CN113905167A

CN113905167A - Camera module and electronic equipment

Info

Publication number: CN113905167A
Application number: CN202111207828.0A
Authority: CN
Inventors: 谢崴; 魏源
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-10-15
Filing date: 2021-10-15
Publication date: 2022-01-07
Anticipated expiration: 2041-10-15
Also published as: CN113905167B

Abstract

The embodiment of the application provides a camera module and electronic equipment. This camera module includes: the lens assembly, the photosensitive chip and the driving assembly; the imaging surface of the photosensitive chip faces the lens assembly; the driving assembly comprises a conductive rod and a piezoelectric sliding part, the piezoelectric sliding part is arranged on the conductive rod in a sliding mode, and the piezoelectric sliding part is connected with the photosensitive chip; under the condition that the conducting rod is electrified, the piezoelectric sliding piece moves along the axial direction of the conducting rod so as to drive the photosensitive chip to be close to or far away from the lens component.

Description

Camera module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a camera module and electronic equipment.

Background

With the development of science and technology, electronic devices are more and more widely applied. Be provided with the camera module among the electronic equipment usually, through the camera module, the user can shoot the image, shoots the video to make the interest that the user used electronic equipment increase. Generally, a camera module includes a lens assembly and a photosensitive chip facing the lens assembly. When shooting image or video through the camera module, light can pass the camera lens subassembly, later forms images on the sensitization chip, and the sensitization chip converts light into the signal of telecommunication to can show the image of shooing on making electronic equipment's the display screen. However, in the shooting process, the focal length of the camera module generally needs to be adjusted, so as to improve the shooting effect. In the related art, when the focal length of the camera module is adjusted, the lens assembly is usually moved, so that the distance between the lens assembly and the photosensitive chip is changed, and the purpose of adjusting the focal length is achieved. But results in a large power consumption of the camera module.

Disclosure of Invention

The embodiment of the application provides a camera module and electronic equipment to when solving the focus of adjustment camera module among the correlation technique, remove the camera lens subassembly usually, thereby make the distance change between camera lens subassembly and the sensitization chip, reach the purpose of adjustment focus. But causes the problem that the power consumption of the camera module is larger.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a camera module, including: the lens assembly, the photosensitive chip and the driving assembly;

the imaging surface of the photosensitive chip faces the lens assembly;

the driving assembly comprises a conductive rod and a piezoelectric sliding part, the piezoelectric sliding part is arranged on the conductive rod in a sliding mode, and the piezoelectric sliding part is connected with the photosensitive chip;

under the condition that the conducting rod is electrified, the piezoelectric sliding part moves along the axial direction of the conducting rod so as to drive the photosensitive chip to be close to or far away from the lens component.

In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes the camera module in the first aspect.

In the embodiments of the present application, since the piezoelectric sliding member is slidably disposed on the conductive rod, the piezoelectric sliding member can slide along the conductive rod. Because the piezoelectric sliding part is connected with the photosensitive chip, the piezoelectric sliding part can drive the photosensitive chip to move in the sliding process of the piezoelectric sliding part. Specifically, under the condition of conducting rod circular telegram, piezoelectric sliding part moves along the axial direction of conducting rod, and piezoelectric sliding part drives the sensitization chip and is close to or keeps away from the camera lens subassembly to make the distance between the imaging surface of sensitization chip and the camera lens subassembly change, reach the purpose of adjusting the focal length, thereby avoid moving the camera lens subassembly, and then can reduce the consumption of camera module.

Drawings

Fig. 1 shows an exploded view of a camera module according to an embodiment of the present disclosure;

fig. 2 is a half-sectional view of a camera module according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram illustrating a chip holder driven by a driving assembly according to an embodiment of the present disclosure;

fig. 4 is a schematic view of a fixing frame and a conductive assembly according to an embodiment of the present disclosure;

FIG. 5 illustrates a schematic view of a conductive assembly provided by an embodiment of the present application;

FIG. 6 is a schematic view of a lens holder enclosing a conductive element and a chip carrier according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of a chip holder and a fixing frame according to an embodiment of the disclosure.

Reference numerals:

10: a lens assembly; 20: a photosensitive chip; 30: a drive assembly; 40: a chip holder; 50: a fixed mount; 60: a ball bearing; 70: a lens base; 80: an optical filter; 90: a circuit board; 11: a lens barrel; 12: a lens; 31: a conductive rod; 32: a piezoelectric slider; 41: a slide rail; 51: a chute; 52: a first ball groove; 91: a connector; 101: lens glue; 201: chip glue; 202: a conductive connection member; 311: a conductive member; 321: a nesting part; 322: a sliding part; 701: and (4) lens base glue.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1, fig. 1 shows an exploded view of a camera module according to an embodiment of the present disclosure; referring to fig. 2, fig. 2 is a half-sectional view of a camera module according to an embodiment of the present disclosure; referring to fig. 3, fig. 3 is a schematic diagram illustrating a chip holder provided in an embodiment of the present application being driven by a driving assembly; referring to fig. 4, fig. 4 is a schematic view illustrating a fixing frame 50 and a conductive element according to an embodiment of the present disclosure; referring to fig. 5, fig. 5 is a schematic diagram of a conductive assembly according to an embodiment of the present disclosure; referring to fig. 6, fig. 6 is a schematic diagram illustrating a lens holder enclosing a conductive assembly and a chip holder according to an embodiment of the present disclosure; referring to fig. 7, fig. 7 is a schematic view illustrating a chip holder and a fixing frame 50 according to an embodiment of the present disclosure. As shown in fig. 1 to 7, the camera module includes: lens assembly 10, photosensitive chip 20 and driving assembly 30.

The photo sensor chip 20 has opposite imaging surfaces facing the lens assembly 10. The driving assembly 30 includes a conductive rod 31 and a piezoelectric sliding element 32, the piezoelectric sliding element 32 is slidably disposed on the conductive rod 31, and the piezoelectric sliding element 32 is connected to the photosensitive chip 20. When the conductive rod 31 is energized, the piezoelectric slider 32 moves in the axial direction of the conductive rod 31 to bring the photosensitive chip 20 closer to or away from the lens assembly 10.

In the embodiment, since the piezoelectric slider 32 is slidably disposed on the conductive rod 31, the piezoelectric slider 32 can slide along the conductive rod 31. Since the piezoelectric sliding element 32 is connected to the photosensitive chip 20, the piezoelectric sliding element 32 can move the photosensitive chip during the sliding process of the piezoelectric sliding element 32. Specifically, under the condition that conducting rod 31 is electrified, piezoelectric sliding element 32 moves along the axial direction of conducting rod 31, and piezoelectric sliding element 32 drives photosensitive chip 20 to be close to or keep away from lens component 10, thereby making the distance between the imaging surface of photosensitive chip 20 and lens component 10 change, reaching the purpose of adjusting the focal length, thereby avoiding moving lens component 10, and then can reduce the power consumption of the camera module.

Additionally, in some embodiments, the camera module may further include a chip holder 40. The photosensitive chip 20 may further include a fixing surface opposite to the imaging surface, and the fixing surface is fixedly connected to the chip holder 40. The chip holder 40 is provided with a slide rail 41, an included angle between a direction from the imaging surface to the lens and an extending direction of the slide rail 41 is an acute angle, the direction from the imaging surface to the lens is perpendicular to the extending direction of the conductive rod 31, and the piezoelectric sliding part 32 is partially embedded in the slide rail 41. When the conductive rod 31 is energized, the piezoelectric sliding part 32 moves along the axial direction of the conductive rod 31, and the piezoelectric sliding part 32 slides in the slide rail 41 to bring the chip holder 40 close to or away from the lens assembly 10, so as to bring the photosensitive chip 20 close to or away from the lens assembly 10.

Since the slide rail 41 is provided on the chip holder 40, and the piezoelectric sliding member 32 is partially embedded in the slide rail 41, when the conductive rod 31 is energized, the piezoelectric sliding member 32 can slide on the conductive rod 31, and the piezoelectric sliding member 32 slides in the slide rail 41 on the chip holder 40. Since the angle between the direction from the image plane to the lens and the extending direction of the conductive rod 31 is an acute angle, and the direction from the image plane to the lens is perpendicular to the extending direction of the conductive rod 31, an angle is formed between the extending direction of the conductive rod 31 and the extending direction of the slide rail 41, so that when the piezoelectric sliding piece 32 slides on the conductive rod 31, the piezoelectric sliding piece 32 simultaneously slides in the slide rail 41, and the piezoelectric sliding piece 32 can apply a force to the slide rail 41, so that when the piezoelectric sliding piece 32 slides in the slide rail 41, the chip holder 40 can move. When the chip holder 40 moves, the chip holder 40 moves the photosensitive chip 20, so that the photosensitive chip 20 approaches or moves away from the lens assembly 10. That is, by setting the driving assembly 30, that is, by setting the conductive rod 31, the piezoelectric sliding element 32 is sleeved on the conductive rod 31, the slide rail 41 is set on the chip support 40, so that the piezoelectric sliding element 32 is partially embedded in the slide rail 41, so that under the condition that the conductive piece 311 is powered on, the piezoelectric sliding element 32 slides on the conductive rod 31 and in the slide rail 41 at the same time, and the extending direction of the slide rail 41 has an included angle with the extending direction of the conductive rod 31, so that the chip support 40 can move, and further the photosensitive chip 20 is close to or away from the lens assembly 10, the purpose of adjusting the focal length of the camera module is achieved, and further the lens assembly 10 is prevented from moving, so that the power consumption of the camera module can be reduced.

It should be noted that, in the embodiment of the present application, a first current may be applied to the conducting bar 31, at this time, the piezoelectric conductive piece 311 may slide along the first direction, and the piezoelectric conductive piece 311 may apply a force to the sliding rail 41 along the first moving direction, so that the sliding rail 41 and the chip holder 40 are close to the lens assembly 10, and then the photosensitive chip 20 is close to the lens assembly 10, thereby achieving the purpose of adjusting the focal length of the camera module. Can let in the second electric current to electrically conductive pole 31, at this moment, piezoelectricity is electrically conductive 311 can slide along the second direction, and piezoelectricity is electrically conductive 311 can be followed the second moving direction and is applied force to slide rail 41 for slide rail 41 and chip support 40 keep away from lens subassembly 10, and then makes photosensitive chip 20 keep away from lens subassembly 10, reaches the purpose of the focus of adjustment camera module. The first direction is opposite to the second direction, and the first moving direction is opposite to the second moving direction.

In addition, in the embodiment of the present invention, as shown in fig. 2, the lens assembly 10 may include a lens barrel 11 and at least one lens 12, and the at least one lens 12 is disposed in the lens barrel 11. At this time, the photosensitive chip 20 facing the lens assembly 10 means that the photosensitive chip 20 faces the lens 12. In this case, when the photosensitive chip 20 approaches or moves away from the lens assembly 10 along with the chip holder 40, the photosensitive chip 20 approaches or moves away from the lens 12, so as to adjust the focal length of the camera module.

In addition, when the number of the lenses 12 is plural, at this time, the plural lenses 12 may be disposed in the lens barrel 11 at intervals. At this time, the light may pass through the plurality of lenses 12 and then irradiate on the photo chip 20. And light is when passing a plurality of lenses 12, and a plurality of lenses 12 can be so that light formation of image, and the formation of image shows on sensitization chip 20, and sensitization chip 20 can be the signal of telecommunication with light conversion to when installing the camera module in electronic equipment, electronic equipment's display screen can show the image of shooing.

When the number of the lens 12 is plural, at this time, the lens 12 may have a convex lens and a concave lens, and the specific arrangement manner of the convex lens and the concave lens may be set according to actual needs. Of course, only convex lenses may be provided in the lens 12. The specific type of the lens 12 is not limited herein.

In addition, in the embodiment of the present application, the fixing surface and the chip holder 40 may be fixedly connected in a manner that: as shown in fig. 1, the fixing surface is adhered to the chip holder 40 by a chip adhesive 201. The chip adhesive 201 may be a double-sided adhesive tape, and certainly, may also be a glue, which is not limited herein in this embodiment of the application.

In addition, in the embodiment of the present application, as shown in fig. 3, the piezoelectric sliding element 32 may include a nesting portion 321 and a sliding portion 322, the nesting portion 321 is connected to the sliding portion 322, the nesting portion 321 is nested on the conductive rod 31, and a portion of the sliding portion 322 is embedded on the sliding rail 41. When the conductive rod 31 is energized, the nesting portion 321 slides along the axial direction of the conductive rod 31, and the nesting portion 321 drives the sliding portion 322 to slide in the slide rail 41, so that the sliding portion 322 applies a force to the slide rail 41, and the chip holder 40 moves. The sliding portion 322 may be in a pin shape, but may also be in other shapes, and the embodiment of the present invention is not limited thereto.

In addition, in some embodiments, as shown in fig. 3, the number of the conductive rods 31 and the number of the piezoelectric sliders 32 may be two. The two conductive rods 31 are located on two opposite sides of the chip holder 40, the two opposite sides of the chip holder 40 are respectively provided with a slide rail 41, and the two piezoelectric sliders 32 are respectively partially embedded in the two slide rails 41.

When the two conductive rods 31 are located at two opposite sides of the chip holder 40, and the two piezoelectric sliders 32 are respectively partially embedded in the slide rails 41 at two opposite sides of the chip holder 40, at this time, under the condition that the two conductive rods 31 are both powered on, the piezoelectric sliders 32 on the two conductive rods 31 respectively slide in the two slide rails 41, which is equivalent to simultaneously applying force to the two opposite sides of the chip holder 40, so that the chip holder 40 moves. Because the opposite sides of the chip support 40 are applied with force, the stress on the chip support 40 can be balanced, and the chip support 40 can move conveniently. In addition, due to the fact that force is applied to the two opposite sides of the chip support 40, the chip support 40 can move fast, and the adjusting efficiency of adjusting the focal length of the camera module is high.

Of course, in the embodiment of the present application, the number of the conductive rods 31 and the number of the piezoelectric sliders 32 may also be other values, for example, the number of the conductive rods 31 is 3, in this case, three conductive rods 31 are disposed around the chip holder 40, three sliding rails 41 are disposed on the chip holder 40, and the piezoelectric slider 32 on each conductive rod 31 is partially embedded in one sliding rail 41. The number of the conductive rods 31 and the number of the piezoelectric sliders 32 are not limited herein.

In addition, in the embodiment of the present application, the number of the piezoelectric sliding parts 32 may be equal to the number of the conductive rods 31, and in this case, one piezoelectric sliding part 32 is sleeved on one conductive rod 31. Of course, the number of the piezoelectric sliding parts 32 may be larger than the number of the conductive rods 31, and at least one piezoelectric sliding part 32 is sleeved on one conductive rod 31. The embodiments of the present application are not limited herein.

In addition, in some embodiments, as shown in fig. 3, 4 and 7, the camera module may further include a fixing frame 50. The fixing frame 50 is sleeved on one end of the chip support 40 departing from the lens assembly 10, a sliding groove 51 is arranged on the fixing frame 50, the piezoelectric sliding part 32 penetrates through the sliding groove 51, and part of the piezoelectric sliding part 32 is embedded in the sliding rail 41. The extending direction of the slide groove 51 is the same as the extending direction of the conductive rod 31.

When the fixing frame 50 is sleeved on one end of the chip holder 40 away from the lens assembly 10, the sliding groove 51 is disposed on the fixing frame 50, the piezoelectric sliding element 32 is inserted into the sliding groove 51, and the piezoelectric sliding element 32 is partially embedded in the sliding rail 41, at this time, under the condition that the conductive rod 31 is powered on, the piezoelectric sliding element 32 moves along the conductive rod 31, and the piezoelectric sliding element 32 moves in the sliding groove 51 and the sliding rail 41 at the same time, so that the chip holder 40 moves. In the moving process of the chip holder 40, the fixing frame 50 is equivalent to provide a barrier for the chip holder 40, so as to prevent the chip holder 40 from shifting during moving, that is, the chip holder 40 is made to move against the lens assembly 10, so that the photosensitive chip 20 is made to move against the lens assembly 10, and thus, when the chip holder 40 moves, the effect of adjusting the focal length of the camera module is better.

It should be noted that, in the embodiment of the present application, the extending direction of the sliding slot 51 is the same as the extending direction of the conductive rod 31, so that when the piezoelectric slider 32 slides on the conductive rod 31, the piezoelectric slider 32 does not apply a force to the sliding slot 51, and the fixed frame 50 is prevented from moving.

In addition, in the embodiment of the present application, the sliding groove 51 is a through groove penetrating through the side wall of the fixing frame 50. The extending direction of the slide groove 51 refers to a direction from one groove wall to the other groove wall of two opposite groove walls of the slide groove 51.

Additionally, in some embodiments, as shown in fig. 1 and 7, the camera module may further include a ball 60. The fixing frame 50 is provided with a first ball groove 52, the extending direction of the first ball groove 52 is the same as the moving direction of the chip support 40, the ball 60 is at least partially embedded in the first ball groove 52, and the ball 60 is in contact with the chip support 40. The ball 60 reduces the friction between the holder 50 and the chip holder 40 in a case where the chip holder 40 is close to or distant from the lens assembly 10.

When the extending direction of the first ball groove 52 is the same as the moving direction of the chip holder 40, the ball 60 is at least partially embedded in the first ball groove 52, and the ball 60 contacts the chip holder 40, at this time, under the condition that the conductive rod 31 is energized, when the piezoelectric slider 32 drives the chip holder 40 to move, the chip holder 40 contacts the ball 60, which is equivalent to converting the static friction between the chip holder 40 and the fixing frame 50 into the dynamic friction, so that the friction between the fixing frame 50 and the chip can be reduced, and the chip holder 40 can be moved conveniently. That is, by providing the balls 60, the movement of the chip holder 40 can be facilitated.

It should be noted that, in the embodiment of the present application, the number of the first ball grooves 52 may be set according to actual requirements, for example, the number of the first ball grooves 52 may be four, and four first ball grooves 52 are spaced apart from each other on the fixing frame 50. The number of the first ball grooves 52 is not limited herein. In addition, the number of the balls 60 may be set according to actual needs, for example, two balls 60 are disposed in one ball 60 groove. The number of the balls 60 is not limited herein.

In addition, in the present embodiment, the extending direction of the first ball groove 52 refers to a direction from one groove wall to the other groove wall of two opposite groove walls of the first ball groove 52.

Additionally, in some embodiments, a second ball groove (not shown) may be disposed on the chip carrier 40. The extending direction of the second ball groove is the same as the extending direction of the first ball groove 52, the second ball groove is opposite to the first ball groove 52, and the ball 60 is partially embedded in the second ball groove.

When the chip holder 40 is provided with the second ball groove and the ball 60 is partially embedded in the second ball groove, at this time, in the moving process of the chip holder 40, the ball 60 can rotate in the first ball groove 52 and the second ball groove simultaneously, which is further beneficial to the movement of the chip holder 40. That is, by providing the second ball groove on the chip holder 40, the movement of the chip holder 40 can be further facilitated.

Additionally, in some embodiments, as shown in fig. 1 and 6, the camera module may further include a lens mount 70. The lens assembly 10 is mounted on the lens holder 70, the lens holder 70 supports the lens assembly 10, the lens holder 70 surrounds the chip holder 40 and the driving assembly 30, and both ends of the conductive rod 31 are respectively fixed on the inner wall of the lens holder 70.

When the camera module includes the lens mount 70, the lens groups can be mounted on the lens mount 70 such that the lens mount 70 supports the lens assembly 10. In addition, because the lens holder 70 includes the chip holder 40 and the driving assembly 30, and the two ends of the conducting rod 31 are respectively fixed on the inner wall of the lens holder 70, the lens holder 70 can protect the photosensitive chip 20 on the chip holder 40, and can fix the position of the conducting rod 31, thereby avoiding the problem that the conducting rod 31 shakes.

It should be noted that, in the embodiment of the present application, the lens assembly 10 may be mounted on the lens holder 70 by: the lens assembly 10 is adhered to the lens holder 70 by a lens adhesive 101. In addition, when the lens assembly 10 includes the lens barrel 11 and at least one lens 12, at this time, the lens barrel 11 may be adhered to the lens holder 70 by the lens glue 101.

Additionally, in some embodiments, as shown in fig. 1, the camera module may further include a filter 80. The optical filter 80 is mounted on the lens holder 70, and the optical filter 80 is located between the photosensitive chip 20 and the lens assembly 10.

When the optical filter 80 is mounted on the lens holder 70 and the optical filter 80 is located between the photosensitive chip 20 and the lens assembly 10, at this time, after the light passes through the lens assembly 10, the light may irradiate on the optical filter 80, the optical filter 80 may filter out stray light in the light, and then the light irradiates on the photosensitive chip 20, and the photosensitive chip 20 converts the light into an electrical signal. That is, through setting up light filter 80, can be so that not have the stray light in the light of shining on photosensitive chip 20, be favorable to photosensitive chip 20 to convert light into the signal of telecommunication to can improve the shooting effect of camera module.

It should be noted that, in the embodiment of the present application, the filter 80 may be an infrared filter 80.

In addition, in some embodiments, as shown in fig. 1, the camera module may further include a circuit board 90, and the photosensitive chip 20 is electrically connected to the circuit board 90.

When the camera module includes the circuit board 90, the light sensing chip 20 is electrically connected to the circuit board 90, and at this time, after the light irradiates on the light sensing chip 20 and the light sensing chip 20 converts the light into an electrical signal, the light sensing chip 20 may transmit the electrical signal to the circuit board 90. When installing the camera module in electronic equipment, circuit board 90 can be connected with electronic equipment's mainboard electricity, consequently, circuit board 90 can transmit the mainboard to electronic equipment with the signal of telecommunication for electronic equipment's display screen can show the image of shooing. That is, by providing the circuit board 90, the image captured by the camera module can be conveniently transmitted to the main board of the electronic device, so that the image is displayed on the display screen of the electronic device.

The Circuit Board 90 may be a Printed Circuit Board (PCB), or may be a Flexible Printed Circuit Board (FPC). The embodiments of the present application are not limited herein.

In addition, when the camera module includes the circuit board 90, when the camera module is installed in the electronic device, the circuit board 90 is usually connected to a main board of the electronic device, and in order to facilitate connection of the circuit board 90 to the main board of the electronic device, in the embodiment of the present application, as shown in fig. 1 and fig. 2, a connector 91 may be disposed on the circuit board 90, and at this time, when the circuit board 90 is required to be connected to the main board of the electronic device, the circuit board 90 may be connected to the main board of the electronic device through the connector 91. Wherein the connector 91 may be a board-to-board connector 91.

In addition, in the embodiment of the present application, when the camera module includes the fixing frame 50 and the lens holder 70, at this time, the lens holder 70 may be mounted on the circuit board 90, the fixing frame 50 may also be mounted on the circuit board 90, and the lens holder 70 surrounds the fixing frame 50.

The mounting manner of the mirror base 70 on the circuit board 90 may be: as shown in fig. 1, the mirror base 70 is adhered to the circuit board 90 by a mirror base adhesive 701. In addition, the fixing frame 50 may be mounted on the circuit board 90 in the following manner: the fixing frame 50 is adhered to the circuit board 90 by an adhesive member. Of course, the mirror base 70 can be mounted on the circuit board 90 by other methods, such as soldering, via the mirror base 70 to the circuit board 90. Similarly, the fixing frame 50 can be welded to the circuit board 90 by welding.

In addition, in the embodiment of the present application, in order to facilitate the electrical connection between the photosensitive chip 20 and the circuit board 90, the photosensitive chip 20 may be connected to the conductive connecting member 202, and at this time, the photosensitive chip 20 is connected to the circuit board 90 through the conductive connecting member 202. As shown in fig. 1, the conductive connecting element 202 may be located between the chip holder 40 and the fixing frame 50, and the conductive connecting element 202 may be fixed on the fixing frame 50.

The conductive connection component 202 may be a Flexible Printed Circuit (FPC), and certainly may also be a Printed Circuit Board (PCB), which is not limited herein.

In addition, in some embodiments, as shown in fig. 5 and 6, a conductive member 311 may be connected to the conductive rod 31, and the conductive member 311 is used to transmit electric energy to the conductive rod 31.

When the conductive rod 31 is connected with the conductive piece 311, at this time, when the conductive rod 31 needs to be electrified, the conductive piece 311 may be directly connected with a power supply, or the conductive piece 311 is connected with an electrified device, so that electric energy is transmitted to the conductive rod 31 through the conductive piece 311, and the piezoelectric sliding piece 32 on the conductive rod 31 slides. That is, by connecting the conductive member 311 through the conductive rod 31, it is possible to facilitate the supply of electric power to the conductive rod 31.

It should be noted that, in the embodiment of the present application, the conductive component 311 may be a Printed Circuit Board (PCB), and of course, may also be a Flexible Printed Circuit Board (FPC), and may also be a conductive wire, which is not limited herein.

The embodiment of the application provides electronic equipment, and the electronic equipment comprises the camera module in any embodiment of the above embodiments.

It should be noted that, in the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the application.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or terminal device comprising the element.

The technical solutions provided in the present application are described in detail above, and the principles and embodiments of the present application are described herein by using specific examples, and meanwhile, for a person of ordinary skill in the art, according to the principles and implementation manners of the present application, changes may be made in the specific embodiments and application ranges.

Claims

1. The utility model provides a camera module which characterized in that includes: the lens assembly, the photosensitive chip and the driving assembly;

the imaging surface of the photosensitive chip faces the lens assembly;

2. The camera module of claim 1, further comprising a chip holder;

the photosensitive chip also comprises a fixed surface opposite to the imaging surface, and the fixed surface is fixedly connected with the chip support;

a slide rail is arranged on the chip support, an included angle between the direction from the imaging surface to the lens and the extension direction of the slide rail is an acute angle, the direction from the imaging surface to the lens is vertical to the extension direction of the conducting rod, and the piezoelectric sliding part is partially embedded in the slide rail;

under the condition that the conducting rod is electrified, the piezoelectric sliding part moves along the axial direction of the conducting rod, and the piezoelectric sliding part slides in the sliding rail to drive the chip support to be close to or far away from the lens assembly, so that the photosensitive chip is close to or far away from the lens assembly.

3. The camera module of claim 2, further comprising a mount;

the fixing frame is sleeved at one end of the chip support, which is far away from the lens component, a sliding chute is arranged on the fixing frame, the piezoelectric sliding part penetrates through the sliding chute, and the piezoelectric sliding part is partially embedded in the sliding rail; wherein, the extending direction of the sliding groove is the same as the extending direction of the conducting rod.

4. The camera module of claim 3, wherein the camera module further comprises a ball;

the fixing frame is provided with a first ball groove, the extending direction of the first ball groove is the same as the moving direction of the chip support, at least part of the balls are embedded in the first ball groove, and the balls are in contact with the chip support;

and under the condition that the chip support is close to or far away from the lens assembly, the ball reduces the friction force between the fixed frame and the chip support.

5. The camera module according to claim 4, wherein a second ball groove is formed on the chip holder;

the extending direction of the second ball groove is the same as that of the first ball groove, the second ball groove is opposite to the first ball groove, and the ball part is embedded in the second ball groove.

6. The camera module according to claim 2, wherein the number of the conductive rods and the number of the piezoelectric sliders are both two;

the two conducting rods are located on two opposite sides of the chip support, the slide rails are respectively arranged on two opposite sides of the chip support, and the two piezoelectric sliding parts are respectively partially embedded in the two slide rails.

7. The camera module of claim 1, further comprising a lens mount;

the lens subassembly is installed on the microscope base, the microscope base supports the lens subassembly, just the microscope base surrounds chip support and drive assembly, the both ends of conducting rod are fixed respectively the inner wall of microscope base.

8. The camera module of claim 7, wherein said camera module further comprises a filter;

the optical filter is arranged on the lens base and is positioned between the photosensitive chip and the lens component.

9. The camera module according to any one of claims 1 to 8, wherein a conductive member is connected to the conductive rod, and the conductive member is configured to transmit electric energy to the conductive rod.

10. An electronic device, characterized in that the electronic device comprises a camera module according to any one of claims 1-9.