CN212625204U - Metallized film direct current supporting capacitor without shell encapsulation - Google Patents
Metallized film direct current supporting capacitor without shell encapsulation Download PDFInfo
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- CN212625204U CN212625204U CN202021262188.4U CN202021262188U CN212625204U CN 212625204 U CN212625204 U CN 212625204U CN 202021262188 U CN202021262188 U CN 202021262188U CN 212625204 U CN212625204 U CN 212625204U
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Abstract
The utility model relates to a condenser technical field discloses a metallized film direct current support capacitor of no shell encapsulation, including electric capacity core, epoxy layer and top jiao gai, the epoxy layer cladding electric capacity core, epoxy layer meets with the top jiao gai will the electric capacity core is sealed, the electric capacity core includes to overlap by two layers of metallized film and forms every layer around rolling up metallized film includes the safety film layer and coats in the metallic coating on safety film layer surface, the safety film layer includes grid district and II shape districts, the grid district is provided with a plurality of fuses, the fuse is crisscross each other and is formed a plurality of grid units, the edge that II shape districts one side was kept away from in the grid district is provided with the portion of staying white. The utility model discloses a can prevent the emergence that the condenser short circuit punctures effectively to the actual life of extension condenser.
Description
Technical Field
The utility model belongs to the technical field of the condenser, especially, relate to a metallized film direct current support capacitor of no shell encapsulation.
Background
Surge voltage in a bus DC _ Link system of wind power generation is difficult to avoid, and a spike voltage higher than a rated voltage of a thin film capacitor often occurs. Although the thin film capacitor has better self-healing characteristics, the damage of the thin film capacitor caused by the peak voltage is repaired through self-healing; however, with the increase of the use time and the excessive self-healing times, the loss of the capacitor is increased, so that the capacitor generates excessive heat in the use process, and the capacitor is easy to thermally fail and even burn. Therefore, how to solve the above technical problems becomes a focus of research by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
A first object of the present invention is to provide a metallized film dc supporting capacitor without housing package, which is not enough in the prior art.
The embodiment of the utility model is realized like this:
the utility model provides a metallized film direct current support capacitor of no shell encapsulation, glues the lid including electric capacity core, epoxy layer and top, the epoxy layer cladding electric capacity core, the epoxy layer with the top glue the lid meet with the electric capacity core is sealed, the electric capacity core includes to overlap by two layers of metallized film and forms around rolling up, every layer metallized film includes the safety film layer and coats in the metallic coating on safety film layer surface, the safety film layer includes grid district and II shape district, the grid district is provided with a plurality of fuses, the fuse is crisscross each other and is formed a plurality of grid units, the edge that II shape district one side was kept away from in the grid district is provided with the portion of staying white.
Furthermore, the grid area and the II-shaped area are symmetrically arranged by taking the central line of the long axis of the safety film layer as a symmetry axis.
Furthermore, one end of the safety film layer is flush with one end of the metal coating layer, and the other end of the safety film layer is exposed outside the other end of the metal coating layer to form an extension part.
Furthermore, an upward bulge is arranged at one end of the metal coating flush with the safety film layer.
Furthermore, in the two overlapped metalized films, the grid area of the upper metalized film corresponds to the II-shaped area of the lower metalized film, and the grid area of the lower metalized film corresponds to the II-shaped area of the upper metalized film.
Furthermore, the top rubber cover is provided with two terminals, and the terminals are connected with the capacitor core through copper strips.
The utility model has the advantages that:
the utility model discloses an electric capacity core is when repairing the damage that peak voltage caused to film capacitor through the self-healing, and the joule heat that produces on the fuse increases to lead to the temperature to rise rapidly and blow the fuse, make each net unit break off mutually, the cutting off current, this process takes place very fast, can prevent the emergence that the condenser short circuit punctures effectively, thereby prolongs the actual life of condenser.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a longitudinal sectional view of a metallized film dc support capacitor without a package according to the present invention;
FIG. 2 is a schematic structural view of a capacitor core;
fig. 3 is a schematic structural view of a safety film layer.
Icon: 1-capacitor core, 2-epoxy layer, 3-top glue cover, 4-terminal, 5-copper strip, 6-insulating cover plate, 7-metalized film, 701-safety film layer, 702-metal coating, 7010-grid region, 7011-II region, 7012-grid unit and 7013-blank part.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1 to 3, the present embodiment provides a metallized film dc-supported capacitor without package on housing, including a capacitor core 1, an epoxy layer 2 and a top cover 3, wherein the epoxy layer 2 covers the capacitor core 1, the epoxy layer 2 is welded to the top cover 3 in a molten state and then solidified to seal the capacitor core 1, the top cover 3 is provided with two terminals 4, the terminals 4 are connected to the capacitor core 1 through a copper tape 5, and an insulating cover plate 6 is filled between one side of the terminals 4 and the capacitor core 1.
The capacitor core 1 is formed by overlapping and winding two layers of metalized films 7, each layer of metalized film 7 comprises a safety film layer 701 and a metal coating 702 coated on the surface of the safety film layer 701, the safety film layer 701 comprises a grid area 7010 and a II-shaped area 7011, the grid areas 7010 and the II-shaped areas 7011 are symmetrically arranged by taking the long axis center line of the safety film layer 701 as a symmetry axis, a plurality of fuses are adhered to the grid area 7010, the fuses are staggered with one another to form a plurality of grid units 7012, and the grid units 7012 are not limited to be honeycomb-shaped or square-shaped. The edge of the grid area 7010, which is far away from the side of the II-shaped area 7011, is provided with a blank part 7013, in the two layers of overlapped metallized films 7, the grid area 7010 of the upper layer of metallized film 7 corresponds to the II-shaped area 7011 of the lower layer of metallized film 7, and the grid area 7010 of the lower layer of metallized film 7 corresponds to the II-shaped area 7011 of the upper layer of metallized film 7. In each layer of the metallized film 7, one end of the safety film layer 701 is flush with one end of the metal plating layer 702, the other end of the safety film layer 701 is exposed outside the other end of the metal plating layer 702 to form an extension part, the extension part is convenient for winding the metallized film 7, and an upward protruding part is arranged at one end of the metal plating layer 702 flush with the safety film layer 701.
The safety film layer 701 is a polypropylene-based film layer, and the metal coating layer 702 is a zinc-aluminum layer.
The metallized film direct current supporting capacitor without the shell encapsulation provided by the embodiment can repair the damage of the thin film capacitor caused by the spike voltage through self-healing, the joule heat generated on the fuse is increased, the temperature is rapidly increased to blow the fuse, each grid unit 7012 is mutually disconnected, the current is cut off, the process is very fast, the short-circuit breakdown of the capacitor can be effectively prevented, and the actual service life of the capacitor is prolonged.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A metallized film direct current support capacitor without shell encapsulation is characterized in that: including electric capacity core (1), epoxy layer (2) and top jiao gai (3), epoxy layer (2) cladding electric capacity core (1), epoxy layer (2) meet with top jiao gai (3) will electric capacity core (1) is sealed, electric capacity core (1) includes to overlap by two-layer metallized film (7) and forms around rolling up, every layer metallized film (7) include safety film layer (701) and coat in metal coating (702) on safety film layer (701) surface, safety film layer (701) include grid district (7010) and II shape district (7011), grid district (7010) is provided with a plurality of fuses, the fuse is crisscross each other and is formed a plurality of grid units (7012), the edge that II shape district (7011) one side was kept away from in grid district (7010) is provided with white portion (7013).
2. The metal-clad thin film dc support capacitor of claim 1 wherein: the grid area (7010) and the II-shaped area (7011) are symmetrically arranged by taking the center line of the long axis of the safety film layer (701) as a symmetry axis.
3. The metal-clad thin film dc support capacitor of claim 1 wherein: one end of the safety film layer (701) is flush with one end of the metal coating layer (702), and the other end of the safety film layer (701) is exposed out of the other end of the metal coating layer (702) to form an extension part.
4. The metal-clad thin film dc support capacitor of claim 3 wherein: an upward convex part is arranged at one end of the metal plating layer (702) which is flush with the safety film layer (701).
5. The metal-clad thin film dc support capacitor of claim 1 wherein: in the two overlapped metalized films (7), a grid area (7010) of the upper metalized film (7) corresponds to a II-shaped area (7011) of the lower metalized film (7), and a grid area (7010) of the lower metalized film (7) corresponds to the II-shaped area (7011) of the upper metalized film (7).
6. The metal-clad thin film dc support capacitor of claim 1 wherein: the top rubber cover (3) is provided with two terminals (4), and the terminals (4) are connected with the capacitor core (1) through copper strips (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021262188.4U CN212625204U (en) | 2020-07-01 | 2020-07-01 | Metallized film direct current supporting capacitor without shell encapsulation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021262188.4U CN212625204U (en) | 2020-07-01 | 2020-07-01 | Metallized film direct current supporting capacitor without shell encapsulation |
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| CN212625204U true CN212625204U (en) | 2021-02-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113948314A (en) * | 2021-10-28 | 2022-01-18 | 厦门法拉电子股份有限公司 | Thin film capacitor |
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2020
- 2020-07-01 CN CN202021262188.4U patent/CN212625204U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113948314A (en) * | 2021-10-28 | 2022-01-18 | 厦门法拉电子股份有限公司 | Thin film capacitor |
| CN113948314B (en) * | 2021-10-28 | 2023-02-24 | 厦门法拉电子股份有限公司 | Thin film capacitor |
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