CN113913140A - Air gap glue and electromagnetic equipment - Google Patents
Air gap glue and electromagnetic equipment Download PDFInfo
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- CN113913140A CN113913140A CN202111366718.9A CN202111366718A CN113913140A CN 113913140 A CN113913140 A CN 113913140A CN 202111366718 A CN202111366718 A CN 202111366718A CN 113913140 A CN113913140 A CN 113913140A
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- Prior art keywords
- air gap
- glue
- gap glue
- filler
- iron
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- 239000003292 glue Substances 0.000 title claims abstract description 96
- 239000000463 material Substances 0.000 claims abstract description 56
- 239000000945 filler Substances 0.000 claims abstract description 39
- 239000006249 magnetic particle Substances 0.000 claims abstract description 38
- 239000011325 microbead Substances 0.000 claims abstract description 28
- 239000002245 particle Substances 0.000 claims abstract description 25
- 239000011159 matrix material Substances 0.000 claims abstract description 15
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 13
- 239000012762 magnetic filler Substances 0.000 claims abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 230000035699 permeability Effects 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910000521 B alloy Inorganic materials 0.000 claims description 4
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 claims description 4
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 claims description 4
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 claims description 4
- NFCWKPUNMWPHLM-UHFFFAOYSA-N [Si].[B].[Fe] Chemical compound [Si].[B].[Fe] NFCWKPUNMWPHLM-UHFFFAOYSA-N 0.000 claims description 4
- -1 iron-silicon-aluminum Chemical compound 0.000 claims description 4
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 claims description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000000788 chromium alloy Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 229940116411 terpineol Drugs 0.000 claims description 3
- 239000013008 thixotropic agent Substances 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 238000005303 weighing Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000008204 material by function Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/01—Magnetic additives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application discloses air gap glue and electromagnetic equipment. The air gap glue comprises a glue matrix, a mixed functional material, a solvent and an auxiliary agent, wherein the mixed functional material comprises microbeads and at least one of magnetic particles and fillers, and the particle size of the microbeads is D1And D is not more than 5 mu m1Less than or equal to 600 mu m; the magnetic particles have a particle diameter D2And D is2≤D1(ii) a The particle diameter of the filler is D3And D is3≤D1The filler is a material with heat conducting property. The air gap glue can improve the air gap control accuracy, has the heat conduction and/or magnetic conduction and magnetic shielding capacity, and has the function of increasing the air gap glue.
Description
Technical Field
The application relates to the field of electromagnetic glue, in particular to air gap glue and electromagnetic equipment.
Background
In the existing electronic component, the air gap control mainly depends on filling materials such as glue without filler, an air gap cushion block, a base plate, a magnetic sheet and the like, so that an air gap with a proper size is obtained; alternatively, suppliers may be required to directly reserve air gaps of appropriate height or length during core or material processing. That is, it is necessary to reserve an air gap with a suitable size for the electronic component, and then glue is used for bonding, or the air gap is fixed by an air gap cushion block, a cushion plate, a magnetic sheet and the like with a suitable size. However, the accuracy of controlling the size of the air gap is poor, which results in poor air gap control effect. In addition, the function of the material for controlling the air gap is single, for example, the glue only has the bonding function and does not have the magnetic conductivity of the magnetic sheet, so that the magnetic shielding can not be realized.
Disclosure of Invention
The embodiment of the application provides air gap glue for improving the problems of poor air gap control precision and single function of air gap control materials such as glue and the like.
In a first aspect, embodiments of the present application provide an air gap glue, which includes a glue matrix, a mixed functional material, a solvent, and an auxiliary agent. The mixed functional material comprises microbeads and at least one of magnetic particles and fillers, and the particle size of the microbeads is D1And D is not more than 5 mu m1Less than or equal to 600 mu m; the magnetic particles have a particle diameter D2And D is2≤D1(ii) a The particle diameter of the filler is D3And D is3≤D1The filler is a material with heat conducting property.
In some embodiments, the weight ratio of the glue matrix to the mixed functional material is 1: (0.1-15).
In some embodiments, the mixed functional material comprises, in parts by weight: 5-100 parts of microbeads, wherein the parts are less than 100 parts; 0-90 parts of magnetic particles; 0-90 parts of a filler; at most one of the magnetic particles and the filler is 0 part.
In some embodiments, the air gap glue has a relative magnetic permeability of μ, and 1 ≦ μ ≦ 25.
In some embodiments, the material of the magnetic particles comprises at least one of manganese zinc ferrite, nickel zinc ferrite, carbonyl iron powder, iron-based alloys, amorphous alloys, nanocrystalline alloys, iron-based alloys comprising at least one of iron-silicon-chromium alloys, iron-silicon alloys, iron-nickel alloys, iron-silicon-aluminum alloys, iron-silicon-boron alloys.
In some embodiments, the air gap glue has a thermal conductivity of A, and 1.4W/(m K). ltoreq.A.
In some embodiments, the material of the filler comprises at least one of calcium carbonate, silica, alumina, aluminum hydroxide, aluminum nitride, magnesium oxide, graphene, modified graphene.
In some embodiments, the air gap glue has a viscosity of C, and 5000cP ≦ C ≦ 300000 cP.
In some embodiments, the glue matrix material includes at least one of epoxy, modified epoxy, silicone rubber, polyurethane, and phenolic.
In some embodiments, the material of the solvent comprises at least one of ethylene glycol butyl ether acetate, ethylene glycol diglycidyl ether, dipropylene glycol methyl ether, ethylene glycol, propylene glycol, terpineol, cyclohexanone, xylene.
In some embodiments, the auxiliary agent comprises at least one of a thixotropic agent, a leveling agent, and a viscosity reducing agent.
In a second aspect, embodiments of the present application provide an electromagnetic device, including any one of the air gap glues described above.
As described above, in the air gap glue according to the embodiment of the present application, the mixed functional material is added into the air gap glue, the mixed functional material includes the microbeads and at least one of the magnetic particles and the filler, and the particle size of the microbeads is D1And D is not more than 5 mu m1Less than or equal to 600 mu m, and the particle diameter of the magnetic particles is D2And D is2≤D1The particle diameter of the filler is D3And D is3≤D1The particle sizes of the micro-beads, the magnetic particles and the filler are small, so that the air gap size can be controlled accurately; the magnetic particles can enable the air gap glue to have magnetic conduction and magnetic shielding capabilities; the filler is the material that has the heat conductivity for air gap glue has better heat conductivility, and the air gap glue of this application embodiment can possess air gap control, heat conduction, magnetic conduction and magnetism shielding ability simultaneously.
Drawings
FIG. 1 is an electron micrograph of an embodiment of a microbead according to the present application;
FIG. 2 is a schematic illustration of the mixing of the components of an air gap glue according to an embodiment of the present application;
FIG. 3 is a graph of a test of the results of Cv (ratio of standard deviation to mean particle diameter) for an embodiment of the air gap glue of the present application;
FIG. 4 is a graph illustrating a test of relative permeability results for an embodiment of the air gap glue of the present application;
fig. 5 is a schematic structural diagram of an embodiment of the electromagnetic apparatus provided with the air gap glue according to the present application.
Detailed Description
The existing air gap glue only has the bonding capability, the function is single, and the air gap control precision is poor. In order to solve the problem, the application provides the air gap glue, the micro-beads and at least one of the magnetic particles and the filler are added into the air gap glue, the particle sizes of the micro-beads, the magnetic particles and the filler are small, the air gap glue is beneficial to improving the air gap control accuracy, the magnetic particles can enable the air gap glue to have magnetic conduction and magnetic shielding capabilities, and the filler enables the air gap glue to have the heat conduction capability, so that the air gap glue is increased.
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described below in detail with reference to specific embodiments and accompanying drawings. It should be apparent that the embodiments described below are only some embodiments of the present application, and not all embodiments. In the following embodiments and technical features thereof, all of which are described below may be combined with each other without conflict, and also belong to the technical solutions of the present application.
It should be understood that in the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing technical solutions and simplifying the description of the respective embodiments of the present application, and do not indicate or imply that a device or an element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
Fig. 1 is a schematic diagram of the mixing of air gap glue according to an embodiment of the present application. The air gap glue of the embodiment of the present application comprises a glue matrix 11, a mixed functional material 12, a solvent (not shown), and an auxiliary agent (not shown). The mixed functional material 12 includes the microbeads 121, and at least one of the magnetic particles 122 and the filler 123. The particle diameter of the microbeads 121 is D1And D is not more than 5 mu m1Less than or equal to 600 mu m. The magnetic particles 122 have magnetic permeability and have a particle diameter D2And D is2≤D1. The particle diameter of the filler 123 is D3And D is3≤D1The filler 123 is a material having a thermal conductive property.
As shown in fig. 2, the particle size of the micro bead 121 is controlled within the above threshold range of 5 μm to 600 μm, the particle size is small, and the particle sizes of the magnetic particle 122 and the filler 123 are both smaller than the particle size of the micro bead 121, that is, the particle sizes of the magnetic particle 122 and the filler 123 are smaller, so that the particle sizes of various materials in the air gap glue are small, the fineness is high, and when the air gap glue is applied to an electromagnetic component, the accuracy of air gap control is improved, and the result shows that the ratio Cv of the standard deviation of the air gap glue to the average particle size can be controlled to be 10% or less, or 7% or less, even 5% or less. The magnetic particles 122 have magnetic conductivity, so that the air gap glue has magnetic conductivity and magnetic shielding capability. The filler 123 is a material with thermal conductivity, so that the air gap glue has good thermal conductivity. The air gap glue of the embodiment of the application can simultaneously have air gap control, heat conduction, magnetic conduction and magnetic shielding capabilities, can also only simultaneously have air gap control and heat conduction capabilities, and can also only simultaneously have air gap control, magnetic conduction and magnetic shielding capabilities.
In some embodiments, the beads 121 include, but are not limited to, spherical beads that are epoxy beads, glass beads, and other materials, and the like, and may be formed by mixing one or more of them.
In some embodiments, the materials of the magnetic particles 122 include, but are not limited to: manganese zinc ferrite, nickel zinc ferrite, carbonyl iron powder, iron-based alloys, amorphous alloys, nanocrystalline alloys, at least one of manganese zinc ferrite, nickel zinc ferrite, carbonyl iron powder, iron-based alloys, including but not limited to: at least one of iron-silicon-chromium alloy, iron-silicon alloy, iron-nickel alloy, iron-silicon-aluminum alloy and iron-silicon-boron alloy. The magnetic permeability of the materials is not limited, but the air gap glue prepared by at least one of the materials has the relative magnetic permeability of mu, and the value of mu can be more than or equal to 1 and less than or equal to 25.
In some embodiments, the material of the filler 123 includes, but is not limited to: calcium carbonate (CaCO)3) Silicon dioxide (SiO)2) Alumina (Al)2O3) Aluminum hydroxide (Al (OH)3) At least one of aluminum nitride, magnesium oxide, graphene and modified graphene. The air gap glue made of at least one of these materials can be such that the thermal conductivity a of the air gap glue is: a is not less than 1.4W/(m × K).
In some embodiments, the air gap glue has a viscosity of C, and 5000cP ≦ C ≦ 300000 cP. The viscosity of the air gap glue can be adjusted or optimized by the viscosity of the glue matrix 11, and in order to achieve the viscosity C within the above threshold, the glue matrix 11 can be made of suitable materials in the embodiments of the present application, including but not limited to: at least one of epoxy resin, modified epoxy resin, organic silicon resin, silicon rubber, polyurethane and phenolic resin.
In some embodiments, the materials of the solvent include, but are not limited to: at least one of ethylene glycol butyl ether acetate, ethylene glycol diglycidyl ether, dipropylene glycol methyl ether, ethylene glycol, propylene glycol, terpineol, cyclohexanone and xylene; the auxiliary agent comprises at least one of a thixotropic agent, a flatting agent and a viscosity reducer, the type of the auxiliary agent is not limited in the application, and the actual requirement can be met.
It should be understood that the ratio of the glue matrix 11 and the mixed functional material 12 and the ratio of the materials in the mixed functional material 12 can be adaptively adjusted or optimized according to actual needs. In some embodiments, the weight ratio of the glue matrix 11 and the mixed functional material 12 is 1: (0.1 to 15), preferably, 1: (1-12); the mixed functional material 12 includes, in parts by weight: 5-100 parts of microbeads, wherein the parts are less than 100 parts; 0-90 parts of magnetic particles; 0-90 parts of a filler; the magnetic particles 122 and the filler 123 are at most 0 part.
The air gap glue and its preparation process of the three embodiments of the present application are described below.
Example 1
1) Preparation of mixed functional materials: 10 parts of micro-beads, 90 parts of iron-silicon-boron alloy amorphous magnetic particles and 0 part of filler. The morphology of the beads is shown in FIG. 2. Weighing the micro-beads, the magnetic particles and the filler according to the actual proportion, adding the micro-beads, the magnetic particles and the filler into a low-speed stirrer (the rotating speed is 50-400r/min), and mixing uniformly to obtain the required mixed functional material.
2) Preparing air gap glue: 10 parts of epoxy resin glue, 90 parts of mixed functional material, 8 parts of dipropylene glycol methyl ether solvent and 0.25 part of BYK-430 auxiliary agent. Weighing the glue matrix, the mixed functional material, the solvent and the auxiliary agent according to the actual proportion, adding the weighed materials into a low-speed stirrer (the rotating speed is 200-600r/min), and mixing uniformly to obtain the air gap glue.
The air gap glue of the embodiment 1 of the application does not contain filler, so that the air gap glue has the air gap control, magnetic conduction and magnetic shielding capabilities.
Example 2
1) Preparation of mixed functional materials: 10 parts by weight of microbeads, 0 part by weight of magnetic particles, Al (OH)390 parts by weight of filler. Weighing the micro-beads, the magnetic particles and the filler according to the actual proportion, adding the micro-beads, the magnetic particles and the filler into a low-speed stirrer (the rotating speed is 50-400r/min), and mixing uniformly to obtain the required mixed functional material.
2) Preparing air gap glue: 10 parts of epoxy resin glue, 90 parts of mixed functional material, 10 parts of dipropylene glycol methyl ether solvent and 0.3 part of BYK-430 auxiliary agent. Weighing the glue matrix, the mixed functional material, the solvent and the auxiliary agent according to the actual proportion, adding the weighed materials into a low-speed stirrer (the rotating speed is 200-600r/min), and mixing uniformly to obtain the air gap glue.
The air gap glue of embodiment 2 of the present application does not contain magnetic particles, so the air gap glue has both air gap control and thermal conductivity.
Example 3
1) Preparation of mixed functional materials: 6 parts of microbeads, 89 parts of iron-silicon-aluminum alloy magnetic particles and 5 parts of AlN fillers. Weighing the micro-beads, the magnetic particles and the filler according to the actual proportion, adding the micro-beads, the magnetic particles and the filler into a low-speed stirrer (the rotating speed is 50-400r/min), and mixing uniformly to obtain the required mixed functional material.
2) Preparing air gap glue: 10 parts of epoxy resin adhesive, 120 parts of mixed functional material, 6 parts of dipropylene glycol methyl ether solvent and 0.12 part of Dapro-BEZ-75 auxiliary agent. Weighing the glue matrix, the mixed functional material, the solvent and the auxiliary agent according to the actual proportion, adding the weighed materials into a low-speed stirrer (the rotating speed is 200-600r/min), and mixing uniformly to obtain the air gap glue.
The air gap glue of embodiment 3 of the present application contains both magnetic particles and filler, so the air gap glue has the air gap control, heat conduction, magnetic conduction and magnetic shielding capabilities at the same time.
Referring to fig. 3, the test result shows that the ratio Cv of the standard deviation of the air gap glue to the average grain size can be controlled below 7%, so as to realize the precise control of the air gap. Referring to FIG. 4, the relative permeability μ of the air gap glue can be controlled to be 12.94-13.06.
As shown in fig. 5, an electromagnetic device 50 is further provided in the embodiment of the present application, where the electromagnetic device 50 includes the air gap glue according to any one of the above embodiments, and the air gap glue is applied or poured in a gap or a reserved air gap of the electromagnetic device 50, so as to implement air gap control of the electromagnetic device 50.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well. The terms "or" and/or "are to be construed as inclusive or meaning any one or any combination. An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
It should be understood that the above-mentioned embodiments are only some examples of the present application, and not intended to limit the scope of the present application, and all structural equivalents made by those skilled in the art using the contents of the present specification and the accompanying drawings are also included in the scope of the present application.
Claims (10)
1. The air gap glue is characterized by comprising a glue matrix, a mixed functional material, a solvent and an auxiliary agent, wherein the mixed functional material comprises microbeads and at least one of magnetic particles and fillers, and the particle size of the microbeads is D1And D is not more than 5 mu m1Less than or equal to 600 mu m; the magnetic particles have a particle diameter D2And D is2≤D1(ii) a The particle diameter of the filler is D3And D is3≤D1The filler is a material with heat conduction performance.
2. An air gap glue according to claim 1, wherein the weight ratio of the glue matrix and the mixed functional material is 1: (0.1-15).
3. An air gap glue according to claim 1,
the mixed functional material comprises the following components in parts by weight:
5-100 parts of the microbeads, wherein the parts are less than 100 parts;
0-90 parts of magnetic particles;
0 to 90 parts of the filler, and 0 part of at most one of the magnetic particles and the filler.
4. The air gap glue of claim 1, wherein the air gap glue has a relative magnetic permeability of μ, and 1 μ ≦ 25.
5. The air gap glue of claim 4, wherein the magnetic particles are made of a material selected from the group consisting of manganese-zinc ferrite, nickel-zinc ferrite, carbonyl iron powder, iron-based alloys, amorphous alloys, and nanocrystalline alloys, and the iron-based alloys include at least one of iron-silicon-chromium alloys, iron-silicon alloys, iron-nickel alloys, iron-silicon-aluminum alloys, and iron-silicon-boron alloys.
6. An air gap glue according to any of the claims 1 to 5, characterized in that the air gap glue has a thermal conductivity of A and 1.4W/(m K). ltoreq.A.
7. The air gap glue of claim 6, wherein the filler material comprises at least one of calcium carbonate, silica, alumina, aluminum hydroxide, aluminum nitride, magnesium oxide, graphene, and modified graphene.
8. The air gap glue of claim 1, wherein the air gap glue has a viscosity of C, and C is 5000cP ≦ C ≦ 300000 cP.
9. Air gap glue according to claim 8,
the glue matrix is made of at least one of epoxy resin, modified epoxy resin, organic silicon resin, silicon rubber, polyurethane and phenolic resin;
the solvent material comprises at least one of ethylene glycol butyl ether acetate, ethylene glycol diglycidyl ether, dipropylene glycol methyl ether, ethylene glycol, propylene glycol, terpineol, cyclohexanone and xylene;
the auxiliary agent comprises at least one of a thixotropic agent, a flatting agent and a viscosity reducer.
10. An electromagnetic device, characterized in that it comprises an air gap glue according to any of claims 1 to 9.
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|---|---|---|---|
| CN202111366718.9A CN113913140A (en) | 2021-11-18 | 2021-11-18 | Air gap glue and electromagnetic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111366718.9A CN113913140A (en) | 2021-11-18 | 2021-11-18 | Air gap glue and electromagnetic equipment |
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| CN113913140A true CN113913140A (en) | 2022-01-11 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102942886A (en) * | 2012-11-16 | 2013-02-27 | 明尼苏达矿业制造特殊材料（上海）有限公司 | Magneto-conductivity gluewater and application thereof |
| CN106433533A (en) * | 2016-07-27 | 2017-02-22 | 苏州巨峰电气绝缘系统股份有限公司 | Outdoor high-low-temperature-resistant and thermally-conductive epoxy encapsulating resin and preparation method thereof |
| CN110746919A (en) * | 2019-11-06 | 2020-02-04 | 宜兴市普利泰电子材料有限公司 | Preparation method of pouring sealant for lightweight locomotive electrical equipment |
| CN110884230A (en) * | 2018-09-07 | 2020-03-17 | 日立金属株式会社 | Bonding method and laminated magnet |
| CN113004846A (en) * | 2021-04-13 | 2021-06-22 | 东莞市恒尔朗实业有限公司 | Low-temperature fast-curing epoxy adhesive for flat transformer |
-
2021
- 2021-11-18 CN CN202111366718.9A patent/CN113913140A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102942886A (en) * | 2012-11-16 | 2013-02-27 | 明尼苏达矿业制造特殊材料（上海）有限公司 | Magneto-conductivity gluewater and application thereof |
| CN106433533A (en) * | 2016-07-27 | 2017-02-22 | 苏州巨峰电气绝缘系统股份有限公司 | Outdoor high-low-temperature-resistant and thermally-conductive epoxy encapsulating resin and preparation method thereof |
| CN110884230A (en) * | 2018-09-07 | 2020-03-17 | 日立金属株式会社 | Bonding method and laminated magnet |
| CN110746919A (en) * | 2019-11-06 | 2020-02-04 | 宜兴市普利泰电子材料有限公司 | Preparation method of pouring sealant for lightweight locomotive electrical equipment |
| CN113004846A (en) * | 2021-04-13 | 2021-06-22 | 东莞市恒尔朗实业有限公司 | Low-temperature fast-curing epoxy adhesive for flat transformer |
Non-Patent Citations (1)
| Title |
|---|
| 张先亮 等: "《高分子复合材料核心理论及进展研究》", vol. 1, 中国原子能出版社, pages: 173 * |
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Application publication date: 20220111 |