CN113948314B - Thin film capacitor - Google Patents

Thin film capacitor Download PDF

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Publication number
CN113948314B
CN113948314B CN202111314269.3A CN202111314269A CN113948314B CN 113948314 B CN113948314 B CN 113948314B CN 202111314269 A CN202111314269 A CN 202111314269A CN 113948314 B CN113948314 B CN 113948314B
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column
grid area
metal
width value
area
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CN113948314A (en
Inventor
郑建林
罗荣海
陈渊伟
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XIAMEN FARATRONIC CO Ltd
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XIAMEN FARATRONIC CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/32Wound capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The invention discloses a film capacitor, which is formed by winding a first metal film and a second metal film in a staggered manner, wherein: the first metal film comprises a first multi-column grid area, the second metal film comprises a second multi-column grid area, and the last column in the first multi-column grid area is partially overlapped with the last column in the second multi-column grid area to obtain an overlapped area; a width value of a last column in the first multi-column grid area is equal to a width value of a last column in the second multi-column grid area, and a ratio of the width value of the overlapping area to the width value of the last column in the first multi-column grid area is greater than or equal to 0.7; the use safety of the film capacitor can be effectively improved.

Description

Thin film capacitor
Technical Field
The invention relates to the technical field of capacitors, in particular to a film capacitor.
Background
Metallized films are used in a wide variety of applications in the thin film capacitor industry.
In the related technology, the film capacitor is manufactured by matching two half-grid designed metallized films; so as to ensure the utilization rate of the electrode layer. However, the film capacitor manufactured by the method is not high in safety in the using process.
Disclosure of Invention
The present application is based on the recognition and study of the following problems by the inventors: in the manufacturing process of the film capacitor, the inventor finds that if the width value of the grid overlapping area of the metal film of the film capacitor is too low; when the weak point self-healing occurs at the central position of the membrane width; because the membrane width and the middle air gap are more, the instantaneous self-healing energy is larger; the fusing action of the fuse is easily ineffective; further, the safety of use of the film capacitor is greatly reduced.
The present invention is directed to solving, at least to some extent, one of the technical problems in the art described above. Therefore, an object of the present invention is to provide a film capacitor, which can effectively improve the safety of the film capacitor.
In order to achieve the above object, a first aspect of the present invention provides a film capacitor, the film capacitor being formed by winding a first metal film and a second metal film in a staggered manner, wherein: the first metal film comprises a first multi-column grid area, the second metal film comprises a second multi-column grid area, the last column in the first multi-column grid area is partially overlapped with the last column in the second multi-column grid area to obtain an overlapped area, the first metal film is provided with a first metal-free edge, the second metal film is provided with a second metal-free edge, the last column in the first multi-column grid area is a column of grid area far away from the first metal-free edge in the first multi-column grid area, and the last column in the second multi-column grid area is a column of grid area far away from the second metal-free edge in the second multi-column grid area; the width value of the last column in the first multi-column grid area is equal to the width value of the last column in the second multi-column grid area, and the ratio of the width value of the overlapping area to the width value of the last column in the first multi-column grid area is greater than or equal to 0.7.
According to the film capacitor of the embodiment of the invention, the film capacitor is formed by winding the first metal film and the second metal film in a staggered manner, wherein: the first metal film comprises a first multi-column grid area, the second metal film comprises a second multi-column grid area, the last column in the first multi-column grid area is partially overlapped with the last column in the second multi-column grid area to obtain an overlapped area, the first metal film is provided with a first metal-free edge, the second metal film is provided with a second metal-free edge, the last column in the first multi-column grid area is a column of grid area far away from the first metal-free edge in the first multi-column grid area, and the last column in the second multi-column grid area is a column of grid area far away from the second metal-free edge in the second multi-column grid area; the width value of the last column in the first multi-column grid area is equal to the width value of the last column in the second multi-column grid area, and the ratio of the width value of the overlapping area to the width value of the last column in the first multi-column grid area is greater than or equal to 0.7; therefore, the failure of the fusing function of the fuse can be effectively prevented, and the use safety of the film capacitor is improved.
In addition, the film capacitor proposed according to the above embodiment of the present invention may also have the following additional technical features:
optionally, a ratio between a width value of the first multi-column grid area and a width value of the last column of the first metal film is greater than or equal to 0.15 and less than or equal to 0.3, and a ratio between a width value of the last column of the second multi-column grid area and a width value of the second metal film is greater than or equal to 0.15 and less than or equal to 0.3.
Optionally, the first multi-column grid region includes multi-column grids, the multi-column grids are formed by dividing longitudinal metal-free strips, each column of grids in the multi-column grids is divided by equally spaced transverse metal-free strips to form a plurality of electrode blocks, and adjacent electrode blocks are connected by fuses.
Optionally, the side of the fuse is arc-shaped.
Drawings
FIG. 1 is a schematic structural diagram of a thin film capacitor according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a thin film capacitor according to yet another embodiment of the present invention;
FIG. 3 is a diagram illustrating a multi-column grid area structure according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a fuse according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the related art, when a weak point self-heals at the central position of the membrane width; because the membrane width and the air gap between the two are more, the instantaneous self-healing energy is larger; the fusing action of the fuse is easily ineffective; furthermore, the use safety of the film capacitor is greatly reduced; according to the film capacitor of the embodiment of the invention, the film capacitor is formed by winding the first metal film and the second metal film in a staggered manner, wherein: the first metal film comprises a first multi-column grid area, the second metal film comprises a second multi-column grid area, the last column in the first multi-column grid area is partially overlapped with the last column in the second multi-column grid area to obtain an overlapped area, the first metal film is provided with a first metal-free edge, the second metal film is provided with a second metal-free edge, the last column in the first multi-column grid area is a column of grid area far away from the first metal-free edge in the first multi-column grid area, and the last column in the second multi-column grid area is a column of grid area far away from the second metal-free edge in the second multi-column grid area; the width value of the last column in the first multi-column grid area is equal to the width value of the last column in the second multi-column grid area, and the ratio of the width value of the overlapping area to the width value of the last column in the first multi-column grid area is greater than or equal to 0.7; therefore, the failure of the fusing function of the fuse can be effectively prevented, and the use safety of the film capacitor is improved.
In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
In order to better understand the technical scheme, the technical scheme is described in detail in the following with reference to the attached drawings of the specification and specific embodiments.
Fig. 1 and 2 are schematic structural views of a film capacitor according to an embodiment of the present invention, and the film capacitor is formed by winding a first metal film 10 and a second metal film 20 in a staggered manner, as shown in fig. 1 and 2.
As shown in fig. 1 and fig. 2, the first metal film 10 includes a first multi-column grid region 11, the second metal film 20 includes a second multi-column grid region 21, a last column 111 in the first multi-column grid region and a last column 211 in the second multi-column grid region are partially overlapped to obtain an overlapped region 30, wherein the first metal film 10 is provided with a first metal-free margin 16, the second metal film 20 is provided with a second metal-free margin 26, the last column 111 in the first multi-column grid region is a column of grid regions far from the first metal-free margin 16 in the first multi-column grid region 11, and the last column 211 in the second multi-column grid region is a column of grid regions far from the second metal-free margin 26 in the second multi-column grid region 21.
The width of the last column 111 in the first multi-column grid region is equal to the width of the last column 211 in the second multi-column grid region, and the ratio of the width of the overlap region 30 to the width of the last column 111 in the first column grid region is equal to or greater than 0.7, so that the use safety of the film capacitor can be effectively improved by limiting the grid overlap region in terms of width.
It should be noted that the above improvement was made by the inventors based on their studies on the case where the fuse blowing action in the film capacitor fails.
In the process of researching the fuse fusing failure phenomenon in the film capacitor, the inventor finds that: the phenomenon of failure of the fuse fusing action is mostly caused by the weak point self-healing of the central position of the membrane width. The reason that the fuse fusing function fails due to the fact that weak points occur in the central position of the membrane width and self-healing occurs is that the central air gap of the membrane width is large, and the instantaneous self-healing energy is large; if the superposition width of the grids of the two metal films is too small, the self-healing points on the two metal films can simultaneously span the last row of grids to be directly and electrically connected with the non-grid area, and further the fuse fusing effect is failed.
To illustrate this problem more clearly, one of the experiments performed by the inventors is exemplified: under the condition that the rated voltage is 800V, the size of a self-healing point at the center of the membrane width is about 4mm; the same conditions of the experiment were carried out in two sets of protocols; wherein, the A scheme is that the width of a grid overlapping area is 3.75mm (assuming that the width value of the last line of grids in a multi-line grid area is 15% of the width of the film, and the width of the grid overlapping area is 3.75mm and is 50% of the width value of the last line of grids in the multi-line grid area in the metal film); the solution B is that the width of the grid overlapping area is 5.5mm (assuming that the width value of the last row of grids in the multi-row grid area is 15% of the width of the film, and the width of the grid overlapping area is 5.5mm of 73% of the width value of the last row of grids in the multi-row grid area in the metal film); taking the number of samples of the scheme A and the scheme B as 30; when 60 cores are subjected to high-temperature pressure-resistant experiments under the same conditions; the fusing action failure number of 30 core fuses corresponding to the scheme A is 2, and the fusing action failure of 30 cores without fuses in the scheme B is avoided.
In some embodiments, a ratio between a width value of the last column 111 of the first multi-column grid region and a width value of the first metal film 10 is greater than or equal to 0.15 and less than or equal to 0.3, and a ratio between a width value of the last column 211 of the second multi-column grid region and a width value of the second metal film 20 is greater than or equal to 0.15 and less than or equal to 0.3; it can be understood that, by the above-mentioned limitation, the utilization rate of the metal film can be effectively ensured; meanwhile, the single-row grid area ratio is prevented from being too large (when the single-row grid area ratio is too large, if self-healing occurs, the capacity loss is extremely large); therefore, through the above limitation, the utilization rate of the metal film can be effectively ensured, and at the same time, the excessive influence of the self-healing on the capacity of the thin film capacitor is prevented.
The generation manners of the first multi-column grid region 11 and the second multi-column grid region 21 may be various (the generation manners of the first multi-column grid region 11 and the second multi-column grid region 21 are the same, and only the generation manner of the first multi-column grid region 11 will be described below).
In some embodiments, as shown in fig. 2 and 3, the first multi-column grid region 11 includes a multi-column grid, the multi-column grid is formed by dividing a longitudinal metal-free strip 12, each column grid of the multi-column grid is divided by a transverse metal-free strip 13 with equal spacing to form a plurality of electrode blocks 14, and adjacent electrode blocks 14 are connected by a fuse 15.
In some embodiments, in order to increase the cross-sectional area of the overcurrent and improve the overcurrent capacity, the side of the fuse 15 is arc-shaped.
As shown in fig. 4, as shown in the lower drawing of fig. 4, in the related art, the side edges of the fuse 15 are all configured to be in an inverted R-shape, while as shown in the upper drawing of fig. 4, in the embodiment of the present application, the side edges of the fuse 15 are in an arc shape (for example, a semicircular shape, or various circular arc shapes); it can be understood that when the minimum width of the fuse is consistent, the arc-shaped fuse adopted by the embodiment can effectively increase the cross-sectional area of the overcurrent, thereby improving the overcurrent capacity.
In summary, according to the film capacitor of the embodiment of the present invention, the film capacitor is formed by winding the first metal film and the second metal film in a staggered manner, wherein: the first metal film comprises a first multi-column grid area, the second metal film comprises a second multi-column grid area, and the last column in the first multi-column grid area is partially overlapped with the last column in the second multi-column grid area to obtain an overlapped area; the width value of the last column in the first multi-column grid area is equal to the width value of the last column in the second multi-column grid area, and the ratio of the width value of the overlapping area to the width value of the last column in the first multi-column grid area is greater than or equal to 0.7; therefore, the failure of the fusing function of the fuse can be effectively prevented, and the use safety of the film capacitor is improved.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means can be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the second feature or the first and second features may be indirectly contacting each other through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description of the specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (4)

1. A film capacitor, characterized in that the film capacitor is formed by winding a first metal film and a second metal film in a staggered manner, wherein:
the first metal film comprises a first multi-column grid area, the second metal film comprises a second multi-column grid area, the last column in the first multi-column grid area is partially overlapped with the last column in the second multi-column grid area to obtain an overlapped area, the first metal film is provided with a first metal-free edge, the second metal film is provided with a second metal-free edge, the last column in the first multi-column grid area is a column of grid area far away from the first metal-free edge in the first multi-column grid area, and the last column in the second multi-column grid area is a column of grid area far away from the second metal-free edge in the second multi-column grid area;
the width value of the last column in the first multi-column grid area is equal to the width value of the last column in the second multi-column grid area, and the ratio of the width value of the overlapping area to the width value of the last column in the first multi-column grid area is greater than or equal to 0.7.
2. The film capacitor according to claim 1, wherein a ratio between a width value of a last column of the first multi-column grid region and a width value of the first metal film is 0.15 or more and 0.3 or less, and a ratio between a width value of a last column of the second multi-column grid region and a width value of the second metal film is 0.15 or more and 0.3 or less.
3. A thin film capacitor as claimed in claim 1, wherein the first multi-column grid region comprises a multi-column grid formed by dividing a longitudinal metal-free strip, each of the multi-column grid is divided by equally spaced transverse metal-free strips to form a plurality of electrode blocks, and adjacent electrode blocks are connected by fuses.
4. A film capacitor according to claim 3, wherein the fuse has arcuate sides.
CN202111314269.3A 2021-10-28 2021-11-08 Thin film capacitor Active CN113948314B (en)

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CN2021112626656 2021-10-28

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1175068A (en) * 1996-08-09 1998-03-04 松下电器产业株式会社 Metallized mylar capacitor and euqipment and method for making metallized mylar
JP2009147255A (en) * 2007-12-18 2009-07-02 Toray Ind Inc Metallized film and metallized film capacitor
CN204204642U (en) * 2014-11-06 2015-03-11 佛山市南海区欣源电子有限公司 A kind of T-shaped metal metallized safety film and metallized safety film capacitor
JP2016009775A (en) * 2014-06-25 2016-01-18 小島プレス工業株式会社 Laminated film capacitor and manufacturing method of the same
CN108346514A (en) * 2018-04-11 2018-07-31 佛山市顺德区胜业电气有限公司 A kind of capacitor double level metallization film
CN108597871A (en) * 2018-04-18 2018-09-28 钱立文 A kind of safety diaphragm of composite construction
CN109074955A (en) * 2016-04-27 2018-12-21 京瓷株式会社 Thin film capacitor, even junction capacitor and converter and electric vehicle using it
CN210110541U (en) * 2019-05-20 2020-02-21 松下电子部品(江门)有限公司 High-voltage direct-current supporting film capacitor
CN212625204U (en) * 2020-07-01 2021-02-26 四川中星电子有限责任公司 Metallized film direct current supporting capacitor without shell encapsulation
CN113077984A (en) * 2021-03-30 2021-07-06 厦门法拉电子股份有限公司 Metallized film and metallized film capacitor

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1175068A (en) * 1996-08-09 1998-03-04 松下电器产业株式会社 Metallized mylar capacitor and euqipment and method for making metallized mylar
JP2009147255A (en) * 2007-12-18 2009-07-02 Toray Ind Inc Metallized film and metallized film capacitor
JP2016009775A (en) * 2014-06-25 2016-01-18 小島プレス工業株式会社 Laminated film capacitor and manufacturing method of the same
CN204204642U (en) * 2014-11-06 2015-03-11 佛山市南海区欣源电子有限公司 A kind of T-shaped metal metallized safety film and metallized safety film capacitor
CN109074955A (en) * 2016-04-27 2018-12-21 京瓷株式会社 Thin film capacitor, even junction capacitor and converter and electric vehicle using it
CN108346514A (en) * 2018-04-11 2018-07-31 佛山市顺德区胜业电气有限公司 A kind of capacitor double level metallization film
CN108597871A (en) * 2018-04-18 2018-09-28 钱立文 A kind of safety diaphragm of composite construction
CN210110541U (en) * 2019-05-20 2020-02-21 松下电子部品(江门)有限公司 High-voltage direct-current supporting film capacitor
CN212625204U (en) * 2020-07-01 2021-02-26 四川中星电子有限责任公司 Metallized film direct current supporting capacitor without shell encapsulation
CN113077984A (en) * 2021-03-30 2021-07-06 厦门法拉电子股份有限公司 Metallized film and metallized film capacitor

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