CN113937030A - Cooling device - Google Patents
Cooling device Download PDFInfo
- Publication number
- CN113937030A CN113937030A CN202011442466.9A CN202011442466A CN113937030A CN 113937030 A CN113937030 A CN 113937030A CN 202011442466 A CN202011442466 A CN 202011442466A CN 113937030 A CN113937030 A CN 113937030A
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- CN
- China
- Prior art keywords
- cooling
- tank
- temperature
- heating
- cooling fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/266—Drying gases or vapours by filtration
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed is a cooling device equipped with a cooling channel and a heating channel that are circulated in a closed manner. In the cooling apparatus, the cooling passage is configured such that low-temperature cooling fluid filled in a cooling tank is sequentially circulated to a low-temperature pump and a manufacturing apparatus, the heating passage is configured such that high-temperature cooling fluid filled in a heating tank is sequentially circulated to a high-temperature pump and the manufacturing apparatus, and buffer tanks connected to the cooling tank and the heating tank by pipes are provided, respectively, and medium-temperature cooling fluid in thermal balance is mixed by the low-temperature cooling fluid and the high-temperature cooling fluid from the cooling tank and the heating tank and is contained in the buffer tanks.
Description
Technical Field
The present invention relates to a cooling device, and more particularly, to a cooling device equipped with a cooling passage and a heating passage that can be circulated hermetically.
Background
In a semiconductor or display panel manufacturing process, a temperature of a heat medium is generally maintained constant, but recently, as manufacturing processes are diversified and a demand for control is increased, it is required to use the heat medium in various temperature ranges, and further, a temperature control device is required: in addition to providing the heat medium with a constant temperature, the heat medium can also cope with a sudden change.
Fig. 1 shows a conventional cooling device.
The cooling channel 100 and the heating channel 200 are independently configured between the cooling device 10 and the manufacturing apparatus (for example, the semiconductor device 20) so that the cooling fluid circulates.
The low-temperature cooling fluid filled in the cooling tank 110 is circulated in a loop in the cooling passage 100 through the semiconductor device 20 by the low-temperature pump 120, and the high-temperature cooling fluid filled in the heating tank 210 is heated by a heater (not shown) and is circulated in a loop in the heating passage 200 through the semiconductor device 20 by the high-temperature pump 220.
The semiconductor device 20 receives and mixes the low-temperature and high-temperature cooling fluid, and the cooling fluid is recovered to the cooling tank 110 and the heating tank 210 according to the temperature conversion system of the semiconductor device 20.
In this process, in the case where water level imbalance occurs between the cooling tank 110 and the heating tank 210 due to a difference in the recovery amount of the cooling fluid from the semiconductor devices 20 through the respective channels 100, 200, the cooling fluids are replenished to each other through the water level adjustment piping 150.
However, in such a configuration, when the cooling fluids are replenished to each other, since the temperature deviation is large, there is a problem that a load is applied to each tank itself largely.
Further, when the water level of the cooling fluid in each tank is lower than the water level adjusting pipe, there is a risk of water level imbalance.
Further, the heating box has a problem that the evaporation amount increases due to the high-temperature cooling fluid.
In addition, each tank is provided with an exhaust port (vent)114, 214 for maintaining the pressure, and the moisture flowing in through the exhaust port 114 provided in the cooling tank is frozen by the primary cooling fluid, thereby reducing the cooling capacity of the cooling device.
Disclosure of Invention
The invention aims to provide a semiconductor cooling device which fundamentally improves the water level imbalance between a cooling box and a heating box.
Another object of the present invention is to provide a semiconductor cooling apparatus capable of reducing a load applied to each tank by reducing a temperature deviation when a cooling fluid is replenished according to a water level imbalance.
Another object of the present invention is to provide a semiconductor cooling device capable of operating with low power and reducing maintenance costs.
The above object is achieved by a cooling device in which a cooling channel (cooling channel) formed by sequentially circulating a low-temperature cooling fluid filled in a cooling tank to a low-temperature pump and a manufacturing apparatus and a heating channel (heating channel) formed by sequentially circulating a high-temperature cooling fluid filled in a heating tank to a high-temperature pump and the manufacturing apparatus are independently supplied or mixed with each other to the manufacturing apparatus, and buffer tanks connected to the cooling tank and the heating tank by pipes, respectively, are provided, and a medium-temperature cooling fluid in thermal balance is mixed with the low-temperature cooling fluid and the high-temperature cooling fluid from the cooling tank and the heating tank.
Preferably, air discharge electronic valves are respectively provided on lines connecting each of the cooling tank and the heating tank with the buffer tank, so that air generated in the cooling tank and the heating tank can be discharged to the buffer tank.
Preferably, the buffer tank may be provided with a moisture filter having an exhaust function.
Preferably, in the case where a water level imbalance occurs between the cooling tank and the heating tank, the medium temperature cooling fluid of the buffer tank is supplied to the tank in which the water level is lowered.
Preferably, the cooling fluid filled in the buffer tank is not circulated to be in a stagnation state, and the cooling fluid of the cooling channel and the cooling fluid of the heating channel are circulated while maintaining a sealed state, respectively.
According to the present invention, since the medium-temperature cooling fluid corresponding to the intermediate level of the low temperature and the high temperature is supplied to the cooling tank or the heating tank, the temperature deviation can be reduced, so that the load applied to each tank can be reduced.
And, the buffer tank replaces and plays the effect of adjusting the uneven effect of water level to can reduce the size of cooler bin and heater bin, and then can reduce the energy consumption that is used for cooling fluid or heating cooling fluid.
Further, the cooling tank and the heating tank are circulated in a closed manner, so that the cooling fluid does not come into contact with the outside air, whereby the cooling fluid can be prevented from being acidified and the inflow of contaminants can be blocked.
In particular, since the cooling fluid is not evaporated in the heating tank having a high temperature and the cooling fluid in the buffer tank maintains a medium temperature, the vapor pressure is lower than that of the high temperature, and the evaporation amount can be reduced.
Drawings
Fig. 1 shows a conventional semiconductor cooling device.
Fig. 2 shows a semiconductor cooling device according to an embodiment of the present invention.
Description of reference numerals:
100: cooling passage 110: cooling box
112. 212, 312: cooling fluid 120: low-temperature pump
160: low-temperature water level adjustment pipe 200: heating channel
210: heating the box 220: high-temperature pump
260: high-temperature water level adjustment pipe 310: buffer box
320. 322: air outlet electronic valve 314: moisture filter
Detailed Description
Technical terms used in the present invention are used only for illustrating specific embodiments and are not intended to limit the present invention. Also, technical terms used in the present invention should be construed as meanings commonly understood by one having ordinary knowledge in the technical field to which the present invention belongs, and should not be construed as an excessively generalized meaning or an excessively limited meaning, as long as they are not particularly defined as other meanings in the present invention.
Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same components as those of the conventional components.
Fig. 2 shows a semiconductor cooling device according to an embodiment of the present invention.
As in the prior art, the cooling channel 100 and the heating channel 200 are independently configured between the cooling device 10 and the manufacturing apparatus (e.g., the semiconductor device 20) so that the cooling fluid circulates.
The cooling duct 100 is configured by the cooling tank 110 and the low-temperature pump 120, the heating duct 200 is configured by the heating tank 210 and the high-temperature pump 220, the low-temperature cooling fluid filled in the cooling tank 110 is circulated through the cooling duct 100 via the semiconductor device 20 by the low-temperature pump 120, and the high-temperature cooling fluid filled in the heating tank 210 is heated by the heater and circulated through the heating duct 200 via the semiconductor device 20 by the high-temperature pump 220.
The semiconductor device 20 receives and mixes the low-temperature and high-temperature cooling fluid, and the cooling fluid is recovered to the cooling tank 110 and the heating tank 210 according to the temperature conversion system of the semiconductor device 20.
According to the present invention, it is different from the conventional cooling apparatus in that the cooling passage 100 and the heating passage 200 constitute a closed loop.
For this purpose, the cooling duct 100 and the heating duct 200 are connected to a buffer tank (buffer tank)310 through a low temperature water level adjustment pipe 160 and a high temperature water level adjustment pipe 260, respectively.
In other words, the cooling fluid filled in the buffer tank 310 is not circulated but stagnated, and on the contrary, the cooling fluid filled in the cooling tank 110 and the heating tank 210 is circulated through the semiconductor device 20 while constituting the closed cooling passage 100 and the closed heating passage 200, respectively.
The buffer tank 310 is mixed with the low-temperature cooling fluid and the high-temperature cooling fluid from the cooling tank 110 and the heating tank 210 to maintain the medium temperature (mid temperature) by heat balance, and the pressure and the flow rate of the circulating cooling fluid are appropriately adjusted to maintain the cooling fluid in the buffer tank 310 at the medium temperature.
Wherein, the medium temperature refers to 0 ℃ to 30 ℃ as a reference, the low temperature refers to more than-20 ℃ and less than 0 ℃, and the high temperature refers to more than 30 ℃ and less than 80 ℃.
The medium-temperature cooling fluid filled in the buffer tank 310 is supplied to the respective tanks 110 and 210 through the water level adjustment pipes 160 and 260 when a water level imbalance occurs in the cooling tank 110 or the heating tank 210.
According to such a configuration, since the medium-temperature cooling fluid corresponding to the intermediate temperature between the low temperature and the high temperature is supplied to the cooling tank 110 or the heating tank 210, the temperature deviation can be reduced, and the load applied to each tank can be reduced.
Also, the buffer tank 310 instead functions to adjust the water level imbalance, so that the sizes of the cooling tank 110 and the heating tank 210 can be reduced, and as a result, the energy consumption for cooling the cooling fluid of the cooling tank 110 or heating the cooling fluid of the heating tank 210 can be reduced.
Air discharge electronic valves 320 and 322 are respectively provided on lines connecting each of the cooling tank 110 and the heating tank 210 and the buffer tank 310 to discharge air generated from the cooling tank 110 and the heating tank 210 to the buffer tank 310, so that the cooling tunnel 100 and the heating tunnel 200 always constitute a closed loop.
As described above, the cooling fluid in each of the cooling tank 110 and the heating tank 210 circulates in a closed state, the air is completely discharged through the air discharge electronic valves 320 and 322 while the pumps 120 and 220 are first started, and the air discharge electronic valves 320 and 322 are closed and circulated after a set time has elapsed, so that the pressure and the flow rate can be maintained.
In this way, the cooling channel 100 and the heating channel 200 are circulated in a closed manner, so that the cooling fluid does not contact with the outside air, thereby preventing the acidification of the cooling fluid and blocking the inflow of pollutants.
In particular, since the cooling fluid is not evaporated in the high-temperature heating tank 210 and the cooling fluid in the buffer tank 310 maintains a medium temperature, the evaporation amount can be reduced by lowering the vapor pressure compared to the high temperature.
The buffer tank 310 is provided with the moisture filter 314 having an exhaust function to prevent the inflow of the humid air generated during the low temperature operation for the first time, and to prevent the inflow for the second time by the pressure of the medium temperature cooling fluid, and the pressure of the buffer tank 310 based on the temperature change can be constantly maintained.
In the above-described embodiment, the cooling passage and the heating passage are constituted independently, and it is obvious that the present invention can also be applied to a structure equipped with a heat medium mixing device that mixes the respective cooling fluids.
In this case, the risk of freezing of the evaporator due to dew condensation during low-temperature single operation can be reduced, the amount of evaporation of the cooling fluid during high-temperature single operation can be reduced, and the risk of water level imbalance during mixed low-temperature and high-temperature operation can be reduced.
Although the above description has been centered on embodiments of the invention, it will be obvious that various modifications may be made at the level of those skilled in the art. Therefore, the scope of the claims of the present invention should not be construed as limited to the embodiments described above, but should be construed according to the scope of the appended claims.
Claims (5)
1. A cooling device is characterized in that a cooling device is provided,
the thermal media from the cooling channels and the heating channels of the cooling device are supplied to the manufacturing apparatus separately or mixed,
the cooling passage is formed by sequentially circulating a low-temperature cooling fluid filled in a cooling tank to a low-temperature pump and the manufacturing apparatus,
the heating passage is formed by circulating a high-temperature cooling fluid filled in a heating tank to a high-temperature pump and the manufacturing apparatus in this order,
a buffer tank connected to the cooling tank and the heating tank by pipes,
the buffer tank is internally provided with a middle temperature cooling fluid which is mixed by low temperature cooling fluid and high temperature cooling fluid from the cooling tank and the heating tank to form heat balance.
2. The cooling device according to claim 1,
an air discharge electronic valve is provided on a line connecting each of the cooling tank and the heating tank with the buffer tank, respectively, to discharge air generated in the cooling tank and the heating tank to the buffer tank.
3. The cooling device according to claim 1,
the surge tank is provided with a moisture filter having an exhaust function.
4. The cooling device according to claim 1,
in the case where a water level imbalance occurs between the cooling tank and the heating tank, the medium temperature cooling fluid of the buffer tank is supplied to the tank where the water level is lowered.
5. The cooling device according to claim 1,
the cooling fluid filled in the buffer tank is not circulated to form a stagnation state,
the cooling fluid in the cooling channel and the cooling fluid in the heating channel are circulated while being maintained in a sealed state.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200087111A KR20220008672A (en) | 2020-07-14 | 2020-07-14 | Chiller apparatus |
| KR10-2020-0087111 | 2020-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113937030A true CN113937030A (en) | 2022-01-14 |
Family
ID=79274029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011442466.9A Pending CN113937030A (en) | 2020-07-14 | 2020-12-08 | Cooling device |
Country Status (2)
| Country | Link |
|---|---|
| KR (2) | KR20220008672A (en) |
| CN (1) | CN113937030A (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5912439B2 (en) * | 2011-11-15 | 2016-04-27 | 東京エレクトロン株式会社 | Temperature control system, semiconductor manufacturing apparatus, and temperature control method |
| KR101594459B1 (en) | 2014-06-11 | 2016-02-16 | (주)한국밸콘 | Electrics solenoid air vent |
| KR101657563B1 (en) * | 2015-09-16 | 2016-09-19 | 김남원 | Vent system for cooling fluid |
| KR102009485B1 (en) * | 2019-03-18 | 2019-10-21 | 주식회사 셀빛 | Modular chiller system |
-
2020
- 2020-07-14 KR KR1020200087111A patent/KR20220008672A/en not_active Application Discontinuation
- 2020-12-08 CN CN202011442466.9A patent/CN113937030A/en active Pending
-
2022
- 2022-07-01 KR KR1020220081360A patent/KR102534743B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220008672A (en) | 2022-01-21 |
| KR20220099532A (en) | 2022-07-13 |
| KR102534743B1 (en) | 2023-05-26 |
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