CN113948319A - Be used for integrated circuit board electrolytic capacitor rubber coating equipment - Google Patents
Be used for integrated circuit board electrolytic capacitor rubber coating equipment Download PDFInfo
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- CN113948319A CN113948319A CN202111077801.4A CN202111077801A CN113948319A CN 113948319 A CN113948319 A CN 113948319A CN 202111077801 A CN202111077801 A CN 202111077801A CN 113948319 A CN113948319 A CN 113948319A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 36
- 238000010073 coating (rubber) Methods 0.000 title claims abstract description 6
- 238000005538 encapsulation Methods 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims description 65
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 14
- 238000001035 drying Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/04—Drying; Impregnating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to encapsulation equipment, in particular to encapsulation equipment for an electrolytic capacitor of an integrated circuit board. The invention aims to provide encapsulation equipment for an electrolytic capacitor of an integrated circuit board, which can automatically encapsulate the capacitor and can assist glue in drying. The utility model provides a be used for integrated circuit board electrolytic capacitor rubber coating equipment, is equipped with the material loading frame including base, material loading frame, lid, unloading pipe, commentaries on classics board and backup pad, the base upside, and the frame top of feeding is equipped with the lid, and the frame bottom of feeding is connected with the unloading pipe, and unloading pipe downside rotary type is equipped with changes the board, and base one side is equipped with the backup pad. A user can heat the heater, so that the heater can dry the glue in the circuit board, and the encapsulation speed of the capacitor can be increased; the second rotating shaft rotates, the third rotating shaft and the fan are driven to rotate through the belt pulley and the flat belt, and then the circuit board which is dried can be cooled.
Description
Technical Field
The invention relates to encapsulation equipment, in particular to encapsulation equipment for an electrolytic capacitor of an integrated circuit board.
Background
An integrated circuit board is a carrier on which an integrated circuit is mounted. When manufacturing a metallized film capacitor, films plated with metal layers need to be mutually overlapped and rolled, and after a substrate is inserted into an isolating film, the substrate is continuously overlapped and rolled to a preset number of turns, so that a capacitor core is formed.
At present, an electrolytic capacitor is generally encapsulated by a manual mode, the electrolytic capacitor is usually manually held, then the electrolytic capacitor is placed at the bottom of glue injection equipment, the glue injection equipment is waited for encapsulating the electrolytic capacitor, after encapsulation is completed, a user needs to place the encapsulated electrolytic capacitor beside a workbench and wait for glue to dry, and as hands contact a capacitor core, sundries contact the capacitor, the quality of the capacitor core is different, and the encapsulation speed is slower.
Therefore, the need exists for an encapsulation device for the electrolytic capacitors of the integrated circuit board, which can automatically encapsulate the capacitors and can assist the drying of the glue.
Disclosure of Invention
In order to overcome the defects that the quality of a capacitor core is poor and the encapsulation speed is slow due to the fact that a person touches the capacitor core and sundries touch the capacitor, the invention aims to provide encapsulation equipment for an electrolytic capacitor of an integrated circuit board, which can automatically encapsulate the capacitor and can assist glue in drying.
The technical scheme is as follows: the utility model provides a be used for integrated circuit board electrolytic capacitor rubber coating equipment, is including base, material loading frame, lid, unloading pipe, commentaries on classics board, backup pad, moving mechanism and trigger mechanism, and the base upside is equipped with the material loading frame, and the frame top of feeding is equipped with the lid, and the frame bottom of feeding is connected with the unloading pipe, and unloading pipe downside rotary type is equipped with the commentaries on classics board, and base one side is equipped with the backup pad, is equipped with moving mechanism in the backup pad, moving mechanism and commentaries on classics are connected with trigger mechanism between the board.
As the improvement of above-mentioned scheme, moving mechanism is including first fixed plate, first dead lever, the second dead lever, first movable rod, first spring and place the board, backup pad top both sides all are equipped with first fixed plate, the symmetry formula is equipped with first dead lever between the first fixed plate, all slidingtype is equipped with the second dead lever on the first dead lever, the equal slidingtype of second dead lever downside is equipped with first movable rod, all be connected with first spring between first movable rod and the second dead lever, be connected with between the first movable rod and place the board.
As the improvement of above-mentioned scheme, trigger mechanism is equipped with first oblique piece including first oblique piece, first support, the oblique piece of second, torsional spring, the oblique piece of third and second spring placing the board front side, the one side that the frame bottom of feeding is close to the backup pad is equipped with first support, the slidingtype is equipped with the oblique piece of second on the first support, be connected with the second spring between first support and the oblique piece of second, the oblique piece of second is kept away from one side of first oblique piece and is equipped with the oblique piece of third, be connected with the torsional spring between unloading pipe and the commentaries on classics board.
As the improvement of above-mentioned scheme, still including the shake mechanism, shake mechanism is including second fixed plate, limiting plate, second support and wheel, and the first fixed plate outside of both sides all is connected with the second fixed plate, is connected with the limiting plate between the second fixed plate, places the board bottom centre and is equipped with the second support, and the last rotation type of second support is equipped with the wheel.
As the improvement of above-mentioned scheme, still including fixed establishment, fixed establishment places the board both sides and all is equipped with the third fixed plate including third fixed plate, second movable rod, splint and third spring, all is equipped with the second movable rod on the third fixed plate, and the second movable rod inboard all is equipped with splint, all is connected with the third spring between second movable rod and the third fixed plate.
As the improvement of above-mentioned scheme, still including rotary mechanism, rotary mechanism is including the third support, including a motor, an end cap, a controller, and a cover plate, the fourth support, first pivot, reel and stay cord, the one side symmetry formula that the dress frame was kept away from at the backup pad top is equipped with the third support, all be equipped with the motor on the third support, the one side symmetry formula that the backup pad top is close to the dress frame is equipped with the fourth support, equal rotary type is equipped with first pivot on the fourth support, first pivot all with the output shaft of adjacent motor, all be equipped with the reel in the first pivot, the reel all is connected with the stay cord with placing the board.
As an improvement of the scheme, the improved solar water heater further comprises a heating mechanism, the heating mechanism comprises a first support frame, an electric box, a heater and a button, the first support frame is arranged on the upper side of the base, the electric box is arranged on the first support frame, the heater is arranged on the lower side of the electric box, and the button is arranged on the top of the heater in a sliding mode.
As the improvement of above-mentioned scheme, still including cooling body, cooling body is including first bevel gear, the second pivot, second bevel gear, the second support frame, the third pivot, fan and flat belt, backup pad one side rotary type is equipped with the second pivot, second pivot downside is equipped with second bevel gear, the first pivot that is close to second pivot one side is equipped with first bevel gear, first bevel gear and second bevel gear meshing, the position that the backup pad is close to the second pivot is equipped with the second support frame, the last rotation type of second support frame is equipped with the third pivot, third pivot downside is equipped with the fan, it has flat belt to wind through the belt pulley between third pivot and the second pivot.
The beneficial effects are that: 1. when a user circuit board is placed on the placing plate, and the motor on the right side drives the first rotating shaft and the winding wheel on the right side to rotate forwards, the winding wheel on the right side takes up the pull rope on the right side, then the placing plate can be pulled to move towards the right side to the bottom of the blanking tube to inject glue, after encapsulation is completed, the motor on the left side drives the first rotating shaft and the winding wheel on the left side to rotate forwards, and then the placing plate moves towards the left side, so that the effect of automatic encapsulation can be achieved;
2. a user can heat the heater, so that the heater can dry the glue in the circuit board, and the encapsulation speed of the capacitor can be increased;
3. the second rotating shaft rotates, the third rotating shaft and the fan are driven to rotate through the belt pulley and the flat belt, and then the circuit board which is dried can be cooled.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a partial perspective view of the present invention.
Fig. 3 is a schematic view of a first partial body structure of the moving mechanism of the present invention.
Fig. 4 is a schematic diagram of a second partial body structure of the moving mechanism of the present invention.
Fig. 5 is a schematic view of a first partial body structure of the triggering mechanism of the present invention.
Fig. 6 is a schematic view of a second partial structure of the triggering mechanism of the present invention.
Fig. 7 is a perspective view of a third part of the trigger mechanism of the present invention.
Fig. 8 is a schematic view of a first partial body structure of the dithering mechanism of the present invention.
Fig. 9 is a schematic diagram of a second partial body structure of the dithering mechanism of the present invention.
Fig. 10 is a perspective view of the fixing mechanism of the present invention.
Fig. 11 is a schematic view of a first partial body structure of the rotating mechanism of the present invention.
Fig. 12 is a schematic structural diagram of a second partial body of the rotating mechanism of the present invention.
Fig. 13 is a schematic view of a first partially separated body structure of the heating mechanism of the present invention.
Fig. 14 is a schematic view of a second partially separated body structure of the heating mechanism of the present invention.
Fig. 15 is a perspective view of the cooling mechanism of the present invention.
Number designation in the figures: 1. a base, 2, a charging frame, 3, a cover, 4, a blanking pipe, 5, a rotating plate, 6, a support plate, 7, a moving mechanism, 71, a first fixing plate, 72, a first fixing rod, 73, a second fixing rod, 74, a first movable rod, 75, a first spring, 76, a placing plate, 8, a triggering mechanism, 81, a first inclined block, 82, a first bracket, 83, a second inclined block, 84, a torsion spring, 85, a third inclined block, 86, a second spring, 9, a shaking mechanism, 91, a second fixing plate, 92, a limiting plate, 93, a second bracket, 94, a wheel, 10, a fixing mechanism, 101, a third fixing plate, 102, a second movable rod, 103, a clamping plate, 104, a third spring, 11, a rotating mechanism, 111, a third bracket, 112, a motor, 113, a fourth bracket, 114, a first rotating shaft, 115, a reel, 116, a pull rope, 12, a heating mechanism, 121, a first support, 122. an electric box 123, a heater 124, a button 13, a cooling mechanism 131, a first bevel gear 132, a second rotating shaft 133, a second bevel gear 134, a second support frame 135, a third rotating shaft 136, a fan 137 and a flat belt.
Detailed Description
The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present application. The conditions used in the examples may be further adjusted according to the conditions of the particular manufacturer, and the conditions not specified are generally the conditions in routine experiments.
Example 1
The utility model provides a be used for integrated circuit board electrolytic capacitor rubber coating equipment, as shown in fig. 1-7, including base 1, the frame of feeding 2, lid 3, unloading pipe 4, change board 5, backup pad 6, moving mechanism 7 and trigger mechanism 8, base 1 upside is equipped with the frame of feeding 2, the frame of feeding 2 tops is equipped with lid 3, the frame of feeding 2 bottoms is connected with unloading pipe 4, the 4 downside rotary type of unloading pipe is equipped with changes board 5, the base 1 front side is equipped with backup pad 6, be equipped with moving mechanism 7 in the backup pad 6, be connected with trigger mechanism 8 between moving mechanism 7 and the commentaries on classics board 5.
The moving mechanism 7 comprises a first fixing plate 71, a first fixing rod 72, a second fixing rod 73, a first movable rod 74, a first spring 75 and a placing plate 76, wherein the first fixing plate 71 is arranged on the left side and the right side of the top of the supporting plate 6, the first fixing rod 72 is symmetrically arranged between the first fixing plates 71 in a front-back mode, the second fixing rod 73 is arranged on the first fixing rod 72 in a sliding mode, the first movable rod 74 is arranged on the lower side of the second fixing rod 73 in a sliding mode, the first spring 75 is connected between the first movable rod 74 and the second fixing rod 73, and the placing plate 76 is connected between the first movable rods 74.
The triggering mechanism 8 comprises a first inclined block 81, a first support 82, a second inclined block 83, a torsion spring 84, a third inclined block 85 and a second spring 86, the front side of the placing plate 76 is provided with the first inclined block 81, the front side of the bottom of the charging frame 2 is provided with the first support 82, the first support 82 is slidably provided with the second inclined block 83, the second spring 86 is connected between the first support 82 and the second inclined block 83, the rear side of the second inclined block 83 is provided with the third inclined block 85, and the torsion spring 84 is connected between the charging pipe 4 and the rotating plate 5.
When a user needs to encapsulate the circuit board, the user can use the device, firstly, the circuit board is placed on the placing plate 76, then the cover 3 is opened, the glue is placed in the loading frame 2, then the cover 3 is placed back to the original position to be closed, the user can manually move the second fixing rod 73, the first movable rod 74 and the placing plate 76 to move towards the right side, and further drive the first inclined block 81 to move towards the right side, when the first inclined block 81 is contacted with the second inclined block 83, the second inclined block 83 and the third inclined block 85 move towards the rear side, the second spring 86 is compressed, the third inclined block 85 is contacted with the rotating plate 5, and the rotating plate 5 is overturned, the torsion spring 84 deforms, at the moment, the rotating plate 5 does not block the discharging pipe 4, the glue in the loading frame 2 flows downwards into the circuit board through the discharging pipe 4, when the placing plate 76 continues to drive the first inclined block 81 to move towards the right side to be separated from the second inclined block 83, under the reset action of the second spring 86, the second inclined block 83 moves to the front side for reset, and further under the reset action of the torsion spring 84, the rotating plate 5 rotates reversely for reset, so that the rotating plate 5 can block the opening position at the bottom of the blanking tube 4 again, and after encapsulation is completed, a user takes down the circuit board on the placing plate 76.
Example 2
On the basis of embodiment 1, as shown in fig. 1, 8, 9, 10, 11, 12, 13, 14 and 15, the shaking device 9 further includes a shaking mechanism 9, the shaking mechanism 9 includes a second fixing plate 91, a limiting plate 92, a second bracket 93 and wheels 94, the second fixing plate 91 is connected to the outer sides of the first fixing plates 71 on both sides, the limiting plate 92 is connected between the second fixing plates 91, the second bracket 93 is arranged in the middle of the bottom of the placing plate 76, and the wheels 94 are rotatably arranged on the second bracket 93.
Place board 76 and move right and drive second support 93 and wheel 94 along second fixed plate 91 and move to the right side, move to limiting plate 92 when wheel 94 on, wheel 94 can reciprocate along limiting plate 92 to drive through second support 93 and place board 76 and first movable rod 74 and reciprocate, first spring 75 takes place adaptability deformation, so make place on the board 76 circuit board can be shaken, thereby glue can evenly tile.
Still including fixed establishment 10, fixed establishment 10 all is equipped with third fixed plate 101 including third fixed plate 101, second movable rod 102, splint 103 and third spring 104 around placing board 76, all is equipped with second movable rod 102 on the third fixed plate 101 in the slidingtype, and second movable rod 102 inboard all is equipped with splint 103, all is connected with third spring 104 between second movable rod 102 and the third fixed plate 101.
The user can pull the second movable rod 102 and the clamping plate 103 on the two sides to the outer side, so that the third spring 104 is compressed, then the user places the circuit board at a position between the clamping plates 103, then force is not applied to the clamping plates 103 and the second movable rod 102 any more, under the reset action of the third spring 104, the clamping plates 103 move to the inner side to clamp and fix the circuit board, and after the encapsulation of the circuit board is completed, the encapsulated circuit board is taken down from the clamping plates 103.
Still including rotary mechanism 11, rotary mechanism 11 is including third support 111, motor 112, fourth support 113, first pivot 114, reel 115 and stay cord 116, 6 top front side bilateral symmetry formulas of backup pad are equipped with third support 111, all be equipped with motor 112 on third support 111, 6 top rear side bilateral symmetry formulas of backup pad are equipped with fourth support 113, equal rotary type is equipped with first pivot 114 on fourth support 113, first pivot 114 all passes through the coupling joint with the output shaft of adjacent motor 112, all be equipped with reel 115 on first pivot 114, reel 115 all is connected with stay cord 116 with placing board 76.
The right motor 112 is started, so that the output shaft of the right motor 112 rotates forwards, the left motor 112 is started, so that the output shaft of the left motor 112 rotates reversely, the right first rotating shaft 114 drives the right reel 115 to take up the right pull rope 116, so that the right pull rope 116 drives the placing plate 76 to move to the right, meanwhile, the left first rotating shaft 114 and the reel 115 rotate backwards, the left reel 115 takes off the left pull rope 116, after the circuit board on the placing plate 76 is coated with glue, the right motor 112 is started again, so that the output shaft of the right motor 112, the first rotating shaft 114 and the reel 115 rotate backwards, the right reel 115 takes off the right pull rope 116, and simultaneously, the left motor 112 is started, so that the left motor 112, the first rotating shaft 114 and the reel 115 rotate forwards, and then the left reel 115 takes up the left pull rope 116, the placing plate 76 is driven to move towards the left side through the pull rope 116 at the left side, and the operation is repeated without manually moving the placing plate 76 to the left and right, and when the circuit board is not required to be encapsulated, the motors 112 at the two sides are turned off.
The heating device further comprises a heating mechanism 12, the heating mechanism 12 comprises a first supporting frame 121, an electric box 122, a heater 123 and a button 124, the first supporting frame 121 is arranged on the upper right side of the base 1, the electric box 122 is arranged on the first supporting frame 121, the heater 123 is arranged on the lower side of the electric box 122, and the button 124 is arranged on the top of the heater 123 in a sliding mode.
The user can press the button 124 to turn on the heater 123, and the electric box 122 supplies power to the heater 123, so that the heater 123 can dry the encapsulated circuit board, and after drying, the user presses the button 124 again to turn off the heater 123.
The cooling device comprises a cooling mechanism 13, wherein the cooling mechanism 13 comprises a first bevel gear 131, a second rotating shaft 132, a second bevel gear 133, a second support frame 134, a third rotating shaft 135, a fan 136 and a flat belt 137, the right rear side of the supporting plate 6 is rotatably provided with the second rotating shaft 132, the lower side of the second rotating shaft 132 is provided with the second bevel gear 133, the rear side of the first rotating shaft 114 on the right side is provided with the first bevel gear 131, the first bevel gear 131 is meshed with the second bevel gear 133, the right rear side of the supporting plate 6 is provided with the second support frame 134, the second support frame 134 is positioned on the left side of the second rotating shaft 132, the second support frame 134 is rotatably provided with the third rotating shaft 135, the lower side of the third rotating shaft 135 is provided with the fan 136, and the flat belt 137 is wound between the third rotating shaft 135 and the second rotating shaft 132 through a belt pulley.
The first rotating shaft 114 on the right side rotates to drive the second rotating shaft 132 to rotate through the meshing of the first bevel gear 131 and the second bevel gear 133, and then the third rotating shaft 135 and the fan 136 are driven to rotate through the belt pulley and the flat belt 137, so that the fan 136 can assist the drying of the circuit board after the glue is dried.
Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art from this disclosure that various changes or modifications can be made herein without departing from the principles and spirit of the invention as defined by the appended claims. Therefore, the detailed description of the embodiments of the present disclosure is to be construed as merely illustrative, and not limitative of the remainder of the disclosure, but rather to limit the scope of the disclosure to the full extent set forth in the appended claims.
Claims (8)
1. The utility model provides a be used for integrated circuit board electrolytic capacitor rubber coating equipment, characterized by, including base (1), feeding frame (2), lid (3), unloading pipe (4), change board (5), backup pad (6), moving mechanism (7) and trigger mechanism (8), base (1) upside is equipped with feeding frame (2), feeding frame (2) top is equipped with lid (3), feeding frame (2) bottom is connected with unloading pipe (4), unloading pipe (4) downside rotary type is equipped with changes board (5), base (1) one side is equipped with backup pad (6), be equipped with moving mechanism (7) on backup pad (6), moving mechanism (7) and change and be connected with trigger mechanism (8) between board (5).
2. The encapsulation device for the integrated circuit board electrolytic capacitor as claimed in claim 1, wherein the moving mechanism (7) comprises a first fixing plate (71), a first fixing rod (72), a second fixing rod (73), a first movable rod (74), a first spring (75) and a placing plate (76), the first fixing plate (71) is arranged on both sides of the top of the supporting plate (6), the first fixing rods (72) are symmetrically arranged between the first fixing plates (71), the second fixing rod (73) is slidably arranged on the first fixing rod (72), the first movable rod (74) is slidably arranged on the lower side of the second fixing rod (73), the first spring (75) is connected between the first movable rod (74) and the second fixing rod (73), and the placing plate (76) is connected between the first movable rods (74).
3. The encapsulating device for the electrolytic capacitors of the integrated circuit boards as claimed in claim 2, wherein the triggering mechanism (8) comprises a first inclined block (81), a first support (82), a second inclined block (83), a torsion spring (84), a third inclined block (85) and a second spring (86), the first inclined block (81) is arranged on the front side of the placing plate (76), the first support (82) is arranged on one side of the bottom of the loading frame (2) close to the supporting plate (6), the second inclined block (83) is arranged on the first support (82) in a sliding manner, the second spring (86) is connected between the first support (82) and the second inclined block (83), the third inclined block (85) is arranged on one side of the second inclined block (83) far away from the first inclined block (81), and the torsion spring (84) is connected between the discharging pipe (4) and the rotating plate (5).
4. The encapsulation device for the electrolytic capacitors of the integrated circuit board according to claim 3, further comprising a shaking mechanism (9), wherein the shaking mechanism (9) comprises a second fixing plate (91), a limiting plate (92), a second bracket (93) and wheels (94), the second fixing plate (91) is connected to the outer side of the first fixing plate (71) on both sides, the limiting plate (92) is connected between the second fixing plates (91), the second bracket (93) is arranged in the middle of the bottom of the placing plate (76), and the wheels (94) are rotatably arranged on the second bracket (93).
5. The encapsulation device for the electrolytic capacitors of the integrated circuit board as claimed in claim 4, further comprising a fixing mechanism (10), wherein the fixing mechanism (10) comprises a third fixing plate (101), a second movable rod (102), a clamping plate (103) and a third spring (104), the third fixing plate (101) is arranged on each of two sides of the placing plate (76), the second movable rod (102) is arranged on each of the third fixing plates (101), the clamping plate (103) is arranged on each of the inner sides of the second movable rods (102), and the third spring (104) is connected between each of the second movable rods (102) and the third fixing plate (101).
6. The encapsulation device for the electrolytic capacitors of the integrated circuit board as claimed in claim 5, further comprising a rotating mechanism (11), wherein the rotating mechanism (11) comprises a third bracket (111), a motor (112) and a fourth bracket (113), first pivot (114), reel (115) and stay cord (116), the one side symmetry formula that dress frame (2) were kept away from at backup pad (6) top is equipped with third support (111), all be equipped with motor (112) on third support (111), the one side symmetry formula that backup pad (6) top is close to dress frame (2) is equipped with fourth support (113), equal rotary type is equipped with first pivot (114) on fourth support (113), first pivot (114) all with the output shaft of adjacent motor (112), all be equipped with reel (115) on first pivot (114), reel (115) all are connected with stay cord (116) with place board (76).
7. The encapsulation device for the electrolytic capacitors of the integrated circuit board as claimed in claim 6, further comprising a heating mechanism (12), wherein the heating mechanism (12) comprises a first supporting frame (121), an electric box (122), a heater (123) and a button (124), the first supporting frame (121) is arranged on the upper side of the base (1), the electric box (122) is arranged on the first supporting frame (121), the heater (123) is arranged on the lower side of the electric box (122), and the button (124) is slidably arranged on the top of the heater (123).
8. The encapsulation device for the electrolytic capacitors of the integrated circuit board as claimed in claim 7, further comprising a cooling mechanism (13), wherein the cooling mechanism (13) comprises a first bevel gear (131), a second rotating shaft (132), a second bevel gear (133), a second supporting frame (134), a third rotating shaft (135), a fan (136) and a flat belt (137), the second rotating shaft (132) is rotatably disposed at one side of the supporting plate (6), the second bevel gear (133) is disposed at the lower side of the second rotating shaft (132), the first rotating shaft (114) near one side of the second rotating shaft (132) is provided with the first bevel gear (131), the first bevel gear (131) is engaged with the second bevel gear (133), the second supporting frame (134) is disposed at the position of the supporting plate (6) near the second rotating shaft (132), the third rotating shaft (135) is rotatably disposed on the second supporting frame (134), the fan (136) is disposed at the lower side of the third rotating shaft (135), a flat belt (137) is wound between the third rotating shaft (135) and the second rotating shaft (132) through a belt pulley.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111077801.4A CN113948319B (en) | 2021-09-15 | 2021-09-15 | Encapsulation equipment for electrolytic capacitor of integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111077801.4A CN113948319B (en) | 2021-09-15 | 2021-09-15 | Encapsulation equipment for electrolytic capacitor of integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113948319A true CN113948319A (en) | 2022-01-18 |
| CN113948319B CN113948319B (en) | 2023-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111077801.4A Active CN113948319B (en) | 2021-09-15 | 2021-09-15 | Encapsulation equipment for electrolytic capacitor of integrated circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN113948319B (en) |
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|---|---|---|---|---|
| DE602006009121D1 (en) * | 2006-10-17 | 2009-10-22 | Delphi Tech Inc | Device for fixing an electrical component on a printed circuit board |
| CN206711774U (en) * | 2017-04-18 | 2017-12-05 | 胡树铎 | A kind of continuous glue injection device of electric capacity |
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| CN113182096A (en) * | 2021-05-07 | 2021-07-30 | 抚州盛宏电子有限公司 | Capacitor gluing device for electronic processing |
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| CN108770212A (en) * | 2018-07-12 | 2018-11-06 | 深圳智慧者机器人科技有限公司 | Pcb board automatic tape-wrapping device |
| CN108838673A (en) * | 2018-07-24 | 2018-11-20 | 山东爱通工业机器人科技有限公司 | Pcb board automatically beats the encapsulated production line of pin |
| CN211720834U (en) * | 2019-12-18 | 2020-10-20 | 惠州市成泰自动化科技有限公司 | Automatic rubber coating mechanism of PCB |
| CN213459439U (en) * | 2020-11-20 | 2021-06-15 | 南京星梵电子科技有限公司 | Glue injection jig for capacitor machining |
| CN112635203A (en) * | 2020-12-10 | 2021-04-09 | 扬州日精电子有限公司 | Thin film capacitor embedment device |
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| CN113182096A (en) * | 2021-05-07 | 2021-07-30 | 抚州盛宏电子有限公司 | Capacitor gluing device for electronic processing |
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| CN113948319B (en) | 2023-07-21 |
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Effective date of registration: 20230628 Address after: 210000 No. 8, Futian Road, Zhetang Town, Lishui District, Nanjing City, Jiangsu Province Applicant after: NANJING GAOXI ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 518000 room 112, floor 1, building 3, Zhongxing Industrial City, Chuangye Road, Nanshan District, Shenzhen, Guangdong Applicant before: Shenzhen wowei Technology Co.,Ltd. |
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Denomination of invention: A device for encapsulating electrolytic capacitors on integrated circuit boards Granted publication date: 20230721 Pledgee: China Postal Savings Bank Co.,Ltd. Nanjing Lishui Branch Pledgor: NANJING GAOXI ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980016784 |