CN113922201A - Sealing shell and semiconductor laser - Google Patents
Sealing shell and semiconductor laser Download PDFInfo
- Publication number
- CN113922201A CN113922201A CN202111160912.1A CN202111160912A CN113922201A CN 113922201 A CN113922201 A CN 113922201A CN 202111160912 A CN202111160912 A CN 202111160912A CN 113922201 A CN113922201 A CN 113922201A
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- Prior art keywords
- sealing
- groove
- main
- embedded clamping
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000007789 sealing Methods 0.000 title claims abstract description 100
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 239000000565 sealant Substances 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000003860 storage Methods 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 16
- 239000012945 sealing adhesive Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 6
- 238000004026 adhesive bonding Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a sealed shell and a semiconductor laser, comprising a main shell and a sealing cover, wherein one end of the main shell, which is provided with an opening, is provided with a sealing groove mechanism, the sealing groove mechanism comprises an inner groove arranged on the inner wall of the main shell and a middle-arranged groove arranged in the side wall of the main shell, the side wall of the middle-arranged groove, which is close to the inner side of the main shell, is provided with an inclined plane inclined towards the outer side of the main shell from top to bottom, the bottom of the inclined plane is provided with an embedded clamping groove, a sealant storage bag is arranged in the embedded clamping groove, the sealing cover comprises a main cover body and a sealing plate mechanism which is arranged on the edge of the main cover body in a surrounding way and is matched with the sealing groove mechanism, the sealing plate mechanism comprises an inner sealing plate matched with the inner groove and a middle-arranged sealing plate inserted in the middle-arranged groove, the section of the middle-arranged sealing plate is rectangular, the bottom of the middle-arranged sealing plate is provided with an embedded clamping block matched with the embedded clamping groove, the invention has the advantages that the gluing and fixing of the sealing cover in the sealed shell on the main shell are realized, and special equipment is not required for welding.
Description
Technical Field
The invention relates to the field of laser accessories, in particular to a sealing shell and a semiconductor laser.
Background
The laser is a device or system capable of generating and emitting laser light, has the characteristics of high brightness, good monochromaticity and directivity, good coherence and the like, and can be generally divided into four types of lasers, i.e., a gas laser, a solid laser, a semiconductor laser and a dye laser, according to working media. Because the semiconductor laser is widely adopted due to small volume and high power, in actual use, in order to improve the total output power of the semiconductor laser, a plurality of semiconductor laser chips, optical structures such as a reflector and a lens are generally integrated into one semiconductor laser, so that high-power output is realized, and application scenes are increased. The semiconductor laser in an integrated state has high requirements on air tightness, working environment humidity and dust-free environment, so that the semiconductor laser is not suitable for being exposed to an open environment to work, and a shell with good sealing performance is generally packaged in practical use, so that in the whole machining operation of the semiconductor laser, the semiconductor laser sealing packaging is a process step in the production process of the semiconductor laser, and the traditional semiconductor sealing packaging mainly comprises packaging methods such as glue injection sealing, parallel sealing and welding, O-ring sealing and the like. The packaging mainly has the effects of ensuring the air tightness inside the cavity of the laser, preventing the interior from dewing and foreign matter pollution, ensuring the normal and stable work of the laser and prolonging the service life of the laser.
When the parallel sealing and welding process is adopted for sealing and packaging processing, high current and high temperature can damage precise optical devices in the shell during welding, the yield of semiconductor laser production is greatly influenced, and the parallel sealing and welding process needs special welding equipment for operation and has higher requirement on equipment of a production side.
When the encapsulation sealing method is adopted for encapsulating and processing the semiconductor laser, a standardized production clamp is required to be configured for encapsulating and packaging operation, and the small-batch production of products is inconvenient.
In summary, a semiconductor laser sealing housing with a higher degree of prefabrication is needed.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a sealed shell and a semiconductor laser aiming at the defects of the prior art.
The technical scheme is as follows: the invention relates to a sealing shell, which comprises a main shell, wherein an opening communicated with the interior of the main shell is arranged on the main shell, a sealing groove mechanism is arranged on the main shell at the edge of the opening, the sealing groove mechanism is arranged around the opening, the sealing groove mechanism comprises an inner groove formed in the inner wall of the main shell and a middle groove formed in the side wall of the main shell, the side wall of the middle groove close to the inner side of the main shell is provided with an inclined surface inclined towards the outer side of the main shell from top to bottom, the bottom of the inclined surface is provided with an embedded clamping groove, and a sealant storage bag is arranged in the embedded clamping groove;
the sealing shell further comprises a sealing cover, the sealing cover comprises a main cover body and a sealing plate mechanism which is arranged on the edge of the main cover body in a surrounding mode and matched with the sealing groove mechanism, the sealing plate mechanism comprises an inner sealing plate matched with an inner groove and an intermediate sealing plate inserted into the intermediate groove, the cross section of the intermediate sealing plate is rectangular, and an embedded clamping block matched with an embedded clamping groove is arranged at the bottom of the intermediate sealing plate.
Preferably, the sealant storage bag comprises a film storage bag filled with sealant.
Preferably, the embedded clamping groove comprises a stepped embedded clamping groove, and the embedded fixture block comprises a stepped embedded fixture block matched with the stepped embedded clamping groove.
Preferably, one surface of the inner closing plate facing the inner groove is attached with an adhesive sealing layer matched with the inner groove.
Preferably, the main casing body is tangent to the edge of the main cover body, and a sealing adhesive layer is arranged between the top surface of the main casing body and the region, matched with the top surface of the main casing body, on the bottom surface of the main cover body.
Preferably, a plurality of overflow chutes are formed on the sealant layer.
A semiconductor laser comprises a laser body and a sealed shell; the laser body is arranged in the sealed shell.
Preferably, the side wall of the main shell is provided with a connecting terminal, the connecting terminal penetrates through the side wall of the main shell, and two ends of the connecting terminal are respectively exposed on the inner side and the outer side of the side wall of the main shell.
Compared with the prior art, the invention has the following beneficial effects: (1) the side wall of the middle closing plate close to the inner side of the main shell is provided with an inclined plane which inclines from top to bottom towards the outer side of the main shell, when the middle closing plate with the rectangular section is inserted into the middle closing plate, the middle closing plate is pressed by the inclined plane to generate stress conflict with the surface of the inclined plane, and the inner closing plate is forced to conflict with the inner groove under the action of the stress, so that the effect of pressing and sealing is realized;
(2) the bottom of the inclined plane is provided with an embedded clamping groove, the bottom of the mid-positioned sealing plate is provided with an embedded clamping block matched with the embedded clamping groove, and the embedded clamping block is inserted into the embedded clamping groove when the mid-positioned sealing plate is inserted into the bottom of the mid-positioned groove, so that auxiliary fixing of the mid-positioned sealing plate is realized;
(3) the sealant storage bag is arranged in the embedded clamping groove, the sealant storage bag can be extruded and broken when the built-in sealing plate is inserted into the bottom of the built-in groove, the sealant overflows and adheres the built-in sealing plate in the built-in groove, sealing and fixing of the built-in sealing plate and the built-in groove are achieved, and accordingly sealing and gluing of the sealing cover on the main shell are achieved.
Drawings
Fig. 1 is a schematic longitudinal sectional view of a sealed housing and a semiconductor laser according to the present invention, in which the sealed housing is opened;
fig. 2 is a schematic longitudinal sectional view showing an assembled state of a sealed case and a semiconductor laser according to the present invention.
In the figure: 1. a main housing; 2. an opening; 3. a seal groove mechanism; 31. a middle-arranged groove; 32. a bevel; 33. an embedded card slot; 34. a sealant storage bag; 35. an inner tank; 4. sealing the cover; 41. a main cover body; 42. a closing plate is arranged in the middle; 43. an embedded fixture block; 44. an inner closure plate; 5. gluing a sealing layer; 6. sealing the adhesive layer; 7. a laser body; 8. and a terminal.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the indicated orientations and positional relationships based on the drawings for convenience in describing and simplifying the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Referring to fig. 1-2, a sealed housing includes a main housing 1, an opening 2 penetrating through the main housing 1 is provided on the main housing 1, a sealing groove mechanism 3 is provided on the main housing at the edge of the opening 2, the sealing groove mechanism 3 is disposed around the opening 2, the sealing groove mechanism 3 includes an inner groove 35 provided on the inner wall of the main housing 1 and a middle groove 31 provided in the side wall of the main housing 1, the side wall of the middle groove 31 near the inner side of the main housing 1 is provided with an inclined surface 32 inclined from top to bottom toward the outer side of the main housing 1, the bottom of the inclined surface 32 is provided with an embedded slot 33, and a sealant storage bag 34 is provided in the embedded slot 33;
the sealing shell further comprises a sealing cover 4, the sealing cover 4 comprises a main cover body 41 and a sealing plate mechanism which is arranged on the edge of the main cover body 41 in a surrounding mode and matched with the sealing groove mechanism 3, the sealing plate mechanism comprises an inner sealing plate 44 matched with the inner groove 35 and a middle sealing plate 42 inserted into the middle groove 31, the cross section of the middle sealing plate 42 is rectangular, and an embedded clamping block 43 matched with the embedded clamping groove 33 is arranged at the bottom of the middle sealing plate 42.
The technical scheme has the advantages that the side wall of the middle closing plate 31 close to the inner side of the main shell 1 is provided with the inclined surface 32 inclined from top to bottom towards the outer side of the main shell 1, when the middle closing plate 42 with the rectangular section is inserted into the middle closing plate 31, the middle closing plate 42 is pressed by the inclined surface 32 to generate stress interference with the surface of the inclined surface 32, and the inner closing plate 44 is pressed to interfere with the inner groove 35 under the action of the stress, so that the effect of compression sealing is realized; the bottom of the inclined plane 32 is provided with an embedded clamping groove 33, the bottom of the middle closing plate 42 is provided with an embedded clamping block 43 matched with the embedded clamping groove 33, and when the middle closing plate 42 is inserted into the bottom of the middle groove 31, the embedded clamping block 43 is inserted into the embedded clamping groove 33, so that the auxiliary fixation of the middle closing plate 42 is realized; the sealant storage bag 34 is arranged in the embedded clamping groove 33, when the built-in sealing plate 42 is inserted into the bottom of the built-in groove 31, the sealant storage bag 34 is squeezed and broken, at the moment, the sealant overflows and adheres the built-in sealing plate 42 in the built-in groove 31, sealing and fixing of the built-in sealing plate 42 and the built-in groove 31 are achieved, and accordingly sealing and gluing of the sealing cover 4 on the main shell 1 are achieved.
In specific implementation, the cross-sectional configuration of the rectangular mid-positioned closing plate 42 is a preferred option, and the mid-positioned closing plate 42 with the cross-sectional configuration of an inverted trapezoid, an inverted cone and the like can be adopted, so that the mid-positioned closing plate 42 can be ensured to effectively abut against the inclined plane 32 and generate enough stress compression strength; the sealant storage bag 34 comprises a sealant filled film bag that is structurally strong to ensure that the sealant is not ruptured when filled.
The embedded clamping groove 33 is a stepped embedded clamping groove, and the embedded clamping block 43 is a stepped embedded clamping block matched with the stepped embedded clamping groove. In effect, the embedded clamping groove 33 can achieve the technical effect of fixing as long as the embedded clamping block 43 can be embedded and clamped, the effect can be achieved by adopting the arc-shaped clamping groove, the rectangular clamping groove and the stepped clamping groove, the stepped embedded clamping groove and the stepped embedded clamping block are an optimal solution in specific implementation, the bonding contact surface between the middle-placed sealing plate 42 and the middle-placed groove 31 in the sealant bonding process can be increased by adopting the stepped configuration, and the bonding stability is improved.
The side of the inner closing plate 44 facing the inner groove 35 is adhered with an adhesive sealing layer 5 matched with the inner groove 35, the main casing 1 is tangent to the edge of the main cover 41, a sealing adhesive layer 6 is arranged between the top surface of the main casing 1 and the area matched with the top surface of the main casing 1 on the bottom surface of the main cover 41, the adhesive sealing layer 5 and the sealing adhesive layer 6 both belong to the structural design of auxiliary sealing, the adhesive sealing layer 5 and the sealing adhesive layer 6 are used for assisting in improving the bonding strength when the closing cover 4 is pressed on the main casing 1, and are used as the peripheral sealing adhesive layer 6 to serve as the peripheral sealing structure and also have the function of preventing the bonding structure of the middle closing plate 42 and the middle groove 31 from being polluted, a plurality of overflow grooves need to be arranged on the sealing adhesive layer 6 during implementation, and the redundant sealant between the middle closing plate 42 and the middle groove 31 flows out when the closing cover 4 is pressed so as to ensure that the thickness of the sealant bonded between the middle closing plate 42 and the middle groove 31 is uniform and the connection surface is flat, the arrangement of the adhesive sealing layer 5 can prevent the redundant sealant from overflowing into the inner space of the main shell 1, thereby avoiding possible pollution to the inner laser body 7.
In addition, the surfaces of the middle closing plate 42 and the middle groove 31 can be subjected to galling treatment, so that the friction force is increased, and the gluing and fixing effect of the sealant on the middle closing plate and the middle groove can also be increased.
A semiconductor laser includes a laser body 7 and a sealed case; the laser body 7 is disposed within the sealed housing.
The side wall of the main shell 1 is provided with a wiring terminal 8, the wiring terminal 8 penetrates through the side wall of the main shell 1, and two ends of the wiring terminal 8 are respectively exposed on the inner side and the outer side of the side wall of the main shell 1. Here, the application of the connecting terminal 8 lies in that the laser body 7 in the sealed sealing shell is electrically connected with external equipment, and meanwhile, the sealing property of the sealing shell can be guaranteed not to be damaged, after the connection of the laser body 7 is connected with the connecting terminal 8, the connection of all the external equipment can be realized through the connecting terminal 8 which is positioned at the contact outside the sealing shell, and the sealing shell does not need to be disassembled and assembled.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. The utility model provides a sealed housing, includes main casing body and closing cap, be provided with the intercommunication on the main casing body the inside opening of main casing body, be equipped with seal groove mechanism, its characterized in that on the main casing body of opening border department: the sealing groove mechanism comprises an inner groove formed in the inner wall of the main shell and a middle groove formed in the side wall of the main shell, the side wall, close to the inner side of the main shell, of the middle groove is an inclined plane inclined towards the outer side of the main shell from top to bottom, an embedded clamping groove is formed in the bottom of the inclined plane, and a sealant storage bag is arranged in the embedded clamping groove;
the sealing shell further comprises a sealing cover, the sealing cover comprises a main cover body and a sealing plate mechanism which is arranged on the edge of the main cover body in a surrounding mode and matched with the sealing groove mechanism, the sealing plate mechanism comprises an inner sealing plate matched with an inner groove and an intermediate sealing plate inserted into the intermediate groove, the cross section of the intermediate sealing plate is rectangular, and an embedded clamping block matched with an embedded clamping groove is arranged at the bottom of the intermediate sealing plate.
2. A sealed housing according to claim 1, wherein: the sealant storage bag comprises a film storage bag filled with sealant.
3. A sealed housing according to claim 1, wherein: the embedded clamping groove comprises a stepped embedded clamping groove, and the embedded clamping block comprises a stepped embedded clamping block matched with the stepped embedded clamping groove.
4. A sealed housing according to claim 1, wherein: and one surface of the inner sealing plate facing the inner groove is adhered with an adhesive sealing layer matched with the inner groove.
5. A sealed housing according to claim 1, wherein: the main casing body is tangent with the border of main lid and be equipped with sealing glue layer between the top surface of main casing body and the main lid bottom surface and main casing body top surface complex region.
6. A sealed housing according to claim 5, wherein: and the sealing adhesive layer is provided with a plurality of overflow grooves.
7. A semiconductor laser comprising a laser body and a hermetically sealed housing according to any of claims 1 to 6; the laser body is arranged in the sealed shell.
8. A semiconductor laser as claimed in claim 7 wherein: the main casing is characterized in that the connecting terminal is arranged on the side wall of the main casing, the connecting terminal penetrates through the side wall of the main casing, and two ends of the connecting terminal are exposed on the inner side and the outer side of the side wall of the main casing respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111160912.1A CN113922201A (en) | 2021-09-30 | 2021-09-30 | Sealing shell and semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111160912.1A CN113922201A (en) | 2021-09-30 | 2021-09-30 | Sealing shell and semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113922201A true CN113922201A (en) | 2022-01-11 |
Family
ID=79237599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111160912.1A Pending CN113922201A (en) | 2021-09-30 | 2021-09-30 | Sealing shell and semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113922201A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000183442A (en) * | 1998-12-15 | 2000-06-30 | Nippon Electric Glass Co Ltd | Cap for optical element |
| CN102182994A (en) * | 2011-04-11 | 2011-09-14 | 浙江捷莱照明有限公司 | Sealing structure for strip-shaped lamp |
| TWM509194U (en) * | 2015-06-11 | 2015-09-21 | Yun-Ping Peng | Container fastener |
| CN207332134U (en) * | 2017-10-12 | 2018-05-08 | 江苏双楼建设集团有限公司 | A kind of roof water-proof heat-insulation system |
| CN208641970U (en) * | 2018-07-19 | 2019-03-26 | 天津市明川阀门有限公司 | A kind of embedded filter maintained easily |
| CN110932090A (en) * | 2019-12-13 | 2020-03-27 | 杭州华锦电子有限公司 | Laser diode and preparation method thereof |
| CN112600064A (en) * | 2020-12-25 | 2021-04-02 | 浙江热刺激光技术有限公司 | Sealed housing and semiconductor laser |
| CN213980464U (en) * | 2020-09-02 | 2021-08-17 | 霍义评 | Take push-and-pull door of waterproof construction |
-
2021
- 2021-09-30 CN CN202111160912.1A patent/CN113922201A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000183442A (en) * | 1998-12-15 | 2000-06-30 | Nippon Electric Glass Co Ltd | Cap for optical element |
| CN102182994A (en) * | 2011-04-11 | 2011-09-14 | 浙江捷莱照明有限公司 | Sealing structure for strip-shaped lamp |
| TWM509194U (en) * | 2015-06-11 | 2015-09-21 | Yun-Ping Peng | Container fastener |
| CN207332134U (en) * | 2017-10-12 | 2018-05-08 | 江苏双楼建设集团有限公司 | A kind of roof water-proof heat-insulation system |
| CN208641970U (en) * | 2018-07-19 | 2019-03-26 | 天津市明川阀门有限公司 | A kind of embedded filter maintained easily |
| CN110932090A (en) * | 2019-12-13 | 2020-03-27 | 杭州华锦电子有限公司 | Laser diode and preparation method thereof |
| CN213980464U (en) * | 2020-09-02 | 2021-08-17 | 霍义评 | Take push-and-pull door of waterproof construction |
| CN112600064A (en) * | 2020-12-25 | 2021-04-02 | 浙江热刺激光技术有限公司 | Sealed housing and semiconductor laser |
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| CB02 | Change of applicant information |
Address after: 215000 1415, block D, No. 398, Ruoshui Road, Suzhou Industrial Park, Jiangsu Province Applicant after: Jiangsu Jicui Zhongke Nano Technology Co.,Ltd. Address before: 215000 1415, block D, No. 398, Ruoshui Road, Suzhou Industrial Park, Jiangsu Province Applicant before: Jiangsu Jicui nano Application Technology Research Institute Co.,Ltd. |
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Application publication date: 20220111 |