CN212695182U - Display panel and display device - Google Patents
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- CN212695182U CN212695182U CN202021909271.6U CN202021909271U CN212695182U CN 212695182 U CN212695182 U CN 212695182U CN 202021909271 U CN202021909271 U CN 202021909271U CN 212695182 U CN212695182 U CN 212695182U
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Abstract
The embodiment of the utility model discloses display panel and display device. The display panel includes: the light extraction layer is arranged on one side, far away from the substrate, of the organic light-emitting structure; the light extraction layer is arranged on the surface of the substrate, which is far away from the substrate; the thin film packaging layer comprises a first inorganic layer in contact with the light extraction layer, the first inorganic layer at least comprises a first inorganic sub-layer, a second inorganic sub-layer and a third inorganic sub-layer which are sequentially stacked, the first inorganic sub-layer is in contact with the light extraction layer, the refractive index of the first inorganic sub-layer is smaller than that of the second inorganic sub-layer and that of the third inorganic sub-layer, and the refractive index of the first inorganic sub-layer is smaller than that of the light extraction layer. The utility model discloses a scheme has improved display panel's resistant bending property, and guarantees that display panel has better display effect.
Description
Technical Field
The embodiment of the utility model provides a relate to and show technical field, especially relate to a display panel and display device.
Background
An Organic Light Emitting Diode (OLED) display panel is a self-luminous display panel, and the OLED display panel is increasingly used in various high-performance display fields due to its advantages of lightness, thinness, high brightness, wide viewing angle, high response speed, and wide temperature range.
The existing OLED display panel has the problem of poor bending resistance.
SUMMERY OF THE UTILITY MODEL
The utility model provides a display panel and display device to improve display panel's resistant bending nature.
In a first aspect, an embodiment of the present invention provides a display panel, including:
the light extraction layer is arranged on one side, far away from the substrate, of the organic light-emitting structure;
the light extraction layer is arranged on the surface of the substrate, which is far away from the substrate; the thin film packaging layer comprises a first inorganic layer in contact with the light extraction layer, the first inorganic layer at least comprises a first inorganic sub-layer, a second inorganic sub-layer and a third inorganic sub-layer which are sequentially stacked, the first inorganic sub-layer is in contact with the light extraction layer, the refractive index of the first inorganic sub-layer is smaller than that of the second inorganic sub-layer and that of the third inorganic sub-layer, and the refractive index of the first inorganic sub-layer is smaller than that of the light extraction layer.
Optionally, the refractive index of the first sub-inorganic layer is 1.45-1.5.
Optionally, the material used for the first sub-inorganic layer includes silicon oxide.
Optionally, the material used for the second sub-inorganic layer includes SiNaOb or SiN, and the material used for the third sub-inorganic layer includes SiNcOd, where a, b, c, and d are positive integers, and a/b > c/d.
Optionally, a/b is more than or equal to 0.6 and less than or equal to 1.5, and c/d is more than or equal to 0.2 and less than 0.6.
Optionally, the thin film encapsulation layer further includes an organic layer and a second inorganic layer, the organic layer is disposed between the first inorganic layer and the second inorganic layer, and the second inorganic layer is disposed on a side of the organic layer away from the light extraction layer.
Optionally, a material used for the second inorganic layer includes SiN.
Optionally, the thickness of the first sub-inorganic layer ranges from 10 micrometers to 200 micrometers, the thickness of the second sub-inorganic layer ranges from 500 micrometers to 1200 micrometers, and the thickness of the third sub-inorganic layer ranges from 50 micrometers to 200 micrometers.
Optionally, the organic light emitting structure includes a first electrode, a second electrode, and a light emitting functional layer disposed between the first electrode and the second electrode; the first electrode is arranged on one side of the light-emitting functional layer, which is adjacent to the light extraction layer.
In a second aspect, the embodiment of the present invention further provides a display device, including the present invention, which is an arbitrary embodiment of the display panel.
The embodiment of the utility model provides a get rid of the light and take out the LiF layer between layer and the film packaging layer, guarantee that display panel has higher resistant bending nature. The first inorganic layer which is provided with the thin film packaging layer comprises a first sub inorganic layer, a second sub inorganic layer and a third sub inorganic layer, the refractive index of the first sub inorganic layer is smaller than that of the second sub inorganic layer and that of the third sub inorganic layer, and the refractive index of the first sub inorganic layer is smaller than that of the light taking-out layer, so that the first sub inorganic layer and the light taking-out layer have larger refractive index difference, a reflection interface between the first sub inorganic layer and the light taking-out layer has stronger reflection effect, the effect that the visual angle and the brightness attenuation of the display panel can be adjusted by adjusting the thickness of the light taking-out layer is guaranteed, and the display panel is guaranteed to have better display effect.
Drawings
Fig. 1 is a schematic diagram of a display panel provided in this embodiment;
fig. 2 is a schematic diagram of a display device provided in this embodiment.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
As mentioned in the background art, the conventional display panel has a problem of poor bending resistance, and the inventors have studied and found that the reason for the problem is that a fragile film layer, such as a LiF layer, exists in the display panel, so that some film layers are easily broken after the display panel is bent for multiple times, and the display effect of the display panel is affected.
In view of the above problem, the present application provides a display panel, and fig. 1 is a schematic diagram of a display panel provided in this embodiment, and referring to fig. 1, the display panel includes:
a substrate 10, an organic light emitting structure 20 disposed on the substrate 10, and a light extraction layer 30 disposed on a side of the organic light emitting structure 20 away from the substrate 10;
the light extraction layer 30 is arranged on the surface of the substrate 10, and the thin film packaging layer 40 is arranged on the surface of the light extraction layer 30 away from the substrate 10; the thin film encapsulation layer 40 includes a first inorganic layer 41 in contact with the light extraction layer 30, the first inorganic layer 41 includes at least a first sub inorganic layer 411, a second sub inorganic layer 412, and a third sub inorganic layer 413 which are sequentially stacked, the first sub inorganic layer 411 is in contact with the light extraction layer 30, a refractive index of the first sub inorganic layer 411 is smaller than refractive indices of the second sub inorganic layer 412 and the third sub inorganic layer 413, and a refractive index of the first sub inorganic layer 411 is smaller than a refractive index of the light extraction layer 30.
The substrate 10 is an array substrate for driving the organic light emitting structure 20 to emit light, the substrate 10 includes a display area and a non-display area, the display area realizes image display of the display panel, and an area corresponding to the non-display area does not present an image. The substrate 10 may include a substrate, a buffer layer, and a Thin-Film Transistor (TFT).
The organic light emitting structure 20 is formed on the TFT, and both the organic light emitting structure 20 and the TFT are located in the display region of the substrate 10. The organic light emitting structure 20 generally includes a first electrode 21, a second electrode 22, and a light emitting function layer 23 disposed between the first electrode 21 and the second electrode 22; the first electrode 21 is provided on the side of the light-emitting functional layer 23 adjacent to the light extraction layer 30. The second electrode 22 (anode) is electrically connected (or coupled) to a source electrode or a drain electrode of the TFT through a contact hole. If a voltage is applied between the first electrode 21 and the second electrode 22, the light emitting function layer 23 emits visible light, thereby realizing an image that can be recognized by a user. The light emitting function layer 23 may include an electron injection layer, an electron transport layer, an organic light emitting layer, a hole transport layer, a hole injection layer, and the like. The light extraction layer 30 is used to adjust the light extraction rate of the display panel. The thin film encapsulation layer 40 serves to protect the light emitting structure 20 and other film layers in the display panel from moisture and oxygen.
Specifically, in the prior art, a LiF layer is disposed between the light extraction layer 30 and the thin film encapsulation layer 40, and the inventor finds that the LiF layer is brittle and fragile, and the film layer may be broken and broken under hundreds of thousands of bending times, which easily causes damage and peeling of the film layer, resulting in poor bending resistance of the display panel. In this embodiment, the LiF layer between the light extraction layer 30 and the film encapsulation layer 40 is removed, so as to ensure that the display panel has higher bending resistance. Meanwhile, the first inorganic layer 41 of the thin film encapsulation layer 40 includes a first sub inorganic layer 411, a second sub inorganic layer 412 and a third sub inorganic layer 413, the refractive index of the first sub inorganic layer 411 is smaller than the refractive indices of the second sub inorganic layer 412 and the third sub inorganic layer 413, and the refractive index of the first sub inorganic layer 411 is smaller than the refractive index of the light extraction layer 30, so that the first sub inorganic layer 411 and the light extraction layer 30 have a larger refractive index difference, and a reflection interface between the first sub inorganic layer 411 and the light extraction layer 30 has a stronger reflection effect, thereby ensuring that the visual angle and the brightness attenuation of the display panel can be adjusted by adjusting the thickness of the light extraction layer 30, and ensuring that the display panel has a better display effect.
Alternatively, the refractive index of the first sub-inorganic layer 411 is 1.45 to 1.5.
Specifically, the refractive index of the light extraction layer 30 is generally about 1.95, and the refractive index of the first sub-inorganic layer 411 is 1.45-1.5, so that a larger refractive index difference between the first sub-inorganic layer 411 and the light extraction layer 30 is ensured, a reflection interface between the first sub-inorganic layer 411 and the light extraction layer 30 has a stronger reflection effect, the effect of adjusting the thickness of the light extraction layer 30 to adjust the visual angle and the brightness attenuation of the display panel is ensured, and the display panel has a better display effect.
Alternatively, the material used for the first sub-inorganic layer 411 includes silicon oxide.
Specifically, since silicon oxide has a better water and oxygen barrier property, the material used for the first sub-inorganic layer 411 includes silicon oxide, which can ensure that the thin film encapsulation layer 40 has a better water and oxygen barrier property.
Optionally, the material used for the second sub-inorganic layer 412 includes SiNaOb or SiN, and the material used for the third sub-inorganic layer 413 includes sincood, where a, b, c, and d are positive integers, and a/b > c/d.
Specifically, the higher the oxygen content in the silicon oxynitride, the better the contact leveling property of the organic material on the surface of the silicon oxynitride material, and the higher the flatness of the organic layer formed on the surface of the silicon oxynitride material. By arranging the third sub-inorganic layer 413 to be SiNcOd and the nitrogen-oxygen ratio c/d to be a smaller value, the third sub-inorganic layer 413 can well block water and oxygen, and meanwhile, when an organic layer is formed on the surface of the third sub-inorganic layer 413, the organic layer has high flatness.
In addition, the higher the nitrogen content in the silicon oxynitride is, the better the water and oxygen blocking characteristics of the silicon oxynitride material are, by setting the second sub-inorganic layer 412 to adopt sinoob, the nitrogen-oxygen ratio a/b adopts a larger value, or the second sub-inorganic layer 412 adopts SiN, the second sub-inorganic layer 412 is ensured to have better water and oxygen blocking characteristics, the first inorganic layer 41 is ensured to have better water and oxygen blocking characteristics, and thus the film packaging layer 40 is ensured to have better water and oxygen blocking performance.
In this embodiment, the first inorganic layer 41 is arranged to include the first sub inorganic layer 411, the second sub inorganic layer 412 and the third sub inorganic layer 413, the first sub inorganic layer 411 is made of a silicon oxide material, it is ensured that the refractive index of the first sub inorganic layer 411 and the refractive index of the light extraction layer 30 have a large difference, it is ensured that the light extraction layer 30 has a high dimming effect, the second sub inorganic layer 412 is made of silicon nitride or silicon oxynitride with a high nitrogen-oxygen ratio, it is ensured that the second sub inorganic layer 412 has a good water-blocking and oxygen-blocking characteristic, it is ensured that the thin film encapsulation layer 40 has a good water-blocking and oxygen-blocking characteristic, it is ensured that the display panel has a high encapsulation reliability, the third sub inorganic layer 413 is made of silicon oxynitride with a low nitrogen-oxygen ratio, it is ensured that the third sub inorganic layer 413 has a good contact leveling property, and it is ensured that the organic layer formed on the surface of the third sub inorganic layer 413 has a good flatness.
Optionally, a/b is more than or equal to 0.6 and less than or equal to 1.5, and c/d is more than or equal to 0.2 and less than 0.6.
Specifically, when the nitrogen-oxygen ratio in the SiNaOb is too low, the nitrogen content is low, which easily causes poor water and oxygen blocking performance of the second sub-inorganic layer 422, and affects the packaging characteristics of the thin film packaging layer 40, when the nitrogen-oxygen ratio in the SiNaOb is too high, the oxygen content is too low, the preparation process is difficult, and by setting a/b to be not less than 0.6 and not more than 1.5, the difficulty in the preparation process of the second sub-inorganic layer 412 is reduced while the second sub-inorganic layer 422 is ensured to have good water and oxygen blocking characteristics.
The contact leveling property of the organic material on the surface of the SiNcOd material is affected by the excessively high nitrogen content in the SiNcOd, the preparation process is difficult due to the excessively low nitrogen content, and the c/d is set to be more than or equal to 0.2 and less than 0.6, so that the preparation process difficulty of the third sub-inorganic layer 413 is reduced while the third sub-inorganic layer 413 has good contact leveling property.
In addition, the first sub-inorganic layer 411 and the second sub-inorganic layer can be formed by chemical vapor depositionInorganic layer 412 and third sub-inorganic layer 413 by adjusting N2/N2The inflow of O gas is used for adjusting the nitrogen-oxygen ratio.
Optionally, the thin film encapsulation layer 40 further includes an organic layer 42 and a second inorganic layer 43, the organic layer 42 is disposed between the first inorganic layer 41 and the second inorganic layer 43, and the second inorganic layer 43 is disposed on a side of the organic layer 42 away from the light extraction layer 30.
Specifically, the inorganic material has a good water and oxygen blocking property, the first inorganic layer 41 and the second inorganic layer 43 are used for blocking water and oxygen, the organic material has a good buffering effect, and the organic layer 42 is used for buffering stress between the first inorganic layer 41 and the second inorganic layer 43, so that stress concentration caused by bending is avoided. By arranging the film packaging layer 40 to comprise the first inorganic layer, the organic layer 42 and the second inorganic layer 43, the film packaging layer 40 is ensured to have better water and oxygen blocking characteristics, and meanwhile, the film packaging layer 40 is ensured to have better bending resistance.
It should be noted that, the present embodiment only exemplarily illustrates that the thin film encapsulation layer 40 includes three film layers, i.e., a first inorganic layer 41, an organic layer 42 and a second inorganic layer 43, and the present invention is not limited thereto, and in other embodiments, the thin film encapsulation layer 40 may further include a plurality of organic layers 42 and a plurality of second inorganic layers 43, where the organic layers 42 and the second inorganic layers 43 are alternately disposed, for example, the thin film encapsulation layer 40 may include a first inorganic layer 41, an organic layer 42, a third inorganic layer 43, an organic layer 42 and a third inorganic layer 43 which are stacked.
Alternatively, the material used for the second inorganic layer 43 includes SiN.
Specifically, SiN has a good water and oxygen blocking performance, and the second inorganic layer 43 is made of SiN, so that the second inorganic layer 43 has a good water and oxygen blocking characteristic, and the thin film packaging layer 40 has a good water and oxygen blocking performance.
Alternatively, the thickness of the first sub inorganic layer 411 is in a range of 10 micrometers to 200 micrometers, the thickness of the second sub inorganic layer 412 is in a range of 500 micrometers to 1200 micrometers, and the thickness of the third sub inorganic layer 413 is in a range of 50 micrometers to 200 micrometers.
Specifically, the first sub-inorganic layer 411 mainly plays a role in enhancing reflection between the light extraction layer 30 and the display panel, and has too small thickness to meet the process requirement, and too large thickness is not beneficial to the lightening and thinning of the display panel, and the thickness range of the second sub-inorganic layer 412 is set to be 10 micrometers-200 micrometers, so that the process difficulty is reduced, the display panel is ensured to have smaller thickness, and the development trend of the lightening and thinning of the display panel is met.
The second sub inorganic layer 412 mainly plays a role in blocking water and oxygen, the thickness of the second sub inorganic layer 412 is too thin and has a small blocking effect on water and oxygen, the thickness of the second sub inorganic layer 412 is too large and is not beneficial to lightening and thinning of the display panel, the thickness range of the second sub inorganic layer 412 is set to be 500-1200 micrometers, the second sub inorganic layer 412 is guaranteed to have a good water and oxygen blocking characteristic, the display panel is guaranteed to have a good packaging effect, meanwhile, the display panel is guaranteed to have a small thickness, and the development trend of lightening and thinning of the display panel is met.
The third sub-inorganic layer 413 is mainly used to ensure that the organic layer 42 has high flatness, the thickness of the third sub-inorganic layer 413 is too small and the process requirement is too high, and the thickness is too large and is not beneficial to the lightening and thinning of the display panel, and the thickness range of the third sub-inorganic layer 413 is set to be 50 micrometers-200 micrometers, so that the process difficulty is reduced, the display panel is ensured to have small thickness, and the development trend of the lightening and thinning of the display panel is met.
Fig. 2 is a schematic view of a display device provided in this embodiment, and referring to fig. 2, a display device 200 includes the display panel 100 according to any embodiment of the present invention. The display device 200 may be a flexible electronic device such as a mobile phone, a tablet, or a smart watch.
The display device 200 of the embodiment ensures that the display panel has higher bending resistance by removing the LiF layer between the light extraction layer and the film encapsulation layer in the display panel 100. The first inorganic layer which is provided with the thin film packaging layer comprises a first sub inorganic layer, a second sub inorganic layer and a third sub inorganic layer, the refractive index of the first sub inorganic layer is smaller than that of the second sub inorganic layer and that of the third sub inorganic layer, and the refractive index of the first sub inorganic layer is smaller than that of the light taking-out layer, so that the first sub inorganic layer and the light taking-out layer have larger refractive index difference, a reflection interface between the first sub inorganic layer and the light taking-out layer has a stronger reflection effect, the effect that the visual angle and the brightness attenuation of the display panel can be adjusted by adjusting the thickness of the light taking-out layer is guaranteed, and the display device 200 is guaranteed to have a better display effect.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. A display panel, comprising:
the light extraction layer is arranged on one side, far away from the substrate, of the organic light-emitting structure;
the light extraction layer is arranged on the surface of the substrate, which is far away from the substrate; the thin film packaging layer comprises a first inorganic layer in contact with the light extraction layer, the first inorganic layer at least comprises a first inorganic sub-layer, a second inorganic sub-layer and a third inorganic sub-layer which are sequentially stacked, the first inorganic sub-layer is in contact with the light extraction layer, the refractive index of the first inorganic sub-layer is smaller than that of the second inorganic sub-layer and that of the third inorganic sub-layer, and the refractive index of the first inorganic sub-layer is smaller than that of the light extraction layer.
2. The display panel according to claim 1, characterized in that:
the refractive index of the first sub-inorganic layer is 1.45-1.5.
3. The display panel according to claim 2, characterized in that:
the material adopted by the first inorganic sub-layer comprises silicon oxide.
4. The display panel according to claim 1, characterized in that:
the material adopted by the second sub-inorganic layer comprises SiNaOb or SiN, the material adopted by the third sub-inorganic layer comprises SiNcOd, wherein a, b, c and d are positive integers, and a/b is larger than c/d.
5. The display panel according to claim 4, wherein:
0.6≤a/b≤1.5，0.2≤c/d<0.6。
6. the display panel according to claim 1, characterized in that:
the film packaging layer further comprises an organic layer and a second inorganic layer, wherein the organic layer is arranged between the first inorganic layer and the second inorganic layer, and the second inorganic layer is arranged on one side, far away from the light taking layer, of the organic layer by layer.
7. The display panel according to claim 6, wherein:
the material adopted by the second inorganic layer comprises SiN.
8. The display panel according to claim 1, characterized in that:
the thickness range of the first sub-inorganic layer is 10 micrometers-200 micrometers, the thickness range of the second sub-inorganic layer is 500 micrometers-1200 micrometers, and the thickness range of the third sub-inorganic layer is 50 micrometers-200 micrometers.
9. The display panel according to claim 1, characterized in that:
the organic light-emitting structure comprises a first electrode, a second electrode and a light-emitting functional layer arranged between the first electrode and the second electrode; the first electrode is arranged on one side of the light-emitting functional layer, which is adjacent to the light extraction layer.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021909271.6U CN212695182U (en) | 2020-09-03 | 2020-09-03 | Display panel and display device |
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| CN202021909271.6U CN212695182U (en) | 2020-09-03 | 2020-09-03 | Display panel and display device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113871547A (en) * | 2021-09-17 | 2021-12-31 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
| CN113871550A (en) * | 2021-09-24 | 2021-12-31 | 惠州华星光电显示有限公司 | Packaging structure and display panel |
| CN113948660A (en) * | 2021-10-14 | 2022-01-18 | 武汉天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN114551769A (en) * | 2022-04-22 | 2022-05-27 | 北京京东方技术开发有限公司 | Display substrate and display device |
-
2020
- 2020-09-03 CN CN202021909271.6U patent/CN212695182U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113871547A (en) * | 2021-09-17 | 2021-12-31 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
| CN113871550A (en) * | 2021-09-24 | 2021-12-31 | 惠州华星光电显示有限公司 | Packaging structure and display panel |
| CN113948660A (en) * | 2021-10-14 | 2022-01-18 | 武汉天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN113948660B (en) * | 2021-10-14 | 2024-03-01 | 武汉天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN114551769A (en) * | 2022-04-22 | 2022-05-27 | 北京京东方技术开发有限公司 | Display substrate and display device |
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