CN113921739A - OLED display module, preparation method of OLED display module and electronic equipment - Google Patents

OLED display module, preparation method of OLED display module and electronic equipment Download PDF

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CN113921739A
CN113921739A CN202111160762.4A CN202111160762A CN113921739A CN 113921739 A CN113921739 A CN 113921739A CN 202111160762 A CN202111160762 A CN 202111160762A CN 113921739 A CN113921739 A CN 113921739A
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layer
metal nanoparticle
display module
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oled display
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秦禄东
李志林
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/008—Surface plasmon devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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Abstract

The embodiment of the application provides an OLED display module, a preparation method of the OLED display module and electronic equipment. The utility model provides an OLED display module assembly, through setting up first metal nanoparticle layer in the one side that the OLED device deviates from the substrate, set up the one side that the OLED device deviates from the substrate into the light-emitting side simultaneously, realized setting up first metal nanoparticle layer on the light-emitting path of OLED device, when the light incidence that the OLED device sent to first metal nanoparticle layer, surface plasmon effect takes place for the surface of metal nanoparticle in the first metal nanoparticle layer, the energy that surface plasmon effect produced radiates away with the form of light, thereby can improve the light extraction efficiency of OLED device, in addition, first metal nanoparticle layer has the light scattering effect, can improve soft degree and the homogeneity of OLED device light-emitting.

Description

OLED display module, preparation method of OLED display module and electronic equipment
Technical Field
The application relates to the technical field of display, in particular to an OLED display module, a preparation method of the OLED display module and electronic equipment.
Background
Since an Organic Light Emitting Diode (OLED) has a self-Light Emitting characteristic, the OLED display panel can be thinner, has a wide viewing angle, and consumes less power, and thus the OLED display panel is regarded as a next generation display technology to replace a Liquid Crystal Display (LCD).
The problems of the existing OLED display screen include: most of light emitted by the OLED device can be limited in the device, and can not be emitted and lost, only a small amount of light can be emitted from the OLED device, and further the light extraction efficiency of the OLED device is not high, so that the effective improvement of the light extraction efficiency of the OLED device becomes a technical problem which needs to be solved in the current industry.
Disclosure of Invention
The embodiment of the application provides an OLED display module, a preparation method of the OLED display module and electronic equipment.
In a first aspect, an embodiment of the present application provides an OLED display module, including:
a substrate;
the OLED device is arranged on the substrate, and one side of the OLED device, which is far away from the substrate, is a light emergent side;
a first layer of metal nanoparticles disposed on a side of the OLED device facing away from the substrate.
In a second aspect, an embodiment of the present application provides a method for manufacturing an OLED display module, including:
providing a substrate, and preparing an OLED device on the substrate;
a first layer of metal nanoparticles is prepared on a side of the OLED device facing away from the substrate.
In a third aspect, an embodiment of the present application provides an electronic device, which includes the OLED display module described above.
The utility model provides an OLED display module assembly, through setting up first metal nanoparticle layer in the one side that the OLED device deviates from the substrate, set up the one side that the OLED device deviates from the substrate into the light-emitting side simultaneously, realized setting up first metal nanoparticle layer on the light-emitting path of OLED device, when the light incidence that the OLED device sent to first metal nanoparticle layer, surface plasmon effect takes place for the surface of metal nanoparticle in the first metal nanoparticle layer, the energy that surface plasmon effect produced radiates away with the form of light, thereby can improve the light extraction efficiency of OLED device, in addition, first metal nanoparticle layer has the light scattering effect, can improve soft degree and the homogeneity of OLED device light-emitting. Because the first metal nanoparticle layer is arranged outside the OLED device, namely the distance between the first metal nanoparticle layer and the light-emitting layer in the OLED device is longer, the problems of exciton quenching, leakage current increase, damage to the stability of the electrical performance of the OLED device and the like caused by the fact that the metal nanoparticles are too close to the light-emitting layer can be avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic view of a first structure of an OLED display module according to an embodiment of the present disclosure.
Fig. 2 is a schematic view of a second structure of an OLED display module according to an embodiment of the present disclosure.
Fig. 3 is a schematic structural diagram of a third OLED display module according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of an OLED device provided in an embodiment of the present application.
Fig. 5 is a first flowchart of a method for manufacturing an OLED display module according to an embodiment of the present disclosure.
Fig. 6 is a second flowchart of a method for manufacturing an OLED display module according to an embodiment of the present disclosure.
Fig. 7 is a third flowchart of a method for manufacturing an OLED display module according to an embodiment of the present disclosure.
Fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic view illustrating a first structure of an OLED display module according to an embodiment of the present disclosure. The embodiment of the application provides an OLED display module 10, and OLED display module 10 can include substrate 11, OLED device 12 and first metal nanoparticle layer 13, and OLED device 12 sets up on substrate 11, and one side that OLED device 12 deviates from substrate 11 is the light-emitting side, and first metal nanoparticle layer 13 sets up in one side that OLED device 12 deviates from substrate 11. Illustratively, OLED device 12 is disposed against a surface of OLED device 12.
The embodiment of the application provides an OLED display module assembly 10, through setting up first metal nanoparticle layer 13 in one side that OLED device 12 deviates from substrate 11, set up one side that OLED device 12 deviates from substrate 11 simultaneously and be the light-emitting side, realized setting up first metal nanoparticle layer 13 on OLED device 12's light-emitting path, when the light that OLED device 12 sent incides to first metal nanoparticle layer 13, surface plasmon effect takes place for the surface of the metal nanoparticle in first metal nanoparticle layer 13, the energy that surface plasmon effect produced radiates away with the form of light, thereby can improve OLED device 12's light extraction efficiency, in addition, first metal nanoparticle layer 13 has the light scattering effect, can improve the soft degree and the homogeneity of OLED device 12 light-emitting. Since the first metal nanoparticle layer 13 is disposed outside the OLED device 12, that is, the distance between the first metal nanoparticle layer 13 and the light emitting layer 124 in the OLED device 12 is relatively long, the problems of exciton quenching, increased leakage current, damage to the electrical performance stability of the OLED device, and the like caused by the metal nanoparticles being too close to the light emitting layer 124 can be avoided.
Surface plasmon effects (SPPs) refer to a special electromagnetic mode formed when light waves (electromagnetic waves) enter a boundary surface between a metal and a medium, free electrons on the surface of the metal oscillate collectively, the electromagnetic waves and the free electrons on the surface of the metal are coupled to form a near-field electromagnetic wave which propagates along the surface of the metal, and if the oscillation frequency of the electrons is consistent with the frequency of the incident light wave, resonance is generated, and the energy of the electromagnetic field is effectively converted into the collective vibration energy of the free electrons on the surface of the metal in the resonance state: the electromagnetic field is localized to a small range of the metal surface and enhanced, and this phenomenon is called a surface plasmon effect. In the embodiment of the present application, when the surface of the metal nanoparticles in the first metal nanoparticle layer 13 generates the surface plasmon effect, the energy generated by the surface plasmon effect is radiated in the form of light, so as to improve the light extraction efficiency of the OLED device 12.
The substrate 11 may be a rigid substrate such as a glass substrate or may be a flexible substrate.
The metal nanoparticles in the first metal nanoparticle layer 13 may have a particle size of 1nm to 100nm, for example, 1nm, 2nm, 5nm, 10nm, 20nm, 50nm, 80nm, 100nm, and the like.
Illustratively, the thickness of the first metal nanoparticle layer 13 may be 4nm to 6nm, such as 4nm, 4.2nm, 4.5nm, 4.8nm, 5nm, 5.3nm, 5.5nm, 5.7nm, 6nm, and the like. It can be understood that, by setting the first metal nanoparticle layer 13 to be a thinner thickness, not only can the metal nanoparticles in the first metal nanoparticle layer 13 be uniformly dispersed, and the metal nanoparticles are prevented from aggregating into a group, but also the first metal nanoparticle layer 13 can have a better light transmittance, so as to improve the light extraction efficiency of the OLED device 12.
Illustratively, the material of the first metal nanoparticle layer 13 may include at least one of gold (Au) and silver (Ag).
Through experimental verification of the inventor of the present application, compared with the OLED display module 10 without the first metal nanoparticle layer 13 (i.e., removing the first metal nanoparticle layer 13 in fig. 1), the light extraction efficiency of the OLED device 12 in the OLED display module 10 shown in fig. 1 of the present application can be improved by 4% to 20%.
Referring to fig. 2, fig. 2 is a schematic view illustrating a second structure of an OLED display module according to an embodiment of the present disclosure. The OLED display module 10 may further include a first encapsulation protective layer 14, where the first encapsulation protective layer 14 is disposed on a side of the first metal nanoparticle layer 13 facing away from the OLED device 12, and the first encapsulation protective layer 14 covers the first metal nanoparticle layer 13 and the OLED device 12.
It can be understood that the first encapsulation protection layer 14 can play a role in encapsulating and protecting the first metal nanoparticle layer 13 and the OLED device 12, so that the first metal nanoparticle layer 13 and the OLED device 12 can be prevented from being attacked by moisture and oxygen in the external environment, and the service life of the first metal nanoparticle layer 13 and the OLED device 12 is prolonged.
Illustratively, the thickness of the first encapsulation protective layer 14 may be 40nm to 60nm, such as 40nm, 42nm, 45nm, 48nm, 50nm, 53nm, 55nm, 57nm, 60nm, and the like. It can be understood that, by setting the first encapsulation protection layer 14 to be 40nm to 60nm, not only can the encapsulation requirements of the first metal nanoparticle layer 13 and the OLED device 12 be met, but also the first encapsulation protection layer 14 can have better light transmission performance, so that the light extraction efficiency of the OLED device 12 is improved.
Illustratively, the material of the first encapsulation protective layer 14 may include molybdenum oxide (MoO)x)。
Referring to fig. 3, fig. 3 is a schematic structural diagram of an OLED display module according to an embodiment of the present disclosure. The OLED display module 10 may further include a second metal nanoparticle layer 15 and a second encapsulation protection layer 16, the second metal nanoparticle layer 15 is disposed on one side of the first encapsulation protection layer 14 departing from the first metal nanoparticle layer 13, the second encapsulation protection layer 16 is disposed on one side of the second metal nanoparticle layer 15 departing from the first encapsulation protection layer 14, and the second encapsulation protection layer 16 covers the second metal nanoparticle layer 15 and the first encapsulation protection layer 14.
It can be understood that by arranging the second metal nanoparticle layer 15, because the second metal nanoparticle layer 15 is also arranged on the light emitting path of the OLED device 12, the surface plasmon effect also occurs on the surface of the second metal nanoparticle layer 15, the light extraction efficiency of the OLED device 12 is further improved, and in addition, based on the light scattering effect of the second metal nanoparticle layer 15, the softness and uniformity of the light emitted from the OLED device 12 can be further improved.
In addition, by arranging the second encapsulation protection layer 16 on the surface of the second metal nanoparticle layer 15, the second encapsulation protection layer 16 can be used to encapsulate and protect the second metal nanoparticle layer 15 and the lower structure layer thereof (including the OLED device 12, the first metal nanoparticle layer 13, and the first encapsulation protection layer 14), and the service life of the OLED device 12 is further prolonged.
Illustratively, the metal nanoparticles in the second metal nanoparticle layer 15 may have a particle size of 1nm to 100nm, such as 1nm, 2nm, 5nm, 10nm, 20nm, 50nm, 80nm, 100nm, etc.; the thickness of the second metal nanoparticle layer 15 may be 4nm to 6nm, such as 4nm, 4.2nm, 4.5nm, 4.8nm, 5nm, 5.3nm, 5.5nm, 5.7nm, 6nm, and the like; the material of the second metal nanoparticle layer 15 may include at least one of gold and silver.
Illustratively, the thickness of the second encapsulation protective layer 16 may be 40nm to 60nm, such as 40nm, 42nm, 45nm, 48nm, 50nm, 53nm, 55nm, 57nm, 60nm, and the like; the material of the second encapsulation protective layer 16 may include molybdenum oxide (MoO)x)。
It should be noted that the OLED display module 10 may further include more metal nanoparticle layers and encapsulation protection layers, that is, a plurality of metal nanoparticle layers and a plurality of encapsulation protection layers which are stacked are disposed on a side of the OLED device 12 away from the substrate 11, where the metal nanoparticle layers and the encapsulation protection layers are alternately stacked. In the embodiments of the present application, a plurality means two or more, for example, three, four, five, six, seven, eight, and the like.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an OLED device according to an embodiment of the present disclosure. The OLED device 12 may include a cathode 121, an electron injection layer 122, an electron transport layer 123, a light emitting layer 124, a hole transport layer 125, a hole injection layer 126, and an anode 127, where the cathode 121 is disposed on the substrate 11, the electron injection layer 122 is disposed on a side of the cathode 121 facing away from the substrate 11, the electron transport layer 123 is disposed on a side of the electron injection layer 122 facing away from the cathode 121, the light emitting layer 124 is disposed on a side of the electron transport layer 123 facing away from the electron injection layer 122, the hole transport layer 125 is disposed on a side of the light emitting layer 124 facing away from the electron transport layer 123, the hole injection layer 126 is disposed on a side of the hole transport layer 125 facing away from the light emitting layer 124, and the anode 127 is disposed on a side of the hole injection layer 126 facing away from the hole transport layer 125, where the anode 127 is a light-transmitting electrode, that is to say, the side where the anode 127 is located is the light-emitting side of the OLED device 12.
The material of the cathode 121 and the anode 127 may be both metal, such as aluminum (Al).
The thickness of the cathode 121 may be set to 180nm to 220nm to provide the cathode 121 with good reflection performance, and illustratively, the thickness of the cathode 121 may be 180nm, 190nm, 200nm, 210nm, 220nm, and the like. It can be understood that when the cathode 121 has a reflective property, it can reflect the light emitted from the OLED device 12 toward the substrate 11 side, and the reflected light can be emitted from the anode 127 side after passing through each film layer, so that the light-emitting efficiency of the OLED device 12 can be improved.
The thickness of the anode 127 may be set to 15nm to 25nm to ensure high light transmittance, and illustratively, the thickness of the anode 127 may be 15nm, 17nm, 20nm, 22nm, 25nm, or the like.
It can be seen that the OLED device 12 shown in fig. 4 is an inverted OLED device 12 (the cathode 121 is disposed close to the substrate 11, and the anode 127 is disposed far from the substrate 11), and it is understood that the non-inverted OLED device 12 can also be applied in the embodiment of the present application, and the non-inverted OLED device 12 can include an anode, an Electron Injection Layer (EIL), an Electron Transport Layer (ETL), an emission layer (EML), a Hole Transport Layer (HTL), a hole injection layer (EIL), and a cathode (i.e., the anode is disposed close to the substrate, and the cathode is disposed far from the substrate) which are sequentially stacked on the substrate.
Referring to fig. 4, OLED device 12 may further include a light matching layer 128, where light matching layer 128 is disposed on a side of anode 127 away from hole injection layer 126.
Illustratively, the thickness of the optical matching layer 128 may be 40nm to 60nm, such as 40nm, 42nm, 45nm, 48nm, 50nm, 53nm, 55nm, 57nm, 60nm, and the like.
It will be appreciated that the light matching layer 128, also known as a CPL layer or light extraction layer, functions as the light matching layer 128 to increase the light extraction efficiency of the OLED device 12. The material of the optical matching layer 128 may be various materials that have been applied in the art, and the specific material is not limited by the embodiment.
Referring to fig. 5 in conjunction with fig. 1 to 4, fig. 5 is a first flowchart of a method for manufacturing an OLED display module according to an embodiment of the present disclosure. The embodiment of the application provides a method for manufacturing an OLED display module, which can be used for manufacturing the OLED display module 10 in any one of the embodiments, and the method includes:
a substrate is provided 100 on which an OLED device is fabricated.
Referring to fig. 1 and 4, the "fabricating an OLED device on a substrate" may specifically include:
a cathode 121 is prepared on the substrate 11 110.
Exemplarily, "preparing the cathode 121 on the substrate 11" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000071
(e.g. in
Figure BDA0003290095210000072
Etc.) to produce cathode 121.
An electron injection layer 122 is prepared 120 on the side of the cathode 121 facing away from the substrate 11.
Exemplarily, "preparing the electron injection layer 122 at a side of the cathode 121 facing away from the substrate 11" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000073
(e.g. in
Figure BDA0003290095210000074
Etc.) to produce the electron injection layer 122.
130, an electron transport layer 123 is prepared on the side of the electron injection layer 122 facing away from the cathode 121.
Exemplarily, "preparing the electron transport layer 123 on a side of the electron injection layer 122 facing away from the cathode 121" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000075
(e.g. in
Figure BDA0003290095210000076
Etc.) to produce electron transport layer 123.
140 and the light-emitting layer 124 is prepared on the side of the electron transport layer 123 facing away from the electron injection layer 122.
Exemplarily, "preparing the light emitting layer 124 at a side of the electron transport layer 123 facing away from the electron injection layer 122" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000077
(e.g. in
Figure BDA0003290095210000078
Etc.) to produce the light emitting layer 124.
150 and a hole transport layer 125 is prepared on the side of the light-emitting layer 124 facing away from the electron transport layer 123.
Exemplarily, "preparing the hole transport layer 125 at a side of the light emitting layer 124 facing away from the electron transport layer 123" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000079
(e.g. in
Figure BDA00032900952100000710
Etc.) to produce hole transport layer 125.
The hole injection layer 126 is prepared 160 on the side of the hole transport layer 125 facing away from the light-emitting layer 124.
Exemplarily, "preparing the hole injection layer 126 on a side of the hole transport layer 125 facing away from the light emitting layer 124" may specifically include: by adopting a method of evaporation and
Figure BDA00032900952100000711
(e.g. in
Figure BDA00032900952100000712
Etc.) to produce the hole injection layer 126.
An anode 127 is prepared 170 on the side of the hole injection layer 126 facing away from the hole transport layer 125.
Exemplarily, "preparing the anode 127 on a side of the hole injection layer 126 facing away from the hole transport layer 125" may specifically include: by adopting a method of evaporation and
Figure BDA00032900952100000713
(e.g. in
Figure BDA00032900952100000714
Etc.) to produce anode 127.
Referring to fig. 4, "fabricating an OLED device on a substrate" may specifically further include:
180, a light matching layer 128 is prepared on the side of the anode 127 facing away from the hole injection layer 126.
Exemplarily, "preparing the light matching layer 128 at a side of the anode 127 facing away from the hole injection layer 126" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000081
(e.g. in
Figure BDA0003290095210000082
Etc.) to produce the optical matching layer 128.
A first layer of metal nanoparticles is prepared 200 on the side of the OLED device facing away from the substrate.
Referring to fig. 1, "preparing a first metal nanoparticle layer on a side of the OLED device facing away from the substrate" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000083
(e.g. in
Figure BDA0003290095210000084
Etc.) to produce the first metal nanoparticle layer 13.
Referring to fig. 6, fig. 6 is a second flowchart of a method for manufacturing an OLED display module according to an embodiment of the present disclosure. The preparation method of the OLED display module can further comprise the following steps:
300, preparing a first packaging protective layer on the side of the first metal nanoparticle layer away from the OLED device, wherein the first packaging protective layer coats the first metal nanoparticle layer and the OLED device.
Referring to fig. 2, the "preparing the first encapsulation protection layer on the side of the first metal nanoparticle layer away from the OLED device" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000085
(e.g. in
Figure BDA0003290095210000086
Figure BDA0003290095210000087
Etc.), the material of the first encapsulation protective layer 14 may include molybdenum oxide.
Referring to fig. 7, fig. 7 is a third flowchart of a method for manufacturing an OLED display module according to an embodiment of the present disclosure. The preparation method of the OLED display module can further comprise the following steps:
a second metal nanoparticle layer is prepared 400 on the side of the first encapsulation protection layer facing away from the first metal nanoparticle layer.
Referring to fig. 3, the "preparing the second metal nanoparticle layer on the side of the first encapsulation protection layer away from the first metal nanoparticle layer" may specifically include: by adopting a method of evaporation and
Figure BDA0003290095210000088
(e.g. in
Figure BDA0003290095210000089
Figure BDA00032900952100000810
Etc.) to produce the second metal nanoparticle layer 15.
500, preparing a second packaging protection layer on the side of the second metal nanoparticle layer departing from the first packaging protection layer, wherein the second packaging protection layer coats the second metal nanoparticle layer and the first packaging protection layer.
Referring to fig. 3, the step of disposing a second encapsulation protection layer on a side of the second metal nanoparticle layer away from the first encapsulation protection layer may specifically include: by adopting a method of evaporation and
Figure BDA00032900952100000811
(e.g. in
Figure BDA00032900952100000812
Figure BDA00032900952100000813
Etc.) to produce the second encapsulation protective layer 16.
It should be noted that all the evaporation processes (for example, the evaporation processes of the cathode 121, the electron injection layer 122, the electron transport layer 123, the light emitting layer 124, the hole transport layer 125, the hole injection layer 126, the anode 127, the light matching layer 128, the first metal nanoparticle layer 13, the first protective packaging layer 14, the second metal nanoparticle layer 15, and the second protective packaging layer 16) in the embodiments of the present application can be performed under a pressure of 5 × 10-6And finishing in a vacuum evaporation cabin of the bracket.
Referring to fig. 8, fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The embodiment of the present application further provides an electronic device 100, and the electronic device 100 may include the OLED display module 10 in any of the embodiments.
Exemplarily, the electronic device 100 may be a mobile phone (as shown in fig. 8), or may be a tablet computer, a game device, an Augmented Reality (AR) device, a Virtual Reality (VR) device, a data storage device, an audio playing device, a video playing device, a wearable device, and the like having a display screen, where the wearable device may be a smart band, smart glasses, a smart watch, a smart decoration, and the like.
The OLED display module, the method for manufacturing the OLED display module, and the electronic device provided in the embodiments of the present application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (12)

1. An OLED display module, comprising:
a substrate;
the OLED device is arranged on the substrate, and one side of the OLED device, which is far away from the substrate, is a light emergent side;
a first layer of metal nanoparticles disposed on a side of the OLED device facing away from the substrate.
2. The OLED display module of claim 1, wherein the metal nanoparticles in the first metal nanoparticle layer have a particle size of 1nm to 100 nm; and/or
The thickness of the first metal nanoparticle layer is 4nm to 6 nm; and/or
The material of the first metal nanoparticle layer includes at least one of gold and silver.
3. The OLED display module of claim 1, further comprising a first encapsulation protection layer disposed on a side of the first metal nanoparticle layer facing away from the OLED device, wherein the first encapsulation protection layer encapsulates the first metal nanoparticle layer and the OLED device.
4. The OLED display module of claim 3, wherein the first encapsulation protection layer has a thickness of 40nm to 60 nm; and/or
The material of the first packaging protection layer comprises molybdenum oxide.
5. The OLED display module of claim 3, further comprising a second metal nanoparticle layer and a second encapsulation protective layer, wherein the second metal nanoparticle layer is disposed on a side of the first encapsulation protective layer facing away from the first metal nanoparticle layer, the second encapsulation protective layer is disposed on a side of the second metal nanoparticle layer facing away from the first encapsulation protective layer, and the second encapsulation protective layer covers the second metal nanoparticle layer and the first encapsulation protective layer.
6. The OLED display module of any one of claims 1-5, wherein the OLED device comprises a cathode disposed on the substrate, an electron injection layer disposed on a side of the cathode facing away from the substrate, an electron transport layer disposed on a side of the electron injection layer facing away from the cathode, an emission layer disposed on a side of the electron transport layer facing away from the electron injection layer, a hole transport layer disposed on a side of the emission layer facing away from the electron transport layer, a hole injection layer disposed on a side of the hole transport layer facing away from the emission layer, and an anode disposed on a side of the hole injection layer facing away from the hole transport layer, wherein the anode is a light transmissive electrode.
7. A preparation method of an OLED display module is characterized by comprising the following steps:
providing a substrate, and preparing an OLED device on the substrate;
a first layer of metal nanoparticles is prepared on a side of the OLED device facing away from the substrate.
8. The OLED display of claim 7The method for manufacturing a module is characterized in that the step of manufacturing a first metal nanoparticle layer on the side of the OLED device, which is far away from the substrate, comprises the following steps: by adopting a method of evaporation and
Figure FDA0003290095200000021
the first metal nanoparticle layer is prepared.
9. The method for manufacturing an OLED display module according to claim 7, further comprising:
and preparing a first packaging protective layer on one side of the first metal nano particle layer, which is far away from the OLED device, wherein the first packaging protective layer coats the first metal nano particle layer and the OLED device.
10. The method for manufacturing an OLED display module according to claim 9, wherein the manufacturing a first encapsulation protection layer on a side of the first metal nanoparticle layer facing away from the OLED device includes: by adopting a method of evaporation and
Figure FDA0003290095200000022
the first encapsulation protection layer is prepared, and the material of the first encapsulation protection layer comprises molybdenum oxide.
11. The method for manufacturing an OLED display module according to claim 9, further comprising:
preparing a second metal nanoparticle layer on a side of the first encapsulation protective layer facing away from the first metal nanoparticle layer;
and preparing a second packaging protective layer on one side of the second metal nano particle layer, which is far away from the first packaging protective layer, wherein the second packaging protective layer coats the second metal nano particle layer and the first packaging protective layer.
12. An electronic device comprising the OLED display module of any one of claims 1-6.
CN202111160762.4A 2021-09-30 2021-09-30 OLED display module, preparation method of OLED display module and electronic equipment Pending CN113921739A (en)

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CN111430573A (en) * 2020-04-27 2020-07-17 武汉华星光电半导体显示技术有限公司 Organic light-emitting device, preparation method thereof and display panel
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CN101292372A (en) * 2005-09-26 2008-10-22 奥斯兰姆奥普托半导体有限责任公司 Interface conditioning to improve efficiency and lifetime of organic electroluminescence devices
CN1967901A (en) * 2005-11-18 2007-05-23 精工电子有限公司 Electroluminescence element and display device using the same
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Application publication date: 20220111