CN108385077A - A kind of coating apparatus and film plating process for capableing of real-time indirect monitoring thicknesses of layers - Google Patents
A kind of coating apparatus and film plating process for capableing of real-time indirect monitoring thicknesses of layers Download PDFInfo
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- CN108385077A CN108385077A CN201810174090.4A CN201810174090A CN108385077A CN 108385077 A CN108385077 A CN 108385077A CN 201810174090 A CN201810174090 A CN 201810174090A CN 108385077 A CN108385077 A CN 108385077A
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- Prior art keywords
- coating materials
- coating
- plated film
- real
- layers
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
Abstract
The invention discloses a kind of coating apparatus for capableing of real-time indirect monitoring thicknesses of layers, including plated film cavity, it is fixed with carrier at the top of plated film cavity, the bottom of plated film cavity is equipped with coating materials Steaming structure, coating materials Steaming structure includes evaporation source supporting rack, and evaporation source supporting rack is equipped with crucible, coating materials is equipped in crucible, evaporation source supporting rack is equipped with accurate weight sensor, and thermal insulation layer is equipped between accurate weight sensor and crucible bottom.The present invention also provides a kind of film plating process for capableing of real-time indirect monitoring thicknesses of layers.The present invention can carry out thicknesses of layers real-time indirect monitoring and can monitor the slight change of film thickness in real time, multiple evaporation sources can be monitored and be controlled respectively simultaneously when multi-source co-evaporates, and the thickness and ratio of difference coating materials, accurately control effect can be obtained for the film plating layer with multiple coating materials when can control multiple coating materials while plated film in this way.
Description
Technical field
The present invention relates to a kind of coating apparatus and film plating process for capableing of real-time indirect monitoring thicknesses of layers.
Background technology
In plated film industry, for multi-source codope coating process, because each evaporation source evaporates coating materials, heating volatilizes
The steam come is blended in plated film cavity, the plated film rate of each raw material cannot be distinguished, and since environment, coating materials subtract
Less, small variation, which occurs, for the factors such as evaporation source structure can all have significant effect plated film rate, cause to co-evaporate in multi-source
The film layer that cannot obtain uniform doping in film layer structure well, to influence film performance.
The variation of Coating Materials quality in coating machine crucible has a certain impact to plated film rate and film performance, because
This, monitors coating materials quality and timely feedbacks and make technique adjustment to program and be necessary in real time.Chinese invention patent
(CN1624191A) " vacuum coating equipment for having orientation and self control function " is disclosed, which can monitor and be plated in substrate at any time
The quality of upper film controls the thickness of plated film, control and quickening deposition rate.But arrive millimetre-sized thickness when being deposited several microns
When film, since thickness has been more than the range of film thickness gauge, film thickness gauge just cannot achieve complete monitoring plated film real time rate, it is even more impossible to
Solution waits for plated product film thickness situation.Particularly in various materials the codope simultaneously technique of plated film, the above film thickness monitoring device is not
The variation that each coating materials can be monitored respectively in real time, cannot really measure the true evaporation rate of various coating materials, can not monitored over time
The thickness of thick film is also unable to get the uniformly mixed film layer of a variety of coating materials.
Invention content
The present invention for overcome the deficiencies in the prior art, provides a kind of plated film dress for capableing of real-time indirect monitoring thicknesses of layers
It sets and film plating process.The present invention can monitor the weight of coating materials in real time, realize the materials rate for monitoring and controlling various coating materials, real
Shi Xiuzheng coating process controls program, and the whole indirect monitoring of energy waits for the thicknesses of layers of plated product.
To achieve the goals above, the present invention uses following technical scheme：
A kind of coating apparatus for capableing of real-time indirect monitoring thicknesses of layers, including plated film cavity, the top of plated film cavity are solid
There are carrier, the bottom of plated film cavity to be equipped with coating materials Steaming structure, coating materials Steaming structure includes evaporation source supporting rack, evaporation source branch surely
Support is equipped with crucible, and coating materials is equipped in crucible, and evaporation source supporting rack is equipped with accurate weight sensor, accurate weight sensor
Thermal insulation layer is equipped between crucible bottom.
There is protective cover outside the precision weight sensor.
It is equipped with one or more coating materials Steaming structures in the plated film cavity, precision is equipped in each coating materials Steaming structure
Weight sensor and thermal insulation layer.
It can be placed into different coating materials in each crucible.
The present invention also provides a kind of film plating process for capableing of real-time indirect monitoring thicknesses of layers, this method uses the above institute
The device stated, and include the following steps：
(1) crucible is added in coating materials；
(2) crucible is heated；
(3) accurate weight sensor surveys the overall weight being positioned on sensor including coating materials in real time
Amount, and data are recorded at regular intervals；
(4) accurate weight sensor is by the data transmission of record to plated film machine controller；
(5) plated film machine controller obtains the changing value of coating materials quality according to the data of record；
(6) plated film machine controller obtains coating film thickness information according to the changing value of coating materials quality, and the calculating of coating film thickness is public
Formula is：H=(W0-Wt) * a/ (ρ * S), wherein W0For the weight that initial time precision weight sensor measures, WtIt is surveyed for t moment
The weight of amount, ρ are coating materials density, and a is coating materials utilization rate, and S is substrate area；
(7) plated film machine controller adjusts the evaporation rate of coating materials according to coating film thickness information；
(8) evaporation coating is completed, and program ends automatically.
The step (3) is to record a data at interval of certain time, and in the process of entire plated film, consecutive intervals phase
The same time carries out record data.
Plated film machine controller adjusts the evaporation speed of coating materials by controlling voltage and the power of output in the step (7)
Rate.Evaporation rate has direct correspondence with the temperature of coating materials；In order to increase or decrease evaporation rate, need to be correspondingly improved
Or the temperature of coating materials is reduced, the temperature of coating materials realizes that voltage increases by adjusting voltage and power, and power increases, and adds
Heated filament quantity of heat given up increases, and coating materials temperature increases, and evaporation rate increases, otherwise principle is identical.
In the case that multi-source steams altogether, the difference material to be plated in different evaporation sources is carried out at the same time the space for being evaporated to coating machine
It is interior, form uniform mixing evaporation raw material, coating materials is evaporated in the mixing that carrier unit interval to be plated, unit area can adsorb
Measure it is identical, therefore can be in all uniform film layer of surface forming component and thickness of carrier to be plated.
What the present invention controlled is the evaporation capacity of material to be plated, therefore, can control a timing by controlling the amount of evaporation
In evaporation raw material in coating machine space, to control raw material that carrier to be plated can adsorb number, compared to relatively directly
For the method that coating film thickness measures on carrier to be plated, the present invention is controlled from the amount that raw material gives, rather than
Result is controlled, can from starting stage of plated film with regard to it is issuable uneven in the good coating process of control the problems such as,
There is better perspective and controllability than detecting afterwards.
The present invention can carry out thicknesses of layers real-time indirect monitoring and can monitor the slight change of film thickness in real time,
Multiple evaporation sources can be monitored and be controlled respectively simultaneously, and can be controlled in this way when multi-source co-evaporates
The thickness and ratio of difference coating materials, can obtain accurately the film plating layer with multiple coating materials when multiple coating materials while plated film
Control effect.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Specific implementation mode
In order to make those skilled in the art be better understood from the present invention program, below in conjunction in the embodiment of the present invention
Attached drawing, technical solution in the embodiment of the present invention carry out clear, complete description.
Embodiment 1, with reference to attached drawing 1.
As shown in Figure 1, the present invention is capable of the coating apparatus of real-time indirect monitoring thicknesses of layers, including plated film cavity 1, plated film
The top of cavity 1 is fixed with carrier 2, and the bottom of plated film cavity 1 is equipped with coating materials Steaming structure, and coating materials Steaming structure includes evaporation source
Supporting rack 7, evaporation source supporting rack 7 are equipped with crucible 3, and coating materials 4 is equipped in crucible 3, and 7 are equipped with accurate weight on evaporation source supporting rack
Sensor 6 is equipped with thermal insulation layer 5 between 3 bottom of accurate weight sensor 6 and crucible.
The precision weight sensor 6 connects data line 8, and data line 8 is drawn from the connecting terminal 9 of coating machine cavity 1 and plated
After film machine cavity body 1 is outer, it is connect with plated film machine controller.
There is protective cover outside the precision weight sensor 6.
It is equipped with one or more coating materials Steaming structures in the plated film cavity 1, essence is equipped in each coating materials Steaming structure
Close weight sensor 6 and thermal insulation layer 5.
It can be placed into different coating materials 4 in each crucible 3.
In the case of multi-source co-evaporates plated film, there are one accurate weight sensors 6 independently to measure in real time respectively for each evaporation source
The overall weight being positioned on sensor, independent real-time inspection and control weight change.
The present invention also provides a kind of film plating process for capableing of real-time indirect monitoring thicknesses of layers, this method uses the above institute
The device stated, and include the following steps：
(1) crucible 3 is added in coating materials 4；
(2) crucible 3 is heated；
(3) accurate weight sensor 6 surveys the overall weight being positioned on sensor including coating materials 4 in real time
Amount, and data are recorded at regular intervals；Initial time t0, the weight that accurate weight sensor measures is W0, what t moment measured
Weight is Wt；
(4) accurate weight sensor 6 is by the data transmission of record to plated film machine controller；
(5) plated film machine controller obtains the changing value of 4 mass of coating materials, changing value W according to the data of record0-Wt；
(6) plated film machine controller obtains coating film thickness information according to the changing value of 4 mass of coating materials, is coating materials according to known ρ
Density, a are coating materials utilization rate, and S is substrate area, and the coating film thickness for calculating t moment is ht=(W0-Wt)*a/(ρ*S)；
(7) plated film machine controller adjusts the evaporation rate of coating materials according to coating film thickness information；Plated film machine controller is according to plating
Film thickness information is calculated in t0To 4 evaporation rate of coating materials in the t times, if calculating the evaporation rate at this moment less than experiment
Setting value, then subsequent time raising heating power, makes to reach scheduled evaporation rate and keep；
Multi-source co-evaporates plated film situation, identical as single principle of source evaporation coating, using automatic control respectively to multiple evaporation sources
It is independently controlled, reaches the evaporation rate and thickness of experiment setting, to obtain the uniform film layer of codope；
(8) evaporation coating is completed, and program ends automatically.
The step (3) is to record a data at interval of certain time, and in the process of entire plated film, consecutive intervals phase
The same time carries out record data.
Plated film machine controller adjusts the evaporation speed of coating materials 4 by controlling voltage and the power of output in the step (7)
Rate.Evaporation rate has direct correspondence with the temperature of coating materials；In order to increase or decrease evaporation rate, need to be correspondingly improved
Or the temperature of coating materials is reduced, the temperature of coating materials realizes that voltage increases by adjusting voltage and power, and power increases, and adds
Heated filament quantity of heat given up increases, and coating materials temperature increases, and evaporation rate increases, otherwise principle is identical.
The present invention can monitor the quality of coating materials in real time, and the decrement of coating materials is calculated according to the variation of quality, realize real
When monitor plated film rate, feed back in process control procedure, control the voltage and power of output, adjust the evaporation rate of coating materials,
It can get uniform film layer；By accurate weight sensor, coating materials quality is monitored in real time, realizes that monitored over time waits for the film layer of plated product
Thickness.
Obviously, described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment should all belong to the scope of protection of the invention.
Claims (5)
1. a kind of coating apparatus for capableing of real-time indirect monitoring thicknesses of layers, including plated film cavity, the top of plated film cavity are fixed
There are carrier, the bottom of plated film cavity to be equipped with coating materials Steaming structure, coating materials Steaming structure includes evaporation source supporting rack, evaporation source support
Frame is equipped with crucible, and coating materials is equipped in crucible, characterized in that evaporation source supporting rack is equipped with accurate weight sensor, precision weight
Thermal insulation layer is equipped between quantity sensor and crucible bottom.
2. the coating apparatus according to claim 1 for capableing of real-time indirect monitoring thicknesses of layers, characterized in that accurate weight
There is protective cover outside sensor.
3. the coating apparatus according to claim 1 for capableing of real-time indirect monitoring thicknesses of layers, characterized in that plated film cavity
It is interior to be equipped with one or more coating materials Steaming structures, it is equipped with accurate weight sensor and thermal insulation layer in each coating materials Steaming structure.
4. the coating apparatus according to claim 1 for capableing of real-time indirect monitoring thicknesses of layers, characterized in that each crucible
It is interior to be placed into different coating materials.
5. a kind of film plating process for capableing of real-time indirect monitoring thicknesses of layers, characterized in that this method uses in claim 1-4
Any one of them device, and include the following steps：
(1) crucible is added in coating materials；
(2) crucible is heated；
(3) accurate weight sensor measures the overall weight being positioned on sensor including coating materials in real time, and
Data are recorded at regular intervals；
(4) accurate weight sensor is by the data transmission of record to plated film machine controller；
(5) plated film machine controller obtains the changing value of coating materials quality according to the data of record；
(6) plated film machine controller obtains coating film thickness information according to the changing value of coating materials quality, and the calculation formula of coating film thickness is：
H=(W0-Wt) * a/ (ρ * S), wherein W0For the weight that initial time precision weight sensor measures, WtThe weight measured for t moment
Amount, ρ are coating materials density, and a is coating materials utilization rate, and S is substrate area；
(7) plated film machine controller adjusts the evaporation rate of coating materials according to coating film thickness information；
(8) evaporation coating is completed, and program ends automatically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810174090.4A CN108385077A (en) | 2018-03-02 | 2018-03-02 | A kind of coating apparatus and film plating process for capableing of real-time indirect monitoring thicknesses of layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810174090.4A CN108385077A (en) | 2018-03-02 | 2018-03-02 | A kind of coating apparatus and film plating process for capableing of real-time indirect monitoring thicknesses of layers |
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| CN108385077A true CN108385077A (en) | 2018-08-10 |
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| CN201810174090.4A Pending CN108385077A (en) | 2018-03-02 | 2018-03-02 | A kind of coating apparatus and film plating process for capableing of real-time indirect monitoring thicknesses of layers |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110257775A (en) * | 2019-06-17 | 2019-09-20 | 深圳市华星光电技术有限公司 | Evaporation coating device and evaporation coating method |
| CN111074230A (en) * | 2018-10-19 | 2020-04-28 | 东泰高科装备科技有限公司 | On-line detection device and method for coating uniformity and coating equipment |
| CN111378931A (en) * | 2018-12-27 | 2020-07-07 | 北京铂阳顶荣光伏科技有限公司 | Evaporation coating equipment, evaporation source evaporation control system and method thereof |
| CN113088916A (en) * | 2021-05-07 | 2021-07-09 | 辽宁分子流科技有限公司 | Intelligent control method for thickness of evaporation coating film based on numerical calculation |
| CN113215535A (en) * | 2021-05-21 | 2021-08-06 | 泊肃叶科技(沈阳)有限公司 | Evaporation coating machine with intelligently adjustable evaporation rate |
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| CN113215535A (en) * | 2021-05-21 | 2021-08-06 | 泊肃叶科技(沈阳)有限公司 | Evaporation coating machine with intelligently adjustable evaporation rate |
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Application publication date: 20180810 |