CN113926791A - Adjustable cleaning clamp - Google Patents
Adjustable cleaning clamp Download PDFInfo
- Publication number
- CN113926791A CN113926791A CN202111172631.8A CN202111172631A CN113926791A CN 113926791 A CN113926791 A CN 113926791A CN 202111172631 A CN202111172631 A CN 202111172631A CN 113926791 A CN113926791 A CN 113926791A
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- CN
- China
- Prior art keywords
- cleaning
- plate
- cleaned
- plates
- clamp
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 10
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention belongs to the field of ultrasonic cleaning, and particularly provides an adjustable cleaning clamp which comprises a fixed plate, a movable plate and support rods, wherein positioning holes at the ends of the support rods are aligned with positioning holes on two sides of the fixed plate and are fixedly connected through bolts, one side of a notch of the movable plate is inserted between the two support rods, screw holes at the notches on the two sides of the movable plate correspond to positioning grooves of the support rods, the movable plate is fixed through positioning bolts, and the distance between the movable plate and the fixed plate is reduced by 3.5mm from the side length of a short side of a substrate to be cleaned or a welded plate, so that the adjustable cleaning clamp is formed. The adjustable cleaning clamp provided by the invention is universal for ultrasonic cleaning of circuit boards in various shapes, and has high efficiency and good consistency of cleaning effect.
Description
Technical Field
The invention belongs to the field of ultrasonic cleaning, and particularly relates to a cleaning clamp and a cleaning program design which are suitable for ceramic substrates and printed circuit boards with various overall dimensions.
Background
The ultrasonic cleaning technology is a mature cleaning technology and is widely applied to the fields of electronics, machinery and the like; in the field of electronics, substrate cleaning and welded plate cleaning after laser scribing are important applications.
Ultrasonic cleaning belongs to physical cleaning, and particularly relates to a compression expansion alternating wave which forms cavitation in cleaning liquid, a large number of bubbles are rapidly formed and burst rapidly, the waves directly act on the surface and pores of a piece to be cleaned, dirt on the surface of the piece to be cleaned can be effectively stripped, and the ultrasonic cleaning device is particularly suitable for cleaning small-mass particles and oil stains.
The ultrasonic cleaning has the characteristics of high precision, high efficiency, good consistency of cleaning effect and the like, and can be applied to cleaning of ceramics and PCB circuit boards in any shapes. During cleaning, different types of cleaning liquids are selected and used according to stains to be cleaned, and parameters such as cleaning frequency, cleaning time and cleaning temperature are adjusted to complete cleaning operation.
The cleaning clamp can effectively avoid the damage of the appearance, the circuit and the device of the circuit board to be cleaned caused by mutual collision in the cleaning process. The special cleaning clamp can be manufactured by large-batch cleaning, and the adjustable universal clamp is more economical and convenient to use for medium-batch and small-batch cleaning and cleaning of substrates with different specifications and sizes. The design of the clamp needs to consider the size of cleaning equipment and the size of a piece to be cleaned; the whole rotational freedom degree and two translational freedom degrees of a piece to be cleaned in the clamp are partially limited, and the size of a clamp slot of the clamp is determined according to the size of a process edge and cleaning frequency parameters.
Disclosure of Invention
The invention aims to provide an adjustable cleaning clamp which is generally used for ultrasonic cleaning of circuit boards in various shapes, and has high efficiency and good consistency of cleaning effect.
Ultrasonic cleaning equipment washing tank is mostly the light groove, only can realize that the piece tiling of waiting to wash in single plane is washd, and the piece that washs often leads to wasing incomplete phenomenon because of overlapping, has fish tail, wearing and tearing hidden danger when laying the washing to two-sided printed substrate, welded plate.
Based on the limitation of the condition, the technical scheme of the invention is as follows: an adjustable cleaning fixture comprises a fixed plate, a movable plate and support rods, wherein positioning holes at the ends of the support rods are aligned with positioning holes at two sides of the fixed plate and are fixedly connected through bolts, one side of a gap of the movable plate is inserted between the two support rods, screw holes at the gaps at two sides of the movable plate correspond to positioning grooves of the support rods, the movable plate is fixed through the positioning bolts, the distance between the movable plate and the fixed plate is reduced by 3.5mm from the side length of a short side of a substrate to be cleaned or a welded plate, and therefore the adjustable cleaning fixture is formed; wherein the total height of the clamp is not higher than 2/3 of the depth of the cleaning tank, and the length and width of the clamp are not more than 3/4 of the length and width of the cleaning tank; the fixed plate aligns with the movable plate draw-in groove one by one, and the draw-in groove width is for waiting to wash circuit board thickness +0.2mm, and the draw-in groove interval is greater than 5mm, draw-in groove degree of depth 2 mm.
This clamp is suitable for the following two cases:
when the bare substrate is cleaned by ultrasonic waves, the distance between the movable plate and the fixed plate is reduced by 3.5mm for the side length of the short edge of the substrate to be cleaned, the substrate can be smoothly inserted into the clamping groove and taken out, and the positioning bolt is screwed up for fixing. When multiple base plates with the same thickness are cleaned simultaneously, the movable plates are increased according to the number of the base plates, the distance between the movable plates is reduced by about 3.5mm for the side length of the short edge of the base plate to be cleaned, the base plates can be smoothly inserted into the clamping grooves and taken out, the positioning bolts are screwed up for fixation, and the like. When substrates with different thicknesses and sizes are cleaned, movable plates with corresponding width clamping grooves are additionally arranged according to the number, at least two movable plates with the same width clamping grooves are additionally arranged, the distance between the movable plates with different specifications is not less than 5mm, and the additional arrangement method is the same as the above. The base plate to be cleaned is longitudinally inserted piece by piece along the vertical direction, a grid plate is transversely inserted along the horizontal direction after the first layer is fully inserted, the thickness of the grid plate is smaller than the width of the clamping groove, meshes with the diameter of 2mm are distributed on the grid plate at intervals of 5mm, and the base plate to be cleaned and the grid plate are inserted layer by layer. And horizontally placing the cleaning clamp in a cleaning tank of the cleaning machine during cleaning, adding cleaning liquid until the cleaning clamp is submerged, performing ultrasonic cleaning by using corresponding cleaning parameters, taking out the cleaning clamp after cleaning is finished, and taking out the substrates layer by layer from top to bottom to finish cleaning.
When the welding plate is cleaned by ultrasonic waves, the distance between the movable plate and the fixed plate is reduced by 3.5mm for the side length of the short edge of the substrate to be cleaned, the welding plate can be smoothly inserted into the clamping groove and taken out, and the positioning bolt is screwed up for fixing. And longitudinally inserting the welding plates to be cleaned one by one, wherein the dense areas of the components on the welding plates are upward, and the interval between the highest components of two adjacent rows of welding plates is larger than 5 mm. The horizontal direction can only insert the one deck welded plate and wash, and when the multiple size welded plate of same thickness was washd simultaneously, can be according to welded plate increase in number movable plate, the movable plate interval for newly treating to wash welded plate minor face length of side subtract 3.5mm, guarantee that the welded plate can insert the draw-in groove smoothly and take out can, screw up the positioning bolt fastening to this analogizes. When the welding plates with different thicknesses and sizes are cleaned, the movable plates with the corresponding width clamping grooves are additionally arranged according to the number, at least two movable plates with the same width clamping grooves are additionally arranged, the distance between the movable plates with different specifications is not less than 5mm, and the additional arrangement method is the same as the above method. When cleaning, firstly, heating the cleaning solution in the cleaning tank to a specified temperature, horizontally placing the cleaning fixture inserted into the welding plate into the cleaning tank, completely soaking for 5-10 minutes, then carrying out ultrasonic cleaning, spraying for 1 minute after cleaning, taking out the welding plate, and finishing cleaning.
The invention has the following beneficial effects:
1. the phenomenon of incomplete surface cleaning caused by substrate overlapping in the cleaning process is avoided;
2. the collision and damage of components caused by the movement of the welding plate in the cleaning process are avoided;
3. various impurities washed out are prevented from entering gaps or the interior of the components;
4. can adapt to base plates and welding plates with various sizes and thicknesses;
5. the inside of the through hole can be cleaned more thoroughly;
6. the direct insertion design is beneficial to the quick and thorough air drying of the surface of the product after cleaning.
Drawings
Fig. 1 is a schematic view of a moving plate structure.
Fig. 2 is a side view of fig. 1.
Fig. 3 is a top view of fig. 1.
Fig. 4 is a schematic view of the fixing plate structure.
Fig. 5 is a side view of fig. 4.
Fig. 6 is a top view of fig. 4.
Fig. 7 is a schematic view of the clip assembly.
Figure 8 is a schematic view of the assembled clip.
Fig. 9 is a bare substrate cleaning insertion example.
FIG. 10 is a schematic view of a bare substrate to be cleaned inserted.
FIG. 11 is an example weld plate cleaning insertion.
FIG. 12 is a schematic view of the inserted soldering plate to be cleaned.
The reference numbers illustrate: the device comprises a fixed plate 1, a movable plate 2, a supporting rod 3, a positioning hole 4, a positioning groove 5, a clamping groove 6, a positioning bolt 7 and a component 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples of the present invention without any inventive step, are within the scope of the present invention.
As shown in fig. 1, 2, 3, 4, 5, 6, 7 and 8, positioning holes 4 at the ends of the supporting rods are aligned with positioning holes 4 at two sides of the fixing plate and are fixedly connected by bolts, one side of the movable plate 2 with a notch is inserted between the two supporting rods 3, screw holes at the notches at two sides of the movable plate correspond to the supporting rod positioning grooves 5, the movable plate 2 is fixed by the positioning bolts 7, and the distance between the movable plate 2 and the fixing plate 1 is reduced by 3.5mm from the side length of the short side of the substrate or welded plate to be cleaned, so that the adjustable cleaning clamp is formed; multiple panels may be secured using the same method. Wherein the total height of the clamp is not higher than 2/3 of the depth of the cleaning tank, and the length and width of the clamp are not more than 3/4 of the length and width of the cleaning tank; the fixed plate 1 is aligned with the movable plate clamping grooves 6 one by one, the clamping grooves are wide and are used for cleaning the circuit board to be cleaned, the thickness of the circuit board to be cleaned is plus 0.2mm, the interval of the clamping grooves is larger than 5mm, and the depth of the clamping grooves is 2 mm.
Fig. 9 and 10 are insertion examples of the bare substrate for ultrasonic cleaning. After the cleaning clamp is assembled according to the size of the bare substrate to be cleaned, the bare substrates to be cleaned are longitudinally inserted into the cleaning clamp piece by piece along the vertical direction, and grid plates with the mesh diameter of 2mm are transversely inserted into each layer of bare substrates along the horizontal direction for separation. And horizontally placing the cleaning clamp in a cleaning tank of the cleaning machine during cleaning, adding cleaning liquid until the cleaning clamp is submerged, performing ultrasonic cleaning by using corresponding cleaning parameters, taking out the cleaning clamp after cleaning is finished, and taking out the substrates layer by layer from top to bottom to finish cleaning.
Fig. 11 and 12 show an example of the cleaning and inserting of the solder plate. After the cleaning fixture is assembled according to the size of the welding plate to be cleaned, the welding plate to be cleaned is longitudinally inserted piece by piece, the dense area of the components 8 on the welding plate faces upwards, the interval between the highest components of two adjacent rows of welding plates needs to be larger than 5mm, and only one layer of welding plate can be inserted in the horizontal direction for cleaning. When the welding plates with different thicknesses and sizes are cleaned, the movable plates with the corresponding width clamping grooves are additionally arranged according to the number, at least two movable plates with the same width clamping grooves are additionally arranged, the distance between the movable plates with different specifications is not less than 5mm, and the additional arrangement method is the same as the above method. When cleaning, firstly, heating the cleaning solution in the cleaning tank to a specified temperature, horizontally placing the cleaning fixture inserted into the welding plate into the cleaning tank, completely soaking for 5-10 minutes, then carrying out ultrasonic cleaning, spraying for 1 minute after cleaning, taking out the welding plate, and finishing cleaning.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are intended to be covered by the scope of the present invention.
Claims (5)
1. An adjustable cleaning fixture is characterized by comprising a fixed plate (1), a movable plate (2) and support rods (3), wherein positioning holes (4) in the ends of the support rods are aligned with positioning holes (4) in two sides of the fixed plate and are fixedly connected through bolts, one side, with a notch, of the movable plate (2) is inserted between the two support rods (3), screw holes in the notch in the two sides of the movable plate correspond to a support rod positioning groove (5), the movable plate (2) is fixed through positioning bolts (7), and the side length of the short side of a substrate to be cleaned or a welded plate is reduced by 3.5mm by the distance between the movable plate (2) and the fixed plate (1), so that the adjustable cleaning fixture is formed; wherein the total height of the clamp is not higher than 2/3 of the depth of the cleaning tank, and the length and width of the clamp are not more than 3/4 of the length and width of the cleaning tank; the fixed plate aligns with movable plate draw-in groove (6) one by one, and the draw-in groove width is for waiting to wash circuit board thickness +0.2mm, and the draw-in groove interval is greater than 5mm, draw-in groove degree of depth 2 mm.
2. The adjustable cleaning fixture according to claim 1, wherein when the substrates or the welded plates with the same thickness and various sizes are cleaned simultaneously, the moving plates are increased according to the number of the substrates or the welded plates, the distance between the moving plates is reduced by 3.5mm from the length of the short side of the substrate or the welded plate to be cleaned, so that the substrates or the welded plates can be smoothly inserted into and taken out of the clamping grooves, and the positioning bolts are tightened for fixation, and the like.
3. The adjustable cleaning fixture according to claim 1, wherein when cleaning substrates or welded plates with different thicknesses and different sizes, the movable plates with corresponding width slots are required to be additionally installed according to the number, at least two movable plates with the same width slots are required to be additionally installed, and the distance between the movable plates with different specifications is not less than 5 mm.
4. The adjustable cleaning fixture as claimed in claim 2 or 3, wherein when the bare substrate is cleaned by ultrasonic waves, the substrate to be cleaned is inserted vertically one by one, after one layer is fully inserted, a grid plate is inserted horizontally along the horizontal direction, the thickness of the grid plate is smaller than the width of the slot, meshes with the diameter of 2mm are arranged on the grid plate at intervals of 5mm, and the substrate to be cleaned and the grid plate are inserted layer by layer; and horizontally placing the cleaning clamp in a cleaning tank of the cleaning machine during cleaning, adding cleaning liquid until the cleaning clamp is submerged, performing ultrasonic cleaning by using corresponding cleaning parameters, taking out the cleaning clamp after cleaning is finished, and taking out the substrates layer by layer from top to bottom to finish cleaning.
5. The adjustable cleaning fixture as claimed in claim 2 or 3, wherein when the welding plates are cleaned by ultrasonic waves, the welding plates to be cleaned are longitudinally inserted piece by piece, the dense areas of the components on the welding plates are upward, and the interval between the highest components of two adjacent rows of welding plates is larger than 5 mm; the cleaning fixture is characterized in that only one layer of welding plate can be inserted in the horizontal direction for cleaning, cleaning liquid in the cleaning tank is heated to a specified temperature during cleaning, the cleaning fixture inserted with the welding plate is horizontally placed into the cleaning tank and is completely soaked for 5-10 minutes for ultrasonic cleaning, the welding plate is taken out after cleaning is finished and is cleaned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111172631.8A CN113926791A (en) | 2021-10-08 | 2021-10-08 | Adjustable cleaning clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111172631.8A CN113926791A (en) | 2021-10-08 | 2021-10-08 | Adjustable cleaning clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113926791A true CN113926791A (en) | 2022-01-14 |
Family
ID=79278400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111172631.8A Pending CN113926791A (en) | 2021-10-08 | 2021-10-08 | Adjustable cleaning clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113926791A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117505368A (en) * | 2024-01-05 | 2024-02-06 | 黑龙江鼎元药业股份有限公司 | Traditional chinese medicine earth treatment facility is used in herbal pieces-production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004020617A (en) * | 2002-06-12 | 2004-01-22 | Mitsubishi Chemicals Corp | Holder for sheet shaped substrate |
| JP2006075761A (en) * | 2004-09-10 | 2006-03-23 | Olympus Corp | Washing jig and washing method |
| CN201030364Y (en) * | 2007-04-28 | 2008-03-05 | 北京交通大学 | Substrate washing unit |
| CN208066862U (en) * | 2018-01-03 | 2018-11-09 | 东莞市兵利电子有限公司 | A kind of safe and efficient supersonic wave cleaning machine of camera production |
| CN208527500U (en) * | 2018-07-10 | 2019-02-22 | 内蒙古博顺和德精密制造有限公司 | A kind of automobile parts cleaning device |
| CN209255375U (en) * | 2018-10-12 | 2019-08-16 | 广东工业大学 | It is a kind of for being cleaned by ultrasonic the container of substrate |
| CN110877042A (en) * | 2019-11-18 | 2020-03-13 | 中国电子科技集团公司第四十三研究所 | Adjustable inserted sheet cleaning clamp |
| CN210586176U (en) * | 2019-09-27 | 2020-05-22 | 宜春市骏智机电科技有限公司 | Ultrasonic cleaning clamp |
| CN212384238U (en) * | 2020-04-07 | 2021-01-22 | 东莞市微玻智能科技有限公司 | Glass cleaning frame |
-
2021
- 2021-10-08 CN CN202111172631.8A patent/CN113926791A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004020617A (en) * | 2002-06-12 | 2004-01-22 | Mitsubishi Chemicals Corp | Holder for sheet shaped substrate |
| JP2006075761A (en) * | 2004-09-10 | 2006-03-23 | Olympus Corp | Washing jig and washing method |
| CN201030364Y (en) * | 2007-04-28 | 2008-03-05 | 北京交通大学 | Substrate washing unit |
| CN208066862U (en) * | 2018-01-03 | 2018-11-09 | 东莞市兵利电子有限公司 | A kind of safe and efficient supersonic wave cleaning machine of camera production |
| CN208527500U (en) * | 2018-07-10 | 2019-02-22 | 内蒙古博顺和德精密制造有限公司 | A kind of automobile parts cleaning device |
| CN209255375U (en) * | 2018-10-12 | 2019-08-16 | 广东工业大学 | It is a kind of for being cleaned by ultrasonic the container of substrate |
| CN210586176U (en) * | 2019-09-27 | 2020-05-22 | 宜春市骏智机电科技有限公司 | Ultrasonic cleaning clamp |
| CN110877042A (en) * | 2019-11-18 | 2020-03-13 | 中国电子科技集团公司第四十三研究所 | Adjustable inserted sheet cleaning clamp |
| CN212384238U (en) * | 2020-04-07 | 2021-01-22 | 东莞市微玻智能科技有限公司 | Glass cleaning frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117505368A (en) * | 2024-01-05 | 2024-02-06 | 黑龙江鼎元药业股份有限公司 | Traditional chinese medicine earth treatment facility is used in herbal pieces-production |
| CN117505368B (en) * | 2024-01-05 | 2024-03-29 | 黑龙江鼎元药业股份有限公司 | Traditional chinese medicine earth treatment facility is used in herbal pieces-production |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220114 |