CN113943924A - Evaporation device and evaporation method - Google Patents

Evaporation device and evaporation method Download PDF

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Publication number
CN113943924A
CN113943924A CN202111107256.9A CN202111107256A CN113943924A CN 113943924 A CN113943924 A CN 113943924A CN 202111107256 A CN202111107256 A CN 202111107256A CN 113943924 A CN113943924 A CN 113943924A
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CN
China
Prior art keywords
heating
evaporation
crucible
groove body
cover plate
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Pending
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CN202111107256.9A
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Chinese (zh)
Inventor
罗武峰
吴炜钦
何文双
蔡晓义
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Truly Huizhou Smart Display Ltd
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Truly Huizhou Smart Display Ltd
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Priority to CN202111107256.9A priority Critical patent/CN113943924A/en
Publication of CN113943924A publication Critical patent/CN113943924A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source

Abstract

The invention relates to an evaporation device, which comprises a crucible, an evaporation spray pipe and a heating system, wherein one end of the evaporation spray pipe, which is far away from the crucible, is provided with a spray component, a containing space is arranged inside the crucible, the evaporation spray pipe is communicated with the containing space, the heating system comprises a heating groove body and a heating cover plate, the heating groove body is used for containing the crucible, the heating cover plate is connected with a notch of the heating groove body, the heating cover plate is provided with a through hole, the through hole penetrates through the heating cover plate, and the through hole is used for enabling the evaporation spray pipe to extend out of the heating groove body from the inside of the groove body of the heating groove body; the plurality of first resistance elements are positioned in the groove body of the heating groove body and distributed on the outer side wall of the crucible; the single or a plurality of first resistance elements are arranged on the end face of the heating cover plate close to the crucible, the first resistance elements arranged on the heating cover plate are in contact with the crucible, and a plurality of second resistance elements are further arranged inside the heating cover plate, and one second resistance element surrounds one through hole. The invention also relates to an evaporation method.

Description

Evaporation device and evaporation method
Technical Field
The invention relates to the technical field of evaporation equipment, in particular to an evaporation device and an evaporation method.
Background
The evaporation coating technology is a commonly used vacuum coating technology at present, and is characterized in that materials (inorganic materials or organic materials) are heated and evaporated in vacuum to form a gas state and are deposited on a substrate. The evaporation coating process is divided into point evaporation and linear evaporation. The point evaporation is to place the material to be evaporated in the middle of a point evaporation source, and when the point evaporation is used, the material is evaporated by a heating wire and is deposited on a substrate, and the point evaporation source is called as the point evaporation source because the evaporation area is relatively small; the evaporation source of the linear evaporation device comprises a crucible and a linear evaporation nozzle, a material to be evaporated is placed in the crucible, a heating wire is arranged outside the crucible to heat the material, the material is converted into a gaseous state and enters the evaporation nozzle from the crucible, the evaporation nozzle is provided with a plurality of nozzles (evaporation nozzles or linear nozzles), and vapor is sprayed out of the nozzles and then deposited on a substrate.
The point evaporation source has the problems of low production efficiency, difficulty in controlling the evaporation rate and temperature at the same time, poor process controllability, inconvenience in loading evaporation raw materials and the like, so a linear evaporation technology is selected in the production process of an Active-matrix Organic Light-Emitting Diode (AMOLED). In AMOLED production, substances such as organic materials need to be evaporated (or sublimated) in a linear evaporation source of an evaporation apparatus, and the formed gaseous organic materials are sprayed onto a normal-temperature substrate above the evaporation source through nozzles of the evaporation source and then condensed on the surface of the substrate, thereby completing the evaporation operation.
The linear evaporation source changes the saturated vapor pressure by changing the temperature to regulate and control the evaporation rate, and because the structure of the linear evaporation source is larger, the temperature regulation is a slow process, and the materials are continuously consumed in the process of temperature rise or temperature reduction, thereby wasting time and raw materials. Failure to immediately adjust the evaporation rate during production can result in increased sample reject rates and reduced production efficiency if process parameters are found to need adjustment. Therefore, the heating system of the linear evaporation source affects the yield and optical performance of the AMOLED product.
The technical problems of the existing evaporation device applied to AMOLED production are as follows: the linear evaporation source of the evaporation device comprises a crucible and a linear evaporation nozzle, the amount of substances in the crucible is reduced as the substances such as organic materials in the crucible are consumed in the production process, thereby causing the change of saturated vapor pressure in the crucible, which can lead to unstable evaporation rate and even cause the explosion of organic materials, the explosion of the organic materials can lead to the spreading of the organic materials in the evaporation nozzle to block the evaporation nozzle, particularly, the sublimation-type organic material is more likely to clog the evaporation nozzle due to its material characteristics, when the evaporation nozzle is blocked, the uniformity of the deposited film layer on the substrate is poor, the AMOLED product has local abnormal light color and even directly causes yield loss, the existing evaporation device needs to be shut down when the blockage of the evaporation nozzle is treated, which can cause the production efficiency to be obviously reduced.
Disclosure of Invention
The invention provides an evaporation device and an evaporation method, aiming at solving the technical problems in the prior art, and the evaporation device can effectively prevent an evaporation nozzle from being blocked when evaporation coating is carried out.
In one aspect, the invention provides an evaporation device, which comprises a crucible, an evaporation nozzle and a heating system.
The crucible is connected with the evaporation nozzles to form a linear evaporation source, one end of each evaporation nozzle, which is far away from the crucible, is provided with an injection part, an accommodating space is arranged in the crucible and is used for accommodating substances such as organic materials capable of being evaporated (or sublimed), and the evaporation nozzles are communicated with the accommodating space.
The heating system includes: heating cell body and heating apron, the heating cell body is used for holding the crucible, and the notch of heating apron and heating cell body is connected, is provided with the through hole on the heating apron, and the through hole runs through the heating apron for let the evaporation spray tube stretch out to the outside of heating cell body by the cell body of heating cell body is inside. Preferably, the diameter of the evaporation nozzle is matched with that of the through hole, namely the outer side wall of the part of the evaporation nozzle, which is positioned in the through hole, is in contact with the inner side wall of the through hole. The groove body depth of the heating groove body is larger than the height of the crucible, and the heating cover plate covers the notch of the heating groove body.
The heating system is used for heating the crucible, so that the heating member further comprises a plurality of first resistance elements for heating predetermined positions inside the crucible. The first resistance elements are positioned in the groove body of the heating groove body and distributed on the outer side wall of the crucible; the single or a plurality of first resistance elements are arranged on the end face of the heating cover plate close to the crucible, and the first resistance elements arranged on the heating cover plate are in contact with the crucible. A plurality of second resistance elements are also arranged in the heating cover plate, each second resistance element corresponds to one through hole, namely one second resistance element surrounds one through hole.
At least two first resistance elements are positioned in the groove body of the heating groove body and are respectively distributed at the top and the middle of the outer side wall of the crucible. When current passes through the first resistance element, heat can be generated to heat the accommodating space of the crucible, so that substances in the accommodating space of the crucible are evaporated (or sublimated); the second resistance element can generate heat to heat the evaporation spray pipe when passing through current, so that substances condensed on the evaporation spray pipe are evaporated (or sublimated), and the situation that the evaporation spray pipe is blocked is prevented. The magnitude of the heat generated by the first resistance element and the second resistance element is controlled by controlling the magnitude of the current on the first resistance element and the second resistance element.
Preferably, the heating tank body is made of heat-insulating and insulated materials (such as glass fiber, silicate, a vacuum plate and the like), so that the heating uniformity of the crucible in the heating tank body is improved; the heating cover plate is made of a heat-conducting and insulating material, so that the second resistance element and the part of the evaporation nozzle, which is in contact with the through hole, can exchange heat better.
In an embodiment, the heating system further comprises a plurality of thermometers for measuring the temperature of said predetermined location, a plurality of said thermometers being located within said crucible; and the control system is used for controlling the resistance values of the resistance elements and the variable resistor, is respectively connected with the first resistance element and the second resistance element, and is connected with the plurality of thermometers. And the control system receives the temperature signal of the temperature measuring instrument and automatically adjusts the current passing through the first resistance element and the second resistance element according to the temperature signal sent by the temperature measuring instrument. The temperature measuring instrument measures the temperature of the preset position in the crucible, and the control system can control the current passing through each first resistance element and each second resistance element so as to perform segmented heating, thereby performing independent temperature control on each preset position and being beneficial to improving the uniformity of the temperature of each position in the crucible. The control system is arranged outside the heating tank body.
In an embodiment, the first resistive element and/or the second resistive element is a fixed resistor.
In one embodiment, the first resistance element and/or the second resistance element is a one-piece heating component formed by a variable resistor and a fixed resistor.
In one embodiment, the single first resistance elements inside the heating tank body are arranged around the outer side wall of the crucible along the horizontal direction, and the plurality of first resistance elements inside the heating tank body are arranged along the vertical direction.
The evaporation device also comprises a crystal oscillator positioned at the injection part of the evaporation nozzle. The crystal oscillator is used for stabilizing and testing the evaporation rate of the organic vapor.
In one embodiment, the spray member is a nozzle.
In another aspect, the present invention provides a vapor deposition method based on the vapor deposition apparatus described above, including: the first resistance element generates heat to heat the crucible, substances in the accommodating space of the crucible are heated to generate organic steam, and the organic steam flows into the evaporation spray pipe and is sprayed out to the surface of the substrate through the spraying part so as to be deposited into a film; the crystal oscillator monitors the evaporation rate of each injection part in real time, and if the crystal oscillator detects that the evaporation rate of a certain injection part is reduced, the second resistance element generates more heat to heat the evaporation spray pipe connected with the injection part, so that substances blocked in the evaporation spray pipe are heated and converted into organic steam.
The circulating current of the first resistance element positioned in the groove body of the heating groove body is changed along with the consumption of substances in the crucible, the circulating current of the first resistance element arranged on the heating cover plate is constant, each second resistance element arranged in the heating cover plate is independently controlled, and the circulating current of each second resistance element can be different.
Compared with the prior art, the invention has at least the following beneficial effects:
1. according to the evaporation device provided by the invention, the first resistance elements are respectively contacted with the outer side wall of the crucible and the end face of the crucible, which is close to the top heating cover plate, and a cavity for placing the crucible is formed by the heating groove body and the heating cover plate, the crucible is heated more uniformly in the cavity, and each first resistance element can be independently controlled, so that the crucible can be better heated at different positions;
2. the first resistance element arranged on the heating cover plate of the invention adopts a constant current mode to fix the generated heat, thereby maintaining the output of the injection part on the evaporation nozzle and the saturated vapor pressure in the crucible, each second resistance element arranged on the heating cover plate is independently controlled, and the first resistance element and the second resistance element on the heating cover plate are combined for use: when a first resistance element is used for heating and meets a blocking substance on a certain evaporation spray pipe, the evaporation rate of an injection part corresponding to the evaporation spray pipe monitored by a crystal oscillator is reduced, at the moment, the evaporation rate is fed back to a second resistance element surrounding a through hole through which the evaporation spray pipe passes, the current flowing through the second resistance element is increased, the heat output by the second resistance element is increased, the heat applied to the blocking substance on the evaporation spray pipe is increased until the blocking substance is evaporated (or sublimated), and the evaporation spray pipe is recovered to be normal;
3. the evaporation device provided by the invention can realize real-time adjustment of the film thickness distribution on the substrate by controlling the current flowing on each second resistance element, the existing technical scheme is that evaporation spray pipes with different pore diameters are replaced to adjust the film thickness uniformity and the film thickness distribution on the substrate, and the evaporation device provided by the invention can independently control the current flowing on each second resistance element through the actually measured change of the film thickness distribution on the substrate, so that the output of each evaporation spray pipe is independently controlled, the film thickness distribution and uniformity on the substrate are adjusted, the yield of products is obviously improved, and the occurrence of CIE (CIE) light color abnormity is reduced;
4. when the evaporation device provided by the invention meets the blockage substances on the evaporation spray pipe, downtime maintenance is not required, and the production efficiency is obviously improved.
The following description will be given with reference to specific examples.
Drawings
The figures further illustrate the invention, but the examples in the figures do not constitute any limitation of the invention.
Fig. 1 is a front view of a heating cover plate according to an embodiment of the present invention.
Fig. 2 is a rear view of a heating cover plate according to an embodiment of the present invention.
Fig. 3 is an internal circuit diagram of a heating cover plate according to an embodiment of the invention.
Fig. 4 is a schematic structural view of a heating tank according to an embodiment of the present invention.
FIG. 5 is a schematic structural view of the crucible connected with the evaporation nozzle according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of an evaporation apparatus according to an embodiment of the present invention.
Fig. 7 is a diagram showing a state of use of the vapor deposition device according to the embodiment of the present invention (the first resistance element and the second resistance element are omitted).
Wherein the reference numerals are: 1. a crucible; 2. evaporating the spray pipe; 31. heating the tank body; 32. heating the cover plate; 33. a through hole; 41. a first resistance element; 42. a second resistance element; 5. a substrate.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be mechanically coupled, directly coupled, or indirectly coupled through intervening agents, both internally and/or in any other manner known to those skilled in the art. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The embodiment provides a vapor deposition device, which comprises a crucible 1, an evaporation nozzle 2 and a heating system.
As shown in fig. 5, a crucible 1 and seven evaporation lances 2 are connected to form a linear evaporation source, the evaporation lances 2 are disposed on a top end surface of the crucible 1, and a nozzle (not shown) is disposed at an end of the evaporation lances 2 away from the crucible, a receiving space for receiving an organic material that can be evaporated is disposed inside the crucible 1, and the seven evaporation lances 2 are all communicated with the receiving space. The evaporation apparatus further comprises a crystal oscillator (not shown in the drawings) located at the nozzle of the evaporation nozzle 2, which is used to stabilize and test the evaporation rate of the organic vapor.
The heating system includes: the heating trough body 31 and the heating cover plates 32, 31 are used for containing the crucible 1, the heating cover plates 32 are connected with the notches of the heating trough body 31, seven through holes 33 are formed in the heating cover plates 31, the through holes 33 penetrate through the heating cover plates 32, and the evaporation spray pipes 2 vertically penetrate through the through holes 33 and extend out of the heating trough body 31.
In this embodiment, the diameter of the evaporation nozzle 2 is matched with the diameter of the through hole 33, that is, the outer sidewall of the portion of the evaporation nozzle 2 located in the through hole 33 is in contact with the inner sidewall of the through hole 33. The depth of the heating tank body 31 is larger than the height of the crucible 1, and the heating cover plate 32 covers the notch of the heating tank body 31.
The heating system is used to heat the crucible 1, and therefore the heating means further comprise three first resistive elements 41 for heating a predetermined position inside the crucible 1. Wherein, as shown in fig. 4, two first resistance elements 41 are located inside the heating tank body 31 and distributed on the outer side wall of the crucible, more specifically, two first resistance elements 41 are arranged on the side wall inside the heating tank body 31, and two electrical connection ends of the first resistance elements 41 respectively penetrate through the side wall of the heating tank body 31 and are connected with an external control system (not shown in the drawing), when the crucible 1 is placed inside the heating tank body 31, the two first resistance elements 41 are clamped between the side wall inside the tank body of the heating tank body 31 and the outer side wall of the crucible 1, and both the two first resistance elements 41 are fully contacted with the outer side wall of the crucible 1, the two first resistance elements 41 are respectively distributed on the top and the middle of the outer side wall of the crucible 1, more specifically, the two first resistance elements 41 are wound on the outer side wall of the crucible 1, so as to heat the inside of the crucible 1 uniformly, and two first resistance elements 41 are arranged along the height direction of the crucible 1 so as to control the temperature of the crucible 1 in the height direction, so that the temperatures of different heights inside the crucible 1 are uniform. The outer side wall of the crucible 1 may be wound with three, four or more first resistance elements 41 arranged in sequence in the height direction of the crucible 1, and the temperature control is more uniform as the number of the first resistance elements 41 is larger.
As shown in fig. 1 to 3, another first resistance element 41 is provided on the bottom end face of the heating cover plate 32 near the crucible 1, and when the heating cover plate 32 is connected to the notch of the heating tank body 31, the first resistance element 41 provided on the heating cover plate 32 is in sufficient contact with the top end face of the crucible 1. In this embodiment, the first resistance element 41 on the heating cover plate 32 surrounds the through hole 33 on the heating cover plate 32, and seven second resistance elements 42 are further disposed inside the heating cover plate 32, each second resistance element 42 corresponding to one through hole 33, that is, one second resistance element 42 surrounds one through hole 33. The two electrical connections of the second resistance element 42 each extend through a side wall of the heating cover 32 and are connected to an external control system (not shown in the drawings).
In the present embodiment, the first resistance element 41 and the second resistance element 42 are both resistance wires. When current is passed through the first resistance element 41, heat can be generated to heat the accommodating space of the crucible 1, so that the organic material in the accommodating space of the crucible 1 is evaporated; the second resistance element 42, when supplied with current, generates heat which heats the evaporation nozzle 2, so that the organic material condensed in the evaporation nozzle 2 evaporates, thereby preventing clogging of the evaporation nozzle 2. The magnitude of the heat generated by the first and second resistance elements 41 and 42 is controlled by controlling the magnitude of the current flowing through the first and second resistance elements 41 and 42.
In this embodiment, the crucible 1 has a rectangular parallelepiped structure. As shown in FIG. 6, the heating cover plate 32 is connected to the notch of the heating vessel body 31 to form a closed space, and the crucible 1 is placed in the closed space. The heating cover plate 32 is screwed and fastened to the heating tank 31 (not shown in the drawings).
In this embodiment the heating system further comprises temperature detectors (not shown in the drawings) located in the crucible 1 for detecting the temperature at different positions of the receiving space in the crucible 1. Since the crucible 1 is provided with a temperature sensor for detecting temperature, such as a thermometer, which belongs to the conventional technical means, the detailed description is omitted here.
In this embodiment, the control system is configured to control the magnitude of the current flowing through the first resistance element 41 and the second resistance element 42, the control system may be a PLC (programmable logic controller) or a single chip, and the control system is connected to the temperature measuring instrument, the first resistance element 41, and the second resistance element 42. The control system used in the conventional linear evaporation vapor deposition apparatus is an automatic control unit, and the control system in this embodiment may be the same automatic control unit that receives the temperature signal transmitted from the temperature measuring instrument and automatically adjusts the magnitude of the current flowing through the first resistance element 41 and the second resistance element 42 based on the measurement result of the temperature measuring instrument, thereby controlling the amount of heat generated by the first resistance element 41 and the second resistance element 42. When the temperature detector detects that the temperature at the preset position is uneven, the temperature detector feeds the temperature back to the automatic control unit, and the automatic control unit automatically controls and adjusts the magnitude of the current flowing on the first resistance element 41 close to the preset position: if the temperature of the top of the crucible 1 is higher than the temperature of the middle portion, the current flowing through the first resistance element 41 positioned at the middle portion of the crucible 1 may be increased to increase the temperature of the middle position of the crucible 1, or the current flowing through the first resistance element 41 positioned at the top of the crucible 1 may be decreased to decrease the temperature of the top position of the crucible 1, and in addition, the current flowing through the first resistance element 41 provided on the heating cover plate 32 may be decreased to decrease the temperature of the top position of the crucible 1. Therefore, by carrying out sectional control to respectively carry out independent temperature control on the preset positions of the crucible 1, the uniformity of the temperature of each position in the crucible 1 is improved.
In another aspect, the present invention provides a vapor deposition method based on the vapor deposition apparatus described above, including: the first resistance element 41 generates heat to heat the crucible, the organic material in the accommodating space of the crucible 1 is heated to generate organic vapor, and the organic vapor flows into the evaporation nozzle 2 and then is sprayed out to the surface of the substrate 5 through the nozzle to be deposited into a thin film, as shown in fig. 7, wherein the dotted line in fig. 7 indicates the coverage of the organic vapor sprayed out from the nozzle on the surface of the substrate 5; the crystal oscillator monitors the evaporation rate of each nozzle in real time, and if the crystal oscillator detects that the evaporation rate of a certain nozzle is reduced, the second resistance element 42 generates more heat to heat and raise the temperature of the evaporation nozzle 2 connected with the nozzle, so that the organic material blocked in the evaporation nozzle 2 is heated and converted into organic vapor.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (9)

1. The utility model provides an evaporation device, includes crucible, evaporation nozzle and heating system, crucible and a plurality of evaporation nozzle is connected and is constituted linear evaporation source, the one end that the crucible was kept away from to the evaporation nozzle is provided with the injection part, the inside accommodation space that is provided with of crucible, the evaporation nozzle with accommodation space intercommunication, its characterized in that:
the heating system comprises a heating groove body and a heating cover plate, the heating groove body is used for accommodating the crucible, the heating cover plate is connected with a notch of the heating groove body, a through hole is formed in the heating cover plate and penetrates through the heating cover plate, and the through hole is used for enabling the evaporation spray pipe to extend out of the heating groove body from the inside of the groove body of the heating groove body;
the plurality of first resistance elements are positioned in the groove body of the heating groove body and distributed on the outer side wall of the crucible;
the single or a plurality of first resistance elements are arranged on the end face, close to the crucible, of the heating cover plate, the first resistance elements arranged on the heating cover plate are in contact with the crucible, and a plurality of second resistance elements are further arranged inside the heating cover plate, wherein one second resistance element surrounds one through hole.
2. The vapor deposition apparatus according to claim 1, wherein: the groove body depth of the heating groove body is larger than the height of the crucible, and the heating cover plate covers the notch of the heating groove body.
3. The vapor deposition apparatus according to claim 1, wherein: the diameter of the evaporation spray pipe is matched with that of the through hole, and the outer side wall of the part, located in the through hole, of the evaporation spray pipe is in contact with the inner side wall of the through hole in a fitting mode.
4. The vapor deposition apparatus according to claim 1, wherein: the two first resistance elements are positioned inside the groove body of the heating groove body and are respectively distributed at the top and the middle of the outer side wall of the crucible.
5. The vapor deposition apparatus according to claim 4, wherein: the first resistive element and/or the second resistive element is a fixed resistor.
6. The vapor deposition apparatus according to claim 4, wherein: the first resistance element and/or the second resistance element are/is a whole-segment heating component formed by a variable resistor and a fixed resistor.
7. The vapor deposition apparatus according to claim 1, wherein: the evaporation device also comprises a crystal oscillator positioned at the spraying component.
8. The vapor deposition apparatus according to claim 7, wherein: the spray component is a nozzle.
9. An evaporation method is characterized in that: vapor deposition is carried out by using the vapor deposition device according to any one of claims 1 to 8.
CN202111107256.9A 2021-09-22 2021-09-22 Evaporation device and evaporation method Pending CN113943924A (en)

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CN105296934A (en) * 2015-11-09 2016-02-03 合肥欣奕华智能机器有限公司 Linear evaporation source and evaporation plating device
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