LED light-emitting substrate, the green LED light-emitting substrate and the blue LED light-emitting substrate are superposed;
the polarization directions of the adjacent first polarizer, the second polarizer and the third polarizer are mutually vertical.
The full-color micro display device has the following advantages:
(1) through set up the polarizer that becomes 90 each other above the adjacent LED chip pixel on different LED luminescent substrate, because the polarization direction becomes 90 each other for every LED chip pixel can realize the polarisation display one by one, unable light-emitting, and whole is absorbed, makes the polarized light that the LED chip pixel on the different LED luminescent substrate sent can't take place to crosstalk. Taking a polarizer as a metal wire grid as an example, light emitted by a single pixel of the LED chip forms linearly polarized light in a specific direction after passing through the metal wire grid, and when the light reaches the metal wire grid of an adjacent pixel, which is perpendicular to the polarization direction of the metal wire grid, the light drives metal atoms of the metal wire grid to do work, so that the metal atoms are converted into heat energy to be absorbed or reflected, and thus the heat energy cannot pass through the metal wire grid, which is perpendicular to the polarization direction of the metal wire grid.
(2) The polarizer is integrated on the light-emitting substrate, so that the subsequent preparation of an expensive polarizing optical system or a thicker optical system can be avoided, and the thickness of the whole full-color micro display device is further reduced.
(3) Because the red light LED chip pixels, the green light LED chip pixels and the blue light LED chip pixels are respectively integrated on different LED light-emitting substrates, the problem that the threshold voltages of the red light LED chip pixels, the green light LED chip pixels and the blue light LED chip pixels are different is not required to be considered when the driving circuit is set, the setting of the driving circuit is greatly simplified, corresponding driving voltages can be set for the light-emitting substrates with different colors, and the light-emitting efficiency of each light-emitting substrate is greatly improved.
(4) In the prior art, in order to prevent that the conducting layer between the LED chip pixel can appear the short circuit, all can require to set up great safe distance between the RGB three-colour LED chip pixel in same pixel on same base plate, but in this application scheme, because RGB three-colour LED chip pixel in same pixel sets up on the LED luminescent substrate of difference, therefore, need not to consider the safe distance between the RGB three-colour chip in same pixel, not only can reduce the interval between the adjacent LED chip pixel, can also reduce the distance between pixel and the pixel, make light more concentrated, the definition is higher, the resolution ratio is higher, can also reduce full-color miniature display device's size.
Specifically, as shown in fig. 1, the full-color micro display device sequentially includes, from bottom to top, a driving substrate 1, a red LED light-emitting substrate 10, a green LED light-emitting substrate 20, and a blue LED light-emitting substrate 30.
The wafer bonding technology is one of the key technologies for realizing a three-dimensional integrated circuit, wherein the hybrid bonding technology can realize the internal connection of thousands of chips, greatly improve the performance of the chips, save the area and reduce the cost. Hybrid bonding (hybrid bonding) refers to a bonding method in which the wafer bonding interface has both metal and insulating material. In the present application, the bonding manner between the three-primary-color LED substrates and between the LED substrate and the driving substrate 1 is preferably a hybrid bonding. Namely, the driving substrate 1 is bonded with the red LED light-emitting substrate 10 in a mixed manner, the red LED light-emitting substrate 10 is bonded with the green LED light-emitting substrate 20 in a mixed manner, and the green LED light-emitting substrate 20 is bonded with the blue LED light-emitting substrate 30 in a mixed manner. The hybrid bonding method is prior art and will not be described herein.
In addition, in the present application, there is no special requirement for the stacking order of the red LED light-emitting substrate 10, the green LED light-emitting substrate 20, and the blue LED light-emitting substrate 30, and the substrates can be stacked in different orders.
The first polarizer 11 comprises at least one sub-first polarizer, and each sub-first polarizer is correspondingly arranged right above one red LED chip pixel. As shown in fig. 1, the first polarizer 11 includes two sub-first polarizers, and from left to right, the polarization direction of the first sub-first polarizer is perpendicular to the polarization direction of the second sub-first polarizer.
The second polarizer 12 comprises at least one sub-second polarizer, and each sub-second polarizer is correspondingly arranged right above one pixel of the green LED chip. As shown in fig. 1, the second polarizer 12 includes two sub-second polarizers, and the polarization direction of the first sub-second polarizer is perpendicular to the polarization direction of the second sub-second polarizer from left to right.
The third polarizer 13 comprises the polarization direction of at least one sub-third polarizer, and each sub-third polarizer is correspondingly arranged right above one pixel of the blue light LED chip. As shown in fig. 1, the third polarizer 13 includes two sub-third polarizers, and from left to right, the polarization direction of the first sub-third polarizer is perpendicular to the polarization direction of the second sub-third polarizer.
As shown in fig. 1, the polarization direction of the first sub-first polarizer is perpendicular to the polarization direction of the first sub-second polarizer, the polarization direction of the first sub-second polarizer is perpendicular to the polarization direction of the first sub-third polarizer, the polarization direction of the first sub-third polarizer is perpendicular to the polarization direction of the second sub-first polarizer, the polarization direction of the second sub-first polarizer is perpendicular to the polarization direction of the second sub-second polarizer, and the polarization direction of the second sub-second polarizer is perpendicular to the polarization direction of the second sub-third polarizer.
In the scheme of the application, the polarization directions of the polarizers which are positioned on different LED light-emitting substrates and between adjacent LED chip pixels are only required to be mutually perpendicular. The polarization direction of the polarizers of the LED chip pixels on the same LED light-emitting substrate has no special requirement, namely the polarization direction of the adjacent polarizers on the same LED light-emitting substrate can be vertical or not vertical, and the polarizers on the same LED light-emitting substrate can be continuous or discontinuous. As shown in fig. 2, a-c LED chip pixels of the same color are in the same row, d is the same row including LED chip pixels of different colors, a is that the polarization directions of polarizers on the same LED light-emitting substrate are not perpendicular to each other and the polarizers are discontinuous, b is that the polarization directions of polarizers on the same LED light-emitting substrate are not perpendicular to each other and the polarizers are continuous, c is that the polarization directions of polarizers on the same LED light-emitting substrate are perpendicular to each other and the polarizers are discontinuous, d is that the polarization directions of polarizers on the same row including LED chip pixels of different colors and adjacent LED chip pixels are perpendicular to each other.
Preferably, in order to ensure that the light emitted by each LED chip pixel can be polarized by the polarizer, the outer edge of each polarizer exceeds the outer edge of the corresponding LED chip pixel by 500nm to 1500 nm.
In the scheme of the application, the polarizer can be a metal wire grid. The metal wire grid can be aluminum, and the aluminum has good shrinkage characteristics and does not have the problem that light isolation between pixels is influenced due to high shrinkage force. Preferably, the thickness of the metal wire grids is between 100nm and 500nm, the width of the metal wire grids is between 100nm and 300nm, and the wire grid spacing of the metal wire grids is between 100nm and 300 nm.
Further, as shown in fig. 1, in one metal wire grid, a first metal wire grid on one side of the metal wire grid is a widened wire grid, and the width of the widened wire grid is larger than that of the other wire grids. Through setting up the wire grid that widens, can play direct reflection's effect to adjacent light, through the combination of direct reflection and polarization mode, can further play the light that further restraines adjacent luminous LED chip pixel. The width of the broadening wire grid is less than or equal to 300 nm.
The red light LED light-emitting substrate 10, the green light LED light-emitting substrate 20 and the blue light LED light-emitting substrate 30 can be reduced in thickness by grinding and thinning, and preferably, the thicknesses of the red light LED light-emitting substrate 10, the green light LED light-emitting substrate 20 and the blue light LED light-emitting substrate 30 can be respectively 5-10 μm (the thickness is the whole thickness including the polarizer, the LED chip pixel and the light-emitting substrate).
Furthermore, the pixel pitch (pitch) of the adjacent LED chip pixels on different LED light-emitting substrates is 0.8 um-5 um. Because the RGB three-color LED chip pixels are arranged on different LED light-emitting substrates, the safe distance between the LED chip pixels with different colors does not need to be considered, and therefore, the distance between the adjacent LED chip pixels with different colors can be reduced.
Furthermore, on the same LED light-emitting substrate, the pixel pitch (pitch) of the adjacent LED chips can be between 2.4 um-15 um. The pixel pitch (pitch) refers to the distance between the center points of two adjacent pixels of the LED chip.
The application provides a preparation method of a full-color micro display device, which comprises the following steps:
step (1): preparing a red light LED light-emitting substrate, and manufacturing a first polarizer on the red light LED light-emitting substrate.
At least one red light LED chip pixel is arranged on the red light LED light-emitting substrate. The first polarizer is arranged right above the red LED chip pixel.
The process of preparing the red light LED light emitting substrate may be that a red light LED chip pixel is formed on the substrate by using a Molecular Beam Epitaxy (MBE) preparation process. The process of preparing the red light LED light emitting substrate is prior art and is not described herein. In the scheme of the application, all the LED chip pixels are flip-chip LED chip pixels.
Preferably, before the first polarizer is fabricated on the red LED light emitting substrate, the method further includes the following steps:
and thinning the light emitting side of the red light LED light emitting substrate, and etching to remove stress.
The thickness of the red light LED light-emitting substrate can be reduced by grinding and thinning the light-emitting side of the red light LED light-emitting substrate, so that the overall thickness of the full-color micro display device is reduced. In this step, the thickness of the red LED light emitting substrate can be thinned to 5-10 μm.
The red light LED light-emitting substrate can generate a crack layer due to pure grinding and thinning, and if the stress is not etched after grinding and thinning, cracking can easily occur in the subsequent bonding process, so that the LED chip pixel light emission can be scattered, the efficiency is influenced, and optical crosstalk occurs.
In the present application, the first polarizer may be a wire grid.
When the first polarizer is a metal wire grid, the process of fabricating the first polarizer on the red LED light emitting substrate may include the following steps:
and depositing a metal layer on the light-emitting side of the red light LED light-emitting substrate, and forming a metal wire grid above the red light LED chip pixel by photoetching and etching.
By adopting the method to form the metal wire grid on the red light LED light-emitting substrate, the overall thickness of the polarized light structure can be greatly reduced. In the scheme of this application, metal wire grid can be aluminium, and aluminium has good shrink characteristic, does not have high contractility and influences the problem of optoisolation between the pixel.
Preferably, the thickness of the metal wire grid is between 100nm and 500nm, the width of the metal wire grid is between 100nm and 300nm, and the wire grid spacing is between 100nm and 300 nm.
The Deposition may be PVD (Physical Vapor Deposition).
Specifically, the process of forming the metal wire grid by photoetching and etching can comprise the following steps:
coating photoresist on the surface of the metal layer, processing the photoresist in an exposure and development mode to form a photoresist grating, and etching the metal layer by taking the photoresist grating as a mask to form a metal wire grid.
By adopting the modes of PVD metal deposition, photoetching and metal etching, the difficult problem of alignment of LED chip pixels and large-area polarizers on the red LED light-emitting substrate can be solved, so that the optical isolation effect between the pixels is better.
Step (2): and preparing a green light LED light-emitting substrate, and manufacturing a second polarizer on the green light LED light-emitting substrate.
At least one green LED chip pixel is arranged on the green LED light-emitting substrate. The second polarizer is arranged right above the pixels of the green LED chip.
The process of manufacturing the green LED light emitting substrate may be to form a green LED chip pixel on the substrate by using a Molecular Beam Epitaxy (MBE) manufacturing process. The process of preparing the green LED light-emitting substrate is prior art and will not be described herein.
Preferably, before the second polarizer is manufactured on the green LED light-emitting substrate, the method further comprises the following steps:
and thinning the light emitting side of the green LED light emitting substrate, and etching to remove stress.
In the scheme of the application, the second polarizer can be a metal wire grid.
When the second polarizer is a metal wire grid, the process of manufacturing the second polarizer on the green LED light-emitting substrate may include the following steps:
and depositing a metal layer on the light emitting side of the green LED light emitting substrate, and forming a metal wire grid above the green LED chip pixel by photoetching and etching.
In step (2), the process of preparing the green LED light-emitting substrate and the second polarizer is similar to that in step (1), and is not repeated herein.
Preferably, before the second polarizer is manufactured on the green LED light-emitting substrate, the method further comprises the following steps:
and thinning the light emitting side of the green LED light emitting substrate, and etching to remove stress.
The thickness of the green light LED light-emitting substrate can be reduced by grinding and thinning the light-emitting side of the green light LED light-emitting substrate, so that the overall thickness of the full-color micro display device is reduced. In this step, the thickness of the green LED light-emitting substrate can be thinned to 5-10 μm.
And (3): and preparing a blue light LED light-emitting substrate, and manufacturing a third polarizer on the blue light LED light-emitting substrate.
At least one blue LED chip pixel is arranged on the blue LED light-emitting substrate. And the third polarizer is arranged right above the pixels of the blue LED chip.
The process of preparing the blue light LED light emitting substrate may be that a blue light LED chip pixel is formed on a substrate by a Molecular Beam Epitaxy (MBE) preparation process. The process of preparing the blue LED light-emitting substrate is prior art and is not described herein.
Preferably, before the third polarizer is manufactured on the blue LED light-emitting substrate, the method further includes the following steps:
and thinning the light emitting side of the blue LED light emitting substrate, and etching to remove stress.
In the present application, the third polarizer may be a metal wire grid.
When the third polarizer is a metal wire grid, the process of manufacturing the third polarizer on the blue LED light-emitting substrate may include the following steps:
and depositing a metal layer on the light-emitting side of the blue light LED light-emitting substrate, and forming a metal wire grid above the blue light LED chip pixel by photoetching and etching.
In step (3), the process of preparing the blue LED light-emitting substrate and the third polarizer is similar to that in step (1), and is not repeated herein.
Preferably, before the third polarizer is manufactured on the blue LED light-emitting substrate, the method further includes the following steps:
and thinning the light emitting side of the blue LED light emitting substrate, and etching to remove stress.
The light-emitting side of the blue light LED light-emitting substrate is ground and thinned, so that the thickness of the blue light LED light-emitting substrate can be reduced, and the overall thickness of the full-color micro display device is reduced. In this step, the thickness of the blue LED light emitting substrate can be thinned to 5-10 μm.
And (4): and the light emitting sides of the red light LED light emitting substrate, the green light LED light emitting substrate and the blue light LED light emitting substrate face upwards and are bonded with the driving substrate.
In the step (4), the red LED light-emitting substrate and the driving substrate may be bonded first, then the green LED light-emitting substrate and the red LED light-emitting substrate are bonded, and finally the blue LED light-emitting substrate and the green LED light-emitting substrate are bonded.
Specifically, the preparation process may also include preparing the red LED light-emitting substrate, depositing SiOx on the anode side (i.e., the side that is not the light-emitting side) of the red LED light-emitting substrate, then grinding and thinning (CMP) the anode side of the red LED light-emitting substrate until Cu to be bonded is exposed, and bonding with the driving substrate; grinding and thinning the cathode side (namely the light emitting side) of the red light LED light emitting substrate to prepare a first polarizer; depositing SiOx on the cathode side of the red light LED light-emitting substrate, bonding the red light LED light-emitting substrate with the green light LED light-emitting substrate subjected to SiOx deposition and grinding and thinning treatment to expose Cu to be bonded, and grinding and thinning the cathode side (namely the light-emitting side) of the light LED light-emitting substrate to prepare a second polarizer; and by analogy, bonding the blue light LED light-emitting substrate, grinding and thinning, and preparing a third polarizer. It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.
Claims (10)
1. A full-color micro display device comprises a light-emitting substrate and a driving substrate, wherein the light-emitting substrate is bonded with the driving substrate, and a full-color display array is formed on the light-emitting substrate;
the red LED light-emitting substrate is provided with at least one red LED chip pixel, the light-emitting side of the red LED light-emitting substrate is provided with a first polarizer, and the first polarizer is arranged right above the red LED chip pixel;
the green light LED light-emitting substrate is provided with at least one green light LED chip pixel, the light-emitting side of the green light LED light-emitting substrate is provided with a second polarizer, and the second polarizer is arranged right above the green light LED chip pixel;
the blue light LED light-emitting substrate is provided with at least one blue light LED chip pixel, the light-emitting side of the blue light LED light-emitting substrate is provided with a third polarizer, and the third polarizer is arranged right above the blue light LED chip pixel;
the light emitting sides of the red light LED light emitting substrate, the green light LED light emitting substrate and the blue light LED light emitting substrate face upwards and are arranged on the driving substrate in an overlapping mode;
the red LED chip pixels, the green LED chip pixels and the blue LED chip pixels are distributed at intervals, so that the red LED chip pixels, the green LED chip pixels and the blue LED chip pixels form a full-color display array after the red LED light-emitting substrate, the green LED light-emitting substrate and the blue LED light-emitting substrate are superposed;
the polarization directions of the adjacent first polarizer, the second polarizer and the third polarizer are mutually vertical.
2. The full-color micro display device according to claim 1, wherein the light emitting substrate and the driving substrate are bonded by hybrid bonding;
and the red light LED light-emitting substrate, the green light LED light-emitting substrate and the blue light LED light-emitting substrate are bonded in a mixed bonding mode.
3. The full-color microdisplay device of claim 1 in which the first, second and third polarizers are wire grids of metal.
4. The full-color micro display device according to claim 3, wherein the thickness of the metal wire grid is between 100nm and 500nm, the wire grid width of the metal wire grid is between 100nm and 300nm, and the wire grid pitch of the metal wire grid is between 100nm and 300 nm.
5. The full-color micro display device according to claim 1, wherein the red light LED light emitting substrate, the green light LED light emitting substrate, and the blue light LED light emitting substrate each have a thickness of 5 to 10 μm.
6. The full-color micro display device according to claim 1, wherein the pixel pitch of the adjacent LED chip pixels on different LED light emitting substrates is 0.8 um-5 um.
7. The full-color micro display device according to claim 4, wherein a first wire grid of one side of the wire grids of the metal wires is a widened wire grid having a width larger than that of the other wire grids in one of the wire grids of the metal wires.
8. A method for preparing a full-color micro display device according to any one of claims 1 to 7, comprising the steps of:
preparing a red light LED light-emitting substrate, and manufacturing a first polarizer on the red light LED light-emitting substrate;
preparing a green light LED light-emitting substrate, and manufacturing a second polarizer on the green light LED light-emitting substrate;
preparing a blue light LED light-emitting substrate, and manufacturing a third polarizer on the blue light LED light-emitting substrate;
and the light emitting sides of the red light LED light emitting substrate, the green light LED light emitting substrate and the blue light LED light emitting substrate face upwards and are bonded with the driving substrate.
9. The method of claim 8, wherein when the first polarizer is a wire grid, the step of fabricating the first polarizer on the red LED light emitting substrate comprises the steps of:
depositing a metal layer on the light-emitting side of the red light LED light-emitting substrate, and forming a metal wire grid above the red light LED chip pixel through photoetching and etching;
when the second polarizer is a metal wire grid, the process for manufacturing the second polarizer on the green light LED light-emitting substrate comprises the following steps:
depositing a metal layer on the light-emitting side of the green LED light-emitting substrate, and forming a metal wire grid above the green LED chip pixel through photoetching and etching;
when the third polarizer is a metal wire grid, the process of manufacturing the third polarizer on the blue light LED light-emitting substrate includes the following steps:
and depositing a metal layer on the light-emitting side of the blue light LED light-emitting substrate, and forming a metal wire grid above the blue light LED chip pixel by photoetching and etching.
10. The method for manufacturing a full-color micro display device according to claim 8, wherein before the first polarizer is fabricated on the red LED light-emitting substrate, the method further comprises the following steps:
thinning the light emitting side of the red light LED light emitting substrate, and etching to remove stress;
before the second polarizer is manufactured on the green LED light-emitting substrate, the method further comprises the following steps:
thinning the light emitting side of the green light LED light emitting substrate, and etching to remove stress;
before the third polarizer is manufactured on the blue LED light-emitting substrate, the method further comprises the following steps:
and thinning the light emitting side of the blue light LED light emitting substrate, and etching to remove stress.
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