CN110884230A

CN110884230A - Bonding method and laminated magnet

Info

Publication number: CN110884230A
Application number: CN201910794468.5A
Authority: CN
Inventors: 井手野博人; 南好治; 山脇静香
Original assignee: Hitachi Metals Ltd
Current assignee: Bomai Licheng Co ltd
Priority date: 2018-09-07
Filing date: 2019-08-27
Publication date: 2020-03-17
Anticipated expiration: 2039-08-27
Also published as: JP2020041022A; CN110884230B; JP7232387B2

Abstract

The invention provides an adhesive method and a laminated magnet with high dimensional accuracy, wherein in the step of preparing an adhesive component in the adhesive method, when the thickness (mum) of an adhesive layer is y, a coefficient is a, and the particle diameter (D) of a filler₅₀) (μm) is b, the adhesive layerWhen the thickness (μm) of the thermosetting resin contained is c and the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer is d, the formula (1), (2) and (3) is satisfied, and y is 10 ≦ y ≦ 50 (1) 0.95 × a × b + c is 1.05 × a × b + c (2) a ≦ 1.94 × d +0.68 (3).

Description

Bonding method and laminated magnet

Technical Field

Embodiments of the present invention relate to a bonding method and a laminated magnet.

Background

Currently, Electric Vehicles (EV) are being put to practical use as next-generation vehicles. There are an IPM Motor (Interior Permanent Magnet Motor) in which a Magnet such as a rare earth Permanent Magnet represented by an R-T-B sintered Magnet (R necessarily containing one of Nd and Pr of at least one rare earth element, and T necessarily containing Fe of at least one transition metal element) is embedded in a rotor formed of a silicon steel plate or the like, and a brushless Motor called a Synchronous Reluctance Motor (SynRM), and the like. In addition, the R-T-B sintered magnet is also used in various motors such as a Voice Coil Motor (VCM) of a hard disk drive, a motor for industrial equipment, and a motor for home electric appliances.

When an alternating electric field is applied to the magnet, eddy current is generated to cause eddy current loss. Therefore, for example, a magnet used in IPM needs to reduce eddy current generated in the magnet. Therefore, a method of dividing a magnet into a plurality of magnet pieces and laminating the magnet pieces in an electrically insulated state to be used as a laminated magnet has been disclosed.

For example, patent document 1 describes a method in which a coating film having good insulation properties is formed as a thin film between the magnet pieces, and the ratio of the thickness of the insulating coating film to the total thickness of the insulating coating film over the entire length of the integrated magnet in the stacking direction is set to a specific value.

Documents of the prior art

Patent document 1: international publication No. 01/95460

However, since the magnets used in IPM are often inserted and assembled into slots provided in a rotor formed of a silicon steel plate or the like, high dimensional accuracy is required. However, in order to produce a laminated magnet that satisfies the above requirements, according to the method described in patent document 1, for example, strict film thickness control of the insulating film is required, and it is not easy to improve the dimensional accuracy for each film thickness.

Various embodiments of the present invention provide a bonding method and a laminated magnet with high dimensional accuracy.

Disclosure of Invention

In an exemplary embodiment, the bonding method of the present invention includes: preparing an adhesive component; a step of applying the adhesive component to a first object to be bonded; a step of forming a joined body by providing a second object to be bonded on the first object to be bonded on which the adhesive component is applied and joining the objects to be bonded; and a step of heating the bonded body so as to cure the adhesive component of the bonded body to form an adhesive layer, wherein in the step of preparing the adhesive component, when the thickness (μm) of the adhesive layer is y, the coefficient is a, and the particle diameter (D) of the filler is₅₀) When b is (μm), c is a thickness (μm) of the thermosetting resin contained in the adhesive layer, and d is a mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer, preparations are made so as to satisfy the following expressions (1), (2), and (3).

10≦y≦50 (1)

0.95×a×b+c≦y≦1.05×a×b+c (2)

a＝1.94×d+0.68 (3)

In one embodiment, the particle size distribution of the filler is the particle size (D) of the filler₅₀) The maximum particle diameter of the filler is 1/2 or less.

In one embodiment, the viscosity of the adhesive component applied to the first adherend is not less than 20Pa · s and not more than 500Pa · s.

In one embodiment, in the coating step, the coating is performed in the following manner: when a plurality of adhesive components are applied to the first object to be bonded, and a second object to be bonded is provided on the first object to be bonded, and the long radius or the short radius when at least 1 part of the applied adhesive components is expanded after being pressed is set as a reference, the overlap between the adhesive components when the first object to be bonded and the second object to be bonded are expanded by pressing is 1/2 or less of the long radius or the short radius from the center when the adhesive components are applied.

In one embodiment, in the coating step, the coating is performed in the following manner: when a plurality of portions of the adhesive component are applied to the first object to be bonded, and a second object to be bonded is provided on the first object to be bonded, and the radius of at least 1 portion of the first object to be bonded when the first object to be bonded is expanded after being pressed is set as a reference, the overlap between the adhesive component when the first object to be bonded and the second object to be bonded are expanded by being pressed is set to be equal to or less than 1/2 of the radius from the center of the first object to be bonded when the first object to be bonded and the second object to be bonded are applied.

In one embodiment, the displacement of the thickness of the adhesive layer is 0.01mm or less.

In one embodiment, the maximum particle size of the filler is equal to or smaller than a value obtained by subtracting a thickness of the thermosetting resin contained in the adhesive layer from a thickness of the adhesive layer.

In one embodiment, the thermosetting resin is an epoxy resin.

In one embodiment, the filler is at least any one of alumina and quartz glass.

In one embodiment, the first object to be bonded and the second object to be bonded are magnets.

In other exemplary embodiments, the laminated magnet of the present invention includes: a first magnet; an adhesive layer provided on the first magnet; and a second magnet provided on the adhesive layer, wherein the adhesive layer has a thickness (μm) of y, a coefficient of a, and a particle diameter (D) of a filler₅₀) B is the thickness (μm) of the thermosetting resin contained in the adhesive layer, c is the thickness (μm) of the thermosetting resin contained in the adhesive layer, and d is the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer, the following expressions (1), (2), and (3) are satisfied.

10≦y≦50 (1)

0.95×a×b+c≦y≦1.05×a×b+c (2)

a＝1.94×d+0.68 (3)

In one embodiment, the thermosetting resin is an epoxy resin.

In one embodiment, the filler is at least any one of alumina and quartz glass.

According to the present invention, a bonding method and a laminated magnet with high dimensional accuracy can be provided.

Drawings

Fig. 1 is a view relating to the first application method, (a) is a plan view of a state in which an adhesive component is applied, and (b) is a plan view of a state in which a first object to be adhered and the adhesive component are joined when a second object to be adhered is provided.

Fig. 2 is a view relating to the second application method, (a) is a plan view of a state in which the adhesive component is applied, (b) is a plan view of a state in which the first adhesion object and the adhesive component are placed and joined when the second adhesion object is placed and (c) is a plan view of a state in which the first adhesion object and the adhesive component are placed and joined when the second adhesion object is placed and joined at 1 place applied in (a).

Fig. 3 is a view relating to a third application method, where (a) is a plan view showing a state where an adhesive component is applied, and (b) is a plan view showing a state where a first object to be adhered and the adhesive component are joined together when a second object to be adhered is provided.

Fig. 4 is a diagram relating to a fourth application method, where (a) is a plan view showing a state where an adhesive component is applied, and (b) is a plan view showing a state where a first object to be adhered and the adhesive component are joined together when a second object to be adhered is provided.

Fig. 5 is a diagram relating to a fifth application method, where (a) is a plan view showing a state where an adhesive component is applied, and (b) is a plan view showing a state where a first object to be adhered and the adhesive component are joined together when a second object to be adhered is provided.

Fig. 6 is a diagram relating to a sixth application method, where (a) is a plan view showing a state where an adhesive component is applied, and (b) is a plan view showing a state where a first object to be adhered and the adhesive component are joined together when a second object to be adhered is provided.

Fig. 7 is a view of another coating method according to the sixth coating method, where (a) is a plan view of a state where an adhesive component is coated, (b) is a plan view of a state where a first bonding object and the adhesive component are bonded when a second bonding object is provided and bonded, and (c) is a plan view of a state where the first bonding object and the adhesive component are bonded when the second bonding object is provided and bonded at 1 place coated in (a).

Fig. 8 is a diagram of another application method according to the seventh application method, where (a) is a plan view of a state where the adhesive component is applied, and (b) is a plan view of a state where the first adhesion object and the adhesive component are joined together when the second adhesion object is provided.

Fig. 9 is a sectional view of an embodiment of the first jig, (a) is a sectional view of a state where the joined body is fixed by the jig, and (b) is a sectional view of the holding member.

Fig. 10 is a sectional view of an embodiment of the first clamp, (a) is a sectional view of a first compression member, and (b) is a sectional view of a second compression member.

FIG. 11 is a sectional view of an embodiment of a second jig, wherein (a) is a sectional view of a state where the joined body is fixed by the jig, and (b) is a sectional view of the holding member.

Fig. 12 is a sectional view of an embodiment of the second jig, where (a) is a sectional view of the first compression member, and (b) is a sectional view of the second compression member.

FIG. 13 shows the particle diameter (D) of the filler relative to the thickness of the adhesive layer in example 1₅₀) And a graph showing a relationship between the mass mixing ratio of the filler and the thermosetting resin contained in the adhesive layer.

FIG. 14 is a graph showing the relationship between the particle diameter and the mass mixing ratio of the filler in example 1.

Fig. 15 is a perspective view of a laminated magnet according to example 2, wherein (a) is a perspective view of a state where an adhesive component is applied, and (b) is a perspective view of the laminated magnet after heat curing.

Fig. 16 is a graph showing the displacement of the thickness of the adhesive layer in each sample of example 2.

Description of the reference numerals

1. 31 … adhesive composition

2. 2a, 2b, 2c, 2d, 32 … first object to be adhered

3. 33 … second object to be adhered

10. 20 … clamp

11 … joint body

12. 21 … holding member

13. 22 … first compression member

14. 23 … second compression member

21a … first member

21b … second member

21c … third Member

30 … laminated magnet

34 … adhesive layer

Detailed Description

As a result of the investigation by the present inventors, it was found that the thickness of the adhesive layer was determined by the particle diameter (D) of the filler₅₀) And a linear function-related relationship between the filler and the mass mixing ratio of the thermosetting resin contained in the adhesive layer. Further, as a result of further examination, it was found that the particle diameter (D) of the filler was controlled by considering the correlation of the linear function in order to obtain a desired adhesive layer thickness₅₀) The thickness of the thermosetting resin contained in the adhesive layer and the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer can provide an adhesive with high dimensional accuracy.

Step 1: process for preparing adhesive composition

In the step of preparing the adhesive component, a thermosetting resin and a filler are prepared. By adding the filler to the thermosetting resin, the filler functions as a spacer between the first object to be bonded and the second object to be bonded, and the insulating property of the adhesive layer is improved.

The thermosetting resin may be any material as long as it has insulating properties and is cured by heating, and for example, an epoxy resin or the like can be used. Since the viscosity increases when the filler is added, a material having a viscosity of 100Pa · s or less before the filler is added is used.

The filler may be made of an insulating material, a heat-resistant material, or the like, and does not react with the components in the thermosetting resin.

In addition, in the step of preparing the adhesive component, in order to improve the accuracy of the thickness of the adhesive layer formed after heat curing, a thermosetting resin and a filler are prepared so as to satisfy the following (1) to (3) with respect to a target adhesive layer thickness. As shown in example 1 described later, the thickness of the adhesive layer was determined by the particle diameter (D) of the filler₅₀) And a linear function-related relationship between the filler and the mass mixing ratio of the thermosetting resin contained in the adhesive layer. Taking into account the correlation of the linear function, the particle diameter (D) of the filler is adjusted₅₀) The thickness of the thermosetting resin contained in the adhesive layer and the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer satisfy the following (1) to (3), and the thermosetting resin and the filler are prepared, whereby adhesion with high dimensional accuracy can be achieved.

When the thickness (mum) of the adhesive layer is y, the coefficient is a, and the particle diameter (D) of the filler₅₀) B is the thickness (mum) of the thermosetting resin contained in the adhesive layer, c is the thickness (mum) of the thermosetting resin contained in the adhesive layer, and d is the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer, the expressions (1), (2) and (3) are satisfied.

10≦y≦50 (1)

0.95×a×b+c≦y≦1.05×a×b+c (2)

a＝1.94×d+0.68 (3)

The thickness y of the adhesive layer is preferably set so that the thickness of the cured adhesive layer is between 10 μm and 50 μm as shown in formula (1). When the thickness is less than 10 μm, the insulation performance may be lowered, and when the thickness is more than 50 μm, the dimensional accuracy may be lowered. In the step of preparing the adhesive composition, an arbitrary target thickness may be set. In order to determine whether the thickness of the cured adhesive layer has reached the set target thickness, the thickness of the cured adhesive layer is measured by cutting and polishing the cross section, capturing a cross-sectional image, recognizing the color of the adhesive layer (i.e., the color of the thermosetting resin after heat curing and the color of the filler) from the cross-sectional image data using an image analysis tool, and calculating the average thickness from the area of the adhesive layer.

The particle diameter (D) of the filler is preferred₅₀) b is about half the maximum particle size of the filler. The maximum particle size of the filler is preferably obtained by subtracting the thickness of the thermosetting resin from the thickness of the target adhesive layer. When the maximum particle diameter of the filler is larger than the target adhesive layer thickness, there is a possibility that the dimensional accuracy is lowered and the adhesiveness is lowered.

In addition, due to the particle diameter (D) of the filler₅₀) And the mass mixing ratio of the filler and the thermosetting resin contained in the adhesive layer have a correlation, it is necessary to prepare so as to satisfy expressions (2) and (3) in addition to expression (1). Further, since the value of the mass mixing ratio of the expression (3) is a formula assuming alumina, when a material other than alumina is used, it is necessary to mix the materials in consideration of the difference from the case of using alumina, and when the mass mixing ratio of the material other than alumina is d ', the mass of alumina is e, the specific gravity of alumina is f, the specific gravity of the material other than alumina is f', and the mass of the thermosetting resin contained in the adhesive layer is g, the expression (4) is satisfied.

d′＝(e×f′/f)/g (4)

Further, the particle diameter (D) of the filler₅₀) The particle diameter (D) of the filler contained in the adhesive layer in a heat-cured state₅₀) Due to the particle size (D) of the filler₅₀) Since the particle diameter (D) of the filler before curing can be used in the step of preparing the adhesive component without being greatly changed by heating₅₀) I.e. the particle size (D) of the filler in the form of a powder₅₀). The particle diameter (D) of the filler in the form of powder was measured₅₀) In this case, the measurement is performed by the fraunhofer method (laser diffraction). Further, the particle diameter (D) of the filler contained in the heat-cured adhesive layer was measured₅₀) In the case of measuring the size of each filler, the cross section after heat curing is cut and ground, a cross section image is taken, the color of the filler in the cross section image data is recognized by using an image analysis tool, and the size of each filler is measured and calculated.

The thickness c of the thermosetting resin is the thickness of the thermosetting resin contained in the adhesive layer in a heat-cured state. In the step of preparing the adhesive component, the thickness of the thermosetting resin may be set by obtaining the thickness after curing from the components of the thermosetting resin used and the like. In order to confirm whether the thermosetting resin has reached a set thickness, the cross section after heat curing is cut and polished to capture a cross-sectional image, the color of the thermosetting resin (excluding the filler) is identified from the cross-sectional image data using an image analysis tool, and the average thickness is calculated from the area of the thermosetting resin.

The mass mixing ratio D of the filler and the thermosetting resin contained in the adhesive layer was determined in consideration of the knowledge obtained in example 1 described later, that is, the particle diameter (D) of the filler₅₀) And setting a correlation of linear functions between the filler and the mass mixing ratio of the thermosetting resin contained in the adhesive layer. When the mass mixing ratio of the filler after heat curing and the thermosetting resin contained in the adhesive layer is determined, the cross section is cut and polished, a cross section image is captured, the colors of the thermosetting resin and the filler are recognized from the cross section image data by using an image analysis tool, and the respective areas are measured and calculated in consideration of the mass.

And a step 2: coating adhesive component on first object to be adhered

The step of applying the adhesive component to the first object to be adhered is a step of applying the adhesive component prepared in step 1 to the first object to be adhered, for example, using a dispenser, a doctor blade, or the like. The first object to be bonded is, for example, a magnet, but is not limited thereto.

The viscosity of the adhesive component varies depending on the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer. The larger the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer, the higher the viscosity, and the smaller the value, the lower the viscosity. When the viscosity becomes high, the density of the filler becomes high, so that the thickness of the adhesive layer becomes stable and the dimensional accuracy becomes high. The thickness of the adhesive layer becomes unstable when the viscosity becomes low.

However, if the viscosity of the adhesive component is too high, the area of the filler dedicated to the adhesive surface increases, and thus the adhesive strength may decrease. Further, when the coating is performed by a dispenser, clogging is caused by excessively high viscosity, and therefore, the discharge amount is liable to become unstable, and there is a possibility that the dimensional accuracy is lowered. Therefore, the viscosity is preferably 20 pas to 500 pas. Therefore, the mass mixing ratio of the filler and the thermosetting resin contained in the adhesive layer is preferably set to a maximum value in the range of a viscosity of 20Pa · s to 500Pa · s. This can further stabilize the thickness of the adhesive layer and improve the dimensional accuracy.

Examples of the method of applying the adhesive component include a method of applying the adhesive component to the entire first object to be bonded, and a method of applying the adhesive component at one or more positions. The adhesive composition may be applied by any method, for example, when the first object to be bonded is applied as a whole, the adhesive composition is applied so as not to overflow from the bonding surface when the second object to be bonded is provided to form a joined body. When the adhesive overflows, it is necessary to perform a removal process after the adhesive layer is formed. Further, the removal process may cause the grinding powder to enter the gap between the adhesive layers, resulting in poor insulation. A specific coating method of coating at one or more positions will be described with reference to fig. 1 to 8.

(first coating method)

The coating method is a method of coating the adhesive component at one place when the bonding surface is square. Fig. 1 (a) is a plan view showing a state where the bonding surface of the first object to be bonded is square and the adhesive component is applied to one portion, and fig. 1 (b) is a plan view showing a state where the first object to be bonded and the adhesive component are bonded together after the application as shown in fig. 1 (a) and the second object to be bonded. Fig. 1 (b) is a view of the second object to be bonded being transmitted therethrough.

As shown in fig. 1 (a), for example, the adhesive component 1 is applied in a dot shape to an intersection (center) K1 of two diagonal lines T1 of the first object to be adhered 2 a. Further, when the adhesive component 1 is applied such that a second object to be adhered (not shown) is placed on the first object to be adhered 2a to which the adhesive component 1 is applied and pressurized, the adhesive component 1 is pressed and spread in a substantially circular shape without protruding from the adhering surface M1 as shown in fig. 1 (b).

By coating according to the present coating method, uniformity of thickness of the adhesive component can be more easily ensured and no overflow is generated than in the case of the integral coating method. Further, the dimensional accuracy of the adhesive layer at the time of forming the adhesive layer can be improved.

(second coating method)

The present coating method differs from the first coating method in that the adhesive component is coated at a plurality of positions. In addition, the same reference numerals are given to the same structures as those of the first coating method. Fig. 2 (a) is a plan view showing a state where the adhesive surface of the first object to be adhered is square and the adhesive component is applied at 2 places, and fig. 2 (b) is a plan view showing a state where at least 1 place (2 places in fig. 2 (b)) of the adhesive component applied at fig. 2 (a) is expanded after being pressurized. Fig. 2 (c) is a plan view showing a state of the first bonding object and the adhesive component when the second bonding object is disposed and bonded at 1 of the coating in fig. 2 (a). Fig. 2 (b) and (c) are diagrams of the second object to be bonded.

As shown in fig. 2a, for example, the adhesive component 1 is applied in a linear shape (band-like shape) to the portion 2 so as to be spaced at a predetermined interval in line symmetry with respect to the center line (center line in the direction of D1 in the figure) X1 of a pair of sides (sides on the left and right in the figure) facing one side of the adhesion surface M1 of the first object to be adhered 2a, and so as to intersect the center line X2 in line symmetry with respect to the center line (center line in the direction of D2 in the figure) X2 of a pair of sides (sides on the upper and lower sides in the figure) facing the other side.

Further, by applying the adhesive component 1 at a plurality of places on the first object to be adhered 2a and providing and bonding a second object to be adhered (not shown) on the first object to be adhered 2a, the adhesive component 1 is pressed and spread in a substantially elliptical shape without protruding from the adhering surface M1 as shown in fig. 2 (b). The adhesive components are applied so that the overlap therebetween is no greater than 1/2 (no greater than 1/2 of the short radius R1 shown in fig. 2 (b)) from the center K2 of the application, based on the long radius or the short radius (the short radius R1 in fig. 2 (c)) when the applied adhesive is spread after being pressurized at least at 1 place. In addition, since the coating method is rectangular, the intersection of the diagonal lines T2 of the adhesive component 1 is defined as the center K2 during coating, but in the case of other polygonal shapes, the intersection of the diagonal lines may be defined as the center. In the case of a shape other than the polygonal shape, for example, an elliptical shape, the center is the intersection of the major axis and the minor axis.

When the adhesive components 1 are overlapped with each other, since the overlapped portion is locally thickened, as shown in fig. 2 (c), the short radius R1 when the adhesive is expanded after being pressurized at the position 1 of the application of fig. 2 (a) is measured in advance, and the application is performed after the overlapping position from the center K2 to 1/2 or less of the short radius R1 at the time of application is grasped. Thus, local thickening can be suppressed.

By performing coating according to the present coating method, the area in which the adhesive component 1 is provided can be made larger than when coating is performed at one place. In addition, uniformity of thickness of the adhesive component can be ensured, and dimensional accuracy of the adhesive layer when the adhesive layer is formed can be improved.

(third coating method)

The coating method is different from the first coating method in that the adhesive surface is rectangular. In addition, the same reference numerals are given to the same structures as those of the first coating method. Fig. 3 (a) is a plan view showing a state where the adhesive surface of the first adhesive object is rectangular and one adhesive component is applied, and fig. 3 (b) is a plan view showing a state where the first adhesive object and the adhesive component are joined together when the second adhesive object is provided after the application as shown in fig. 3 (a). Fig. 3 (b) is a view of the second object to be bonded being transmitted therethrough.

As shown in fig. 3 (a), for example, an adhesive component 1 is applied in a dot shape to an intersection K3 of two diagonal lines T3 of the first object to be adhered 2 b. Then, when the adhesive component 1 is applied and a second object to be adhered (not shown) is placed on the first object to be adhered 2b to which the adhesive component 1 is applied and pressurized, the adhesive component 1 is pressed and spread in a substantially circular shape without protruding from the adhering surface M2 as shown in fig. 3 (b).

By coating according to the coating method, it is easier to set without overflowing while ensuring the thickness uniformity of the adhesive component than a method of coating as a whole. Then, the dimensional accuracy of the adhesive layer at the time of forming the adhesive layer can be improved.

(fourth coating method)

The present coating method is different from the third coating method in that the adhesive component is coated at a plurality of positions. In addition, the same reference numerals are given to the same structures as those of the third coating method. Fig. 4 (a) is a plan view showing a state where the bonding surface of the first object to be bonded is rectangular and the adhesive component is applied at 2, and fig. 4 (b) is a plan view showing a state where the first object to be bonded and the adhesive component are bonded together after the application as shown in fig. 4 (a). Fig. 4 (b) is a view of the second object to be bonded being transmitted therethrough.

As shown in fig. 4 (a), the adhesive component 1 is applied at 2 in a dot form, for example, spaced apart at a predetermined interval so as to be line-symmetrical with respect to a center line X3 in the longitudinal direction (direction D3 in the drawing) on the adhesive surface M2 of the first object to be adhered 2b, and applied on the center line X4 so as to be line-symmetrical with respect to a center line X4 in the short direction (direction D4 in the drawing).

Further, when the adhesive component 1 is applied such that a second object to be adhered (not shown) is placed on the first object to be adhered 2b to which the adhesive component 1 is applied and pressurized, the adhesive component 1 is pressed and spread in a substantially circular shape without protruding from the adhering surface M2 as shown in fig. 4 (b).

In addition, in the present application method, the adhesive component 1 is applied at a position not overlapping each other, but in the case of the double application, the radius R2 when the area 1 of the application is expanded after being pressurized is measured in advance, and the application may be performed after grasping the position overlapping 1/2 or less from the center K4 to the radius R2 in the application.

By performing coating according to the present coating method, the area where the adhesive component 1 is provided can be made larger than in the case of one-point coating. In addition, uniformity of thickness of the adhesive component can be ensured, and dimensional accuracy of the adhesive layer when the adhesive layer is formed can be improved.

(fifth coating method)

The present application method is different from the fourth application method in that the adhesive component is applied in a linear (strip-like) form at a plurality of positions when the adhesive surface is in a rectangular form. In addition, the same reference numerals are given to the same structures as those of the fourth coating method. Fig. 5 (a) is a plan view showing a state where the bonding surface of the first object to be bonded is rectangular and the adhesive component is applied at 2, and fig. 5 (b) is a plan view showing a state where the first object to be bonded and the adhesive component are bonded together after the second object to be bonded are applied as shown in fig. 5 (a). Fig. 5 (b) is a view of the second object to be bonded being transmitted therethrough.

As shown in fig. 5 (a), for example, the adhesive component 1 is applied in a linear (strip-like) form at 2, spaced apart at a predetermined interval in line symmetry with respect to a center line X3 in the longitudinal direction (D3 direction in the drawing) of the adhesion surface M2 of the first object to be adhered 2b, and perpendicular to the center line X4 in line symmetry with respect to a center line X4 in the short direction (D4 direction in the drawing).

Further, when the adhesive component 1 is applied and pressurized by providing a second object to be adhered (not shown) on the first object to be adhered 2b to which the adhesive component 1 is applied, the adhesive component 1 is pressed and spread in a substantially elliptical shape without protruding from the adhering surface M2 as shown in fig. 5 (b).

In the present application method, the adhesive component 1 is applied at a position not overlapping each other, but in the case of the double application, the short radius R3 when the applied 1-point is expanded after pressurization is measured in advance, and the position overlapping 1/2 or less of the short radius R3 from the center K5 in the case of the application may be grasped and applied, as in the second application method. In addition, since the coating method is rectangular, the intersection of the diagonal lines T4 of the adhesive component 1 is defined as the center K5 during coating, but the center K5 may be defined as the intersection of the diagonal lines as a center, as in the case of other polygonal shapes. In the case of a shape other than the polygonal shape, for example, an elliptical shape, the center is the intersection of the major axis and the minor axis.

In the present application method, the adhesive component 1 is applied in a linear (strip-like) form at 2, spaced apart at a predetermined interval so as to be line-symmetrical with respect to the center line X3 in the longitudinal direction (D3 direction in the drawing) in the adhesive surface M2 of the first object to be adhered 2b, and perpendicular to the center line X4 so as to be line-symmetrical with respect to the center line X4 in the short side direction (D4 direction in the drawing), but the present application method is not limited thereto. For example, the coating may be applied in a linear (band-like) form at 2, separated at a predetermined interval so as to be line-symmetrical with respect to the center line X4 in the short side direction (D4 direction in the drawing), and perpendicular to the center line X3 so as to be line-symmetrical with respect to the center line X3 in the long side direction (D3 direction in the drawing).

(sixth coating method)

The present coating method is different from the fourth coating method in that the length of the bonding surface in the longitudinal direction is longer than that of the fourth coating method and the adhesive component is more applied in dots. Fig. 6 (a) is a plan view showing a state where the bonding surface of the first object to be bonded is rectangular and the adhesive component is applied at 5, and fig. 6 (b) is a plan view showing a state where the first object to be bonded and the adhesive component are bonded together after the application as shown in fig. 6 (a) and the second object to be bonded. Fig. 6 (b) is a view of the second object to be bonded being transmitted therethrough.

As shown in fig. 6 (a), the adhesive component 1 is applied at 5 in a dot form, for example, spaced apart at a predetermined interval so as to be line-symmetrical with respect to a center line X5 in the longitudinal direction (direction D5 in the drawing) on the adhesive surface M3 of the first object to be adhered 2c, and applied on the center line X6 so as to be line-symmetrical with respect to a center line X6 in the short direction (direction D6 in the drawing).

Further, when the adhesive component 1 is applied so that a second object to be adhered (not shown) is placed on the first object to be adhered 2c to which the adhesive component 1 is applied and pressurized, the adhesive component 1 is pressed and spread in a substantially circular shape without overflowing from the adhering surface M3 as shown in fig. 6 (b).

In addition, in the present coating method, the adhesive component 1 is coated at a position not overlapping each other, but in the case of overlapping coating, for example, coating may be performed as shown in fig. 7. Fig. 7 (a) is a plan view showing a state where the bonding surface of the first object to be bonded is rectangular and the adhesive component is applied to the spot 7, and fig. 7 (b) is a plan view showing a state where the first object to be bonded and the adhesive component are bonded together after the application as shown in fig. 7 (a). Fig. 7 (c) is a plan view showing a state of the first bonding object and the adhesive component at 1 point of application of fig. 7 (a) when the second bonding object is provided and bonded. Fig. 7 (b) and (c) are diagrams of the second object to be bonded.

As shown in fig. 7 (a), the adhesive component 1 is applied in dots at 7, as in fig. 6 (a), and is applied on the center line X6 so as to be line-symmetrical with respect to the center line X5 in the longitudinal direction (direction D5 in the drawing) on the adhesive surface M3 of the first object to be adhered 2c, and so as to be line-symmetrical with respect to the center line X6 in the short direction (direction D6 in the drawing).

Further, when the adhesive component 1 is applied such that a second object to be adhered (not shown) is provided on the first object to be adhered 2c to which the adhesive component 1 is applied and pressurized to such an extent that the adhesive component 1 obtains a target adhesive layer thickness between the first object to be adhered 2c and the second object to be adhered, the adhesive component 1 is pressed and spread in a substantially circular shape without overflowing from the adhesive surface M3 as shown in fig. 7 (b).

In this case, as in the second coating method, at least 1 part of the coating is applied by measuring the radius R4 (radius R4 in fig. 7 (c)) when the coating is expanded after being pressurized by the second bonding object, and the coating can be performed after recognizing the position overlapping from the center K6 to 1/2 or less of the radius R4. That is, the adhesive component 1 is applied so that the adhesive component 1 is applied to the first object to be bonded 2c at a plurality of positions, and the second object to be bonded (not shown) is provided on the first object to be bonded 2c and bonded, and when the radius when at least 1 position of the application is pressed and spread is taken as a reference, the adhesive components overlap each other when the first object to be bonded 2c and the second object to be bonded are pressed and spread, and the radius is 1/2 (1/2 of the radius R4 in fig. 7 (b)) or less from the center at the time of application.

In the present application method, the adhesive component is applied to an odd number of portions, but may be applied to an even number of portions, and the adhesive components 1 may or may not overlap each other.

(seventh coating method)

The present coating method is different from the sixth coating method in that the length of the bonding surface in the short side direction is shorter than that of the sixth coating method and the adhesive component is coated in a linear (band-like) shape at a plurality of places. Fig. 8 (a) is a plan view showing a state where the bonding surface of the first object to be bonded is rectangular and the adhesive component is applied at 4, and fig. 8 (b) is a plan view showing a state where the first object to be bonded and the adhesive component are bonded together after the application as shown in fig. 8 (a). Fig. 8 (b) is a view of the second object to be bonded being transmitted therethrough.

As shown in fig. 8 (a), the adhesive component 1 is applied in a linear shape (strip shape) at 4, for example, spaced at a predetermined interval so as to be line-symmetrical with respect to a center line X7 in the longitudinal direction (D7 direction in the drawing) on the adhesive surface M4 of the first object to be adhered 2D, and applied on the center line X8 so as to be line-symmetrical with respect to a center line X8 in the short direction (D8 direction in the drawing).

Further, when the adhesive component 1 is applied and pressurized by providing a second object to be adhered (not shown) on the first object to be adhered 2d to which the adhesive component 1 is applied, the adhesive component 1 is pressed and spread in a substantially elliptical shape without protruding from the adhering surface M4 as shown in fig. 8 (b).

In the present application method, the adhesive component 1 is applied at a position not overlapping each other, but when the adhesive component 1 is placed in an overlapping manner, the long radius R5 when the applied 1 is expanded after pressurization is measured in advance, and the position overlapping 1/2 or less of the long radius R5 from the center K7 when applied is grasped and applied. In addition, since the coating method is rectangular, the intersection of the diagonal lines T5 of the adhesive component 1 is defined as the center K7 during coating, but the center K7 may be defined as the intersection of the diagonal lines as a center, similarly to the polygonal shape. In the case of a shape other than the polygonal shape, for example, an elliptical shape, the intersection of the major axis and the minor axis may be the center.

In the present application method, the adhesive component is applied to even-numbered portions, but may be applied to odd-numbered portions having 3 or more positions, and the adhesive components 1 may or may not overlap each other.

Step 3: a step of forming a bonded body by providing a second object to be bonded on the first object to be bonded coated with the adhesive component and bonding the second object to be bonded

Step 3 is a step of forming a joined body by providing a second object to be bonded on the first object to be bonded on which the adhesive component is applied and pressing and spreading the adhesive component. The second object to be bonded is, for example, a magnet, but is not limited thereto.

Further, when pressing to press-spread the adhesive component, pressing spreading may be performed using a jig. Since the thickness of the adhesive component can be made uniform by using a jig.

An embodiment of the jig will be described with reference to fig. 9 to 12.

(embodiment of the first jig)

Fig. 9 (a) is a sectional view of the state in which the joint body 11 is fixed by the jig 10, and fig. 9 (b) is a sectional view of the holding member 12. As shown in fig. 9 (a), the jig 10 includes: a holding member 12 in which a recess C1 for holding the joint body 11 is formed; a first pressing member 13 formed in a tapered shape and contacting the joined body 11 disposed in the recess C1 of the holding member 12; and a second pressing member 14 formed in a tapered shape capable of fitting with the first pressing member 13, and provided between the first pressing member 13 and the holding member 12, and pressing the joint body 11 via the first pressing member 13.

Further, the jig 10 is provided with a position adjusting member (not shown) having a surface parallel to the X-Z plane in a contact manner on at least one end surface of the holding member 12 in the Y-axis direction. Then, the position adjustment member covers the recess C1, and is attached with, for example, a screw or the like. In the present embodiment, the position adjustment member is attached by a screw or the like, but is not limited thereto, and may be integrated with the holding member 12.

The holding member 12 and the position regulating member are formed of a material resistant to a heating temperature, for example, a metal. Further, the recess C1 formed on the holding member 12 has a first recess C1a and a second recess C1 b.

As shown in fig. 9 (a) and (b), the recess C1 has a cross section (X-Z section) of substantially 21274;, a vertical section (Y-Z section) of substantially 21274; (when one end face has a position adjustment member) or a substantially mouth shape (when both end faces have position adjustment members). That is, the opening surface 12a side has an opening, and has a first bottom surface 12b provided substantially in parallel with the opening surface 12a, and a pair of first side surfaces 12c provided substantially perpendicular to the first bottom surface 12 b.

The first bottom surface 12b is disposed substantially parallel to the opening surface 12a, and the first side surface 12c and the first bottom surface 12b are disposed substantially perpendicular to each other, but the present invention is not limited thereto. Any pattern may be provided as long as the pressure can be uniformly applied to the engaging body 11, and the shape may be provided so that the line contact and the point contact can be performed at a plurality of places.

The opening width W1 of the first recess C1a is set so as to be able to hold the joint body 11 and to be adjusted to a width that enables the joint body 11 to be uniformly pressed by the first pressing member 13 and the second pressing member 14. Then, the width W2 of the first bottom face 12b is set narrower than the first opening width W1.

The distance W3 from the first opening surface 12a to the first bottom surface 12b is preferably equal to or greater than the length of the joined body 11, i.e., the length in the X-axis direction perpendicular to the Z-axis direction in which the joined body 11 is pressed. When the length is shorter than the length of the joined body 11, it becomes difficult to uniformly press the joined body 11.

The second recessed portion C1b is provided at 2 at a position where the corner 11a of the joined body 11 in contact with the first side surface 12C and the first bottom surface 12b is located, and at a position where the corner 14a of the second pressing member 14 in contact with the first side surface 12C and the first bottom surface 12b is located. That is, as shown in fig. 9 (a) and (b), at the corner of the bottom surface of the concave portion C1 having a substantially Contraband-shaped cross section (X-Z cross section), 2 second concave portions C1b having a substantially Contraband-shaped shape are provided, and have openings facing upward at substantially 45 degrees and facing downward at substantially 45 degrees, respectively. Further, the second concave portion C1b is provided so as to communicate in the Y-axis direction. In the present embodiment, the second recessed portion C1b is provided at 2 positions, but any one of them may be provided.

Further, in the second concave portion C1b, a second bottom portion 12d is provided in a direction intersecting the opening direction E, and a pair of second side surfaces 12E substantially perpendicular to the second bottom portion 12d is provided. The second opening width W4 is set to a width that allows insertion of a part of the corner 11a of the joined body 11 and a part of the corner 14a of the second compression member 14. The second bottom surface 12d is located at a position not in contact with the corner 11a of the inserted joint body 11 and the corner 14a of the second pressing member 14.

Fig. 10 (a) is a cross-sectional view of first compression member 13, and fig. 10 (b) is a cross-sectional view of second compression member 14. As shown in fig. 9 (a), 10 (a), and 10 (b), first compression member 13 includes: a bonding body contact surface 13a which is in contact with the bonding body 11; a bottom surface contact surface 13b contacting the first bottom surface 12 b; a pressing member contact surface 13 c; and an opposing surface 13d opposing the bottom surface contact surface 13 b. The bottom surface contact surface 13b and the opposed surface 13d are disposed substantially perpendicular to the joint body contact surface 13 a. The pressing member contact surface 13c that contacts the second pressing member 14 is inclined with respect to the joint body contact surface 13 a. That is, the bottom surface contact surface 13b is inclined toward the opposed surface 13d so as to approach the junction body contact surface 13 a.

The opposing surface 13d opposing the bottom surface contact surface 13b is provided substantially parallel to the bottom surface contact surface 13b, and the distance W5 between the bottom surface contact surface 13b and the opposing surface 13d is preferably equal to or greater than the length of the joined body 11, i.e., the length in the X-axis direction perpendicular to the Z-axis direction in which the joined body is pressed. When the length is shorter than the length of the joined body 11, it is difficult to uniformly press the joined body 11. The facing surface 13d is not necessarily parallel to the bottom surface contact surface 13 b.

Second compression member 14 has: a holding member contact surface 14b that contacts the holding member 12; a bottom surface contact surface 14c contacting the first bottom surface 12 b; a pressing member contact surface 14d that contacts the first pressing member 13; and an opposed surface 14e opposed to the bottom surface contact surface 14 c. The bottom surface contact surface 14c and the opposed surface 14e are disposed substantially perpendicularly with respect to the holding member contact surface 14 b. The pressing member contact surface 14d, which contacts the first pressing member 13, is inclined with respect to the holding member contact surface 14 b. That is, the pressing member contact surface 13c of the first pressing member 13 is inclined at an angle from the bottom surface contact surface 14c toward the opposed surface 14e so as to be away from the holding member contact surface 14 b. In addition, although the present embodiment is inclined at an angle along the first pressing member contact surface 13c, the inclination may be different as necessary in order to adjust the pressing pressure.

The opposing surface 14e opposing the bottom surface contact surface 14c is provided substantially parallel to the bottom surface contact surface 14c, and the distance W6 between the bottom surface contact surface 14c and the opposing surface 14e is preferably equal to or longer than the length of the joined body 11. Further, the distance W5 between the bottom surface contact surface 13b and the facing surface 13d of the first compression member 13 is preferably equal to or greater than. When the length of the joined body 11 or the distance W5 between the bottom surface contact surface 13b and the opposed surface 13d of the first pressing member 13 is shorter, it becomes difficult to uniformly press the joined body 11. The opposed surface 14e is not necessarily parallel to the bottom surface contact surface 14 c.

In order to heat-cure the adhesive component 1 of the joined body 11 using such a jig 10, first, the joined body 11 is disposed in the first concave portion C1a in the holding member 12. At this time, the first bottom surface 12b and the first side surface 12c contact a position adjustment member not shown. The first object to be bonded 2 of the joined body 11 is in contact with the first side surface 12 c. Further, the second object to be adhered 3 may be in contact with the first side surface 12 c.

Then, the first pressing member 13 is disposed so as to contact the first bottom surface 12b, the position adjustment member, and the joined body 11. At this time, the bottom surface contact surface 13b of the first compression member 13 contacts the first bottom surface 12b, and the joint body contact surface 13a of the first compression member 13 contacts the second object to be bonded 3 of the joint body 11. Further, the first object to be adhered 2 may be in contact therewith.

Subsequently, the second pressing member 14 is pressed so as to contact the first bottom surface 12b, the first side surface 12c, the pressing member contact surface 13c of the first pressing member 13, and the position adjustment member. At this time, the pressing member 14 is pressed so that the bottom surface contact surface 14c of the second pressing member 14 contacts the first bottom surface 12b and the holding member contact surface 14b of the second pressing member 14 contacts the first side surface 12 c.

The bottom surface contact surface 14c of the second compression member 14 does not necessarily have to be in contact with the first bottom surface 12b to the extent of fitting and pressing. Although the applied pressure increases as second pressing member 14 is pressed in the direction of first bottom surface 12b, since joint body 11 is pressed by first pressing member 14, a uniform pressure can be applied from first pressing member 13 to joint body 11.

By forming the joined body 11 by pressing and spreading the adhesive component using the jig 10, uniformity of the thickness of the adhesive component can be ensured, and the dimensional accuracy of the adhesive layer at the time of forming the adhesive layer can be improved.

(second Clamp embodiment)

The present embodiment is different from the first clamp embodiment in that the holding member is composed of a plurality of members, and the first compression member and the second compression member have different shapes. Fig. 11 (a) is a sectional view of the joined body in a state of being fixed by a jig, and fig. 11 (b) is a sectional view of the holding member. As shown in fig. 11 (a), the jig 20 is composed of a plurality of members including: a holding member 21 that forms a recess C2 for holding the joint body 11 by combining members; the first pressing member 22 is in contact with the joint body 11 disposed in the holding member 21; and a second pressing member 23 which is provided between the first pressing member 22 and the holding member 21, and presses the joined body 11 via the first pressing member 22.

Further, the jig 20 is provided with a position adjusting member (not shown) having a surface parallel to the X-Z plane in a contact manner on at least one end surface of the holding member 21 in the Y-axis direction. The position adjustment member is attached to cover the recessed portion C2, for example, with a screw. In the present embodiment, the position adjustment member is attached by a screw or the like, but is not limited thereto, and may be integrated with a part of the member of the holding member 21.

The holding member 21 and the position regulating member are formed of a material resistant to the heating temperature, for example, a metal. Further, the holding member 21 is constituted by three members of a first member 21a, a second member 21b, and a third member 21 c.

The first member 21a is formed in a columnar shape and is in contact with the joined body 11 on the contact surface 21 a-1. Further, the first member 21a is in contact with the second member 21b on the contact surface 21 a-1, and is fixed using a screw or the like, for example. The position where the second member 21b is fixed is a position where the joint body 11 can be held, and is fixed to the end of the contact surface 21 a-1 of the first member 21 a. In the present embodiment, the contact surface 21 a-1 is fixed to an end portion thereof, but may be fixed to a position away from the end portion as long as the position can hold the joined body 11.

The second member 21b has a stepped shape, having a thick-thickness region F1 and a thin-thickness region F2. The thickness is a thickness in the X-axis direction that perpendicularly intersects the Z-axis direction in which the bonded body 11 is pressed. The thick region F1 is a region for holding the bonded body 11, and is in contact with the bonded body 11 through the bonded body contact surface 21 b-1 of the second member 21 b. The thin region F2 is a region that holds the first compression member 22 and the second compression member 23, and is in contact with the first compression member 22 and the second compression member 23 at the compression member contact surface 21 b-2. Also, the coupling body contact surface 21 b-1 and the compression member contact surface 21 b-2 are arranged substantially in parallel, connected by a step surface 21 b-3 between the coupling body contact surface 21 b-1 and the compression member contact surface 21 b-2.

The thick region F1 of the second member 21b is provided to have a thickness such that the joined body 11 does not protrude from the first member 21a when the joined body 11 is held, and the height (length in the Z-axis direction) of the thick region F1 of the second member 21b is not higher than the height (length in the Z-axis direction) of the joined body 11. The thin region F2 is provided to have a thickness not protruding from the third member 21c described later when the first compression member 22 and the second compression member 23 are held. The thin region F2 may be provided so that the first compression member 22 and the second compression member 23 protrude, and may have any thickness as long as a uniform pressure is applied from the first compression member 22 to the joined body 11.

The third member 21c has a length in the X-axis direction that is approximately the same as the length of the first member 21a, and is formed in a columnar shape. Further, the contact surface 21 c-1 of the third member 21c is in contact with the second pressing member 23.

Further, the third member 21c is brought into contact with the second member 21b at the contact surface 21 c-1, and is fixed using a screw or the like, for example. The second member 21b is fixed at a position where the second pressing member 23 can be held, and is fixed to an end of the contact surface 21 c-1 of the third member 21 c. Further, the contact surface 21 c-1 of the third member 21c is fixed in a substantially parallel manner to the contact surface 21 a-1 of the first member 21 a. In the present embodiment, the end portion of the contact surface 21 c-1 is fixed, but may be fixed at a position away from the end portion as long as the position can hold the second pressing member 23.

In the present embodiment, the holding member 21 is formed of three members, but the present invention is not limited to this as long as the joint body 11, the first pressing member 22, and the second pressing member 23 can be arranged, and the first member 21a and the second member 21b, or the second member 21b and the third member 21c may be formed of two members integrally. Further, the first member 21a and a part of the second member 21b, and the other part of the second member 21b and the third member 21c may be integrated into two members, or three members may be integrated into one member.

Fig. 12 (a) is a cross-sectional view of the first compression member, and fig. 12 (b) is a cross-sectional view of the second compression member. As shown in fig. 11 (a) and 12 (a), the first pressing member 22 is formed in a columnar shape, and is provided with a contact surface 22a that contacts the step surface 21 b-3 of the joined body 11 and the second member 21 b. Further, a second member contact surface 22b that contacts the pressing member contact surface 21 b-2 of the second member 21b and a contact surface 22c that contacts the second pressing member 23 are provided.

As shown in fig. 11 (a) and 12 (b), the second compression member 23 is formed in a columnar shape, and the thickness in the Z-axis direction in the direction of pressing the joint 11 is larger than the thickness of the first compression member 22. The thickness of the first compression member 22 and the second compression member 23 may be the same, or the thickness of the first compression member 22 may be thicker.

As shown in fig. 11 (a) and 12 (b), the second pressing member 23 has a pressing member contact surface 23a that contacts the first pressing member 22, a second member contact surface 23b that contacts the pressing member contact surface 21 b-2 of the second member 21b, and a third member contact surface 23c that contacts the third member 21 c.

When the adhesive composition 1 of the joined body 11 is heat-cured using such a jig 20, first, the holding member 21 is assembled using the first member 21a, the second member 21b, and the third member 21c, and the joined body 11 is arranged on the first member 21 a. At this time, the contact surface 21 a-1 of the first member 21a, the joint body contact surface 21 b-1 of the second member 21b, and a position adjusting member not shown are disposed in contact therewith. The contact surface 21 a-1 of the first member 21a is disposed so as to contact one of the first object to be bonded 2 and the second object to be bonded 3 of the joined body 11.

Then, the first pressing member 22 is disposed so that the contact surface 22a of the first pressing member 22 contacts the joint body 11, the step surface 21 b-3 of the second member 21b, and the position adjustment member. The second member contact surface 22b of the first press member 22 is disposed so as to contact the press member contact surface 21 b-2 of the second member 21 b. The first pressing member 22 may be in contact with the stepped surface 21 b-3 of the joined body 11 or the second member 21b, without contacting the pressing member contact surface 21 b-2 of the second member 21 b.

Subsequently, the second pressing member 23 is disposed so as to contact the pressing member contact surface 22c of the first pressing member 22, the pressing member contact surface 21 b-2 of the second member 21b, the contact surface 21 c-1 of the third member 21c, and the position adjustment member, respectively. In addition, the second compression member 23 may not contact the compression member contact surface 21 b-2 of the second member 21 b. Since the applied pressure presses the joint body 11 via the first pressing member 22, a uniform pressure is applied from the first pressing member 22 to the joint body 11.

By forming the joined body 11 by pressing and spreading the adhesive component using the jig 20, uniformity of the thickness of the adhesive component can be ensured, and the dimensional accuracy of the adhesive layer at the time of forming the adhesive layer can be improved.

And step 4: heating step for forming adhesive layer by curing adhesive component of joined body

Step 4 is a step of heating and curing the adhesive component of the formed joined body. At this time, the joined body is heated and cured in a state of being fixed by the jig. In addition, the heat curing may be performed without being fixed by a jig, and may be performed by replacing the heat curing with another jig, or by heat curing without being fixed by a jig.

The heating temperature varies depending on the material of the object to be bonded, the material of the adhesive component, the material of the jig, the heating time, and the like, and the temperature at which the adhesive component is cured is, for example, 100 to 200 ℃.

According to the bonding method of the present invention, a laminated magnet can be obtained by using a magnet (for example, an R-T-B sintered magnet) as the first bonding object and the second bonding object.

That is, the magnet comprises a first magnet, an adhesive layer provided on the first magnet, and a second magnet provided on the adhesive layer, wherein the thickness (μm) of the adhesive layer is y, the coefficient is a, and the particle diameter (D) of the filler₅₀) When b is (μm), c is the thickness (μm) of the thermosetting resin contained in the adhesive layer, and d is the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer, the laminated magnet can be obtained by satisfying the expressions (1), (2), and (3).

10≦y≦50 (1)

0.95×a×b+c≦y≦1.05×a×b+c (2)

a＝1.94×d+0.68 (3)

Example 1

In this example, an R-T-B sintered magnet having a composition of 28 wt% Nd-70 wt% Fe-1 wt% B-1 wt% Co having a size of 8mm in length, 8mm in width and 8mm in height was used as the first and second objects to be bonded. Furthermore, a one-pack epoxy resin having a viscosity of 100Pa · s or less is used as the thermosetting resin. Alumina was used as the filler.

First, an adhesive component is prepared. Specifically, the particle diameter (D) is prepared₅₀) 3.4 μm, 8 μm, 10 μm filler, heat contained in the adhesive layerThe thickness of the curable resin was adjusted to about 10 μm, and the curable resin was mixed in a ratio of 0, 0.3, 0.6, 0.9, and 1.25, respectively, in the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer (mass of filler/mass of thermosetting resin contained in the adhesive layer). Further, the particle diameter (D) of the filler₅₀) Using HELOS manufactured by JAN LASER, K.K&RODES was measured by fraunhofer method (laser diffraction).

Next, as shown in FIG. 1, an adhesive component is applied to each of the first objects to be bonded (R-T-B sintered magnets).

Then, a second object to be bonded (R-T-B sintered magnet) is provided on the first object to be bonded (R-T-B sintered magnet) coated with the adhesive component, and the bonded body is formed. In addition, the jig described in the embodiment using the second jig was engaged.

Subsequently, the joined body fixed to the second jigs is heated for each second jig until the adhesive component is cured.

After heating, the joined body was taken out from the second jig, and the thickness of the adhesive layer of the obtained laminated magnet was measured.

The adhesive layer thickness is calculated from the area of the adhesive layer by cutting and polishing a cross section, capturing a cross-sectional image, recognizing the color of the adhesive layer (i.e., the color of the thermosetting resin and the color of the filler after heat curing) from the cross-sectional image data using an image analysis tool, and calculating the average thickness. The thickness of the thermosetting resin is obtained by cutting and polishing a cross section after heat curing, capturing a cross-sectional image, recognizing the color of the thermosetting resin from the cross-sectional image data using an image analysis tool, and calculating the average thickness from the area of the thermosetting resin.

FIG. 13 is a graph showing the particle diameter (D) of the filler with respect to the thickness of the adhesive layer₅₀) And the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer. Further, the thickness of the adhesive layer and the particle diameter (D) of the filler are expressed in each mixing ratio₅₀) The correlation of (2) is approximated for each mixing ratio.

When the mixing ratio by mass is 0 (when no filler is mixed), the thickness of the thermosetting resin contained in the adhesive layer is about 10 μm, and therefore the thickness of the adhesive layer and the thickness of the thermosetting resin are both about 10 μm.

When the mixing ratio by mass is 0.3, the thickness of the adhesive layer is larger than the thickness (about 10 μm) of the thermosetting resin because the filler is mixed in the thermosetting resin contained in the adhesive layer. It is understood that the larger the particle size of the mixture, the thicker the thickness of the adhesive layer, and the correlation of the linear function is present.

When the mass mixing ratio is 0.6, the thickness of the adhesive layer becomes thicker as the particle diameter of the mixture becomes larger, and the slope of the linear function becomes larger than that when the mass mixing ratio is 0.3. The thickness of the thermosetting resin contained in the adhesive layer was about 10 μm.

The mass mixing ratio of 0.9 is the same as the mass mixing ratios of 0.3 and 0.6, and the thickness of the adhesive layer is increased as the particle diameter of the mixture is increased, and the inclination of the linear function is increased as compared with the case where the mass mixing ratio is 0.3 and 0.6. The thickness of the thermosetting resin contained in the adhesive layer was about 10 μm.

When the mass mixing ratio is 1.25, the thickness of the adhesive layer becomes thicker as the mixed particle diameter becomes larger, and the inclination of the linear function becomes maximum. The thickness of the thermosetting resin contained in the adhesive layer was about 10 μm.

From the above results, it is understood that the particle diameter (D) of the filler is relative to the thickness of the adhesive layer₅₀) And the mass mixing ratio of the filler and the thermosetting resin contained in the adhesive layer has a linear function correlation. Further, the formula (2) of the present invention can be expressed in consideration of the variation of. + -. 5% in the mixing state of the filler or the like.

Further, in order to examine the particle diameter (D) of the filler₅₀) And whether or not there is a correlation between the mass mixing ratio of the filler and the thermosetting resin contained in the adhesive layer and the inclination (coefficient α) of the linear function, and it was found that there is a correlation between the inclination (coefficient α) and the inclination (coefficient α) of the linear function for each mass mixing ratio (0.3, 0.6, 0.9, 1.25) as shown in fig. 14.

Thus, in other wordsThe particle diameter (D) of the filler is adjusted so as to satisfy the correlation between the expressions (2) and (3) within the range shown by the expression (1)₅₀) The adhesive composition is prepared by mixing the thickness of the thermosetting resin contained in the adhesive layer and the mass ratio of the filler to the thermosetting resin contained in the adhesive layer, and the target adhesive layer thickness can be obtained.

For example, as shown in FIG. 13, when the mixing ratio of the particle diameter (D) is 0.3, assuming that the thickness of the adhesive layer is 20 μm₅₀) About 8.5 μm filler. Further, when the mixing ratio by mass was 0.6, the particle diameter (D) was prepared₅₀) The filler of about 5.5 μm may be used, and the particle diameter (D) may be prepared at a mixing ratio of 0.9 by mass₅₀) About 4 μm filler, and particle diameter (D) prepared at a mixing ratio of 1.25₅₀) About 3 μm filler.

In this way, since the target thickness of the adhesive layer can be set within the range shown in expression (1) and preparation is made in advance by applying the inclination (coefficient α) of the linear function obtained by expression (3) to expression (2), adhesion with high dimensional accuracy can be performed.

Example 2

First and second objects to be bonded were prepared in the same manner as in example 1 except that the dimensions of the R-T-B sintered magnet were 6mm in length, 43mm in width, and 8mm in height. In addition, as in example 1, a one-pack epoxy resin having a viscosity of 100Pa · s or less was used as the thermosetting resin, and alumina was used as the filler.

This embodiment will be described with reference to fig. 15 (a), (b), and 16. Fig. 15 (a) is a perspective view showing a state where an adhesive component is applied, and (b) is a perspective view of the laminated magnet after heat curing. Fig. 16 is a graph showing the displacement of the thickness of the adhesive layer in each sample.

In this example, laminated magnets were prepared by using R-T-B sintered magnets having rectangular bonding surfaces on the first and second bonding objects, and the dimensional accuracy thereof was measured. In preparation of the adhesive component, the target thickness of the adhesive layer was 20 μm, the thickness of the thermosetting resin contained in the adhesive layer was 10 μm, and the particle diameter (D) of the filler used was₅₀) 3 μm, and the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layerIs 1.25. These satisfy the formulae (1) to (3) of the present invention. Further, the particle diameter (D) of the filler₅₀) Using HELOS manufactured by JAN LASER, K.K&RODES was measured by fraunhofer method (laser diffraction).

As shown in fig. 15 (a), the adhesive component 31 is applied 8 spots in dots, spaced apart at a predetermined interval so as to be line-symmetrical with respect to the center line X9 in the longitudinal direction (direction D9 in the drawing) of the first object to be adhered 32, and applied on the center line X10 so as to be line-symmetrical with respect to the center line X10 in the short direction (direction D10 in the drawing). At this time, the adhesive component 31 is applied so that when the second object to be adhered 33 is placed on the first object to be adhered 32 to which the adhesive component 31 is applied and pressed, the adhesive component 31 is pressed and spread in a substantially circular shape without protruding from the adhering surface M5 as shown in fig. 15 (b). In addition, the positions of the applied adhesive components 31 do not overlap each other.

Subsequently, a second object to be adhered 33 is provided on the first object to be adhered 32 coated with the adhesive component 31 and the adhesive component 31 is pressed and spread to form a joined body.

Then, after the bonded body is uniformly pressed by the jig described in the first embodiment and fixed at a target bonding layer thickness, each jig is heated until the adhesive component is cured, thereby producing a laminated magnet 30 shown in fig. 15 (b). In order to measure the dimensional accuracy of the

adhesive layer

34, 30 laminated magnets 30 were prepared as a sample.

Next, as shown in fig. 15 (b), in order to examine the dimensional accuracy of the adhesive layer 34 of the laminated magnet 30, the thickness of the adhesive layer 34 at 5 positions (point a, point b, point c, point d, point e) of the laminated magnet 30 of 30 samples was measured, and the difference between the maximum thickness and the minimum thickness at 5 positions was obtained to obtain the displacement (mm). The points a, b, and c are positions on the center line X9 in the longitudinal direction D9, and the points b, D, and e are positions on the center line X10 in the lateral direction D10. In addition, each point is set in a line symmetry manner. The adhesive layer thickness is determined by cutting and polishing a cross section, capturing a cross-sectional image, recognizing the color of the adhesive layer (i.e., the color of the thermosetting resin after heat curing and the color of the filler) from the cross-sectional image data using an image analysis tool, and calculating the average thickness from the area of the adhesive layer.

As a result, as shown in fig. 16, the displacement of any sample was 0.01mm or less, and the dispersion of the displacement between samples was small. That is, a laminated magnet with high dimensional accuracy can be produced.

Claims

1. A bonding method characterized by comprising:

preparing an adhesive component;

a step of applying the adhesive component to a first object to be bonded;

a step of forming a joined body by providing a second object to be bonded on the first object to be bonded on which the adhesive component is applied and joining the objects to be bonded; and

a step of heating the bonded body so that the adhesive component of the bonded body is cured to form an adhesive layer,

in the step of preparing the adhesive component, the thickness (μm) of the adhesive layer is defined as y, the coefficient is defined as a, and the particle diameter (D) of the filler₅₀) B is (μm), c is a thickness (μm) of the thermosetting resin contained in the adhesive layer, and d is a mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer, the preparation is performed so as to satisfy the expressions (1), (2), and (3),

10≦y≦50 (1)

0.95×a×b+c≦y≦1.05×a×b+c (2)

a＝1.94×d+0.68 (3)。

2. bonding method according to claim 1, characterized in that the particle size distribution of the filler is the particle size (D) of the filler₅₀) The maximum particle diameter of the filler is 1/2 or less.

3. The bonding method according to claim 1 or 2, wherein the viscosity of the adhesive component applied to the first object to be bonded is 20Pa · s or more and 500Pa · s or less.

4. The bonding method according to claim 1, wherein in the coating step, the coating is performed in the following manner: when a plurality of adhesive components are applied to the first object to be bonded, and a second object to be bonded is provided on the first object to be bonded, and the long radius or the short radius when at least 1 part of the applied adhesive components is expanded after being pressed is set as a reference, the overlap between the adhesive components when the first object to be bonded and the second object to be bonded are expanded by pressing is 1/2 or less of the long radius or the short radius from the center when the adhesive components are applied.

5. The bonding method according to claim 1, wherein in the coating step, the coating is performed in the following manner: when a plurality of portions of the adhesive component are applied to the first object to be bonded, and a second object to be bonded is provided on the first object to be bonded, and the radius of at least 1 portion of the first object to be bonded when the first object to be bonded is expanded after being pressed is set as a reference, the overlap between the adhesive component when the first object to be bonded and the second object to be bonded are expanded by being pressed is set to be equal to or less than 1/2 of the radius from the center of the first object to be bonded when the first object to be bonded and the second object to be bonded are applied.

6. The bonding method according to claim 1, wherein the displacement of the thickness of the bonding layer is 0.01mm or less.

7. The bonding method according to claim 1, wherein the maximum particle diameter of the filler is equal to or smaller than a value obtained by subtracting a thickness of the thermosetting resin contained in the adhesive layer from the thickness of the adhesive layer.

8. The bonding method according to claim 1, wherein the thermosetting resin is an epoxy resin.

9. The bonding method according to claim 1, wherein the filler is at least one of alumina and silica glass.

10. The bonding method according to claim 1, wherein the first object to be bonded and the second object to be bonded are magnets.

11. A laminated magnet, comprising:

a first magnet;

an adhesive layer provided on the first magnet; and

a second magnet disposed on the adhesive layer,

the adhesive layer has a thickness (μm) of y, a coefficient of a, and a particle diameter (D) of the filler₅₀) B is the thickness (mum) of the thermosetting resin contained in the adhesive layer, c is the thickness (mum) of the thermosetting resin contained in the adhesive layer, and d is the mass mixing ratio of the filler to the thermosetting resin contained in the adhesive layer, the expressions (1), (2) and (3) are satisfied,

10≦y≦50 (1)

0.95×a×b+c≦y≦1.05×a×b+c (2)

a＝1.94×d+0.68 (3)。

12. the laminated magnet according to claim 11, wherein said filler has a particle size distribution in which a particle diameter (D) of said filler₅₀) The maximum particle diameter of the filler is 1/2 or less.

13. The laminated magnet according to claim 11 or 12, wherein a displacement of a thickness of said adhesive layer is 0.01mm or less.

14. The laminate magnet according to claim 11, wherein the maximum particle diameter of the filler is not larger than a value obtained by subtracting a thickness of the thermosetting resin contained in the adhesive layer from a thickness of the adhesive layer.

15. The laminate magnet according to claim 11, wherein said thermosetting resin is an epoxy resin.

16. The laminated magnet according to claim 11, wherein said filler is at least any one of alumina and quartz glass.