CN113932700A - Thermal barrier coating bonding layer thickness measuring method based on impedance coordinate transformation - Google Patents

Thermal barrier coating bonding layer thickness measuring method based on impedance coordinate transformation Download PDF

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CN113932700A
CN113932700A CN202111142711.9A CN202111142711A CN113932700A CN 113932700 A CN113932700 A CN 113932700A CN 202111142711 A CN202111142711 A CN 202111142711A CN 113932700 A CN113932700 A CN 113932700A
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thickness
impedance
bonding layer
standard test
included angle
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CN113932700B (en
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曹丙花
徐闯
范孟豹
吕珊珊
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China University of Mining and Technology CUMT
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10Complex mathematical operations
    • G06F17/15Correlation function computation including computation of convolution operations
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation

Abstract

The invention discloses a thermal barrier coating bonding layer thickness measuring method based on impedance coordinate transformation, which comprises the following steps: firstly, acquiring an included angle between the thickness of a ceramic layer and the thickness change direction of a bonding layer on an impedance coordinate system by using a standard test piece, and performing first impedance coordinate transformation on a test piece to be tested according to the included angle to obtain an impedance coordinate which is not influenced by the ceramic layer; then, calculating the thickness of the bonding layer by utilizing the established relation between the thickness of the bonding layer and the impedance phase; then, correcting the included angle by using the relation between the thickness of the bonding layer and the included angle, performing second impedance coordinate transformation, and finally calculating the thickness of the bonding layer after correction; the invention solves the problem that signals of the bonding layer and the ceramic layer are difficult to decouple in the current measurement of the thickness of the thermal barrier coating by applying an impedance coordinate transformation method, can measure the thickness of the bonding layer and greatly improves the detection efficiency.

Description

Thermal barrier coating bonding layer thickness measuring method based on impedance coordinate transformation
Technical Field
The invention relates to a thermal barrier coating bonding layer thickness measuring method based on impedance coordinate transformation, and belongs to the field of conventional eddy current detection.
Background
The thermal barrier coating consists of a ceramic layer, a bonding layer and a nickel-based high-temperature alloy substrate, covers the turbine blade of the aeroengine, and is used for improving the safety performance and the service life of the turbine blade in extremely severe environments such as high temperature, high pressure, high stress, high speed and the like. Along with the increase of service time, the thickness of the bonding layer and the thickness of the ceramic layer are reduced, and the bonding layer and the ceramic layer are oxidized at high temperature to generate oxides, so that the heat insulation performance is deteriorated, and the ceramic layer is more seriously peeled off, so that the thermal barrier coating fails. Therefore, the detection of the thickness of the thermal barrier coating plays an important role in monitoring the health condition of the aircraft engine and predicting the service life of the aircraft engine.
The thickness signals of the two layers of coating layers of the thermal barrier coating are mutually influenced, and decoupling can not be realized. The conventional thickness measuring method can only realize that the thickness of one layer of coating is within a certain range at present and is used for measuring the thickness of the other layer, and the subsequent processing steps are complicated; the method based on the iteration of the analytical model requires a large amount of sample data for measuring the thickness, consumes long time and has low efficiency.
The eddy current nondestructive detection technology has the characteristics of high sensitivity, high detection speed, non-contact property and the like, and can be used as an ideal method for measuring the thickness of the thermal barrier coating; the technology is based on the electromagnetic induction principle, namely when an exciting coil which is energized by sine waves is close to a conductor, eddy currents can be induced in the conductor, a magnetic field formed by the eddy currents can affect an original magnetic field, and therefore impedance of the original exciting coil is changed. The impedance signal of the original coil is processed to obtain the parameters to be measured, such as thickness, magnetic conductivity and the like.
At present, the mechanical configuration is high in coating thickness measurement at home and abroad, the related algorithm is relatively complex, and the problems of mutual cross influence of signals of two layers of coatings and the like exist in the measurement.
Disclosure of Invention
The invention aims to provide a thermal barrier coating bonding layer thickness eddy current testing method which can overcome the problems of high mechanical configuration and complex related algorithm of the existing coating thickness measurement and has the effect of better decoupling the influence of the ceramic layer thickness.
In order to achieve the aim, the invention adopts the technical scheme that the method for measuring the thickness of the bonding layer of the thermal barrier coating based on impedance coordinate transformation comprises the following steps:
a thermal barrier coating bonding layer thickness measuring method based on impedance coordinate transformation is characterized by comprising the following steps:
the first step is as follows: four standard test pieces M, N, P, L were produced with a ceramic layer thickness TCM、TCN、TCP、TCLThe thickness of the bonding layer is BCM、BCN、BCP、BCL(ii) a Wherein BCM=BCP<BCN=BCL,TCM=TCN<TCL=TCP
The second step is that: respectively placing the eddy current probes above the four standard test pieces, detecting the impedance of the standard test pieces by using an impedance analyzer, and respectively measuring the impedances as follows: zM=RM+XM;ZN=RN+XN;ZP=RP+XP;ZL=RL+XL
The third step: the impedance of the probe in air was measured: z0=R0+X0And taking the impedance as a reference, and carrying out differential processing on the impedances of the four standard test pieces in the second step: delta ZM=(RM-R0)+(XM-X0),ΔZN=(RN-R0)+(XN-X0),ΔZP=(RP-R0)+(XP-X0),ΔZL=(RL-R0)+(XL-X0) Then, the resistances of the differential impedance are: Δ RM=RM-R0,ΔRN=RN-R0,ΔRP=RP-R0,ΔRL=RL-R0(ii) a The reactance is expressed as: Δ XM=XM-X0,ΔXN=XN-X0,ΔXP=XP-X0,ΔXL=XL-X0
The fourth step: establishing a model for solving the thickness of the bonding layer by the phase of the impedance difference according to the linear relation between the phase of the impedance difference of the standard test piece M and the standard test piece N and the thickness of the bonding layer; from the third step, the phase of the impedance difference between the standard test piece M and the standard test piece N and the thickness of the bonding layer can construct two points A (BC) in an impedance phase-bonding layer thickness coordinate systemM,|ΔXM/ΔRM|),B(BCN,|ΔXN/ΔRN|) from which a linear model between bond layer thickness and phase is derived as follows:
Figure BDA0003284330290000031
Figure BDA0003284330290000032
wherein BC represents the bond line thickness, k1Is the slope of the linear model and,
Figure BDA0003284330290000033
is the impedance phase;
the fifth step: in an impedance coordinate system, the four standard test pieces respectively correspond to M, N, P, L four points, wherein the included angle between a straight line MN and NL is alpha, the included angle between the straight line MN and MP is beta, and a linear relation exists between the included angle and the thickness of the bonding layer, so that two points C (BC) in a bonding layer thickness-included angle coordinate system are constructedN,α),D(BCMβ), the model between bond line thickness and angle can be further found as follows:
Figure BDA0003284330290000034
θ=k2(BC)+(α-k2(BCN)) (4)
where θ is the angle, k2BC represents the bond line thickness, being the slope of the linear model;
and a sixth step: the second step is used to obtain the impedance value of the tested piece T and further obtain the difference impedance value delta ZT=ΔRT+ΔXTCorresponding to the T point in the impedance coordinate system, the coordinate is T (Delta R)T,ΔXT) At T, TT/NL intersection line MN is at T' (Δ R)T′,ΔXT′) Point, the included angle between the straight line MN and TT' is also alpha; the impedance phase angle | Delta X of TT′/ΔRT′Substituting | into formula (2) to obtain predicted value BC of bonding layer thickness of piece to be testedT′
Mixing BCT′Substituting into formula (4) to obtain the correction angle alpha of the projection angle1. Passing through T point TT/NL intersection line MN at T "point, the included angle between line MN and TT' is alpha1Wherein T' is represented by the coordinate (Δ R)T″,ΔXT″);
The seventh step: will | Δ XT″/ΔRT″Substituting | into function (2) to obtain bond line thickness BCT″And finally, the thickness of the bonding layer of the test piece T is measured.
Compared with the prior art, the invention has the advantages that:
(1) the method selects a mode of the ratio of the imaginary part to the real part of the impedance variation as a signal characteristic, and the signal characteristic and the thickness of the bonding layer form a linear relation under the condition that the thickness of the ceramic layer is not changed; moreover, the influence of the thickness change of the ceramic layer on the thickness measurement of the bonding layer is well compensated by utilizing the characteristic that the included angle formed by the thickness change direction of the ceramic layer and the thickness change direction of the bonding layer is approximately unchanged and utilizing the calibration test piece to obtain the included angle direction. The problem of mutual coupling of signals of two layers of coatings is solved, and the operation is simple, convenient and feasible;
(2) the invention utilizes the eddy current technology to measure the thickness of the thermal barrier coating, and has no destructiveness to the test piece: the basic principle of eddy current detection is electromagnetic induction, so that the method is only suitable for conductive materials capable of generating eddy currents, and the conductivity of the conductor is less influenced at different environmental temperatures, so that the method has low requirements on detection environments. On the premise of keeping other influencing factors such as geometric parameters of the coil, exciting current, exciting frequency, lift-off and the like consistent, the phase of the thickness of the bonding layer and the impedance variation is a single-value function, and the included angle between the thickness of the bonding layer and the change direction of two layers of signals is also a single-value function, so that the detection precision is high.
Drawings
FIG. 1 is a linear relationship between the thickness of the bonding layer and the phase of the impedance for different thicknesses of the ceramic layer according to the present invention;
FIG. 2 is a schematic diagram of the impedance coordinate transformation of the present invention;
FIG. 3 is a linear relationship between the thickness of the bonding layer and the included angle of impedance transformation for different thicknesses of ceramic layers in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the law of electromagnetic induction, a coil which is electrified with time-varying current can generate a changing magnetic field, and eddy current can be induced inside a test piece in the magnetic field; the properties of the test piece itself, such as size, thickness, defects, etc., can alter the magnetic flux that the eddy currents react on the coil, which in turn results in a change in the coil impedance. Therefore, the coil impedance signal acting above the test piece is analyzed, so that the information of the size, the defect, the thickness and the like of the test piece can be obtained. By analyzing the eddy current impedance signal shown in fig. 1, we find that under the condition that the thickness of the ceramic layer is not changed, a good linear relationship exists between the differential phase signal of the coil impedance signal above the test piece and the coil impedance signal in the air and the thickness of the bonding layer. According to the principle, the linear relation between the standard test pieces can be obtained by selecting the standard test pieces, and a detection model is established; meanwhile, the included angle between the thickness change direction of the ceramic layer under different thicknesses of the bonding layer and the thickness change direction of the bonding layer under the same thickness of the ceramic layer has good linear relation with the thickness of the bonding layer. According to the principle, the influence of the thickness of the ceramic layer on the detection of the thickness of the bonding layer can be decoupled by selecting a proper standard test piece and adopting an impedance transformation method, and an accurate bonding layer thickness detection model is established and is not influenced by the thickness of the ceramic layer.
Referring to fig. 1-3, a method for measuring a thickness of a bond coat of a thermal barrier coating based on impedance coordinate transformation includes the following steps:
the first step is as follows: four standard test pieces M, N, P, L were produced with a ceramic layer thickness TCM、TCN、TCP、TCLThe thickness of the bonding layer is BCM、BCN、BCP、BCL(ii) a Wherein BCM=BCP<BCN=BCL,TCM=TCN<TCL=TCP
The second step is that: respectively placing the eddy current probes above the four standard test pieces, detecting the impedance of the standard test pieces by using an impedance analyzer, and respectively measuring the impedances as follows: zM=RM+XM;ZN=RN+XN;ZP=RP+XP;ZL=RL+XL
The third step: the impedance of the probe in air was measured: z0=R0+X0And taking the impedance as a reference, and carrying out differential processing on the impedances of the four standard test pieces in the second step: delta ZM=(RM-R0)+(XM-X0),ΔZN=(RN-R0)+(XN-X0),ΔZP=(RP-R0)+(XP-X0),ΔZL=(RL-R0)+(XL-X0) Then, the resistances of the differential impedance are: Δ RM=RM-R0,ΔRN=RN-R0,ΔRP=RP-R0,ΔRL=RL-R0(ii) a The reactance is expressed as: Δ XM=XM-X0,ΔXN=XN-X0,ΔXP=XP-X0,ΔXL=XL-X0
The fourth step: establishing a model for solving the thickness of the bonding layer by the phase of the impedance difference according to the linear relation between the phase of the impedance difference of the standard test piece M and the standard test piece N and the thickness of the bonding layer; from the third step, the phase of the impedance difference between the standard test piece M and the standard test piece N and the thickness of the bonding layer can construct two points A (BC) in an impedance phase-bonding layer thickness coordinate systemM,|ΔXM/ΔRM|),B(BCN,|ΔXN/ΔRN|) from which a linear model between bond layer thickness and phase is derived as follows:
Figure BDA0003284330290000061
Figure BDA0003284330290000062
wherein BC represents the bond line thickness, k1Is the slope of the linear model and,
Figure BDA0003284330290000063
is the impedance phase;
the fifth step: in the impedance coordinate system of fig. 2, the four standard test pieces correspond to M, N, P, L four points respectively, wherein the included angle between the straight line MN and NL is α, the included angle between the straight line MN and MP is β, and a linear relationship exists between the included angle and the thickness of the bonding layer, so that two points C (BC) in the bonding layer thickness-included angle coordinate system are constructedN,α),D(BCMβ), the model between bond line thickness and angle can be further found as follows:
Figure BDA0003284330290000064
θ=k2(BC)+(α-k2(BCN)) (4)
where θ is the angle, k2BC represents the bond line thickness, being the slope of the linear model;
and a sixth step: the second step is used to obtain the impedance value of the tested piece T and further obtain the difference impedance value delta ZT=ΔRT+ΔXTCorresponding to point T in the impedance coordinate system of FIG. 2, the coordinate is T (Δ R)T,ΔXT) At T, TT/NL intersection line MN is at T' (Δ R)T′,ΔXT′) Point, the included angle between the straight line MN and TT' is also alpha; the impedance phase angle | Delta X of TT′/ΔRT′Substituting | into formula (2) to obtain predicted value BC of bonding layer thickness of piece to be testedT′
Mixing BCT′Substituting into formula (4) to obtain the correction angle alpha of the projection angle1. Passing through T point TT/NL intersection line MN at T "point, the included angle between line MN and TT' is alpha1Wherein T' is represented by the coordinate (Δ R)T″,ΔXT″);
The seventh step: will | Δ XT″/ΔRT″Substituting | into function (2) to obtain bond line thickness BCT″And finally, the thickness of the bonding layer of the test piece T is measured.
Fig. 2 shows a schematic diagram of the impedance coordinate transformation.
As shown in fig. 3, it is feasible to re-estimate the impedance angle according to the thickness of the bonding layer first obtained from the impedance phase, thereby improving the accuracy of the angle.
Compared with the traditional method of directly adopting phase measurement, the method for measuring the thickness of the thermal barrier coating by using the impedance coordinate transformation provided by the invention is also beneficial to inhibiting the influence of the lift-off effect on the result in the measurement of the thickness of the bonding layer.
For different material matrixes and coating materials, the thickness of the corresponding coating can be detected and evaluated by obtaining the included angle formed by the thickness change directions of the different coating materials in the impedance coordinate system and establishing a model of the impedance change quantity phase and the thickness change.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the equivalent replacement or change according to the technical solution and the modified concept of the present invention should be covered by the scope of the present invention.

Claims (1)

1. A thermal barrier coating bonding layer thickness measuring method based on impedance coordinate transformation is characterized by comprising the following steps:
the first step is as follows: four standard test pieces M, N, P, L were produced with a ceramic layer thickness TCM、TCN、TCP、TCLThe thickness of the bonding layer is BCM、BCN、BCP、BCL(ii) a Wherein BCM=BCP<BCN=BCL,TCM=TCN<TCL=TCP
The second step is that: respectively placing the eddy current probes above the four standard test pieces, detecting the impedance of the standard test pieces by using an impedance analyzer, and respectively measuring the impedances as follows: zM=RM+XM;ZN=RN+XN;ZP=RP+XP;ZL=RL+XL
The third step: the impedance of the probe in air was measured: z0=R0+X0And taking the impedance as a reference, and carrying out differential processing on the impedances of the four standard test pieces in the second step: delta ZM=(RM-R0)+(XM-X0),ΔZN=(RN-R0)+(XN-X0),ΔZP=(RP-R0)+(XP-X0),ΔZL=(RL-R0)+(XL-X0) Then, the resistances of the differential impedance are: Δ RM=RM-R0,ΔRN=RN-R0,ΔRP=RP-R0,ΔRL=RL-R0(ii) a The reactance is expressed as: Δ XM=XM-X0,ΔXN=XN-X0,ΔXP=XP-X0,ΔXL=XL-X0
The fourth step: establishing a model for solving the thickness of the bonding layer by the phase of the impedance difference according to the linear relation between the phase of the impedance difference of the standard test piece M and the standard test piece N and the thickness of the bonding layer; from the third step, the phase of the impedance difference between the standard test piece M and the standard test piece N and the thickness of the bonding layer can construct two points A (BC) in an impedance phase-bonding layer thickness coordinate systemM,|ΔXM/ΔRM|),B(BCN,|ΔXN/ΔRN|) from which a linear model between bond layer thickness and phase is derived as follows:
Figure FDA0003284330280000011
Figure FDA0003284330280000012
wherein BC represents the bond line thickness, k1Is the slope of the linear model and,
Figure FDA0003284330280000013
is the impedance phase;
the fifth step: in an impedance coordinate system, the four standard test pieces respectively correspond to M, N, P, L four points, wherein the included angle between a straight line MN and NL is alpha, the included angle between the straight line MN and MP is beta, and a linear relation exists between the included angle and the thickness of the bonding layer, so that two points C (BC) in a bonding layer thickness-included angle coordinate system are constructedN,α),D(BCMβ), the model between bond line thickness and angle can be further found as follows:
Figure FDA0003284330280000021
θ=k2(BC)+(α-k2(BCN)) (4)
where θ is the angle, k2BC represents the bond line thickness, being the slope of the linear model;
and a sixth step: the second step is used to obtain the impedance value of the tested piece T and further obtain the difference impedance value delta ZT=ΔRT+ΔXTCorresponding to the T point in the impedance coordinate system, the coordinate is T (Delta R)T,ΔXT) At T, TT/NL intersection line MN is at T' (Δ R)T′,ΔXT′) Point, the included angle between the straight line MN and TT' is also alpha; the impedance phase angle | Delta X of TT′/ΔRT′Substituting | into formula (2) to obtain predicted value BC of bonding layer thickness of piece to be testedT′
Mixing BCT′Substituting into formula (4) to obtain the correction angle alpha of the projection angle1. Passing through T point TT/NL intersection line MN at T "point, the included angle between line MN and TT' is alpha1Wherein T' is represented by the coordinate (Δ R)T″,ΔXT″);
The seventh step: will | Δ XT″/ΔRT″Substituting | into the function (2),obtaining bond coat thickness BCT″And finally, the thickness of the bonding layer of the test piece T is measured.
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