CN113905502A - Circuit board assembly, manufacturing method and electronic equipment - Google Patents

Circuit board assembly, manufacturing method and electronic equipment Download PDF

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Publication number
CN113905502A
CN113905502A CN202110596071.2A CN202110596071A CN113905502A CN 113905502 A CN113905502 A CN 113905502A CN 202110596071 A CN202110596071 A CN 202110596071A CN 113905502 A CN113905502 A CN 113905502A
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CN
China
Prior art keywords
board
module
module board
assembly
substrate
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Granted
Application number
CN202110596071.2A
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Chinese (zh)
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CN113905502B (en
Inventor
黄秋育
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
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Honor Device Co Ltd
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Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202110596071.2A priority Critical patent/CN113905502B/en
Publication of CN113905502A publication Critical patent/CN113905502A/en
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Publication of CN113905502B publication Critical patent/CN113905502B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Abstract

The application provides a circuit board assembly, a manufacturing method and electronic equipment, and relates to the technical field of electronics. The special-shaped main board is used for solving the problems that the local strength of the special-shaped main board is low and the board breaking condition is easy to occur. The circuit board assembly comprises a main board, a reinforcing board assembly and at least one component. The main board comprises a first part and a second part, the first part is connected with the second part, the first part is provided with at least one opening, and the main board is provided with a first surface. The reinforcing plate assembly is arranged on the first surface and located on the first portion, the reinforcing plate assembly is electrically connected with the mainboard, the reinforcing plate assembly comprises a plurality of module boards, and at least one part of vertical projections of the module boards on the mainboard are overlapped and connected. At least one component part is arranged on one side surface of the reinforcing plate assembly, which is far away from the main board, and is electrically connected with the main board through the reinforcing plate assembly.

Description

Circuit board assembly, manufacturing method and electronic equipment
Technical Field
The present disclosure relates to the field of electronic technologies, and in particular, to a circuit board assembly, a manufacturing method thereof, and an electronic device.
Background
Electronic devices have become an indispensable tool in people's daily life. The electronic equipment is connected with other electronic elements, such as a display module, a camera module, an audio module, a battery and the like through the mainboard.
Some existing main boards are irregular in shape, and some areas with narrow width or corner areas exist on the main boards, so that the areas are poor in strength and risk of board breaking.
In order to solve the problems, the local strength of the special-shaped main board can be improved by arranging the module board on the special-shaped main board, but the cost for arranging the module board on the whole special-shaped main board is too high, and the machinability is low; the workability can be improved by dividing the module board, but the strength of the main board region corresponding to the division is not enhanced, and there is still a risk of breaking the board.
Disclosure of Invention
The embodiment of the application provides a circuit board assembly, a manufacturing method and electronic equipment, and can solve the problem that the local strength of a special-shaped mainboard is low.
In order to achieve the above purpose, the following technical solutions are adopted in this embodiment:
in a first aspect, a circuit board assembly is provided that includes a main board, a stiffener assembly, and at least one component. The main board comprises a first part and a second part, the first part is connected with the second part, the first part is provided with at least one opening, and the main board is provided with a first surface. The reinforcing plate assembly is arranged on the first surface and located on the first portion, the reinforcing plate assembly is electrically connected with the mainboard, the reinforcing plate assembly comprises a plurality of module boards, and at least one part of vertical projections of the module boards on the mainboard are overlapped and connected. The part of the at least one component is arranged on the surface of one side, away from the main board, of the reinforcing board assembly and is electrically connected with the main board through the reinforcing board assembly.
In the embodiment of the application, the main board comprises a first part and a second part which are connected. Wherein the first part is provided with at least one opening for avoiding other electronic components, such as a camera or the like. However, the strength of the first portion having the opening may be less than the strength of the second portion. In this case, a reinforcing plate assembly may be provided on the first surface of the main plate at a position of the first portion to improve the overall strength of the first portion of the main plate. The reinforcing plate assembly includes a plurality of module boards, and at least a portion of vertical projections of the plurality of module boards on the main board are overlapped and connected, respectively. Therefore, the plurality of module boards continuously cover the first part, gaps among the module boards are avoided, and the area where the reinforcing plate assembly is located is provided with the area which does not cover the first part, so that the strength of the peripheral area of the opening of the main plate is increased, and the integral strength of the main plate is improved. And, this part components and parts set up in the side surface that the mainboard is kept away from to the reinforcing plate subassembly to be connected with the mainboard electricity through the reinforcing plate subassembly, so, can set up components and parts on the reinforcing plate subassembly equally, these components and parts can be connected with the mainboard electricity through the reinforcing plate subassembly. Under the condition, the reinforcing plate assembly can be arranged on the first surface of the main board, and components can be arranged on one side, away from the main board, of the reinforcing plate assembly, so that the effective layout area of the components in the circuit board assembly is increased.
Optionally, the reinforcing plate assembly includes a first module plate and a second module plate, the first module plate is disposed on the first surface and electrically connected to the main board; the second module board is arranged on the first surface, one part of the second module board is arranged in a stacking mode and electrically connected with one part of the first module board, and the other part of the second module board is electrically connected with the main board. Because one part of the first module board and one part of the second module board are arranged in a stacked mode, the vertical projections of the first module board and the second module board on the main board can be mutually overlapped and connected, so that the two module boards continuously cover the first part, the situation that a gap exists between the module boards, the area where the reinforcing board assembly is located has an area which does not cover the first part is avoided, and the strength of the first part of the main board is improved.
Optionally, the first module board is far away from the surface of the main board, and one side of the first module board close to the second module board is recessed towards the direction close to the main board to form a first step surface; the second module board is close to the surface of the main board, and one side close to the first module board is recessed towards the direction far away from the main board to form a second step surface; wherein the first step surface and the second step surface are stacked and electrically connected. The protruding part of the first module plate can be arranged on the recessed part of the second module plate, and the protruding part of the second module plate is arranged on the recessed part of the first module plate, so that the first module plate and the second module plate can be arranged in a stacked mode, and the strength of a gap between the first module plate and the second module plate can be improved.
Optionally, the reinforcing plate assembly includes a first module plate, a second module plate and a third module plate, the first module plate is disposed on the first surface and electrically connected to the main board; the second module board is arranged on the first surface and is electrically connected with the main board; the third module board is arranged on one side of the first module board far away from the mainboard, the third module board is arranged with the first module board in a stacking mode, the other part of the third module board is arranged with the second module board in a stacking mode, and the third module board is electrically connected with the first module board and the second module board respectively. Because the third module board is located on one side of the first module board far away from the main board and is simultaneously stacked with the first module board and the first module board, in this way, the vertical projections of the first module board and the second module board on the main board can be overlapped and connected through the vertical projection of the third module board on the main board. Therefore, the three module plates continuously cover the first part, the phenomenon that gaps exist among the module plates, and the area where the reinforcing plate assembly is located has the area which does not cover the first part is avoided, and the strength of the gap between the first module plate and the second module plate is improved through the third module plate.
Optionally, a side surface of the first module board away from the main board is flush with a side surface of the second module board away from the main board. In this way, the side surfaces of the first module board and the second module board away from the main board are located on the same plane. Under this condition, when the surface of keeping away from the mainboard at first module board and the surface that the mainboard was kept away from to the second module board set up components and parts, the thickness that the components and parts that lie in the direction of perpendicular to mainboard on the different module boards can be the same to make the distance between circuit board assembly and the mainboard backshell control easily, be convenient for lay electronic components.
Optionally, at least one component is disposed on a side surface of the first module board away from the main board. The area of the layout-capable area of the components in the circuit board assembly is increased by arranging the components on the first module board.
Optionally, a first accommodating groove is formed in the first module board, the first accommodating groove penetrates through the first module board in a direction perpendicular to the main board, and a part of the at least one component is disposed on a side surface of the second module board, which is far away from the main board. When promoting mainboard intensity, can also directly set up components and parts on the mainboard, when components and parts are different along the thickness of the direction of perpendicular to mainboard, the great components and parts of thickness can set up in first holding tank to make the distance between the components and parts that are located first holding tank and the mainboard backshell, and the difference of distance between the components and parts that are located first module board and the mainboard backshell is littleer, so that the distance between control circuit board subassembly and the mainboard backshell. And set up components and parts in first holding tank, can form the protection to components and parts.
Optionally, the at least one component includes a first component and a second component, the first component is disposed on a side surface of the first module board away from the motherboard, and the second component is disposed on a side surface of the second module board away from the motherboard. Not only can set up components and parts on first module board, can also set up components and parts on second module board to the region of laying of components and parts in the circuit board subassembly has further been increased.
Optionally, the at least one component further includes a third component and a fourth component, the first module board is provided with a first accommodating groove, the first accommodating groove penetrates through the first module board along a direction perpendicular to the main board, and the third component is located in the first accommodating groove and arranged on the first surface; the second module board is provided with a second accommodating groove, the second accommodating groove penetrates through the second module board along the direction perpendicular to the main board, and the fourth component is located in the second accommodating groove and arranged on the first surface. Not only can set up components and parts in the first holding tank, can also set up components and parts in the second holding tank to form the protection to more components and parts.
Optionally, at least one component is disposed on the first surface. When the reinforcing plate assembly does not need to cover the whole main board, components can still be arranged in the region where the reinforcing plate assembly is not arranged, and the region where the reinforcing plate assembly covers the main board is reduced, so that the production cost is reduced.
Optionally, the module board is one of a planar grid array package substrate, a pin grid array package substrate, a ball grid array package substrate, and a frame board.
In a second aspect, a manufacturing method of the circuit board assembly is provided, where the manufacturing method includes: providing a main board; forming a reinforcing plate assembly, wherein the reinforcing plate assembly comprises a plurality of module plates, and at least one part of vertical projection of the module plates on the main plate is overlapped and connected with each other; arranging a reinforcing plate component on the main board; and one side surface of the reinforcing plate assembly, which is far away from the main plate, is provided with components, and the components are electrically connected with the main plate through the reinforcing plate assembly. The reinforcing plate assembly is arranged on the main board and comprises a plurality of module boards, and at least one part of vertical projection of the module boards on the main board is overlapped and connected with each other. Therefore, the plurality of module boards continuously cover the first part, gaps among the module boards are avoided, and the area where the reinforcing plate assembly is located is provided with the area which does not cover the first part, so that the strength of the peripheral area of the opening of the main plate is increased, and the integral strength of the main plate is improved. And be provided with components and parts on the gusset plate subassembly, can increase the laying area of components and parts in the circuit board subassembly.
Optionally, forming the gusset assembly comprises: providing a first substrate, forming conductive circuits on two sides of the first substrate, and forming a first through hole penetrating through the first substrate, wherein the first through hole is electrically connected with the conductive circuits formed on two sides of the first substrate; stacking a plurality of first substrates to form a first module plate, and removing a part of the first module plate to form a first step surface; providing a second substrate, forming conductive circuits on two sides of the second substrate, and forming a second through hole penetrating through the second substrate, wherein the second through hole is electrically connected with the conductive circuits formed on two sides of the second substrate; stacking a plurality of second substrates to form a second module plate, and removing a part of the second module plate to form a second step surface; the first step surface and the second step surface are arranged in a stacked manner and electrically connected. The first module board and the second module board are arranged in a laminated mode through the two step faces, namely the first module board and the second module board can continuously cover the local area of the main board, and therefore the strength of the gap between the first module board and the second module board can be improved.
Optionally, forming the gusset assembly comprises: providing a first substrate, forming conductive circuits on two sides of the first substrate, and forming a first through hole penetrating through the first substrate, wherein the first through hole is electrically connected with the conductive circuits formed on two sides of the first substrate; stacking a plurality of first substrates to form a first module board; providing a second substrate, forming conductive circuits on two sides of the second substrate, and forming a second through hole penetrating through the second substrate, wherein the second through hole is electrically connected with the conductive circuits formed on two sides of the second substrate; stacking a plurality of second substrates to form a second module board; providing a third substrate, forming conductive circuits on two sides of the third substrate, and forming a third through hole penetrating through the third substrate, wherein the third through hole is electrically connected with the conductive circuits formed on two sides of the third substrate; stacking a plurality of third substrates to form a third module board; arranging a first module board and a second module board on the mainboard and electrically connecting the first module board and the second module board with the mainboard; and arranging a third module board on one side of the first module board, which is far away from the mainboard, wherein one part of the third module board is arranged in a stacking manner and is electrically connected with the first module board, and the other part of the third module board is arranged in a stacking manner and is electrically connected with the second module board. Because the third module board is located the first module board and keeps away from the one side of mainboard and simultaneously with first module board and the range upon range of setting of first module board, so for three module board continuously covers the local area of mainboard, has avoided having the clearance between the module board, thereby improves the intensity of clearance department between first module board and the second module board through the third module board.
In a second aspect, an electronic device is provided, comprising a housing and the circuit board assembly of any one of the first aspect, the circuit board assembly being located within the housing.
Drawings
Fig. 1 is a block diagram of an electronic device provided in an embodiment of the present application;
fig. 2 is an exploded view of an electronic device provided in an embodiment of the present application;
fig. 3 is a block diagram of a circuit board assembly on an electronic device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a circuit board assembly including a reinforced board assembly according to an embodiment of the present application;
fig. 6 is a top view structural diagram of the reinforced board assembly provided in the embodiment of the present application, which covers only a first partial area of the main board;
FIG. 7 is a top view of a reinforced board assembly around an opening in a first portion of a main board according to an embodiment of the present disclosure;
fig. 8 is a top structural view of a second portion of the circuit board assembly, where the reinforcing board assembly of the circuit board assembly extends to the main board according to the embodiment of the present application;
fig. 9 is a top view structural diagram of an opening of a main board according to an embodiment of the present disclosure;
fig. 10 is a top view structural diagram of another opening of a main plate according to an embodiment of the present application;
fig. 11 is a top view structural diagram of a circuit board assembly provided with a chip in a reinforced board assembly according to an embodiment of the present disclosure;
fig. 12 is a top view structural diagram of a reinforcing board assembly of a circuit board assembly according to an embodiment of the present application covering an entire main board;
fig. 13 is a schematic structural diagram of a module board as a planar grid array package substrate according to the present application;
fig. 14 is a schematic structural diagram of a module board as a pin grid array package substrate according to the present application;
FIG. 15 is a schematic structural diagram of a ball grid array package substrate as a module board according to the present invention;
fig. 16 is a top view structural diagram of a reinforced board assembly of a circuit board assembly in an example embodiment of the present application;
fig. 17 is a front view structural diagram of a reinforcing plate assembly of a circuit board assembly in an example embodiment of the present application;
fig. 18 is a front view structural diagram of another reinforced board assembly of the circuit board assembly in an example first provided by the embodiment of the present application;
fig. 19 is a front view structural diagram of another reinforcing plate assembly of the circuit board assembly in the example first embodiment of the present application;
fig. 20 is a front view structural diagram of another reinforcing plate assembly of the circuit board assembly in the example first embodiment of the present application;
fig. 21 is a front view structural diagram of another reinforcing plate assembly of the circuit board assembly in the example first embodiment of the present application;
fig. 22 is a top view structural diagram of another reinforced board assembly of the circuit board assembly in an example first provided by an embodiment of the present application;
fig. 23 is a top structural view of another reinforcing plate assembly of the circuit board assembly in the example first embodiment of the present application;
fig. 24 is a top view structural diagram of yet another stiffener assembly for a circuit board assembly in accordance with an exemplary embodiment of the present disclosure;
fig. 25 is a top view structural diagram of yet another reinforcing plate assembly of the circuit board assembly in the example first embodiment of the present application;
fig. 26 is a top view structural diagram of yet another stiffener assembly for a circuit board assembly in accordance with an exemplary embodiment of the present disclosure;
fig. 27 is a top view structural diagram of yet another stiffener assembly for a circuit board assembly in accordance with an exemplary embodiment of the present disclosure;
fig. 28 is a top view structural diagram illustrating a first accommodating groove formed in a first module board according to an embodiment of the present disclosure;
fig. 29 is a front view structural diagram illustrating a first accommodating groove formed in a first module board according to an embodiment of the present application;
fig. 30 is a top view structural diagram illustrating a second accommodating groove formed in a second module board according to an embodiment of the present application;
fig. 31 is a front view structural diagram illustrating a second accommodating groove formed in a second module board according to an embodiment of the present application;
fig. 32 is a schematic structural diagram of a first step in a manufacturing process of a circuit board assembly according to an embodiment of the present application;
fig. 33 is a schematic structural diagram of a second step of a manufacturing process of a circuit board assembly according to an embodiment of the present application;
fig. 34 is a schematic structural diagram of a third step in the manufacturing process of the circuit board assembly according to the embodiment of the present application;
fig. 35 is a schematic structural diagram of a fourth step in the manufacturing process of the circuit board assembly according to the embodiment of the present application;
fig. 36 is a schematic structural diagram of a fifth step in the manufacturing process of the circuit board assembly according to the embodiment of the present application;
fig. 37 is a schematic structural diagram of a sixth step in the manufacturing process of the circuit board assembly according to the embodiment of the present application;
fig. 38 is a schematic structural diagram of a seventh step in the process for manufacturing a circuit board assembly according to the embodiment of the present application;
fig. 39 is a schematic structural diagram of an eighth step in the manufacturing process of the circuit board assembly according to the embodiment of the present application;
fig. 40 is a front view structural diagram of a reinforcing plate assembly of a circuit board assembly in an example second embodiment of the present application;
fig. 41 is a front view structural diagram of another reinforced board assembly of the circuit board assembly in the second example provided in the embodiment of the present application;
fig. 42 is a front view structural diagram of another reinforcing plate assembly of the circuit board assembly in the second example provided in the embodiment of the present application.
Reference numerals: 10-an electronic device; 100-screen; 200-middle frame; 300-a rear shell; 400-a circuit board assembly; 410-a main board; 411-first part; 412-a second portion; 413-opening; 414 — a first surface; 420-reinforcing plate assembly; 421-module board; 422-a first module board; 4221-a first step surface; 4222-a first holding tank; 4223-a first substrate; 42231-core plate; 42232-copper foil; 4224-a first via; 4225-a third substrate; 4226-a third via; 423-a second module board; 4231-a second step surface; 4232-a second holding tank; 4233-a second substrate; 4234-a second via; 4235-a fourth substrate; 4236-a fourth via; 424-a third module board; 4241-third step surface; 430-chip; 431-a first chip; 432-a second chip; 433-a third chip; 434-a fourth chip; 435-fifth chip; 500-camera.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
Further, in the present application, directional terms such as "upper" and "lower" are defined with respect to a schematically-disposed orientation of components in the drawings, and it is to be understood that these directional terms are relative concepts that are used for descriptive and clarity purposes and that will vary accordingly with respect to the orientation in which the components are disposed in the drawings.
In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate. In addition, "electrically connected" is to be understood in a broad sense, for example, the "electrically connected" may be a direct contact electrical connection between two conductive components, or may also be an indirect electrical connection between conductive components through other intermediaries.
The present application provides an electronic device, which may include a device requiring data storage, such as a mobile phone, a tablet personal computer (tablet personal computer), a laptop computer (laptop computer), a Personal Digital Assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, Augmented Reality (AR) glasses, an AR helmet, Virtual Reality (VR) glasses, or a VR helmet. The embodiment of the present application does not specifically limit the specific form of the electronic device. For convenience of description, the electronic device 10 is exemplified as a mobile phone as shown in fig. 1.
Referring to fig. 1 and fig. 2, fig. 1 is a perspective view of an electronic device 10 according to some embodiments of the present disclosure, and fig. 2 is an exploded view of the electronic device 10 shown in fig. 1. As can be seen from the above, in the present embodiment, the electronic device 10 is a mobile phone. The electronic device 10 may include a screen 100, a middle frame 200, a rear case 300, and a Printed Circuit Board Assembly (PCBA) 400 and a camera 500 fixed on the middle frame 200 as shown in the figure.
The middle frame 200 and the rear case 300 of the electronic device 10 constitute a housing of the electronic device 10, which protects components inside the electronic device 10 and can make the appearance of the electronic device 10 more beautiful.
In some embodiments of the present application, as shown in fig. 3, the circuit board assembly 400 includes a Printed Circuit Board (PCB) 410 and a component (the component may be a chip 430, a capacitor, an inductor, or other electronic device, and hereinafter, the component is described as an example of the chip 430), the motherboard 410 has a first surface 414, the first surface 414 is a surface of the motherboard 410 facing the mobile phone rear case 300, and at least one chip 430 may be disposed on the first surface 414.
In some embodiments of the present application, to enable motherboard 410 to bypass electronic components, for example, camera 500. An opening 413 shown in fig. 3 can be formed in the main plate 410, and the main plate 410 is sleeved on the camera 500 through the opening 413, so that the purpose of avoiding the camera 500 is achieved. In this case, the main board 410 may be divided into a first portion 411 and a second portion 412 connected to each other as shown in fig. 4, and the first portion 411 is opened with at least one opening 413.
However, although the opening 413 is able to escape the camera or other electronic components, the opening 413 causes the overall strength of the first portion 411 to be less than the overall strength of the second portion 412, leaving the first portion 411 at risk of breaking the board. To solve the above problem, as shown in fig. 5, the circuit board assembly 400 provided by the present application further includes a reinforcing plate assembly 420, and the reinforcing plate assembly 420 is disposed on the first surface 414 of the main board 410 and located at the first portion 411. The overall strength of the first portion 411 is improved by the reinforcing plate assembly 420, thereby preventing the main plate 410 from being damaged due to insufficient strength.
In some embodiments of the present application, as shown in fig. 6, the reinforcing plate assembly 420 provided herein includes a plurality of module plates 421, and at least a portion of vertical projections of the plurality of module plates 421 on the main plate 410 are overlapped and connected, respectively. In this way, the plurality of module boards 421 can continuously cover the first portion 411 of the main board 410, so as to avoid a gap between the module boards 421, and thus the area where the reinforcing board assembly 420 is located has an area not covering the first portion 411, that is, an area where stress is weak is not formed on the first portion 411 covered by the module boards 421, so that the overall strength of the first portion 411 of the main board 410 is enhanced, and the main board 410 is prevented from being damaged.
It should be noted that the reinforcing plate assembly 420 composed of the plurality of module plates 421 may cover only a partial area on the first portion 411, and as shown in fig. 6, the module plates 421 are disposed in an area with weak strength around the opening 413, so as to improve the overall strength of the main plate 410. The weaker region, such as the narrower width border region, is less able to withstand the forces due to its narrower width, thus resulting in a weaker region. Or the corner position, because the corner position is located at the intersection point of the two areas on the main board 410, when the two areas are stressed, the corner will bear two external forces, and therefore, the strength of the corner position is low. In this case, by providing a plurality of module boards 421 on the local area with relatively weak strength on the first portion 411, the strength of the local area with weak strength can be compensated, that is, the thickness of the local area with weak strength is increased, so that the magnitude of the force that can be borne by the local area is increased, and the overall strength of the main board 410 can be improved; as shown in fig. 7, the reinforcing plate assembly 420 may also be disposed around a circumference of the opening 413 to enhance the overall strength of the first portion 411 of the main plate 410.
In addition, as shown in fig. 7, the module board 421 may be provided only on the first portion 411 on the main board 410. For example, the opening 413 is a rectangular opening 413, four module boards 421 are respectively disposed along the edge of the opening 413, and the four module boards 421 are sequentially distributed end to end around a circumference of the opening 413, that is, the end to end regions of the four module boards 421 are partially overlapped with each other, so that the vertical projections of the module boards 421 on the main board 410 are overlapped, and thus the four module boards 421 can continuously cover a circumference of the opening 413 to reinforce the strength of the circumference region of the opening 413.
Alternatively, as shown in fig. 8, the reinforced board assembly 420 may extend toward the second portion 412 and cover a local area of the second portion 412, for example, the width of one module board 421 adjacent to the second portion 412 is increased, and the module board 421 extends to the second portion 412, so that the strength of the joint of the first portion 411 and the second portion 412 can be increased to further strengthen the overall strength of the main board 410; therefore, the present application is not particularly limited thereto.
The above description is made by taking the opening 413 as a rectangle, the opening 413 on the main board 410 provided by the present application may be a square, a regular polygon, a circle, or other irregular shapes, so that the main board 410 forms an irregular shaped main board 410.
The opening 413 may be a closed opening 413 as shown in fig. 8; or may be an unclosed opening 413 extending to an edge of the main plate 410, for example, as shown in fig. 9, the opening 413 extends to one side edge of the main plate 410; as shown in fig. 10, the opening 413 may also extend to adjacent two side edges of the main board. Thereby forming an unclosed opening 413. Therefore, the present application is not limited to the specific structure of the opening 413.
On this basis, since the main board 410 is provided with at least one opening 413, the layout area on the first surface 414 of the main board 410, which can be used for layout of the chip 430 or other electronic components, is reduced. Also, the reinforcing plate assembly 420 for increasing the strength of the main plate 410 occupies a partial area of the first surface 414, resulting in a further reduction in the routable area on the first surface 414.
Therefore, in order to increase the effective layout area of the main board 410, as shown in fig. 11, the at least one chip 430 is partially disposed on a side surface of the stiffener assembly 420 away from the main board 410, and is electrically connected to the main board 410 through the stiffener assembly 420. Thus, the chips 430 may be also disposed on the module boards 421, and the chips 430 on the module boards 421 are electrically connected to the main board 410 through the module boards 421, so as to achieve the purpose of ensuring the communication between the chips 430 and the main board 410. Thereby ensuring that the effective layout area on the main board 410 is not reduced.
The effective layout area of the main board 410 is an area of a region where the chips 430 can be arranged on the main board 410, for example, when the reinforced board assembly 420 cannot conduct electricity (i.e., the chips 430 cannot be arranged), the chips 430 can be arranged only in a region where the reinforced board assembly 420 is not arranged on the first main board 410, and thus the layout area is small. Compared with the scheme, the chip 430 can be arranged on one side, far away from the main board, of the reinforcing board assembly 420, namely, the chip 430 can be arranged on one side, far away from the main board, of the reinforcing board assembly 420 except for the area, far away from the main board, of the main board 410, and therefore the area of the area, far away from the main board, of the chip 430 on the main board 410 is increased.
It should be noted that the at least one chip 430 is partially disposed on the surface of the reinforcing plate assembly 420 on the side away from the main plate 410, which means that the reinforcing plate assembly 420 does not cover the entire main plate 410, and therefore, a part of the chip 430 is disposed on the reinforcing plate assembly 420, and another part is disposed in the area where the reinforcing plate assembly 420 is not disposed (including the second part 412 of the main plate 410 and the area where the reinforcing plate assembly 420 is not disposed on the first part 411 of the main plate 410).
In addition, as shown in fig. 12, when the reinforcing plate assembly 420 provided herein covers the entire main plate 410 (including the first portion 411 and the second portion 412), the at least one chip 430 may be entirely disposed on the reinforcing plate assembly 420 and electrically connected to the main plate 410 through the reinforcing plate assembly 420.
The present application provides a circuit board assembly 400, which on one hand prevents gaps between a plurality of module boards 421 by the reinforcing board assembly 420, i.e. the plurality of module boards 421 continuously cover the first portion 411 of the main board 410, so that the area where the reinforcing board assembly 420 is located has an area not covering the first portion 411, thereby increasing the strength of the area covered by the reinforcing board assembly 420 (i.e. the area with weaker strength around the opening 413). On the other hand, a part of the chips 430 is electrically connected to the main board 410 through the reinforcing board assembly 420, so that the chips 430 disposed on the side of the module board 421 away from the main board 410 can also communicate with the main board 410, thereby increasing the effective layout area of the chips 430 in the circuit board assembly 400.
On this basis, in order to enable the module board 421 in the stiffener plate assembly 420 to be electrically connected with the main board 410, in some embodiments of the present application, the module board 421 may be a Land Grid Array (LGA) package Substrate (SUB). In this case, as shown in fig. 13, the module board 421 is configured to be electrically connected to the main board 410 such that a plurality of bosses are provided on a surface of the module board 421 facing the main board 410, and the surface of the bosses facing the main board 410 is a flat surface and is electrically connected to the main board 410 by protrusions.
The module board 421 may be a Pin Grid Array (PGA) package Substrate (SUB). In this case, as shown in fig. 14, the module board 421 is configured to be electrically connected to the main board 410 by having a plurality of pins on a surface of the module board 421 facing the main board 410, and electrically connected to the main board 410 through the pins.
In addition, the module board 421 may also be a Ball Grid Array (BGA) package Substrate (SUB). In this case, as shown in fig. 15, the module board 421 is configured to be electrically connected to the main board 410 in such a manner that the module board 421 has a plurality of spherical protrusions on a surface thereof facing the main board 410, and is electrically connected to the main board 410 through the spherical protrusions.
Note that, the plurality of module boards 421 may use the same substrate, or may use different substrates as the module boards 421, which is not particularly limited in this application.
As can be seen from the above description, in order to increase the local strength of the main board 410, a plurality of module boards 421 are required, and at least a part of the vertical projections of the plurality of module boards 421 on the main board 410 are overlapped and connected, so that the plurality of module boards 421 can continuously cover the local area of the main board 410, thereby increasing the local strength of the main board 410. The connection structure between the plurality of module boards 421 in the reinforcing board assembly 420 will be described in detail below by way of specific examples.
Example 1
In this example, as shown in fig. 16, a gusset assembly 420 is provided that includes a first module plate 422 and a second module plate 423 arranged in a stack.
The first module board 422 and the second module board 423 are disposed on the first surface 414 of the main board 410, a portion of the second module board 423 is stacked with a portion of the first module board 422, and another portion of the second module board 423 is disposed on the first surface 414 of the main board 410. That is, there is a partial overlap between the first module board 422 and the second module board 423, and thus, there is no space between the first module board 422 and the second module board 423, that is, an area of the main board 410 between the first module board 422 and the second module board 423 is covered by the portion where the first module board 422 and the second module board 423 overlap with each other, so that there is no area that is not reinforced on the area covered by the first module board 422 and the second module board 423.
In this case, in order to partially laminate the first module board 422 and the first module board 422, as shown in fig. 17, the first module board 422 provided by the present application has a surface close to the main board 410, and a side close to the second module board 423 is recessed in a direction away from the main board 410 to form a first step surface 4221, and the first step surface 4221 is laminated with a side surface of the second module board 423 away from the main board 410. By forming a step structure on the first module board 422, one side edge of the second module board 423 close to the first module board 422 is extended between the first step surface 4221 and the first surface 414 of the motherboard 410, so that the first module board 422 and the second module board 423 are partially stacked, the strength of the motherboard 410 area covered by the vertical projection of the first module board 422 and the second module board 423 on the motherboard 410 is enhanced, and the gap between the two opposite side walls of the first module board 422 and the second module board 423 is covered by the first step surface 4221, thereby avoiding a stress concentration area on the motherboard 410 and reducing the risk of breaking the motherboard 410.
In order to reduce the height difference between the first module board 422 and the second module board 423 in the direction perpendicular to the main board 410 (X direction), as shown in fig. 18, the second module board 423 provided in the present application is recessed to form a second step surface 4231 in the direction close to the main board 410 on the side close to the first module board 422, and the second step surface 4231 is stacked on the first step surface 4221. In this way, step surfaces are formed on the first module board 422 and the second module board 423, and the two step surfaces are stacked with each other, so that the height difference between the first module board 422 and the second module board 423 along the direction perpendicular to the main board 410 can be reduced, and the flatness can be improved, so that the distance difference between the first module board 422 and the second module board 423 and the rear case 300 is reduced, which is beneficial to reducing the overall size of the electronic device 10.
Note that, the X direction refers to a direction perpendicular to the middle frame 200 of the electronic device 10, that is, a direction perpendicular to the main board 410. Therefore, when the height difference between the first module board 422 and the second module board 423 along the X direction is reduced, the thickness of the electronic device 10 along the X direction is advantageously reduced, and the overall appearance of the electronic device 10 can be improved.
On this basis, since the first module board 422 and the second module board 423 occupy a local area on the main board 410, so that an available area on the main board 410 for laying the chip 430 or other electronic components is reduced, as shown in fig. 19, in order to increase the laying area of the chip 430 or other electronic components on the main board 410, the first module board 422 and the second module board 423 provided in the present application are electrically connected to the main board 410, and the first step surface 4221 is electrically connected to the second step surface 4231, and then the chip 430 may be laid on a side surface of the first module board 422 and the second module board 423 away from the main board 410, so that the chip 430 can communicate with the main board 410 through the first module board 422 and the second module board 423, thereby increasing the effective laying area on the main board 410.
In addition, the first module plate 422 and the second module plate 423 provided in the present application may have a certain back difference in thickness in the X direction. For example, generally, a thermal conductive adhesive needs to be disposed between the chip 430 and the rear case 300 of the electronic device 10 to improve the heat dissipation effect of the chip 430, as shown in fig. 20, when the thickness of one chip 430 is L1, the thickness of the other chip 430 is L2, and L1 is greater than L2 along the X direction, the distance between the two chips 430 and the rear case 300 is different, and therefore, the thickness of the thermal conductive adhesive disposed between the chip 430 with smaller thickness and the rear case 300 is greater, which results in an increase in cost. Therefore, in order to ensure that the distance between the two chips 430 and the rear case 300 of the electronic apparatus 10 is the same, it may be configured that the thickness L3 of the first module board 422 in the X direction is smaller than the thickness L4 of the second module board 423 in the X direction, and the thickness difference (L1-L2) of the two chips 430 is the same as the thickness difference (L4-L3) between the first module board 422 and the second module board 423, and then the chip 430 with the larger thickness is disposed on the first module board 422 and the chip 430 with the smaller thickness is disposed on the second module board 423, so that the distance between the two chips 430 and the rear case 300 of the electronic apparatus 10 is the same, i.e., L1+ L3 is L2+ L4. Thus, the thickness of the thermal conductive paste disposed between the two chips 430 and the rear case 300 can be the same, which is beneficial to reducing the cost, and is beneficial to reducing the size of the electronic device 10 along the X direction, so that the electronic device 10 is more beautiful.
Alternatively, as shown in fig. 21, the thicknesses of the two modules may be the same, that is, the surface of the first module board 422 on the side away from the main board 410 is flush with the surface of the second module board 423 on the side away from the main board 410. When the thicknesses of the first module board 422 and the second module board 423 are completely the same, the flatness of the side surfaces of the first module board 422 and the second module board 423 away from the main board 410 is improved. For example, when a part of the chip 430 is stacked on the first module board 422 and another part is stacked on the second module board 423, the chip 430 is not affected in mounting, which is beneficial to reducing the process difficulty of the chip 430 in production. And when the thicknesses of the chips 430 are the same, the distances between the chips 430 disposed on the first module board 422 and the second module board 423 and the rear case 300 are also the same, which is advantageous to reduce the cost and the thickness of the electronic device 10.
It should be noted that the surface of the first module board 422 away from the main board 410 is flush with the surface of the second module board 423 away from the main board 410, which may allow some error during processing, and therefore, it cannot be considered that the two modules must be in the same plane.
On this basis, as shown in fig. 22, in a direction parallel to the main board 410 (Y direction), that is, in a direction parallel to the middle frame 200 of the electronic apparatus 10, the width H1 of the first step surface 4221 and the second step surface 4231 may be equal to the width H2 of the first module board 422 and the second module board 423, thereby forming a two-step structure, and stacked on each other.
Alternatively, as shown in fig. 23, the width H1 of the first step surface 4221 and the second step surface 4231 may be smaller than the width H2 of the first module board 422 and the second module board 423, and at this time, two convex structures may be formed on the opposite side walls between the first module board 422 and the second module board 423, and the two convex structures may be stacked and electrically connected to each other.
Further, the width of the first step surface 4221 and the width of the second step surface 4231 may be equal to or different from each other, and therefore, the width of the first step surface 4221 and the width of the second step surface 4231 in the Y direction are not particularly limited in the present application.
No matter how the widths of the first step surface 4221 and the second step surface 4231 in the Y direction are set, the first module board 422 and the second module board 423 may continuously cover a partial area of the main board 410 by the first step surface 4221 and the second step surface 4231, thereby enhancing the partial strength of the main board 410 covered by the first module board 422 and the second module board 423 to avoid a stress concentration area on the main board 410.
In the above embodiment, only two module boards 421, that is, the first module board 422 and the second module board 423 are provided, and it should be noted that, as shown in fig. 24, when a plurality of module boards 421 are provided, one module board 421 and a plurality of module boards 421 may be stacked on each other through step surfaces, that is, step surfaces are provided at a plurality of positions on one module board 421 and are stacked on adjacent module boards 421, and the specific structure between the adjacent two module boards 421 is the same as that between the first module board 422 and the second module board 423, and therefore, a detailed description thereof will not be given.
On this basis, the at least one chip 430 provided in the present application includes a first chip 431 and a second chip 432, which are not arranged in an exclusive manner, for example, as shown in fig. 25, the first chip 431 may be arranged on a side surface of the first module board 422 away from the main board 410. Alternatively, as shown in fig. 26, the second chip 432 is disposed on a side surface of the second module board 423 away from the main board 410. As shown in fig. 27, it is also possible to dispose the first chip 431 on the surface of the first module board 422 on the side away from the main board 410 and to dispose the second chip 432 on the surface of the second module board 423 on the side away from the main board 410, so that the effective layout area of the chips 430 on the circuit board assembly 400 can be increased.
In order to avoid that some chips 430 with larger thickness increase the overall thickness of the electronic device 10 after being mounted on the first module board 422, as shown in fig. 28 and 29, at least one chip 430 provided herein further includes a third chip 433, a first receiving groove 4222 is formed on the first module board 422, the first receiving groove 4222 penetrates the first module board 422 along the X direction (the direction perpendicular to the main board 410), and the third chip 433 is disposed in the first receiving groove 4222 and disposed on the first surface 414. The third chip 433 can be directly disposed on the first surface 414 of the motherboard 410 through the first accommodating groove 4222, so that the distance between the motherboard 410 and the rear case 300 of the electronic device 10 can be reduced, the overall thickness of the electronic device 10 can be reduced, and the third chip 433 can be protected.
It should be noted that the first accommodating groove 4222 is formed in the first module board 422, and does not mean that only the first accommodating groove 4222 can be formed in the first module board 422, because the first module board 422 and the second module board 423 are distinguished for the purpose of describing the two module boards 421 respectively, that is, the first module board 422 may be the second module board 423, and the second module board 423 may also be the first module board 422, and therefore, the formation of the first accommodating groove 4222 in the first module board 422 means that the first accommodating groove 4222 is formed in one of the first module board 422 and the second module board 423.
In another possible embodiment provided in the present application, as shown in fig. 30 and fig. 31, the at least one chip 430 further includes the third chip 433 and the fourth chip 434, the first module board 422 has a first accommodating groove 4222, the second module board 423 has a second accommodating groove 4232, the first accommodating groove 4222 penetrates the first module board 422 along the X direction, the second accommodating groove 4232 penetrates the second module board 423 along the X direction, the third chip 433 is disposed in the first accommodating groove 4222, the fourth chip 434 is disposed in the second accommodating groove 4232, and the third chip 433 and the fourth chip 434 are both disposed on the first surface 414 of the motherboard 410. By arranging the accommodating grooves on both the first module board 422 and the second module board 423, the mounting position of the chip 430 having a thicker thickness can be increased, and the thickness of the electronic device 10 can be further reduced.
The first module board 422 may have only one first accommodation groove 4222, or may have a plurality of first accommodation grooves 4222. The second module plate 423 may be provided with only one second accommodation groove 4232, or may be provided with a plurality of second accommodation grooves 4232, which is not limited in the present application.
The number of the third chips 433 provided in each first accommodation groove 4222 may be one or more. The number of the third chips 433 disposed in the plurality of first accommodation grooves 4222 may be the same or different. The number of the fourth chips 434 provided in each of the second accommodation grooves 4232 may be one or more. The number of the fourth chips 434 disposed in the plurality of second accommodation grooves 4232 may be the same or different. The number of the third chips 433 provided in the first accommodation groove 4222 may be the same as or different from the number of the fourth chips 434 provided in the second accommodation groove 4232, and therefore, this is not particularly limited in this application.
In addition, a receiving groove may be formed in each of the first stepped surface 4221 and the second stepped surface 4231, and the chip 430 may be disposed in the receiving groove. And the receiving grooves on the first step surface 4221 and the second step surface 4231 may penetrate through the portion where the first module board 422 and the second module board 423 are stacked with each other, so that the chip 430 is disposed on the main board 410. The accommodation groove of the first step surface 4221 and the second step surface 4231 may not penetrate through the portion where the first module board 422 and the second module board 423 are stacked on each other (i.e., a recessed groove is formed in the step surfaces), so that the chip 430 is disposed in the accommodation groove, thereby further increasing the area of the layout-able region of the chip 430.
It should be noted that, in the present application, when the first module board 422 and the second module board 423 do not cover the first surface 414 of the main board 410, the at least one chip 430 further includes a fifth chip 435, and the fifth chip 435 is disposed on an area of the first surface 414 where the first module board 422 and the second module board 423 are not disposed.
The circuit board assembly 400 provided by the present application can be manufactured by the following process flow:
as shown in fig. 32, first, the main board 410 and two substrates, i.e., a first substrate 4223 and a second substrate 4233, are prepared. Any one of the first and second substrates 4223 and 4233 may include a core plate and copper foils disposed on both upper and lower surfaces of the core plate. The core board may be an insulating layer made of an insulating material.
Next, as shown in fig. 33, first via holes 4224 are opened in the X direction (i.e., the direction perpendicular to the main board 410) in the first substrate 4223, and second via holes 4234 are opened in the X direction in the second substrate 4233, and conductive traces are processed, respectively, as shown in fig. 34.
Next, as shown in fig. 35, a third substrate 4225 is stacked on the first substrate 4223, and a fourth substrate 4235 is stacked on the second substrate 4233. The third substrate 4225 and the fourth substrate 4235 are both the same as the first substrate 4223 and the second substrate 4233 in structure.
Next, as shown in fig. 36, conductive traces are formed by forming a third via hole 4226 in the X direction in the first substrate 4223 and the third substrate 4225, forming a third via hole 4226 through the first substrate 4223 and the third substrate 4225, forming a fourth via hole 4236 in the X direction in the second substrate 4233 and the fourth substrate 4235, and forming the fourth via hole 4236 through the second substrate 4233 and the fourth substrate 4235, respectively.
Next, as shown in fig. 37, a portion of the third substrate 4225 corresponding to the first via hole 4224 is cut off, and a portion of the fourth substrate 4235 corresponding to the second via hole 4234 is cut off by a cutting process, so that the first step surface 4221 is formed on the first substrate 4223, the first substrate 4223 and the third substrate 4225 constitute the first module board 422, the second step surface 4231 is formed on the second substrate 4233, and the second substrate 4233 and the fourth substrate 4235 constitute the second module board 423.
Next, as shown in fig. 38, the second substrate 4233 of the second module board 423 is first soldered to the main board 410 via conductive pads, as shown in fig. 39, and the third substrate 4225 of the first module board 422 is then soldered to the main board 410 via conductive pads, and the first step surface 4221 and the second step surface 4231 are also soldered via conductive pads, thereby forming the circuit board assembly 400.
The above description is made by taking an example in which the first module plate 422 and the second module plate 423 are stacked on each other, that is, two module plates 421, and the reinforcing plate assembly 420 provided in the present application may be three module plates 421.
Example two
In this example, as shown in fig. 40, the reinforcing plate assembly 420 includes a first module plate 422, a second module plate 423, and a third module plate 424, the first module plate 422 and the second module plate 423 are disposed on the first surface 414 of the main board 410, the third module plate 424 is disposed on a side of the first module plate 422 away from the main board 410, and the third module plate 424 is partially disposed to be stacked with the first module plate 422 and partially disposed to be stacked with the second module plate 423.
The third module board 424 is disposed on a side of the first module board 422 and the second module board 423 away from the main board 410, and a portion of the third module board 424 is stacked with the first module board 422, and another portion is stacked with the second module board 423, so that the vertical projections of the first module board 422 and the second module board 423 on the main board 410 can be overlapped and connected by the vertical projection of the third module board 424 on the main board 410, so that the first module board 422, the second module board 423 and the third module board 424 continuously cover the area of the main board 410 with weak strength, and the strength of the gap between the first module board 422 and the second module board 423 is enhanced by the third module board 424.
In addition, other process machining is not needed to be carried out on the first module plate 422 and the second module plate 423, and the process difficulty and the production cost are favorably reduced.
In this case, as shown in fig. 41, the thicknesses of the first module board 422 and the second module board 423 in the X direction may have a certain thickness difference, and when chips 430 having different thicknesses are respectively disposed on the first module board 422 and the second module board 423, the distance from the chips 430 having different thicknesses to the rear case 300 of the electronic device 10 can be made the same by the thickness difference between the first module board 422 and the second module board 423, so that the thickness of the electronic device 10 can be reduced.
For example, as shown in fig. 41, the thickness of the first module board 422 in the X direction is greater than the thickness of the second module board 423 in the X direction, which results in a gap between the third module board 424 and the second module board 423, and therefore, a third step surface 4241 may be formed by recessing a portion of the third module board 424 facing the first module board 422 in a direction away from the first module board 422, and a height of the third step surface 4241 in the X direction may be matched with a difference in thickness between the first module board 422 and the second module board 423, so that the third module board 424 and the first module board 422 and the second module board 423 may be stacked, and no gap may be formed between the third module board 424 and the first module board 422 and between the third module board 424 and the second module board 423, thereby making the overall structure more compact.
Alternatively, as shown in fig. 42, the thicknesses of the first module board 422 and the second module board 423 in the X direction may be the same, that is, the surface of the first module board 422 away from the main board 410 is flush with the surface of the second module board 423 away from the main board 410. In this case, it is beneficial to improve the flatness of the surfaces of the first module board 422 and the second module board 423 on the sides away from the main board 410, facilitate the arrangement of the chips 430 or other electronic components, and it is not necessary to process step surfaces on the third module board 424, which is beneficial to further reduce the process difficulty and cost during production.
It should be noted that, in this example, the first module board 422 and the second module board 423 may also be provided with an accommodating groove, so that the chip 430 is disposed in the accommodating groove, and the specific structure is the same as in the first example. In addition, the distribution of chips in this example is also the same as in example one. Therefore, this example is not described in detail.
In addition, in this example, the manufacturing method of the circuit board assembly 400 is substantially the same as that of the first example, that is, three module boards, i.e., a first module board 422, a second module board 423, and a third module board 424 are manufactured by the same method. The difference is that the first module board 422 and the second module board 423 do not need to be partially cut off by a cutting process, so the first module board 422 and the second module board 423 are directly welded to the main board 410 through conductive pads, and then the third module board 424 is respectively welded to the first module board 422 and the second module board 423 through conductive pads. Therefore, this example is not described in detail.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (15)

1. A circuit board assembly, comprising:
the main board comprises a first part and a second part, the first part is connected with the second part, the first part is provided with at least one opening, and the main board is provided with a first surface;
the reinforcing plate assembly is arranged on the first surface and positioned on the first part, the reinforcing plate assembly is electrically connected with the main board, the reinforcing plate assembly comprises a plurality of module boards, and at least one part of vertical projection of the module boards on the main board is overlapped and connected with one another;
and the part of the at least one component is arranged on one side surface of the reinforcing plate assembly, which is far away from the mainboard, and is electrically connected with the mainboard through the reinforcing plate assembly.
2. The circuit board assembly of claim 1, wherein the stiffener assembly comprises:
the first module board is arranged on the first surface and is electrically connected with the mainboard;
and the second module board is arranged on the first surface, one part of the second module board is arranged in a stacking mode and is electrically connected with one part of the first module board, and the other part of the second module board is electrically connected with the mainboard.
3. The circuit board assembly of claim 2,
the first module board is close to the surface of the main board, and one side of the first module board close to the second module board is recessed towards the direction far away from the main board to form a first step surface;
the second module board is far away from the surface of the main board, and one side of the second module board close to the first module board is recessed towards the direction close to the main board to form a second step surface;
the first step surface and the second step surface are stacked and electrically connected.
4. The circuit board assembly of claim 1, wherein the stiffener assembly comprises:
the first module board is arranged on the first surface and is electrically connected with the mainboard;
the second module board is arranged on the first surface and is electrically connected with the mainboard;
and the third module board is arranged on one side of the first module board, which is far away from the main board, the third module board part is arranged with the first module board in a stacked mode, the other part of the third module board is arranged with the second module board in a stacked mode, and the third module board is electrically connected with the first module board and the second module board respectively.
5. A circuit board assembly according to any one of claims 2-4, characterised in that a surface of the first module board remote from the main board is flush with a surface of the second module board remote from the main board.
6. A circuit board assembly according to any one of claims 2-4, characterised in that the at least one component is arranged on a surface of the first module board at a side remote from the main board.
7. The circuit board assembly of claim 6, wherein the first module board defines a first receiving slot, the first receiving slot extends through the first module board along a direction perpendicular to the main board, and a portion of the at least one component is disposed in the first receiving slot and disposed on the first surface.
8. The circuit board assembly of claim 6, wherein the at least one component comprises a first component and a second component; the first component is arranged on one side surface of the first module board far away from the mainboard, and the second component is arranged on one side surface of the second module board far away from the mainboard.
9. The circuit board assembly of claim 8, wherein the at least one component further comprises a third component and a fourth component;
the first module board is provided with a first accommodating groove, the first accommodating groove penetrates through the first module board along a direction perpendicular to the main board, and the third component is positioned in the first accommodating groove and arranged on the first surface;
the second module board is provided with a second accommodating groove, the second accommodating groove penetrates through the second module board along a direction perpendicular to the main board, and the fourth component is located in the second accommodating groove and arranged on the first surface.
10. The circuit board assembly of claim 1, wherein the at least one component is disposed on the first surface.
11. The circuit board assembly of claim 1, wherein the module board is one or more of a planar grid array package substrate, a pin grid array package substrate, and a ball grid array package substrate.
12. A method of manufacturing a circuit board assembly according to any of claims 1 to 11, the method comprising:
providing a main board;
forming a reinforcing plate assembly including a plurality of module plates, which are respectively overlapped and connected at least a part of vertical projections on the main plate;
arranging the reinforced plate assembly on the main plate;
and one side surface of the reinforced plate assembly, which is far away from the main board, is provided with components, and the components are electrically connected with the main board through the reinforced plate assembly.
13. The method of manufacturing of claim 12, wherein the forming a gusset assembly comprises:
providing a first substrate, forming conductive circuits on two sides of the first substrate, and forming a first via hole penetrating through the first substrate, wherein the first via hole is electrically connected with the conductive circuits formed on two sides of the first substrate;
stacking a plurality of first substrates to form a first module plate, and removing a part of the first module plate to form a first step surface;
providing a second substrate, forming conductive circuits on two sides of the second substrate, and forming a second via hole penetrating through the second substrate, wherein the second via hole is electrically connected with the conductive circuits formed on two sides of the second substrate;
stacking a plurality of second substrates to form a second module plate, and removing a part of the second module plate to form a second step surface;
and laminating and electrically connecting the first step surface and the second step surface.
14. The method of manufacturing of claim 12, wherein the forming a gusset assembly comprises:
providing a first substrate, forming conductive circuits on two sides of the first substrate, and forming a first via hole penetrating through the first substrate, wherein the first via hole is electrically connected with the conductive circuits formed on two sides of the first substrate;
stacking a plurality of the first substrates to form a first module board;
providing a second substrate, forming conductive circuits on two sides of the second substrate, and forming a second via hole penetrating through the second substrate, wherein the second via hole is electrically connected with the conductive circuits formed on two sides of the second substrate;
stacking a plurality of the second substrates to form a second module board;
providing a third substrate, forming conductive circuits on two sides of the third substrate, and forming a third via hole penetrating through the third substrate, wherein the third via hole is electrically connected with the conductive circuits formed on two sides of the third substrate;
stacking a plurality of the third substrates to form a third module board;
arranging the first module board and the second module board on the mainboard and electrically connecting the first module board and the second module board with the mainboard;
and arranging the third module board on one side of the first module board far away from the main board, wherein one part of the third module board is arranged on the first module board in a stacked mode and is electrically connected with the first module board, and the other part of the third module board is arranged on the second module board in a stacked mode and is electrically connected with the second module board.
15. An electronic device comprising a housing and the circuit board assembly of any of claims 1-11, the circuit board assembly being located within the housing.
CN202110596071.2A 2021-05-29 2021-05-29 Circuit board assembly, manufacturing method and electronic equipment Active CN113905502B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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