CN109728190A - Display panel and display device - Google Patents
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- CN109728190A CN109728190A CN201811417836.6A CN201811417836A CN109728190A CN 109728190 A CN109728190 A CN 109728190A CN 201811417836 A CN201811417836 A CN 201811417836A CN 109728190 A CN109728190 A CN 109728190A
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Abstract
It include substrate, multiple luminescence units and packaging film the present invention relates to a kind of display panel；Multiple luminescence units are set on the substrate；Packaging film covers the multiple luminescence unit；The packaging film includes: the inorganic encapsulated film layer and organic packages film layer of stacking；And expansion buffer layer, the expansion buffer are placed between the organic packages film layer and the inorganic encapsulated film layer, and are contacted with corresponding organic packages film layer and inorganic encapsulated film layer；Wherein, the thermal expansion coefficient of the expansion buffer layer is less than the thermal expansion coefficient for the organic packages film layer being in contact with it.Expansion buffer layer is set between the upper surface and adjacent inorganic encapsulated film layer of organic packages film layer, it can play a buffer role in, reduce the dilation of organic packages film layer, it avoids under high temperature environment, the cracking of inorganic encapsulated film layer caused by each film layer thermally expands, to improve the package reliability of packaging film.A kind of display device is also provided.
Description
Technical field
The present invention relates to field of display technology, more particularly to a kind of display panel and display device.
Background technique
With the development of the technologies such as big data, cloud computing and mobile Internet, the mankind come into intellectualization times, packet
The smart machines such as intelligent mobile communication terminal, wearable device and artificial intelligence are included, are had become in people's work and life
Indispensable part.As the important window of intellectualization times human-computer interaction, also major transformation is occurring for display panel.Have
Machine light emitting diode (Organic Light-Emitting Diode, OLED) display panel, the thin, self-luminosity with thickness
Can, the advantages such as low in energy consumption, flexibility is good, have become after Thin Film Transistor-LCD, it is considered to be most have development
The flat-panel display device of potentiality.
Since the luminous organic material in OLED display panel is very sensitive to external environments such as water, oxygen, therefore, it is necessary to right
OLED display panel is packaged, to invade for blocking air and steam, to guarantee the reliability of display panel.
Generally, the encapsulation of OLED display device mainly include thin-film package (Thin-Film Encapsulation,
TFE) and Frit (frit) is encapsulated.It is real by organic packages film layer and inorganic encapsulated film stack by taking thin-film package as an example
The encapsulation of existing OLED device, the encapsulation suitable for flexible OLED display panel.But it is limited to the limit of encapsulating material and packaging film
It makes, thin-film package film is bad in the water oxygen barrier property of hot conditions in existing design, and the steam and oxygen in external environment are easy
Intrusion, affects the service life and stability in use of OLED display device.
Summary of the invention
Based on this, it is necessary to for traditional packaging film bad problem of water oxygen barrier property under the high temperature conditions, provide
A kind of display panel and display device improving the above problem.
According to the present invention on one side, a kind of display panel is provided, comprising:
Substrate；
Multiple luminescence units are set on the substrate；
Packaging film covers the multiple luminescence unit；The packaging film includes:
The inorganic encapsulated film layer and organic packages film layer of stacking；And
Expansion buffer layer, the expansion buffer are placed between the organic packages film layer and the inorganic encapsulated film layer,
And it is contacted with corresponding organic packages film layer and inorganic encapsulated film layer；
Wherein, the thermal expansion coefficient of the expansion buffer layer is less than the thermal expansion for the organic packages film layer being in contact with it
Coefficient.
In one embodiment, the thermal expansion coefficient of the expansion buffer layer is greater than the inorganic encapsulated film layer being in contact with it
Thermal expansion coefficient.
In one embodiment, the material of the expansion buffer layer is the nanometer rods of metal or metal oxide.
In one embodiment, the expansion buffer layer includes the first sub- expansion buffer layer and the second son for stacking gradually setting
Expansion buffer layer；
The first sub- expansion buffer layer is hyaline layer；The second sub- expansion buffer layer is semitransparent layer.
In one embodiment, the display panel has flattened region and bending region；
The display panel includes first electrode and the second electrode in face of first electrode setting；
Positioned at the distance between the expansion buffer layer in the bending region and the first electrode, it is greater than described in being located at
The distance between the expansion buffer layer of flattened region and the first electrode.
In one embodiment, at least partly surface that the organic packages film layer is contacted with the expansion buffer layer is coarse
Face.
In one embodiment, at least partly surface that the organic packages film layer is contacted with the expansion buffer layer has more
A recess portion；
The expansion buffer layer covers the recess portion；
In one embodiment, the recess portion is hemispherical.
In one embodiment, at least portion of the expansion buffer layer towards inorganic encapsulated film layer side adjacent thereto
Point surface is formed with coarse metal layer；
The metal layer is bonded together with the inorganic encapsulated film layer.
In one embodiment, the substrate has display area and non-display area；The display panel further include:
Planarization layer is set to the substrate；
Dyke, is in the non-display area, and the organic packages film layer is in the inside of the dyke；
The expansion buffer layer and the inorganic encapsulated film layer positioned at the expansion buffer layer far from the substrate side
It stacks and covers the organic packages film layer, and extend to the outside of the dyke.
In one embodiment, there are multiple grooves on the planarization layer in the outside of the dyke；The expansion is slow
It rushes layer and is extended in the groove positioned at the expansion buffer layer far from the inorganic encapsulated film layer of the substrate side.
According to another aspect of the present invention, a kind of display device is provided, including display described in any of the above-described implementation
Panel.
Using the display panel and display device in the application, organic packages film layer and adjacent inorganic encapsulated film layer it
Between be arranged expansion buffer layer, and the thermal expansion coefficient of expansion buffer layer be less than organic packages film layer adjacent thereto thermal expansion system
Number, can play a buffer role in, and reduces the dilation of organic packages film layer, avoids under high temperature environment, and each film layer thermal expansion causes
Inorganic encapsulated film layer cracking, to improve the package reliability of packaging film.
Detailed description of the invention
Fig. 1 is the schematic cross-section of the display panel in one embodiment of the invention；
Fig. 2 is the schematic cross-section of the display panel in another embodiment of the present invention；
Fig. 3 is the schematic cross-section of the display panel in further embodiment of this invention；
Fig. 4 is the structural schematic diagram of the display panel in yet another embodiment of the invention；
Fig. 5 is the schematic cross-section of display panel shown in Fig. 4；
Fig. 6 is the schematic partial cross-sectional view of the encapsulation boundary of the display panel in further embodiment of this invention.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
When describing positional relationship, unless otherwise defined, when an element such as layer, film or substrate are regarded as another
When film layer "upper", middle film layer can directly may be present in other film layers or also.Furtherly, when layer is regarded as in another layer
When "lower", one or more middle layers can also may be present directly in lower section.It can also understand, when layer is regarded as at two layers
" between " when, it can be the sole layer between two layers, or one or more middle layers also may be present.
Using " comprising " described herein, " having " and "comprising", unless having used specific restriction
Term, such as " only ", " by ... form " etc., it otherwise can also add another component.Unless refer on the contrary, otherwise singular shape
The term of formula may include plural form, and can not be interpreted as its quantity is one.
It will be appreciated that though term " first ", " second " etc. can be used herein to describe various elements, but these yuan
Part should not be limited by these terms.These terms are only used to distinguish an element and another element.For example, not taking off
In the case where the scope of the present invention, first element can be referred to as second element, and similarly, and second element can be claimed
For first element.
It is to be further understood that, although not being expressly recited, element is construed to include error model when explaining element
It encloses, which should be in the acceptable deviation range of particular value identified by the skilled person.For example, " big
About ", it " approximation " or " substantially " may mean that in one or more standard deviations, be not limited thereto.
In addition, in the description, phrase " floor map " refers to the attached drawing when target part viewed from above, phrase
Attached drawing when " schematic cross-section " refers to from side through the vertically section of cutting target part interception.
In addition, the ratio that attached drawing is not 1:1 is drawn, and the relative size of each element is in the accompanying drawings only illustratively to draw
System, and not necessarily drawn according to actual proportions.
It is wide with flexible, good flexible characteristic with the fast development of OLED display panel technology
General application, compared to traditional TFT-LCD technology, the big advantage of the one of OLED is can be made into folding, rollable or stretchable
Product.For example, stretchable OLED display panel can be applied to bionic, electronic skin, wearable device, mobile unit,
The fields such as material net equipment and artificial intelligence equipment.In order to realize the flexibility of OLED display panel, firstly, deflection must be used
Substrate, secondly, compared to the glass cover-plate packaged type being widely used, for flexible OLED display panel, film envelope
Dress encapsulation (Thin Film Encapsulation, TFE) is more particularly suitable.
In general, thin-film packing structure can be one or more layers structure, organic packages film layer or inorganic encapsulated film can be
Layer, but the also laminated construction of organic packages film layer and inorganic encapsulated film layer.It is readily appreciated that, inorganic material has good resistance to
Water, oxygen performance, so that can avoid water oxygen invades display panel, organic packages film layer has certain flexibility, envelope can be improved
The flexibility of assembling structure simultaneously plays buffer function, to effectively avoid the extraneous impact force applied/bending force damage display panel.
And influence except the de-stress (bending/stretching) of the package reliability of thin-film packing structure, there are also temperature, humidity etc.
Factor, for example, during the broiling summer, the temperature in automobile of exposure in the sun is up to 70 DEG C, and vehicle humidity is larger, application
There must be excellent water and oxygen barrier property under conditions of high temperature, high humility in the OLED display panel of car-mounted display.
As a kind of traditional packaged type, thin-film packing structure may include that two layers of inorganic encapsulated film layer and one layer are located at two
Organic packages film layer between layer inorganic encapsulated film layer.Present inventor is the study found that in the case of a high temperature, inorganic encapsulated
Different degrees of expansion can occur for film layer and organic packages film layer, can not discharge so as to cause stress, lead to inorganic encapsulated film layer
Cracking, greatly reduces the water and oxygen barrier property of packaging film, influences the package reliability of packaging film.
Therefore, the present invention provides a kind of display panel, can preferably solve the above problems.
Fig. 1 shows the schematic cross-section of the display panel in one embodiment of the invention；For ease of description, attached drawing is only shown
Relevant to embodiment of the present invention structure.
Refering to fig. 1, the display panel 10 in one embodiment of the invention, including substrate 12, luminescence unit 14 and covering shine
The packaging film 16 of unit 14.
Substrate 12 includes substrate, array layer group and the functional film layer being formed in array layer group.Containing thin in array layer group
Film transistor and conducting wire to control the transmitting of each luminescence unit 14, or can control hair when each luminescence unit 14 emits
The amount penetrated.It may be noted that thin film transistor (TFT) be it is well-known to those having ordinary skill in the art, which is not described herein again.
Substrate 12 further includes buffer layer, the another of such as buffer layer can be formed on the substrate before forming array layer group
Outer layer.Buffer layer can be formed in substrate whole surface, can also be formed by patterning.Buffer layer can have packet
Suitable material in the materials such as PET, PEN polyacrylate and/or polyimides is included, is formed in the form that single-layer or multi-layer stacks
Layer structure.Buffer layer can also be formed by silicon oxide or silicon nitride, or may include organic material layer and/or inorganic material
Composite layer.
Since array layer group has complicated layer structure, top surface may be it is uneven, display panel also wraps
Planarization layer 122 is included, to form sufficiently flat surface.It, can be in planarization layer 122 after forming planarization layer 122
Through-hole is formed, with the source electrode and drain electrode of exposed film transistor.It should be understood that planarization layer 122 can help to disappear
Except step caused by thin film transistor (TFT), and make surface planarisation thereon, to reduce the element due to 14 lower part of luminescence unit
It is irregular caused by defect possibility.
In some embodiments, luminescence unit 14 includes first electrode, in face of the second electrode of first electrode setting, Yi Jijie
Middle layer between first electrode and second electrode.Specifically, first electrode is formed in planarization layer 122 away from substrate 12
Side, and be in contact and conducted with thin film transistor (TFT) by contact hole.First electrode can have various shapes, for example, can be by
It is patterned to island.
First electrode can be transparent electrode, semitransparent electrode or reflecting electrode.For example, when first electrode is transparent electricity
Pole, first electrode may include such as indium tin oxide (ITO), indium-zinc oxide, zinc oxide, indium sesquioxide, indium potassium oxide
Or aluminium zinc oxide etc..When first electrode be semitransparent electrode or reflecting electrode when, may include silver, magnesium, aluminium, platinum, gold, nickel,
The materials such as ytterbium.
Second electrode can be transparent electrode or semitransparent electrode.For example, it may include the metal with small-power function
Film, metal can be silver, lithium, magnesium, calcium, strontium, aluminium, the lower metal of indium constant power function, or be metallic compound or conjunction
Gold.
In some embodiments, display panel further includes pixel defining layer, and pixel defining layer is formed on planarization layer 122,
And at least part of each first electrode of exposure.For example, pixel defining layer can cover the edge of each first electrode at least
A part, so that at least part of each first electrode is exposed.In this way, pixel defining layer has defined multiple pixels
Definition opening and the interval region (figure is not marked) between each pixel definition opening, some or all of centre of first electrode
Part is open via the pixel definition to be exposed, and middle layer is set in pixel definition opening.
Middle layer includes at least organic luminous layer, and organic luminous layer may include that low molecule organic material or macromolecule are organic
Material.It is appreciated that middle layer can also include such as hole transmission layer, hole injection layer, electron-transport in some embodiments
The film layers such as layer, electron injecting layer.
It should be noted that functional film layer above-mentioned be buffer layer, interlayer insulating film, passivation layer, planarization layer 122, as
The film layers such as plain definition layer.
It is appreciated that substrate can be for carrying pixel (including luminescence unit 14 and the film to be formed on the surface thereof
Transistor), and can be stretchable at least one direction or shrink.For example, substrate be optionally it is flexible, can roll over
Folded, stretchable or rollable material is made, and in some embodiments, substrate can be stacked by organic polymer and inorganic material
It is formed.
For example, substrate may include the first supporting course, the first barrier layer, second that sequence stacks in some embodiments
Hold layer and the second barrier layer.Wherein, the first barrier layer and the second barrier layer may include inorganic material, the first supporting course and second
Supporting course may include organic material.Specific in embodiment, the first barrier layer and the second barrier layer may include for example nitrogenizing
At least one of silicon, aluminium nitride, zirconium nitride, titanium nitride, silica, aluminium oxide or silicon oxynitride etc..First supporting course and second
Supporting course may include polyimides, polymethyl methacrylate, polycarbonate, polystyrene, allyl resin, epoxy group tree
At least one of rouge, polyethylene etc..
Be readily appreciated that, pixel is set on substrate, then substrate is other than with certain flexibility, it is also necessary to reduce and/
Prevent outside moisture and oxygen from penetrating into display panel by substrate.Therefore, substrate and packaging film 16 are collectively formed to hair
The encapsulating structure that light unit 14 is packaged.Specifically, the first barrier layer and the second barrier layer play the role of obstructing water oxygen, the
Two supporting courses are formed by organic polymer, can be mitigated or be reduced the stress generated between barrier layer, thus make substrate have compared with
Good bending, tensile property.
The packaging film 16 includes the inorganic encapsulated film layer 162 and organic packages film layer 164 of stacking.Specific to some implementations
In example, inorganic encapsulated film layer 162 and organic packages film layer 164 can be alternately stacked to be formed, and inorganic encapsulated film layer 162 is arranged to seal
The top layer and lowest level, inorganic encapsulated film layer 162 for filling film 16 coat organic encapsulating film layer 164.For example, specific to such as Fig. 1
Shown in embodiment, packaging film 16 includes two layers of inorganic encapsulated film layer 162, respectively the first inorganic encapsulated film layer 162a and
Second inorganic encapsulated film layer 162b, organic packages film layer 164 are located at the first inorganic encapsulated film layer 162a and the second inorganic encapsulated film
Between layer 162b.
In some embodiments, organic packages film layer 164 can be by such as acrylic resin, epoxy resin, polyimides, poly-
The organic insulating material of ethylene or silicon oxide carbide is formed.Organic packages film layer 164 may be used as cushion to alleviate due to display
Stress between each layer caused by the bending of panel 10.Inorganic encapsulated film layer 162 can be nitrogenized by such as Si oxide, silicon
The inorganic material such as object, silicon nitrogen oxides or aluminium oxide are formed.These inorganic encapsulated film layers 162 have good water oxygen barrier property
Can, and can deposit to be formed at low temperature, so as to prevent the light-emitting component influenced vulnerable to high temperature in inorganic encapsulated film layer 162
Deposition process in damage.
It should be understood that inorganic encapsulated film layer 162 can make moisture, oxygen and/or hydrogen to thin film transistor (TFT) and hair
Infiltration in optical element tends to minimize or entirely prevent, therefore, as a preferred embodiment, being located at organic packages film
The inorganic encapsulated film layer 162 of 164 top of layer is configured to cover the upper surface and side surface of organic encapsulating film layer 164, to be formed
The encapsulated space of water oxygen can be obstructed.
In the embodiment of the present invention, packaging film 16 further includes expansion buffer layer 18, and expansion buffer layer 18 is placed in organic envelope
It fills between film layer 164 and inorganic encapsulated film layer 162, and is connect with corresponding organic packages film layer 164 and inorganic encapsulated film layer 162
Touching.Wherein, the thermal expansion coefficient of expansion buffer layer 18 is less than the thermal expansion coefficient for the organic packages film layer 164 being in contact with it.
Inventor is the study found that the thermal expansion coefficient of inorganic encapsulated film layer 162 is lower, and the heat of organic packages film layer 164
The coefficient of expansion is relatively high.Since the thermal expansion coefficient difference of the two is larger, in thermal expansion contraction process, inorganic encapsulated film layer
162 differ greatly with the elasticity modulus (dependent variable) of organic packages film layer 164, so as to cause inorganic encapsulated film layer 162 with it is organic
It is excessive to encapsulate stress between film layer 164, and then discharge stress can not cause inorganic encapsulated film layer 162 to crack, and substantially reduce envelope
Fill the barrier property of film 16.
Expansion buffer layer 18, and expansion buffer layer 18 are set between organic packages film layer 164 and inorganic encapsulated film layer 162
Thermal expansion coefficient be less than the thermal expansion coefficient of organic packages film layer 164 being in contact with it, can play a buffer role in, reduce organic
The dilation for encapsulating film layer 164, avoids under high temperature environment, and inorganic encapsulated film layer 162 caused by each film layer thermally expands cracks, from
And improve the package reliability of packaging film 16.
It is expanded it is appreciated that organic packages film layer 164 is heated, is in contrast easy to produce crackle or instant of complete cracking
It is the inorganic encapsulated film layer 162 positioned at 164 upper layer of organic packages film layer.Therefore, as an implementation, expansion buffer layer 18
It should be located at least between organic packages film layer 164 and the inorganic encapsulated film layer 162 of layer disposed thereon.
It should be noted that film layer is to overlap to be formed one by one in layer, then in rear shape in the manufacture craft of display panel
At film layer be considered as positioned at " top/upper layer " of film layer being previously formed；Accordingly, the film layer being previously formed is considered as
Positioned at " lower section/lower layer " of the film layer in rear formation.Therefore, when layer be regarded as another layer " top/upper layer " or " lower section/under
Layer " when, be by film layer it is overlapping when it is upper and lower on the basis of.
Inventor continues the study found that the thermal expansion coefficient of inorganic encapsulated film layer 162 is generally less than 5 × 10-6/ K, and it is organic
Encapsulate the thermal expansion coefficient substantially 80 × 10 of film layer 164-6The thermal expansion coefficient of/K or so, organic packages film layer 164 substantially exist
15 times or so of inorganic encapsulated film layer 162.It is readily appreciated that, thermal expansion coefficient is bigger, and easier temperature distortion is sent out in an experiment
It is existing, if the thermal expansion coefficient of thermal expansion buffer layer 18 is too small, for example, being less than the thermal expansion coefficient of inorganic encapsulated film layer 162, equally
There are problems that stress can not discharge, causes thermal expansion buffer layer 18 to crack, or even influence inorganic encapsulated film layer 162, and
The deformation for leading to organic packages film layer 164, not can guarantee encapsulation film layer has a good packaging effect.Therefore, as one
In the preferable embodiment of kind, the thermal expansion coefficient of expansion buffer layer 18 is greater than the heat of inorganic encapsulated film layer 162 adjacent thereto
The coefficient of expansion.
In this way, buffer function can be played, the dilation of organic packages film layer 164 is reduced, is avoided under high temperature environment, respectively
Inorganic encapsulated film layer 162 caused by film layer thermally expands cracks, to improve the package reliability of packaging film 16.
Inventor further study show that, the thermal expansion coefficient of organic packages film layer 164 is substantially in inorganic encapsulated film layer 162
15 times or so, organic packages film layer 164 and the thermal expansion coefficient difference of inorganic encapsulated film layer 162 are excessive, heat between the two
The stress generated during dilation is bigger.In some embodiments, set the thermal expansion coefficient of organic packages film layer 164 to
1.5~3 times of the thermal expansion coefficient of expansion buffer layer 18；It is inorganic encapsulated film layer by the thermal expansion coefficient of expansion buffer layer 18
4-8 times of 162 thermal expansion coefficient.
For example, expansion buffer layer 18 can be metal nano layer or metal oxide nano layer, specifically, expansion buffer layer
18 can be metallic silver nanometer layer, magnesium metal nanometer layer or metallic aluminium nanometer layer.In general, the thermal expansion coefficient of metal be 30 ×
10-6The thermal expansion coefficient of/K or so, organic packages film layer 164 are swollen for the heat of metal nano layer or part of the metal oxide nanometer layer
2.5 times or so of swollen coefficient；Metal nano layer or part of the metal oxide nanometer layer are the thermal expansion system of inorganic encapsulated film layer 162
Several 6 times or so.
In this way, on the one hand can be shunk to avoid between inorganic encapsulated film layer 162 and organic packages film layer 164 due to thermally expanding
Caused by the excessive problem of dependent variable difference so as to the stress being effectively reduced between two layers of film layer reduce inorganic encapsulated film
The degree that the cracking degree and/or organic packages film layer 164 of layer 162 deform.On the other hand, metal nano layer can be with the water of intrusion
Oxygen reacts to form fine and close sull, and metal oxide nano layer itself has preferable compactness, to further serve as
To the effect of barrier water oxygen, and then improve the package reliability of packaging film 16.
In some embodiments, the material of expansion buffer layer 18 is the nanometer rods of metal or metal oxide.Specific to implementation
In mode, the metal in metal nano-rod can be located at organic packages film layer 164 and inorganic envelope for coefficients of expansion such as silver, magnesium, aluminium
Fill the metal between film layer 162；Metal oxide include the coefficients of expansion such as indium oxide, tin oxide, zinc oxide, zirconium oxide be located at have
Machine encapsulates the metal oxide between film layer 164 and inorganic encapsulated film layer 162.
For inorganic encapsulated film layer 162, film surface that metal nano-rod or metal oxide nanorods are formed compared with
To be coarse, the arrangement of particle is more loose, so that effective contact area between expansion buffer layer 18 and organic packages film layer 164
Bigger and part is run through each other, can effectively improve the binding force between film layer, prevent expansion buffer layer 18 and organic packages
It is peeling-off between film layer 164.
It should be understood that luminous efficiency and colour purity are also an important references standard of display panel yield.It is public
Know, when light is propagated from a kind of medium with refractive index to another medium with refractive index, in the interface of the two
The reflection and refraction of light can occur simultaneously.Specifically, a kind of medium of light is to another medium, due to refractive index difference, part
Emergent light is absorbed after film layer in some light that the interface of two media can be reflected, and be reflected in reflection
Loss, here it is Fresnel effects.Therefore, Fresnel effect is reduced, display effect can be improved to a certain extent.
In some embodiments, at least partly surface that organic packages film layer 164 is in contact with expansion buffer layer 18 is non-flat
Whole surface.Since expansion buffer layer 18 is formed in organic packages film layer 164, then expansion buffer layer 18 is close to organic packages film layer
164 side surface is also non-smooth surface.In this way, can reduce reflection journey when emergent ray is emitted from expansion buffer layer 18
Degree to reduce light loss, and then reduces Fresnel effect, improves light extraction efficiency and display effect.
It should be noted that non-smooth surface is for smooth horizontal surface, referring to has certain rise and fall
Degree or the surface with certain roughness, for example, non-smooth surface can behave as three with waviness in some embodiments
Curved surface is tieed up, which also can be bent for the three-dimensional of random fluctuations
Face；In other embodiments, non-smooth surface can behave as the rough surface with protrusion and/or recess portion.
It is appreciated that expansion buffer layer 18 is received by metal nano-rod or metal oxide in previously described embodiments
Rice stick is formed, and is rough surface at least partly surface of the contact of organic packages film layer 164, is also reduced phenanthrene to a certain extent
Nie Er effect, to improve light emission rate and colour purity.
Fig. 2 shows the schematic cross-sections of the display panel 10 in another embodiment of the present invention；For ease of description, attached drawing is only
Show structure relevant to the embodiment of the present invention.
Refering to attached drawing, at least partly surface that organic packages film layer 164 is contacted with expansion buffer layer 18 has multiple recess portions
165, expansion buffer layer 18 covers recess portion 165.That is, being partially submerged into organic after expansion buffer layer 18 covers recess portion 165
Encapsulate film layer 164.In this way, on the one hand improving the contact area between expansion buffer layer 18 and organic packages film layer 164, improve
Binding force between film layer；On the other hand multiple recess portions 165 form class microlens structure, can reduce Fresnel effect, thus
Improve light extraction efficiency.
For example, in some embodiments recess portion 165 can be formed using plasma bombardment.It is to be appreciated that plasma
(Plasma), it is made of the positive and negative charged ion and molecule, atom and the atomic group that are generated after gas ionization, is in strong electrical field
It is generated when avalanche ionization occurs under acting on.Rough surface can be formed by plasma bombardment or etching, for example, plasma etching mistake
It is reacted in journey using high frequency glow discharge, so that reaction gas is activated Viability particle, such as atom or free radical, these active particles
It is diffused into the position for needing to etch, is reacted there with the material being etched, return volatile reactants is formed and is removed, from
And form the rough surface with recess portion 165.Due to the protrusion obtained using plasma method and other vacuum processing methods and recess portion
165 is in irregular shape, for example, in some embodiments, recess portion 165 can specifically be presented as irregular circular pit, irregular
Crack, irregular inverted trapezoidal, irregular round cave, compare regular shape, increase electrode and organic light-emitting units it
Between contact area, improve binding force between the two.
Illustratively, as a kind of preferable embodiment, recess portion 165 can be hemispherical, i.e., organic packages film layer 164 with
Expansion buffer layer 18 contact at least partly surface hemispherical recess is distributed with, accordingly, make expansion buffer layer 18 with it is organic
Encapsulating the side surface that film layer 164 contacts includes multiple hemispherical surfaces, hemispherical opening up, that is, deviates from the one of substrate
Side.In this way, also making expansion buffer layer 18 while improving the binding force of expansion buffer layer 18 and organic packages film layer 164
There is optical coupling film layer property with organic packages film layer 164, improve light extraction efficiency.
It is appreciated that recess portion 165 can be regular array, it can also be irregular arrangement.For example, in some embodiments,
Hemispherical recess portion 165 is in array distribution, in this way, light extraction efficiency is more preferably more evenly.
In some embodiments, organic material microballoon is also filled up between organic packages film layer 164 and expansion buffer layer 18, and (figure is not
Show).It should be understood that organic material microballoon is similar to lenticule, since the change of refractive index is so that angle of total reflection increase, increases
The area for having added light to project outward from lenticule increases out the probability of light so that light is emitted from normal direction substantially.In this way,
Fresnel effect can be reduced, improve light emission rate and light-emitting uniformity.In addition, organic material microballoon has flexibility, it can be in organic envelope
Buffer function is played between dress film layer 164 and expansion buffer layer 18, further 164 expanded by heating of organic packages film layer that reduces is made
At influence.Specific in embodiment, to reach preferable transmissivity, and there is preferable flexibility, it, should to play buffer function
Organic material microballoon can be polystyrene (Polystyrene, PS) microballoon.It should be noted that polystyrene is with excellent
Optical property, light transmittance up to 88%~92%, refractive index be 1.59~1.60, can penetrate all wavelengths visible light, tool
There is preferable transmissivity.
In some embodiments, the depth for being formed in the recess portion 165 of organic packages film layer 164 is that organic packages film layer 164 is thick
The one third of degree is to half.It has been investigated that the depth of recess portion 165 or the height of protrusion that are mutually embedded directly affect
Binding force between film layer, when the height for the protrusion being mutually embedded or the depth of recess portion 165 are too small, the binding force between film layer increases
Add not significant enough.When the height for the protrusion being mutually embedded or the depth of recess portion 165 are excessive, then it will affect the release stress of film layer
Ability decline and light-out effect weaken.Therefore, the depth for being formed in the recess portion 165 of organic packages film layer 164 is organic packages film
The one third of 164 thickness of layer can dramatically increase the combination of expansion buffer layer 18 and organic packages film layer 164 to half
Power, and guarantee the light-out effect of electroluminescent device.
In some embodiments, expansion buffer layer 18 towards 162 side of inorganic encapsulated film layer adjacent thereto at least partly
Surface is formed with coarse metal layer, and metal layer is bonded together with inorganic encapsulated film layer 162.For example, specific to embodiment
In, it can sputter to form coarse metal layer in the side of expansion buffer layer 18 towards inorganic encapsulated film layer 162 adjacent thereto.
It is readily appreciated that, the sputtering in expansion buffer layer 18 towards 162 side of inorganic encapsulated film layer adjacent thereto is formed slightly
Rough metal layer, the surface of metal layer will appear rough surface defect.After depositing inorganic encapsulated film layer 162, on the one hand
The film layer binding ability for improving the two, effectively reduces the water oxygen of inorganic encapsulated film layer 162 Yu 18 junctional interfaces of expansion buffer layer
Transmission channel improves water oxygen obstructing capacity.On the other hand, the surface for contacting inorganic encapsulated film layer 162 with expansion buffer layer 18
It is more loose, the transition region of stress dispersion is formed, so that stress be avoided to concentrate, and then inorganic encapsulated film layer 162 is avoided to open
It splits through entire film layer, also improves the water oxygen obstructing capacity of packaging film.
Fig. 3 shows the schematic cross-section of the display panel 10 in further embodiment of this invention；For ease of description, attached drawing is only
Show structure relevant to the embodiment of the present invention.
In OLED display panel, luminescence unit can be deteriorated according to driving time.In addition, to prevent outdoor light
Reflection caused by contrast decline, be typically employed in its light emission side attach polaroid.Ambient can become after polaroid
At line polarisation, to the emission electrode transmitting of thin film transistor (TFT) (TFT) after when projected again to polaroid, will become inclined with polaroid
The vertical line polarisation in vibration direction, therefore human eye can not be entered through polaroid.Thus it is ensured that OLED display panel is in outdoor comparison
Degree improves display effect.But in this way, the emergent light of a part is lost by polaroid, influence display effect.Invention of the invention
The study found that for example, can form microcavity between first electrode (anode) and expansion buffer layer 18, the light of luminescence unit transmitting exists people
Hair can be improved in the amplification and constructive interference of repeat its transmission between first electrode and expansion buffer layer 18 and light caused by reflecting again
Light efficiency.
Therefore, in some embodiments, expansion buffer layer 18 includes the first sub- 182 He of expansion buffer layer for stacking gradually setting
Second sub- expansion buffer layer 184；First sub- expansion buffer layer 182 is hyaline layer；Second sub- expansion buffer layer 184 is translucent
Layer.Specific in embodiment, the material of the first sub- expansion buffer layer 182 can be titanium oxide, tin indium oxide (ITO) or oxidation
The transmission materials such as indium zinc (IZO) or alkali metal；The material of second sub- expansion buffer layer 184 can be the conjunction of magnesium, silver and/or magnesium silver
The half transmitting metal material of gold etc.Certainly, also can in the transparent material of tin indium oxide etc doped with aluminium, copper or other thoroughly
The relatively low material of degree of penetrating.
Since the second sub- expansion buffer layer 184 is semitransparent layer, then between first electrode and the second sub- expansion buffer layer 184
Micro-cavity structure can be formed.Microcavity can be considered as resonant cavity, when first electrode and the distance of the second sub- expansion buffer layer 184 increase
Greatly, that is, after the chamber length for increasing microcavity, the light of bigger wavelength can be enabled to project from the microcavity.In this way, two straton expansion buffers of setting
Layer 18 realizes that micro-cavity structure is mentioned compared to the expansion buffer layer 18 of single layer by first electrode and the second sub- expansion buffer layer 184
High luminous efficiency.
For example, the second sub- expansion buffer layer 184 can be formed specific in one embodiment for metallic elements such as magnesium, silver
Metal layer with rough surface.In this way, not only increasing the binding force of film layer, light emission rate is also improved.But it should be noted that
For the light emission rate for guaranteeing entire packaging film, the dilation of organic packages film layer 164 can be reduced in guarantee expansion buffer layer 18
Under the premise of, the thickness of the second sub- expansion buffer layer 184 is unsuitable blocked up, for example, in some embodiments, the second sub- expansion buffer
The thickness of layer 184 can be less than 1 nanometer.
At the same time, inventor has found in subsequent research, for flexible display panels, is guaranteeing the tool of packaging film 16
There is preferable encapsulation it is also desirable to guarantee the bending property of packaging film 16.If 164 thickness of organic packages film layer increases
Bending, the tensile property of packaging film 16 can be improved in thickness, but so 162 expanded by heating of inorganic encapsulated film layer shrinks generation
The risk of stress cracking also improves simultaneously.If the thickness of inorganic encapsulated film layer 162 is excessively thin, the bending of packaging film 16,
Draftability is able to ascend, but the performance for obstructing water oxygen not can guarantee, and vice versa.
In some embodiments, inorganic encapsulated film layer 162 with a thickness of 0.5~1.5 micron；The thickness of organic packages film layer 164
Degree is 0.5~1.5 micron；Expansion buffer layer 18 with a thickness of 5~15 nanometers.Mode, inorganic envelope are preferably carried out as one kind
Fill film layer 162 with a thickness of 1 micron, organic packages film layer 164 with a thickness of 8 microns, expansion buffer layer 18 is received with a thickness of 10
Rice.
In this way, the thickness of inorganic encapsulated film layer 162, organic packages film layer 164 and expansion buffer layer 18 may be at one
In reasonable range, at this point it is possible to make packaging film 16 that there is preferably bending, tensile property, and make expansion buffer layer 18 will
Thermal expansion between inorganic encapsulated film layer 162 and organic packages film layer 164 shrinks the stress generated and tends to become smaller, to improve envelope
Fill the package reliability of film 16.
Fig. 4 shows the schematic cross-section of the display panel 10 in yet another embodiment of the invention；Fig. 5 is shown shown in Fig. 4
Display panel 10 schematic cross-section；For ease of description, attached drawing illustrates only structure relevant to the embodiment of the present invention.
Refering to attached drawing, display panel 10 has flattened region 110 and bending region 120；Expansion positioned at bending region 120
The distance between buffer layer 180 and first electrode, greater than be located at flattened region 110 expansion buffer layer 180 and first electrode it
Between distance.Be readily appreciated that, when the curved edge of OLED display panel, be bent region 120 relative to flattened region 110 and
Speech, the observation angle of user become larger, and the variation that the light intensity and wavelength of the light of injection will become apparent leads to the model of spectrum
The picture for enclosing and changing, and then user is caused to be seen in the case where being bent the corresponding observation angle in region 120 generates colour cast, thus
Influence the viewing experience of user.Resonance principle analysis based on microcavity above-mentioned, increase expansion buffer layer 18 and first electrode it
Between distance, i.e., increase microcavity chamber it is long, can enable the light of bigger wavelength from packaging film project.It is located at buckled zone due to curved
The distance between the expansion buffer layer 186 in domain 120 and first electrode, greater than be located at flattened region 110 expansion buffer layer 180 with
The distance between first electrode, that is to say, that relative to flattened region 110, increase the expansion buffer layer in bending region 120
The distance between 186 and first electrode realize the increase long to the chamber of micro-cavity structure in bending region 120.Thus may be used
So that the light in bigger wave-length coverage meets resonance condition and projects from bending region, projected to increase by being bent region 120
Light spectral region.
Therefore, when user is when watching picture under being bent observation angle corresponding to region 120, so that it may see bigger light
The light of spectral limit, so that watched picture be avoided to generate colour cast.
Fig. 6 shows the schematic partial cross-sectional view of the encapsulation boundary of the display panel 10 in another embodiment of the present invention；
For ease of description, attached drawing illustrates only structure relevant to the embodiment of the present invention.
It may be noted that it is solid phase that the forming process of organic packages film layer 164, which is by liquid-phase conversion, for example, organic packages film
Layer 164 can be formed by the method for ink-jet.When the organic packages film layer 164 in liquid phase is dripped, to prevent in liquid phase
Organic packages film layer 164 flowing intrusion non-display area and cause bad.Substrate has display area and non-display area.It can
To understand, a display panel refers to the panel cut from display panel motherboard；Wherein, display panel includes using
Around cabling etc. in the active region for forming light-emitting component, and for providing signal line for display does not allow to be cut off
Region.For example, a display panel, may include be subsequently used for being formed light-emitting component display area AA (Active Area,
It AA), can also include the non-display area (region including setting driving circuit, chip) for being subsequently used for display panel.
Display panel 10 further includes dyke 19, and dyke 19 is in non-display area, when positioned at 19 inside of dyke and in liquid
The organic packages film layer 164 of phase flows to dyke 19, and dyke 19 could be formed with the boundary of machine encapsulation film layer 164.Expansion buffer
It layer 18 and is stacked positioned at expansion buffer layer 18 far from the inorganic encapsulated film layer 162 of 12 side of substrate and covers organic encapsulating film layer 164,
And extend to the outside of dyke 18.
For example, the first inorganic encapsulated film layer 162a covers luminescence unit 14, the first inorganic encapsulated film specific in embodiment
Layer 162a is located at 19 inside of dyke, and organic packages film layer 164 is formed on the first inorganic encapsulated film layer 162a, and is hindered by dyke 19
Gear, 19 medial surface of dyke define the boundary of organic packages film layer 164.Expansion buffer layer 18 covers organic encapsulating film layer 164, the
Two inorganic encapsulated film layer 162b and expansion buffer layer 18 stack and cross upper surface and the outer surface that dyke 19 covers dyke 19,
And it is contacted respectively with the planarization layer 122 for being located at 19 outside of dyke.
It is stacked compared to two layers of inorganic encapsulated film layer 162 in existing design in non-display area, due to expansion
The part that buffer layer 18 extends to 19 outside of dyke with inorganic encapsulated film layer 162 with planarization layer 122 respectively directly contacts, flat
Changing layer 122 has flexibility, can play the role of discharging stress, facilitates the stress for the encapsulation boundary for reducing packaging film,
To effectively prevent packaging film to crack, the package reliability of packaging film is improved, and then improve display panel
Bending resistance.
As a kind of preferable embodiment, positioned at expansion buffer layer 18 close to the first inorganic encapsulated film layer of substrate side
162a is located at the inside of dyke 19.Compared to two layers inorganic encapsulated film layer 162 is stacked in boundary, on the one hand reduces inorganic encapsulated
Film layer 162 effectively prevent inorganic encapsulated film layer 162 to crack in the thickness of boundary.On the other hand, it avoids on encapsulation boundary
Two layers of inorganic encapsulated film layer 162 at place is influenced by expansion buffer layer 18 and is easy to happen film layer separation, further increases envelope
Fill effect.
In some embodiments, there are multiple grooves 124 in non-display area planarization layer 122；Expansion buffer layer 18 extends
Into groove 124.Specifically, several grooves 124 are located at least on the planarization layer 122 in 19 outside of dyke.That is, several grooves
124 are located at least on the planarization layer 122 in 19 outside of dyke.Further, in further embodiments, it is located at expansion buffer layer
The 18 inorganic encapsulated film layers 162 far from substrate side also extend into groove 124.It is swollen specific in embodiment as shown in FIG. 6
Swollen buffer layer 18 and the second inorganic encapsulated film layer 162b are extended in groove.
In this way, further increasing the binding force of film layer and substrate, packaging effect is improved, stress can also be discharged,
Play the role of obstructing crackle to the diffusion of inorganic encapsulated film layer 162, prevents the encapsulation of thin-film encapsulation layer caused by spreading because of crackle
Failure improves packaging film in the package reliability of encapsulation boundary.
Specific in embodiment, the horizontal cross sectional geometry of the groove 124 can be with strip, polygon or round etc., groove
124 longitudinal section shape can be rectangle, shape, inverted trapezoidal or back taper etc., be not limited thereto.
Based on above-mentioned display panel 10, the embodiment of the present invention also provides a kind of display device, should in some embodiments
Display device can be display terminal, such as tablet computer, and in further embodiments, which also can be whole for mobile communication
End, such as mobile phone terminal.The display device can also be wearable device, VR equipment, mobile unit in yet other embodiments,
Deng.
In some embodiments, which includes display panel 10 and control unit, which is used for display
Plane transport shows signal.
Above-mentioned display panel 10 and display device, upper surface and adjacent inorganic encapsulated in organic packages film layer 164
Expansion buffer layer 18 is set between film layer 162, and the thermal expansion coefficient of expansion buffer layer 18 is less than organic packages adjacent thereto
The thermal expansion coefficient of film layer 164, can play a buffer role in, and reduces the dilation of organic packages film layer 164, avoids in hot environment
Under, inorganic encapsulated film layer 162 caused by each film layer thermally expands cracks, to improve the package reliability of packaging film 16.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of display panel characterized by comprising
Substrate；
Multiple luminescence units are set on the substrate；
Packaging film covers the multiple luminescence unit；The packaging film includes:
The inorganic encapsulated film layer and organic packages film layer of stacking；And
Expansion buffer layer, the expansion buffer are placed between the organic packages film layer and the inorganic encapsulated film layer, and with
Corresponding organic packages film layer and the contact of inorganic encapsulated film layer；
Wherein, the thermal expansion coefficient of the expansion buffer layer is less than the thermal expansion system for the organic packages film layer being in contact with it
Number.
2. display panel according to claim 1, which is characterized in that the thermal expansion coefficient of the expansion buffer layer be greater than with
The thermal expansion coefficient of its inorganic encapsulated film layer contacted.
3. display panel according to claim 1, which is characterized in that the material of the expansion buffer layer is metal or metal
The nanometer rods of oxide.
4. display panel according to claims 1 to 3, which is characterized in that the expansion buffer layer includes stacking gradually to set
The sub- expansion buffer layer of first set and the second sub- expansion buffer layer；
The first sub- expansion buffer layer is hyaline layer；The second sub- expansion buffer layer is semitransparent layer.
5. display panel according to claim 4, which is characterized in that the display panel has flattened region and buckled zone
Domain；
The display panel includes first electrode and the second electrode in face of first electrode setting；
Positioned at the distance between the expansion buffer layer in the bending region and the first electrode, it is greater than positioned at described smooth
The distance between the expansion buffer layer in region and the first electrode.
6. described in any item display panels according to claim 1~3, which is characterized in that the organic packages film layer with it is described
At least partly surface of expansion buffer layer contact is rough surface.
7. display panel according to claim 6, which is characterized in that the organic packages film layer and the expansion buffer layer
At least partly surface of contact has multiple recess portions；
The expansion buffer layer covers the recess portion；
Preferably, the recess portion is hemispherical.
8. described in any item display panels according to claim 1~3, which is characterized in that the expansion buffer layer towards and its
At least partly surface of adjacent inorganic encapsulated film layer side is formed with coarse metal layer；
The metal layer is bonded together with the inorganic encapsulated film layer.
9. described in any item display panels according to claim 1~8, which is characterized in that the substrate have display area and
Non-display area；The display panel further include:
Planarization layer is set to the substrate；
Dyke, is in the non-display area, and the organic packages film layer is in the inside of the dyke；
The expansion buffer layer and the inorganic encapsulated film stack positioned at the expansion buffer layer far from the substrate side
The organic packages film layer is covered, and extends to the outside of the dyke；
Preferably, there are multiple grooves on the planarization layer in the outside of the dyke；The expansion buffer layer and it is located at
The expansion buffer layer extends in the groove far from the inorganic encapsulated film layer of the substrate side.
10. display device, which is characterized in that including display panel as claimed in claim 9.
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| CN201811417836.6A CN109728190A (en) | 2018-11-26 | 2018-11-26 | Display panel and display device |
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