CN113921425A - Semiconductor cleaning apparatus and control method thereof - Google Patents
Semiconductor cleaning apparatus and control method thereof Download PDFInfo
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- CN113921425A CN113921425A CN202111166491.3A CN202111166491A CN113921425A CN 113921425 A CN113921425 A CN 113921425A CN 202111166491 A CN202111166491 A CN 202111166491A CN 113921425 A CN113921425 A CN 113921425A
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- liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
Abstract
The application discloses semiconductor cleaning equipment and control method thereof, semiconductor cleaning equipment are including sending liquid pipeline, air feed pipeline, shower nozzle and liquid detection sensor, it has feed liquor end and goes out the liquid end to send the liquid pipeline, the air feed pipeline has the inlet end and gives vent to anger the end, the shower nozzle is equipped with inlet, air inlet and sprays the mouth, the inlet with the air inlet all with spray the mouth intercommunication, go out the liquid end with the inlet intercommunication, give vent to anger the end with the air inlet intercommunication, it is used for spraying the gas-liquid mixture to spray the mouth, liquid detection sensor install in the air feed pipeline for whether there is liquid in the detection air feed pipeline. The semiconductor cleaning equipment disclosed by the technical scheme can detect whether liquid is mixed into the air supply pipeline or not in the process of cleaning the wafer, and prevent the problem that the air supply pipeline is easy to corrode because the liquid is retained in the air supply pipeline for a long time.
Description
Technical Field
The application belongs to the technical field of semiconductor processing, and particularly relates to semiconductor cleaning equipment and a control method thereof.
Background
In semiconductor processing, semiconductor cleaning is an important process to ensure high cleanliness of semiconductor surfaces. At present, a two-phase jet apparatus is generally used for cleaning a semiconductor, and a liquid supply line for supplying a cleaning liquid (e.g., ultrapure water) and a gas supply line for supplying a cleaning gas (e.g., nitrogen gas) are both communicated to a two-phase flow showerhead to form a two-phase jet. However, if the liquid pressure is higher than the gas pressure during the gas-liquid mixing process, the cleaning liquid flows into the gas supply line, and the gas supply line is easily corroded and damaged.
Disclosure of Invention
The application discloses a semiconductor cleaning device and a control method thereof, which can detect whether liquid is mixed into an air supply pipeline in the process of cleaning a wafer and prevent the problem that the liquid is retained in the air supply pipeline for a long time and is easy to corrode the gas pipeline.
In a first aspect, the embodiment of the application provides a semiconductor cleaning device, which comprises a liquid feeding pipeline, a gas feeding pipeline, a spray head and a liquid detection sensor,
the utility model discloses a liquid spraying device, including liquid sending pipeline, shower nozzle, liquid inlet, liquid outlet, liquid detection sensor, liquid outlet and liquid outlet, the liquid sending pipeline has the feed liquor end and goes out the liquid end, the gas sending pipeline has the inlet end and gives vent to anger the end, the shower nozzle is equipped with inlet, air inlet and sprays the mouth, the inlet with the air inlet all with spray mouthful intercommunication, go out the liquid end with the inlet intercommunication, give vent to anger the end with the air inlet intercommunication, it is used for spraying the gas-liquid mixture to spray the mouth, liquid detection sensor install in the gas sending pipeline for whether there is liquid in the detection gas sending pipeline.
In a second aspect, an embodiment of the present application provides a control method applied to the above semiconductor cleaning apparatus, where the control method includes:
detecting whether liquid exists in the air supply pipeline in real time in the process of carrying out the wafer cleaning process;
and under the condition that the liquid is detected in the gas feeding pipeline, the liquid feeding pipeline and the gas feeding pipeline are closed.
The embodiment of the application discloses semiconductor cleaning equipment, it includes liquid feed pipeline, air feed pipeline, shower nozzle and liquid detection sensor, and liquid feed pipeline and air feed pipeline all are connected with the shower nozzle to make liquid and gas can be in shower nozzle department intermixture, and make gas-liquid mixture spout from the mouth that sprays of shower nozzle, wash the wafer. Meanwhile, the liquid detection sensor is arranged on the air supply pipeline, the liquid detection sensor can be used for detecting the air supply pipeline, and under the condition that liquid is contained in the air supply pipeline, the liquid detection sensor can give an alarm to represent that the liquid is mixed in the air supply pipeline, and the air supply pipeline needs to be cleaned, so that the liquid can be prevented from being retained in the air supply pipeline for a long time, the air supply pipeline is prevented from being corroded and damaged, and the wafer cleaning equipment is guaranteed to have longer service life.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic structural diagram of a semiconductor cleaning apparatus disclosed in an embodiment of the present application;
fig. 2 is a flowchart of a control method of a semiconductor cleaning apparatus according to an embodiment of the present application.
Description of reference numerals:
100-liquid delivery pipeline,
200-air supply pipeline,
300-a spray head,
400-liquid detection sensor,
510-liquid discharge pipeline, 520-control valve, 530-siphon valve,
610-gas filter, 620-pneumatic valve, 630-gas flow control meter, 640-pressure regulating valve,
710-suckback valve, 720-ultrasonic flowmeter, 730-pneumatic valve, 740-manual valve,
800-wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
As shown in fig. 1, an embodiment of the present application discloses a semiconductor cleaning apparatus, which includes a liquid supply line 100, a gas supply line 200, a showerhead 300, and a liquid detection sensor 400, and by which a wafer 800 can be cleaned.
The liquid feeding line 100 is used for feeding a cleaning liquid, and the cleaning liquid may specifically include a cleaning liquid medicine, ultrapure water, and the like, which is not limited herein. The liquid feeding pipeline 100 has a liquid inlet end and a liquid outlet end, and during the assembly process of the semiconductor cleaning device, the liquid inlet end of the liquid feeding pipeline 100 can be communicated with a container or a pipeline containing cleaning liquid, so that the liquid feeding pipeline 100 in the semiconductor cleaning device can provide the cleaning liquid.
Accordingly, the gas supply line 200 is used for supplying a cleaning gas, which may specifically include inert gas, nitrogen gas, and the like, which are not easy to react with the wafer 800 or contaminate the wafer 800. The gas supply pipe 200 has a gas inlet end and a gas outlet end, and the gas inlet end of the gas supply pipe 200 can be communicated with a container or a pipe containing a cleaning gas during the assembly process of the semiconductor cleaning apparatus, so that the gas supply pipe 200 in the semiconductor cleaning apparatus can supply the cleaning gas.
In order to mix the cleaning liquid and the cleaning gas with each other, the liquid feeding line 100 and the gas feeding line 200 are connected to the showerhead 300, so that the cleaning liquid and the cleaning gas are mixed in the showerhead 300 and are ejected from the showerhead 300 to clean the wafer 800. In detail, the nozzle 300 is provided with a liquid inlet, a gas inlet and a spray port, and the liquid inlet and the gas inlet are both communicated with the spray port, so that the liquid entering from the liquid inlet and the gas entering from the gas inlet can be sprayed out from the spray port.
In the process of assembling the semiconductor cleaning apparatus, the liquid outlet end of the liquid delivery pipeline 100 is communicated with the liquid inlet of the spray head 300, so as to deliver the liquid in the liquid delivery pipeline to the spray head 300 through the liquid inlet. Correspondingly, the gas outlet end of the gas supply pipeline 200 is communicated with the gas inlet of the showerhead 300, so that the gas in the gas supply pipeline is conveyed into the showerhead 300 through the gas inlet, and under the action of the spray opening, the liquid and the gas in the showerhead 300 are mixed with each other, and the gas-liquid mixture is sprayed out from the spray opening, so as to clean the wafer 800.
Meanwhile, since the pressure of the liquid in the liquid feeding pipe 100 is generally higher than the pressure of the gas in the gas feeding pipe 200, and thus there may be a case where the liquid is mixed into the gas feeding pipe 200, as described above, the semiconductor cleaning apparatus disclosed in the embodiment of the present application includes the liquid detection sensor 400, and the liquid detection sensor 400 is installed in the gas feeding pipe 200, and whether the liquid exists in the gas feeding pipe 200 can be detected by the liquid detection sensor 400; correspondingly, when the liquid detection sensor 400 detects that liquid is contained in the air supply pipeline 200, the liquid detection sensor 400 gives an alarm, and further, the fact that liquid is mixed in the air supply pipeline 200 can be known through the alarm information of the liquid detection sensor 400, and in this case, corresponding measures need to be taken to clean the liquid in the air supply pipeline 200.
The embodiment of the application discloses semiconductor cleaning equipment, which comprises a liquid feeding pipeline 100, a gas feeding pipeline 200, a spray head 300 and a liquid detection sensor 400, wherein the liquid feeding pipeline 100 and the gas feeding pipeline 200 are both connected with the spray head 300, so that liquid and gas can be mixed with each other at the spray head 300, and the gas-liquid mixture is sprayed out from a spray opening of the spray head 300 to clean a wafer 800. Meanwhile, the liquid detection sensor 400 is disposed on the gas supply pipeline 200, the gas supply pipeline 200 can be detected by the liquid detection sensor 400, and when the gas supply pipeline 200 contains liquid, the liquid detection sensor 400 can give an alarm to indicate that the gas supply pipeline 200 contains the liquid, and the gas supply pipeline 200 needs to be cleaned, so that the liquid can be prevented from being retained in the gas supply pipeline 200 for a long time, the gas supply pipeline 200 is prevented from being corroded and damaged, and the semiconductor cleaning equipment has a long service life.
Further, in the semiconductor cleaning apparatus disclosed in the embodiment of the present application, the gas filter 610 may be further disposed on the gas supply pipe 200, and the gas filter 610 may filter the gas introduced into the gas supply pipe 200 to improve the cleanliness of the gas-liquid mixture sprayed from the showerhead 300, so as to prevent the wafer 800 from being not cleaned and further contaminated. According to the present embodiment, the liquid detection sensor 400 is optionally disposed between the gas outlet end of the gas supply pipeline 200 and the gas filter 610, and is spaced from the gas filter 610 by a predetermined distance, and specific parameters of the predetermined distance may be determined according to parameters such as the length of the gas supply pipeline 200 and the pressure of the gas supply pipeline 100, which is not limited herein.
With the above technical solution, the liquid detection sensor 400 can be ensured to have high detection reliability, and because the cleanliness of the gas after passing through the gas filter 610 is relatively high, and the cleanliness of the cleaning liquid conveyed in the liquid conveying pipeline 100 is also relatively high, in this case, even if part of the liquid in the liquid conveying pipeline 100 is mixed into the gas conveying pipeline 200, because the cleanliness of the liquid and the gas is relatively high, the gas conveying pipeline 200 and the gas filter 610 are not corroded substantially in a short time, in this case, the urgency of cleaning work of the gas conveying pipeline 200 can be reduced slightly, which can improve the production safety to a certain extent. Of course, in order to maximally prevent the air supply pipe 200 and the devices mounted on the air supply pipe 200 from being damaged, after the liquid detection sensor 400 sends an alarm signal, the air supply pipe 200 may be cleaned as quickly as possible while ensuring safety.
Optionally, the distance from the liquid detection sensor 400 to the gas filter 610 may be 80-115 mm, preferably 100mm, in which case, whether liquid is mixed in the air supply pipeline can be detected relatively sensitively, and a situation that the liquid detection sensor 400 is triggered by mistake due to accumulation of a trace amount of liquid near the spray head 300 can be prevented relatively effectively.
Of course, the semiconductor cleaning apparatus may further include other components, and in detail, the pressure regulating valve 640, the gas flow rate controller 630 and the pneumatic valve 620 may be further provided on the gas supply pipe in sequence from the gas inlet end to the gas outlet end. Specifically, the pneumatic valve 620 is disposed on a side of the gas filter 610 facing away from the liquid detection sensor 400 to control the on/off of the air supply line; a gas flow control meter 630 is provided on the side of the pneumatic valve 620 facing away from the gas filter 610 to detect and control the flow rate of the gas; a pressure regulating valve 640 is provided on a side of the gas flow rate controller 630 facing away from the pneumatic valve 620 to regulate the pressure of the gas in the gas feed line.
Correspondingly, the liquid sending pipe 100 may also be provided with a functional device pointing to the liquid inlet end along the liquid outlet end, and specifically may include a suck-back valve 710, an ultrasonic flow meter 720, a pneumatic valve 730 and a manual valve 740, wherein the suck-back valve 710 is disposed on a side of the spray head 300 away from the gas sending pipe 200 to block the flow of the liquid under the action of the pressure difference; an ultrasonic flow meter 720 is arranged on the side of the suck-back valve 710, which faces away from the spray head 300, so as to meter the liquid flow in the liquid conveying pipeline 100; the pneumatic valve 730 and the manual valve 740 are sequentially arranged on the side of the ultrasonic flowmeter 720, which is far away from the suckback valve 710, so as to control the on-off of the liquid feeding pipeline 100.
As described above, when the liquid is mixed in the air supply line 200, the interface between the air supply line 200 and the showerhead 300 is opened, the operation of the air supply line 200 is controlled, the air supply line 200 is purged by purging, the liquid mixed in the air supply line 200 is blown out, and it is ensured that the air supply line 200 does not contain the liquid.
In another embodiment of the present application, the semiconductor cleaning apparatus disclosed in the embodiment of the present application may further include a drain line 510, and one end of the drain line 510 is communicated with a portion of the gas supply line 200 between the gas filter 610 and the gas outlet end. That is, the drain pipe 510 communicates with the gas supply pipe 200, and a port of the drain pipe 510 is located on a portion between the gas outlet end of the gas supply pipe 200 and the gas filter 610. And, the other end of the drain pipe 510 is communicated with a negative pressure source, which may be specifically an air extraction device. Meanwhile, the drainage pipeline 510 is provided with a control valve 520, and the on-off condition of the drainage pipeline 510 can be changed by utilizing the control valve 520. Wherein, when the control valve 520 is in an open state, the gas supply pipeline 200 is communicated with the negative pressure source through the liquid discharge pipeline 510, and further, when the gas supply pipeline 200 is working, the gas in the gas supply pipeline 200 can be blown out to the negative pressure source through the liquid discharge pipeline 510, and the inner cavity of the gas supply pipeline 200 can be purged together in the flowing process of the gas, if the gas supply pipeline 200 is mixed with liquid, the liquid in the gas supply pipeline 200 can be purged into the liquid discharge pipeline 510 in a gas purging mode, and the liquid is discharged to the negative pressure source through the liquid discharge pipeline 510.
Under the condition of adopting the technical scheme, when the air supply pipeline 200 is cleaned, the air supply pipeline 200 does not need to be detached, only the control valve 520 on the liquid discharge pipeline 510 needs to be opened, and the air supply pipeline 200 is controlled to be blown, so that the cleaning work is simple and convenient, and the condition that the air supply pipeline 200 is damaged due to frequent detachment of the air supply pipeline 200 can be prevented. Specifically, the drain line 510 and the air supply line 200 may be communicated by a three-way joint, and the control valve 520 may be a manual valve, or the control valve 520 may be a pneumatic valve.
In order to further improve the cleaning effect of the liquid in the air supply pipeline 200, further, the negative pressure source may include a main liquid discharge pipeline of the semiconductor cleaning apparatus provided in this embodiment of the present application and a siphon valve 530 disposed on the main liquid discharge pipeline, the siphon valve 530 is provided with a liquid discharge port and a siphon channel which are communicated with each other, the liquid discharge port is communicated with the other end of the liquid discharge pipeline 510, that is, the liquid discharge port is communicated with one end of the liquid discharge pipeline which is away from the air supply pipeline 200, so that the fluid in the liquid discharge pipeline 510 can flow into the siphon valve 530 through the liquid discharge port. Further, the liquid in the main drain line flows through the siphon channel of the siphon valve 530, and a negative pressure is applied to the drain line 510 through the siphon channel and the drain port of the siphon valve 530 by the flowing liquid, so that the liquid mixed in the air supply line 200 is further promoted to flow to the drain line 510 and is finally discharged from the siphon valve 530 to the main drain line. Specifically, the main drain line may be a plant drain line, so as to provide a negative pressure effect to the siphon valve 530 by using a continuous plant drain line.
As described above, the liquid detection sensor 400 may be specifically a laser sensor, and in another embodiment of the present application, the liquid detection sensor 400 may be a capacitive liquid sensor to improve detection stability and reliability, and the capacitive liquid sensor has good response efficiency and relatively high sensitivity.
Based on the foregoing embodiment, as shown in fig. 2, the present application further provides a control method for controlling the foregoing semiconductor cleaning apparatus, where the control method includes:
s1, detecting whether liquid exists in the air supply pipeline in real time in the process of carrying out the wafer cleaning process; specifically, whether liquid exists in the air supply pipeline can be detected by using the liquid detection sensor in the semiconductor cleaning equipment, and since the above embodiments have described the specific installation and the like of the liquid detection sensor in detail, the text is not repeated here in consideration of brevity.
And S2, closing the liquid feeding pipeline and the air feeding pipeline when the liquid in the air feeding pipeline is detected. Specifically, in response to the above steps, after the liquid detection sensor detects the liquid in the air supply pipeline, the liquid detection sensor may give an alarm, and in this case, it is determined that the liquid is present in the air supply pipeline, and at this time, the air supply pipeline does not have a condition for continuing the operation, and it is necessary to clean the liquid in the air supply pipeline in time to prevent the liquid from being retained in the air supply pipeline for a long time and corroding the air supply pipeline. Based on this, when the liquid in the gas pipeline is detected, the liquid pipeline and the gas pipeline are closed, the wafer cleaning process is stopped, and the liquid in the gas pipeline is cleaned by adopting a proper means.
Of course, in the wafer cleaning process corresponding to step S2, the liquid detection sensor may not give an alarm, and in this case, it is considered that no liquid is mixed in the air supply pipe, and at this time, the wafer cleaning process may be continued.
Further, as described above, the semiconductor cleaning apparatus may further include a drain line, one end of which is communicated between the gas inlet end of the gas supply line and the showerhead, that is, the drain line is communicated with the gas supply line, and a port of the drain line is located at a portion between the gas outlet end of the gas supply line and the gas filter, and the other end of which is communicated with the negative pressure source. Based on the semiconductor cleaning apparatus, the control method provided in the embodiment of the present application may further include, after the step of turning off the liquid supply line and the gas supply line:
and S3, opening a control valve on a liquid discharge pipeline communicated with the air supply pipeline, and discharging the liquid in the air supply pipeline. That is, when the liquid detection sensor detects that the liquid is present in the air supply line, the liquid in the air supply line can be discharged in an auxiliary manner through the liquid discharge line. Specifically, the control valve on the liquid discharge pipeline is opened to enable the air supply pipeline to be communicated with the liquid discharge pipeline, gas in the air supply pipeline can be blown into the liquid discharge pipeline through the air supply pipeline, the air supply pipeline can be blown in the flowing process of the gas, and then the liquid in the air supply pipeline is driven to flow to the liquid discharge pipeline and is finally discharged to the negative pressure source from the liquid discharge pipeline. The mode of this kind of clearance air feed pipeline is comparatively simple and convenient, and can prevent frequently to dismantle the condition that air feed pipeline leads to air feed pipeline damage. Particularly, depending on the discharge of the liquid, the gas supply line may be opened again to increase the amount and flow rate of the gas in the gas supply line.
As described above, the liquid in the gas supply line can be basically removed after the gas in the gas supply line is purged by communicating the gas supply line with the drain line. Of course, there are other unexpected situations that after the purging process of the air supply line is completed, liquid may still be in the air supply line, and based on this, optionally, the control method disclosed in the embodiment of the present application further includes:
s4, before the wafer cleaning process, whether the liquid exists in the air supply pipeline is detected. Specifically, in step S4, the detection manner and means for the liquid may be the same as those of step S1 described above. In step S4, the time point for detecting whether there is liquid in the gas pipe is located before the wafer cleaning process, that is, before the wafer cleaning process is started, whether there is liquid in the gas pipe is detected first, so as to prevent the gas pipe from having liquid residue before the cleaning process is performed, and further enhance the effect of the wafer cleaning process.
Based on the step S4, the control method further includes:
and S5, under the condition that the liquid is detected in the air supply pipeline, keeping the liquid supply pipeline closed, opening the air supply pipeline, purging the air supply pipeline, and opening a control valve on the liquid discharge pipeline. Specifically, before the wafer cleaning process is performed, the gas supply pipeline is detected, and if the gas supply pipeline is detected to have liquid, the liquid in the gas supply pipeline can be discharged through the liquid discharge pipeline. The specific control mode is that the liquid supply pipeline is kept closed to prevent liquid from flowing in continuously, the gas in the gas supply pipeline is used for blowing the gas supply pipeline by opening control valves on the gas supply pipeline and the liquid discharge pipeline, the liquid in the gas supply pipeline is blown out of the gas supply pipeline through the liquid discharge pipeline, and the fact that liquid residue does not exist in the gas supply pipeline any more is guaranteed.
Further, the control method may further include, after the step S5 of keeping the liquid supply line off, opening the gas supply line, purging the gas supply line, and opening the control valve on the liquid discharge line:
s6, after a preset time (e.g. 10 seconds), the air supply pipeline is closed, and the control valve is closed to detect whether there is liquid in the air supply pipeline again. Specifically, in the above step, if the liquid in the air supply pipeline is detected, the liquid in the air supply pipeline is blown out by using the preset time length of the working of the air supply pipeline and the liquid discharge pipeline. Correspondingly, after the air supply pipeline and the liquid discharge pipeline work for a preset time, the liquid in the air supply pipeline can be generally purged. In order to confirm that no liquid remains in the air supply pipeline, after the purging is carried out for a preset time, the air supply pipeline can be closed, the control valve is closed, and then whether liquid exists in the air supply pipeline or not is detected, wherein the specific detection process and the device are similar to the steps.
Based on the step S6, further, the control method disclosed in the embodiment of the present application further includes:
and S7, when the liquid in the air supply pipeline is detected again, giving an alarm. Specifically, after the air supply pipeline is used for purging for a preset time, the control valve is closed, the air supply pipeline is disconnected from the liquid discharge pipeline, meanwhile, the air supply pipeline is stopped to supply air continuously, in this case, the air supply pipeline can be detected again by the liquid detection sensor, and if the air supply pipeline still contains liquid, the situation shows that the liquid in the air supply pipeline cannot be removed normally only by the purging function of the air supply pipeline. Based on the situation, the liquid detection sensor can be controlled to give an alarm, so that a worker can know the situation, and the liquid in the air supply pipeline is cleaned, so that the situation that the air supply pipeline is corroded and the like due to the fact that the liquid stays in the air supply pipeline for a long time is prevented.
In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. The semiconductor cleaning equipment is characterized by comprising a liquid feeding pipeline, a gas feeding pipeline, a spray head and a liquid detection sensor,
the utility model discloses a liquid spraying device, including liquid sending pipeline, shower nozzle, liquid inlet, liquid outlet, liquid detection sensor, liquid outlet and liquid outlet, the liquid sending pipeline has the feed liquor end and goes out the liquid end, the gas sending pipeline has the inlet end and gives vent to anger the end, the shower nozzle is equipped with inlet, air inlet and sprays the mouth, the inlet with the air inlet all with spray mouthful intercommunication, go out the liquid end with the inlet intercommunication, give vent to anger the end with the air inlet intercommunication, it is used for spraying the gas-liquid mixture to spray the mouth, liquid detection sensor install in the gas sending pipeline for whether there is liquid in the detection gas sending pipeline.
2. The semiconductor cleaning apparatus according to claim 1, wherein a pressure regulating valve, a gas flow rate controller, a pneumatic valve and a gas filter are sequentially disposed along the gas inlet end to the gas outlet end of the gas supply line, and the liquid detection sensor is located between the gas filter and the gas outlet end at a predetermined distance from the gas filter.
3. The semiconductor cleaning apparatus according to claim 2, wherein the predetermined distance is 80 to 115 mm.
4. The semiconductor cleaning apparatus according to claim 2, further comprising a drain line, one end of which communicates with a portion of the gas supply line between the gas filter and the gas outlet end, and the other end of which communicates with a negative pressure source, wherein a control valve is provided on the drain line, and the gas supply line communicates with the negative pressure source through the drain line in an open state of the control valve.
5. The semiconductor cleaning device according to claim 4, wherein the negative pressure source comprises a main drain line of the semiconductor cleaning device and a siphon valve arranged on the main drain line, the siphon valve is provided with a drain port and a siphon channel which are communicated with each other, the drain port is communicated with the other end of the drain line, and liquid in the main drain line flows through the siphon channel.
6. The semiconductor cleaning apparatus according to any one of claims 1 to 5, wherein the liquid detection sensor is a capacitive liquid sensor.
7. A control method applied to the semiconductor cleaning apparatus according to any one of claims 1 to 6, characterized in that the control method comprises:
detecting whether liquid exists in the air supply pipeline in real time in the process of carrying out the wafer cleaning process;
and under the condition that the liquid is detected in the gas feeding pipeline, the liquid feeding pipeline and the gas feeding pipeline are closed.
8. The control method according to claim 7, further comprising, after said shutting off the liquid feed line and the gas feed line:
and opening a control valve on a liquid discharge pipeline communicated with the air supply pipeline to discharge the liquid in the air supply pipeline, wherein one end of the liquid discharge pipeline is communicated with the air supply pipeline, and the other end of the liquid discharge pipeline is communicated with a negative pressure source.
9. The control method according to claim 8, characterized by further comprising:
detecting whether liquid exists in the air supply pipeline before the wafer cleaning process is carried out;
and under the condition that liquid is detected in the gas supply pipeline, keeping the liquid supply pipeline closed, opening the gas supply pipeline, purging the gas supply pipeline, and opening the control valve on the liquid discharge pipeline.
10. The control method according to claim 9, further comprising, after the keeping the liquid feeding line off, opening the gas feeding line, purging the gas feeding line, and opening the control valve on the liquid discharge line:
after a preset time, the gas supply pipeline is shut off, the control valve is closed, and whether liquid exists in the gas supply pipeline is detected again;
and sending an alarm under the condition that the liquid in the air supply pipeline is detected again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111166491.3A CN113921425A (en) | 2021-09-30 | 2021-09-30 | Semiconductor cleaning apparatus and control method thereof |
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| CN202111166491.3A CN113921425A (en) | 2021-09-30 | 2021-09-30 | Semiconductor cleaning apparatus and control method thereof |
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| CN113921425A true CN113921425A (en) | 2022-01-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115356422A (en) * | 2022-10-24 | 2022-11-18 | 广东电网有限责任公司佛山供电局 | Double-ended needle and method for transferring insulating oil chromatographic test sample gas |
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2021
- 2021-09-30 CN CN202111166491.3A patent/CN113921425A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115356422A (en) * | 2022-10-24 | 2022-11-18 | 广东电网有限责任公司佛山供电局 | Double-ended needle and method for transferring insulating oil chromatographic test sample gas |
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