CN113948319B - Encapsulation equipment for electrolytic capacitor of integrated circuit board - Google Patents

Encapsulation equipment for electrolytic capacitor of integrated circuit board Download PDF

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Publication number
CN113948319B
CN113948319B CN202111077801.4A CN202111077801A CN113948319B CN 113948319 B CN113948319 B CN 113948319B CN 202111077801 A CN202111077801 A CN 202111077801A CN 113948319 B CN113948319 B CN 113948319B
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plate
rotating shaft
support
circuit board
electrolytic capacitor
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CN202111077801.4A
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CN113948319A (en
Inventor
张小娟
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Nanjing Gaoxi Electronic Technology Co ltd
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Nanjing Gaoxi Electronic Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/003Apparatus or processes for encapsulating capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/04Drying; Impregnating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention relates to encapsulation equipment, in particular to encapsulation equipment for an integrated circuit board electrolytic capacitor. The invention aims to provide an encapsulation device for an electrolytic capacitor of an integrated circuit board, which can automatically encapsulate the capacitor and can assist in glue drying. The utility model provides an be used for integrated circuit board electrolytic capacitor rubber coating equipment, includes base, charging frame, lid, unloading pipe, revolving plate and backup pad, and the base upside is equipped with the charging frame, and the charging frame top is equipped with the lid, and the charging frame bottom is connected with the unloading pipe, and unloading pipe downside rotation type is equipped with revolving plate, and base one side is equipped with the backup pad. The user can start the heater, so that the heater can dry the glue in the circuit board, and the speed of encapsulating the capacitor can be increased; the second rotating shaft rotates, and drives the third rotating shaft and the fan to rotate through the belt pulley and the flat belt, so that the circuit board after drying can be cooled.

Description

Encapsulation equipment for electrolytic capacitor of integrated circuit board
Technical Field
The invention relates to encapsulation equipment, in particular to encapsulation equipment for an integrated circuit board electrolytic capacitor.
Background
An integrated circuit board is a carrier on which integrated circuits are mounted. When the metallized film capacitor is manufactured, the films plated with the metal layers are required to be mutually overlapped and rolled, and the substrate is inserted into the isolating film and then is continuously overlapped and rolled to a preset circle number to form the capacitor core.
At present, generally carry out the rubber coating to electrolytic capacitor through manual mode, generally by artifical handheld electrolytic capacitor, then place electrolytic capacitor in the bottom of injecting glue equipment, wait for injecting glue equipment to carry out the rubber coating to electrolytic capacitor, after the rubber coating is accomplished, the user needs place the electrolytic capacitor that the rubber coating is accomplished at one side of workstation, waits for glue to dry, because staff contact electric capacity core, debris contact electric capacity for the quality of electric capacity core is ragged, and the speed of rubber coating is slower.
Therefore, there is a need to design an encapsulation device for an electrolytic capacitor of an integrated circuit board, which can encapsulate the capacitor automatically and can assist in drying glue.
Disclosure of Invention
In order to overcome the defects that the quality of the capacitor core is uneven and the encapsulation speed is low due to the fact that hands contact the capacitor core and sundries contact the capacitor, the invention aims to provide encapsulation equipment for the electrolytic capacitor of the integrated circuit board, which can encapsulate the capacitor automatically and assist in glue drying.
The technical proposal is as follows: the utility model provides an be used for integrated circuit board electrolytic capacitor rubber coating equipment, including base, charging frame, lid, unloading pipe, revolving plate, backup pad, mobile mechanism and trigger mechanism, the base upside is equipped with the charging frame, and the charging frame top is equipped with the lid, and the charging frame bottom is connected with the unloading pipe, and unloading pipe downside rotation is equipped with the revolving plate, and base one side is equipped with the backup pad, is equipped with mobile mechanism in the backup pad, is connected with trigger mechanism between mobile mechanism and the revolving plate.
As the improvement of above-mentioned scheme, moving mechanism is including first fixed plate, first dead lever, second dead lever, first movable rod, first spring and place the board, and backup pad top both sides all are equipped with first fixed plate, and the symmetry is equipped with first dead lever between the first fixed plate, all slidingtype be equipped with the second dead lever on the first dead lever, and second dead lever downside all slidingtype be equipped with first movable rod, all is connected with first spring between first movable rod and the second dead lever, is connected with between the first movable rod and places the board.
As the improvement of above-mentioned scheme, trigger mechanism is including first oblique shape piece, first support, second oblique shape piece, torsional spring, third oblique shape piece and second spring, place the board front side and be equipped with first oblique shape piece, the one side that the frame bottom of feeding is close to the backup pad is equipped with first support, the slidingtype is equipped with the second oblique shape piece on the first support, be connected with the second spring between first support and the second oblique shape piece, one side that the first oblique shape piece was kept away from to the second oblique shape piece is equipped with the third oblique shape piece, be connected with the torsional spring between unloading pipe and the revolving plate.
As the improvement of above-mentioned scheme, still including shake mechanism, shake mechanism is including second fixed plate, limiting plate, second support and wheel, and the first fixed plate outside of both sides all is connected with the second fixed plate, is connected with the limiting plate between the second fixed plate, is equipped with the second support in the middle of placing the board bottom, and the rotation is equipped with the wheel on the second support.
As the improvement of above-mentioned scheme, still including fixed establishment, fixed establishment is including third fixed plate, second movable rod, splint and third spring, places the board both sides and all is equipped with the third fixed plate, all is equipped with the second movable rod on the third fixed plate, and the second movable rod inboard all is equipped with splint, all is connected with the third spring between second movable rod and the third fixed plate.
As the improvement of above-mentioned scheme, still including rotary mechanism, rotary mechanism is including third support, the motor, the fourth support, first pivot, reel and stay cord, the backup pad top is kept away from the one side symmetry of charging frame and is equipped with the third support, all be equipped with the motor on the third support, the backup pad top is close to one side symmetry of charging frame and is equipped with the fourth support, all the rotation is equipped with first pivot on the fourth support, first pivot all with adjacent motor's output shaft, all be equipped with the reel in the first pivot, the reel all is connected with the stay cord with placing the board.
As the improvement of above-mentioned scheme, still including heating mechanism, heating mechanism is equipped with first support frame including first support frame, electronic box, heater and button, base upside, is equipped with the electronic box on the first support frame, and the electronic box downside is equipped with the heater, and the heater top slidingtype is equipped with the button.
As the improvement of above-mentioned scheme, still including cooling body, cooling body is including first bevel gear, the second pivot, the second bevel gear, the second support frame, the third pivot, the fan and flat belt, backup pad one side rotation is equipped with the second pivot, second pivot downside is equipped with the second bevel gear, the first pivot that is close to second pivot one side is equipped with first bevel gear, first bevel gear and second bevel gear meshing, the backup pad is close to the position of second pivot and is equipped with the second support frame, the rotation is equipped with the third pivot on the second support frame, the third pivot downside is equipped with the fan, it has flat belt to wind through the belt pulley between third pivot and the second pivot.
The beneficial effects are as follows: 1. when the motor on the right side drives the first rotating shaft on the right side and the reel to rotate positively, the reel on the right side takes up the pull rope on the right side, then the placing plate can be pulled to move to the bottom of the blanking pipe to inject glue, after the encapsulation is finished, the motor on the left side drives the first rotating shaft on the left side and the reel to rotate positively, and then the placing plate moves to the left side, so that the effect of automatic encapsulation can be realized repeatedly;
2. the user can start the heater, so that the heater can dry the glue in the circuit board, and the speed of encapsulating the capacitor can be increased;
3. the second rotating shaft rotates, and drives the third rotating shaft and the fan to rotate through the belt pulley and the flat belt, so that the circuit board after drying can be cooled.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic view of a partial perspective structure of the present invention.
Fig. 3 is a schematic perspective view of a first part of a moving mechanism according to the present invention.
Fig. 4 is a schematic perspective view of a second part of the moving mechanism of the present invention.
Fig. 5 is a schematic perspective view of a first part of the trigger mechanism according to the present invention.
Fig. 6 is a schematic perspective view of a second portion of the trigger mechanism of the present invention.
Fig. 7 is a schematic perspective view of a third portion of the trigger mechanism of the present invention.
Fig. 8 is a schematic perspective view of a first part of the dithering mechanism of the present invention.
Fig. 9 is a schematic perspective view of a second part of the dithering mechanism of the present invention.
Fig. 10 is a schematic perspective view of a fixing mechanism according to the present invention.
Fig. 11 is a schematic perspective view of a first part of a rotary mechanism according to the present invention.
Fig. 12 is a schematic perspective view of a second part of the rotary mechanism of the present invention.
Fig. 13 is a schematic perspective view of a first part of the heating mechanism of the present invention.
Fig. 14 is a schematic perspective view of a second part of the heating mechanism of the present invention.
Fig. 15 is a schematic perspective view of a cooling mechanism according to the present invention.
Reference numerals in the figures: 1. base, 2, charging frame, 3, lid, 4, blanking tube, 5, rotating plate, 6, supporting plate, 7, moving mechanism, 71, first fixed plate, 72, first fixed rod, 73, second fixed rod, 74, first movable rod, 75, first spring, 76, placing plate, 8, triggering mechanism, 81, first diagonal piece, 82, first bracket, 83, second diagonal piece, 84, torsion spring, 85, third diagonal piece, 86, second spring, 9, shaking mechanism, 91, second fixed plate, 92, limiting plate, 93, second bracket, 94, wheel, 10, fixed mechanism, 101, third fixed plate, 102, second movable rod, 103, clamping plate, 104, third spring, 11, rotating mechanism, 111, third bracket, 112, motor, 113, fourth bracket, 114, first rotating shaft, 115, winding wheel, 116, pulling rope, 12, heating mechanism, 121, first bracket, 122, electric box, 123, heater, 124, button, 13, cooling mechanism, 132, second rotating shaft, 134, second rotating shaft, 133, bevel gear, 133, fan, second rotating shaft, 137, belt.
Detailed Description
The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present application and are not limiting the scope of the present application. The implementation conditions used in the examples may be further adjusted according to the conditions of the specific manufacturer, and the implementation conditions not specified are generally those in routine experiments.
Example 1
The utility model provides an be used for integrated circuit board electrolytic capacitor rubber coating equipment, as shown in fig. 1-7, including base 1, charging frame 2, lid 3, unloading pipe 4, revolving plate 5, backup pad 6, moving mechanism 7 and trigger mechanism 8, the base 1 upside is equipped with charging frame 2, charging frame 2 top is equipped with lid 3, charging frame 2 bottom is connected with unloading pipe 4, unloading pipe 4 downside rotation is equipped with revolving plate 5, base 1 front side is equipped with backup pad 6, be equipped with moving mechanism 7 on the backup pad 6, be connected with trigger mechanism 8 between moving mechanism 7 and the revolving plate 5.
The moving mechanism 7 comprises a first fixing plate 71, a first fixing rod 72, a second fixing rod 73, a first movable rod 74, a first spring 75 and a placing plate 76, wherein the left side and the right side of the top of the supporting plate 6 are respectively provided with the first fixing plate 71, the first fixing rods 72 are symmetrically arranged between the first fixing plates 71, the second fixing rods 73 are respectively arranged on the first fixing rods 72 in a sliding mode, the first movable rods 74 are respectively arranged on the lower sides of the second fixing rods 73 in a sliding mode, the first springs 75 are respectively connected between the first movable rods 74 and the second fixing rods 73, and the placing plate 76 is connected between the first movable rods 74.
The triggering mechanism 8 comprises a first inclined block 81, a first bracket 82, a second inclined block 83, a torsion spring 84, a third inclined block 85 and a second spring 86, wherein the first inclined block 81 is arranged on the front side of the placement plate 76, the first bracket 82 is arranged on the front side of the bottom of the charging frame 2, the second inclined block 83 is arranged on the first bracket 82 in a sliding mode, the second spring 86 is connected between the first bracket 82 and the second inclined block 83, the third inclined block 85 is arranged on the rear side of the second inclined block 83, and the torsion spring 84 is connected between the discharging pipe 4 and the rotating plate 5.
When the user needs to encapsulate the circuit board, the apparatus can be used, firstly, the circuit board is placed on the placing plate 76, then the cover 3 is opened, glue is placed in the charging frame 2, then the cover 3 is put back to the original position for closing, the user can manually move the second fixed rod 73, the first movable rod 74 and the placing plate 76 to the right side, further drive the first diagonal block 81 to the right side, when the first diagonal block 81 and the second diagonal block 83 are contacted, the second diagonal block 83 and the third diagonal block 85 are moved to the rear side, the second spring 86 is compressed, the third diagonal block 85 is contacted with the rotating plate 5, and make the revolving plate 5 overturn, torsional spring 84 takes place deformation, revolving plate 5 no longer blocks up unloading pipe 4 this moment, glue in the charging frame 2 flows down to the circuit board through unloading pipe 4 in, when placing the board 76 and continue to drive first diagonal piece 81 and remove to the right side and break away from with second diagonal piece 83, under the reset action of second spring 86, second diagonal piece 83 moves forward and resets, and then under the reset action of torsional spring 84, revolving plate 5 reverse rotation resets, thereby revolving plate 5 can block up the open position of unloading pipe 4 bottom again, after the encapsulation is accomplished, the user will place the circuit board on the board 76 and take off can.
Example 2
On the basis of embodiment 1, as shown in fig. 1, 8, 9, 10, 11, 12, 13, 14 and 15, the device further comprises a shaking mechanism 9, the shaking mechanism 9 comprises a second fixing plate 91, a limiting plate 92, a second bracket 93 and wheels 94, the outer sides of the first fixing plates 71 on two sides are respectively connected with the second fixing plate 91, the limiting plate 92 is connected between the second fixing plates 91, the middle of the bottom of the placing plate 76 is provided with the second bracket 93, and the wheels 94 are rotatably arranged on the second bracket 93.
The placing plate 76 moves right to drive the second support 93 and the wheels 94 to move right along the second fixing plate 91, when the wheels 94 move to the limiting plate 92, the wheels 94 move up and down along the limiting plate 92, so that the placing plate 76 and the first movable rod 74 are driven to move up and down through the second support 93, the first springs 75 are deformed adaptively, and therefore the circuit board on the placing plate 76 can be dithered, and glue can be evenly spread.
The fixing mechanism 10 comprises a third fixing plate 101, a second movable rod 102, clamping plates 103 and third springs 104, wherein the third fixing plate 101 is arranged on the front side and the rear side of the placing plate 76, the second movable rod 102 is arranged on the third fixing plate 101 in a sliding mode, the clamping plates 103 are arranged on the inner side of the second movable rod 102, and the third springs 104 are connected between the second movable rod 102 and the third fixing plate 101.
The user can pull the second movable rod 102 and the clamping plate 103 on two sides outwards, so that the third spring 104 is compressed, then the user places the circuit board at the position between the clamping plates 103, then no force is applied to the clamping plates 103 and the second movable rod 102, under the reset action of the third spring 104, the clamping plates 103 move inwards to clamp and fix the circuit board, and after encapsulation of the circuit board is completed, the encapsulated circuit board is taken off the clamping plates 103.
The rotary mechanism 11 comprises a third support 111, a motor 112, a fourth support 113, a first rotating shaft 114, a reel 115 and a pull rope 116, wherein the third support 111 is arranged on the front side of the top of the support plate 6 in a bilateral symmetry mode, the motor 112 is arranged on the third support 111, the fourth support 113 is arranged on the rear side of the top of the support plate 6 in a bilateral symmetry mode, the first rotating shaft 114 is arranged on the fourth support 113 in a rotation mode, the first rotating shaft 114 is connected with an output shaft of an adjacent motor 112 through a coupling, the reel 115 is arranged on the first rotating shaft 114, and the pull rope 116 is connected with the placing plate 76.
Starting the motor 112 on the right side, the output shaft of the motor 112 on the right side is enabled to rotate forward, starting the motor 112 on the left side, enabling the output shaft of the motor 112 on the left side to rotate reversely, enabling the first rotating shaft 114 on the right side to drive the reel 115 on the right side to reel in the right side, further enabling the pull rope 116 on the right side to drive the placement plate 76 to move to the right side, simultaneously enabling the first rotating shaft 114 and the reel 115 on the left side to rotate reversely, enabling the output shaft of the motor 112 on the right side, the first rotating shaft 114 and the reel 115 on the right side to rotate reversely, enabling the motor 112 on the right side, the first rotating shaft 114 and the reel 115 on the right side to rotate forward, further enabling the reel 115 on the left side to reel 116 to reel in the right side, enabling the placement plate 76 to move to the left side in the left side through the pull rope 116 on the left side, repeating the steps of manually driving the placement plate 76 to pay-off the left side, and closing the motor 112 when the placement plate 76 is not required to be manually moved to place the circuit board.
The heating device comprises a base 1, and is characterized by further comprising a heating mechanism 12, wherein the heating mechanism 12 comprises a first supporting frame 121, an electric box 122, a heater 123 and a button 124, the first supporting frame 121 is arranged on the upper right side of the base 1, the electric box 122 is arranged on the first supporting frame 121, the heater 123 is arranged on the lower side of the electric box 122, and the button 124 is arranged on the top of the heater 123 in a sliding mode.
The user can press the button 124 to turn on the heater 123, and the electric box 122 supplies power to the heater 123, so that the heater 123 can dry the encapsulated circuit board, and after drying, the user presses the button 124 again to turn off the heater 123.
The cooling mechanism 13 comprises a first bevel gear 131, a second rotating shaft 132, a second bevel gear 133, a second supporting frame 134, a third rotating shaft 135, a fan 136 and a flat belt 137, wherein the second rotating shaft 132 is rotatably arranged on the right rear side of the supporting plate 6, the second bevel gear 133 is arranged on the lower side of the second rotating shaft 132, the first bevel gear 131 is arranged on the rear side of the first rotating shaft 114 on the right side, the first bevel gear 131 is meshed with the second bevel gear 133, the second supporting frame 134 is arranged on the right rear side of the supporting plate 6, the second supporting frame 134 is positioned on the left side of the second rotating shaft 132, the third rotating shaft 135 is rotatably arranged on the second supporting frame 134, the fan 136 is arranged on the lower side of the third rotating shaft 135, and the flat belt 137 is wound between the third rotating shaft 135 and the second rotating shaft 132 through a belt pulley.
The first rotating shaft 114 on the right rotates to drive the second rotating shaft 132 to rotate through the meshing of the first bevel gear 131 and the second bevel gear 133, and then drives the third rotating shaft 135 and the fan 136 to rotate through the belt pulley and the flat belt 137, so that the fan 136 can assist in drying the circuit board after glue drying.
While the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art from this disclosure that various changes or modifications can be made therein without departing from the spirit and scope of the invention as defined in the following claims. Accordingly, the detailed description of the disclosed embodiments is to be taken only by way of illustration and not by way of limitation, and the scope of protection is defined by the content of the claims.

Claims (6)

1. The encapsulation equipment for the integrated circuit board electrolytic capacitor is characterized by comprising a base (1), a charging frame (2), a cover (3), a blanking pipe (4), a rotating plate (5), a supporting plate (6), a moving mechanism (7) and a triggering mechanism (8), wherein the charging frame (2) is arranged on the upper side of the base (1), the cover (3) is arranged at the top of the charging frame (2), the blanking pipe (4) is connected to the bottom of the charging frame (2), the rotating plate (5) is arranged on the lower side of the blanking pipe (4), the supporting plate (6) is arranged on one side of the base (1), the moving mechanism (7) is arranged on the supporting plate (6), and the triggering mechanism (8) is connected between the moving mechanism (7) and the rotating plate (5);
the moving mechanism (7) comprises a first fixed plate (71), a first fixed rod (72), a second fixed rod (73), a first movable rod (74), a first spring (75) and a placing plate (76), wherein the first fixed plate (71) is arranged on two sides of the top of the supporting plate (6), the first fixed rods (72) are symmetrically arranged between the first fixed plates (71), the second fixed rods (73) are arranged on the first fixed rods (72) in a sliding mode, the first movable rods (74) are arranged on the lower sides of the second fixed rods (73) in a sliding mode, the first springs (75) are connected between the first movable rods (74) and the second fixed rods (73), and the placing plate (76) is connected between the first movable rods (74);
the triggering mechanism (8) comprises a first oblique block (81), a first support (82), a second oblique block (83), a torsion spring (84), a third oblique block (85) and a second spring (86), wherein the first oblique block (81) is arranged on the front side of the placement plate (76), the first support (82) is arranged on one side, close to the support plate (6), of the bottom of the charging frame (2), the second oblique block (83) is arranged on the first support (82) in a sliding mode, the second spring (86) is connected between the first support (82) and the second oblique block (83), the third oblique block (85) is arranged on one side, far away from the first oblique block (81), of the second oblique block (83), and the torsion spring (84) is connected between the discharging pipe (4) and the rotating plate (5).
2. The encapsulation equipment for the electrolytic capacitor of the integrated circuit board according to claim 1, further comprising a shaking mechanism (9), wherein the shaking mechanism (9) comprises a second fixing plate (91), a limiting plate (92), a second support (93) and wheels (94), the outer sides of the first fixing plates (71) on two sides are respectively connected with the second fixing plate (91), the limiting plate (92) is connected between the second fixing plates (91), the middle of the bottom of the placing plate (76) is provided with the second support (93), and the wheels (94) are rotatably arranged on the second support (93).
3. The encapsulation device for the electrolytic capacitor of the integrated circuit board according to claim 2, further comprising a fixing mechanism (10), wherein the fixing mechanism (10) comprises a third fixing plate (101), a second movable rod (102), clamping plates (103) and third springs (104), the third fixing plates (101) are arranged on two sides of the placing plate (76), the second movable rods (102) are arranged on the third fixing plates (101), the clamping plates (103) are arranged on the inner sides of the second movable rods (102), and the third springs (104) are connected between the second movable rods (102) and the third fixing plates (101).
4. A packaging apparatus for an electrolytic capacitor of an integrated circuit board as claimed in claim 3, further comprising a rotating mechanism (11), wherein the rotating mechanism (11) comprises a third bracket (111), a motor (112), a fourth bracket (113), a first rotating shaft (114), a reel (115) and a pull rope (116), wherein the third bracket (111) is symmetrically arranged on one side of the top of the supporting plate (6) far away from the loading frame (2), the motor (112) is respectively arranged on the third bracket (111), the fourth bracket (113) is symmetrically arranged on one side of the top of the supporting plate (6) close to the loading frame (2), the first rotating shaft (114) is respectively rotatably arranged on the fourth bracket (113), the first rotating shaft (114) is respectively connected with an output shaft of an adjacent motor (112), the reel (115) is respectively arranged on the first rotating shaft (114), and the pull rope (116) is respectively connected with the placing plate (76).
5. The encapsulation apparatus of claim 4, further comprising a heating mechanism (12), wherein the heating mechanism (12) comprises a first support frame (121), an electric box (122), a heater (123) and a button (124), the first support frame (121) is arranged on the upper side of the base (1), the electric box (122) is arranged on the first support frame (121), the heater (123) is arranged on the lower side of the electric box (122), and the button (124) is arranged on the top of the heater (123) in a sliding manner.
6. The encapsulation apparatus for an electrolytic capacitor of claim 5, further comprising a cooling mechanism (13), wherein the cooling mechanism (13) comprises a first bevel gear (131), a second rotating shaft (132), a second bevel gear (133), a second supporting frame (134), a third rotating shaft (135), a fan (136) and a flat belt (137), the second rotating shaft (132) is rotatably arranged on one side of the supporting plate (6), the second bevel gear (133) is arranged on the lower side of the second rotating shaft (132), the first bevel gear (131) is arranged on the first rotating shaft (114) near one side of the second rotating shaft (132), the first bevel gear (131) is meshed with the second bevel gear (133), the second supporting frame (134) is rotatably arranged on the position of the supporting plate (6) near the second rotating shaft (132), the third rotating shaft (135) is rotatably arranged on the second supporting frame (134), the fan (136) is arranged on the lower side of the third rotating shaft (135), and the flat belt (137) is wound around the belt (132) through the belt.
CN202111077801.4A 2021-09-15 2021-09-15 Encapsulation equipment for electrolytic capacitor of integrated circuit board Active CN113948319B (en)

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Application Number Priority Date Filing Date Title
CN202111077801.4A CN113948319B (en) 2021-09-15 2021-09-15 Encapsulation equipment for electrolytic capacitor of integrated circuit board

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Application Number Priority Date Filing Date Title
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CN113948319B true CN113948319B (en) 2023-07-21

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CN108770212A (en) * 2018-07-12 2018-11-06 深圳智慧者机器人科技有限公司 Pcb board automatic tape-wrapping device
CN108838673A (en) * 2018-07-24 2018-11-20 山东爱通工业机器人科技有限公司 Pcb board automatically beats the encapsulated production line of pin
CN211720834U (en) * 2019-12-18 2020-10-20 惠州市成泰自动化科技有限公司 Automatic rubber coating mechanism of PCB

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