CN113206934B

CN113206934B - Camera module and mobile terminal

Info

Publication number: CN113206934B
Application number: CN202110377134.5A
Authority: CN
Inventors: 胡北
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2023-06-06
Anticipated expiration: 2041-04-08
Also published as: CN113206934A

Abstract

The embodiment of the application provides a camera module and a mobile terminal, wherein the camera module comprises a fixed seat, a lens assembly capable of automatically focusing, a driving assembly fixedly arranged on the fixed seat, an image sensor assembly and a flexible circuit board, wherein the image sensor assembly is positioned on one side of the driving assembly far away from the lens assembly, and the driving assembly is used for driving the image sensor assembly to translate along a direction perpendicular to an optical axis; the flexible circuit board comprises a first movable part extending along a first direction and a second movable part bending from the first movable part to a second direction, wherein the first movable part is fixedly connected with the image sensor assembly and electrically connected with the image sensor assembly, the first direction and the second direction are perpendicular to the optical axis, and the first direction and the second direction are intersected. The camera module that this application embodiment provided, drive assembly drive image sensor subassembly translate along the direction of perpendicular to optical axis to realize the shake compensation.

Description

Camera module and mobile terminal

Technical Field

The application relates to the technical field of optical imaging, in particular to a camera module and a mobile terminal.

Background

The mobile terminal takes a mobile phone as an example, and the mobile phone is provided with an automatic focusing lens component. In general, shake compensation is achieved by driving a lens assembly to move, and in a photographing process, the lens assembly is easily shaken to easily affect imaging quality.

Disclosure of Invention

In view of this, the embodiment of the application provides a camera module and mobile terminal that can anti-shake, and the technical scheme of this application embodiment is realized like this:

an aspect of the embodiments of the present application provides a camera module, including:

a fixing seat;

a lens assembly capable of auto-focusing;

the driving component is fixedly arranged on the fixing seat;

the image sensor assembly is positioned at one side of the driving assembly away from the lens assembly, and the driving assembly is used for driving the image sensor assembly to translate along the direction perpendicular to the optical axis; and

the flexible circuit board comprises a first movable part and a second movable part, wherein the first movable part extends along a first direction, the second movable part bends towards a second direction, the first movable part is fixedly connected with the image sensor assembly and is electrically connected with the image sensor assembly, the first direction and the second direction are perpendicular to the optical axis, and the first direction and the second direction are intersected.

In some embodiments, the first movable portion and the second movable portion are wound around the outer periphery of the fixing base.

In some embodiments, the flexible circuit board includes a substrate extending from the first movable portion to the bottom side of the fixing base, the image sensor assembly includes an image sensor fixedly and electrically connected to the substrate, and a bearing structure between the driving assembly and the substrate, where the driving assembly and the substrate are fixedly connected to the bearing structure.

In some embodiments, the fixing base has a spacing space with two open sides at the top and bottom, the lens assembly is located outside the fixing base and is disposed at the top open position of the spacing space, the substrate is disposed at the bottom open position of the spacing space, the bearing structure is located in the spacing space and has a light transmission channel, the driving assembly is located in the spacing space and has a light transmission channel communicated with the light transmission channel, and the driving assembly drives the bearing structure to translate in the spacing space.

In some embodiments, the fixing base includes a support plate with a light inlet, a baffle with a light outlet, and a support body, wherein the support plate and the baffle are arranged at intervals along the height direction of the camera module, the support body is supported between the support plate and the baffle, the support plate, the baffle and the support body enclose together to form a limit space, the lens assembly is located at the light inlet, and the substrate is located at the light outlet.

In some embodiments, the driving assembly comprises a connecting piece, a shape memory piece and a circuit board, wherein the connecting piece comprises a connecting plate fixedly connected with the fixing seat, and at least one elastic arm fixedly connected with the circuit board and the connecting plate, the circuit board is positioned between the connecting plate and the base plate, the circuit board is fixedly connected with the base plate and is electrically connected with the base plate, and the circuit board and the connecting plate are both fixedly connected with the shape memory piece and are electrically connected with the shape memory piece.

In some embodiments, the elastic arm includes a first straight arm, a second straight arm, and a tilting arm, and a plane perpendicular to the optical axis is taken as a projection plane, and a straight line where the first straight arm projects intersects a straight line where the second straight arm projects; in the free state of the elastic arm, the first straight arm, the second straight arm, the inclined arm and the connecting plate are in the same plane, two ends of the inclined arm are respectively and fixedly connected with the first straight arm and the second straight arm, the end part, far away from the second straight arm, of the first straight arm is fixedly connected with the connecting plate, and the bottom surface of the second straight arm is fixedly connected with the top surface of the loop board.

In some embodiments, the shape memory member is rectangular, the periphery side of connecting plate is formed with first gripping platform, the periphery side of return circuit board is formed with the second gripping platform in the direction of height of camera module, first gripping platform with second gripping platform parallel and level, the both ends of shape memory member respectively with first gripping platform with second gripping platform fixed connection.

In some embodiments, the shape memory member is elongated and four of the shape memory members are distributed in a regular quadrilateral.

In some embodiments, the bearing structure comprises a bearing plate between the circuit board and the substrate, the circuit board and the substrate are both fixedly connected with the bearing plate and electrically insulated, the circuit board is formed with a connection finger extending towards the substrate, the bearing plate is provided with an avoidance gap, and the connection finger penetrates through the avoidance gap and is fixedly connected with the substrate and electrically connected with the substrate.

In some embodiments, the bearing structure comprises an insulating plate disposed between the circuit board and the bearing plate, and the circuit board and the bearing plate are fixedly connected with the insulating plate and electrically insulated.

In some embodiments, the circuit board is formed with a receiving opening, and the camera module includes sliding parts disposed in the receiving opening in a one-to-one correspondence, and the sliding parts are supported between the connecting plate and the bearing plate.

In some embodiments, the slider is movably disposed between the connection plate and the carrier plate; or alternatively, the first and second heat exchangers may be,

one of the connecting plate and the bearing plate is fixedly connected with the sliding piece, and the other one of the connecting plate and the bearing plate is abutted to the sliding piece.

In some embodiments, the fixing base is provided with a limit space with two open top and bottom sides, the lens component is located outside the fixing base and is arranged at the open top side of the limit space, the substrate is arranged at the open bottom side of the limit space, the bearing structure and the driving component are both located in the limit space, the driving component is provided with a light transmission channel penetrating through the connecting plate and the circuit board, the bearing structure is provided with a light transmission channel penetrating through the bearing plate, and the light transmission channel is communicated with the light transmission channel;

the bearing structure comprises an elastic column arranged on the outer peripheral side of the bearing plate, and the driving assembly drives the bearing structure to elastically contact with the inner wall surface of the limiting space in the translational process in the limiting space.

In some embodiments, the bearing structure comprises a bearing table arranged on the outer peripheral side of the bearing plate, the bearing table is arranged in one-to-one correspondence with the elastic columns, the bearing table is provided with mounting holes, the elastic columns comprise columns, necks fixedly connected with the columns and expansion bodies positioned at one ends of the necks, far away from the columns, and the expansion bodies can penetrate through the mounting holes in a mode of recovering deformation so that the necks penetrate through the mounting holes.

In some embodiments, a plane perpendicular to the optical axis is taken as a projection plane, and the projection outline of the loop board is located in the projection outline of the carrier board.

In some embodiments, the camera module comprises:

the induction piece is fixedly arranged on the fixing seat; and

the detection piece is fixedly and electrically connected to the substrate, and can detect the sensing piece in a non-contact mode so as to obtain the current position of the image sensor.

Another aspect of the embodiments of the present application provides a mobile terminal, including:

the camera module of any one of the above; and

and the main board is fixedly connected with the flexible circuit board and is electrically connected with the flexible circuit board.

In the camera module provided by the embodiment of the application, the driving component drives the image sensor component to translate along the direction perpendicular to the optical axis, that is, the image sensor component can translate approximately in the plane perpendicular to the optical axis so as to realize jitter compensation. On the one hand, the image sensor assembly is lighter in weight, the driving force requirement on the driving assembly is lower, and the driving assembly is more convenient for driving the image sensor assembly, and the cost is lower. On the other hand, as the first movable part extends along the first direction, the second movable part bends towards the second direction, an included angle is formed between the first movable part and the second movable part, and the driving assembly drives the image sensor assembly to deflect a certain angle around the optical axis in the process of translating along the direction perpendicular to the optical axis, so that the movement distance of the image sensor assembly is adapted, the flexible circuit board is prevented from being pulled, and the electric wiring and/or electronic components on the flexible circuit board are prevented from being damaged. On the other hand, the flexible circuit board is provided with the electric wiring and/or the electronic components, so that the process is simpler, the yield is higher, and the cost is lower.

Drawings

Fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application;

FIG. 2 is an exploded view of the structure of FIG. 1;

FIG. 3 is another exploded view of the structure of FIG. 1;

FIG. 4 is a schematic view of a portion of the structure of FIG. 1 from another perspective, wherein the lens assembly is not shown;

FIG. 5 is a schematic structural diagram of a fixing base according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a driving assembly according to an embodiment of the present disclosure;

FIG. 7 is a schematic view of the structure of FIG. 6 from another perspective;

FIG. 8 is a schematic view of the structure of FIG. 6 from another perspective;

FIG. 9 is a schematic structural view of a connector according to an embodiment of the present application;

FIG. 10 is a schematic diagram of a circuit board according to an embodiment of the present disclosure;

FIG. 11 is a schematic view of a bearing structure according to an embodiment of the present disclosure;

FIG. 12 is an exploded view of the structure of FIG. 11;

FIG. 13 is a schematic view of an assembly of a load bearing structure and a drive assembly in an embodiment of the present application;

fig. 14 is a schematic view of the structure of fig. 13 from another perspective.

Description of the reference numerals

A fixing base 10; a limit space 10a; a support plate 11; a light inlet 11a; a housing groove 11b; a baffle 12; a light outlet 12a; a support body 13; a lens assembly 20; an actuator 21; a lens barrel 22; a drive assembly 30; a light-transmitting channel 30a; a connecting member 31; a connection plate 311; the first light passing hole 311a; a first gripping station 3111; a resilient arm 312; a first straight arm 3121; a second straight arm 3122; tilting arm 3123; a shape memory member 32; a circuit board 33; a receiving port 33a; a second light passing hole 33b; a second clamping stage 331; a connection finger 332; an image sensor assembly 40; an image sensor 41; a load bearing structure 42; a light-transmitting channel 42a; a carrier plate 421; avoidance gap 421a; a first light hole 421b; an insulating plate 422; a second light hole 422a; a through hole 422b; a carrying platform 423; a mounting hole 423a; a side plate 4231; a spring post 424; a column 4241; a neck 4242; an inflation body 4243; a flexible circuit board 50; a first movable portion 51; a second movable portion 52; a substrate 53; a slider 60; a sensing member 70; and a detecting member 80.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings, and it should be noted that, in the embodiments of the present application, "top", "bottom" and "height direction" refer to directions shown in fig. 1 and 7, and the first direction, the second direction and the optical axis refer to directions shown in fig. 4, and in the descriptions of the embodiments of the present application, the orientation or positional relationship is merely for convenience of describing the present application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and should not be considered as limiting the embodiments of the present application, but all other embodiments obtained by those of ordinary skill in the art without making any inventive effort are within the scope of the present application.

Referring to fig. 1 to 4, in one aspect, a camera module is provided, the camera module includes a fixing base 10, a lens assembly 20 capable of auto-focusing, a driving assembly 30 fixedly disposed on the fixing base 10, an image sensor assembly 40 disposed on a side of the driving assembly 30 away from the lens assembly 20, and a flexible circuit board 50, the driving assembly 30 is used for driving the image sensor assembly 40 to translate along a direction perpendicular to an optical axis, the flexible circuit board 50 includes a first movable portion 51 extending along a first direction, and a second movable portion 52 bending from the first movable portion 51 to a second direction, the first movable portion 51 is fixedly connected and electrically connected with the image sensor assembly 40, wherein the first direction and the second direction are perpendicular to the optical axis, and the first direction and the second direction are intersected. Specifically, the optical axis refers to the optical axis of the lens assembly.

In the camera module provided in the embodiment of the present application, the driving component 30 drives the image sensor component 40 to translate along the direction perpendicular to the optical axis, that is, the image sensor component 40 can translate substantially in the plane perpendicular to the optical axis, for example, the image sensor component 40 can translate along the first direction or the second direction, so as to implement shake compensation. On the one hand, because the image sensor assembly 40 is lighter in weight, the driving force requirement for the driving assembly 30 is lower, and the driving assembly 30 is more convenient and lower in cost for driving the image sensor assembly 40. On the other hand, since the first movable portion 51 extends along the first direction, the second movable portion 52 bends towards the second direction, a set included angle is formed between the first movable portion 51 and the second movable portion 52, and the driving assembly 30 drives the image sensor assembly 40 to deflect a certain angle around the optical axis in the process of translating along the direction perpendicular to the optical axis, so as to adapt to the movement distance of the image sensor assembly 40, and avoid pulling the flexible circuit board 50, thereby avoiding damage to electrical wires and/or electronic components on the flexible circuit board 50. Taking the translation of the image sensor assembly 40 along the second direction as an example, the first movable portion 51 deflects a certain angle around the optical axis, and the set included angle between the first movable portion 51 and the second movable portion 52 correspondingly increases or decreases, so that the first movable portion 51 and the second movable portion 52 are not directly pulled. Taking the translation of the image sensor assembly 40 along the first direction as an example, the first movable portion 51 pushes the second movable portion 52 to deflect a certain angle around the optical axis, so that the first movable portion 51 and the second movable portion 52 are not directly pulled. On the other hand, the electrical traces and/or electronic components are provided on the flexible circuit board 50 with simpler process, higher yields, and lower costs.

The flexible circuit board 50 (Flexible Printed Circuit, FPC), that is, the flexible circuit board, has characteristics such as high wiring density, light weight, thin thickness, and good flexibility. The substrate of the flexible circuit board 50 includes, but is not limited to, polyimide or mylar, and the like.

The specific shapes of the first movable portion 51 and the second movable portion 52 are not limited, and in an exemplary embodiment, referring to fig. 1 to 4, the first movable portion 51 and the second movable portion 52 are each flat. Thus, the first movable portion 51 and the second movable portion 52 are simple in structure, and the electric wiring is more convenient to set. In another embodiment, the first movable portion 51 and the second movable portion 52 may also have a certain curvature, for example, the first movable portion 51 and the second movable portion 52 each have an arc shape.

Taking the example that the camera module in any embodiment of the present application is applied to a mobile terminal, the mobile terminal provided in the embodiments of the present application includes, but is not limited to, a mobile phone, a tablet computer, a PDA (Personal Digital Assistant, a personal digital assistant), a portable computer, and the like. In some embodiments, the total volume of the mobile terminal is small, the weight is relatively light, and a user can hold the mobile terminal to shoot a shot object. The mobile terminal includes a camera module and a motherboard in any embodiment of the present application, where the motherboard is fixedly connected and electrically connected to the flexible circuit board 50.

In the mobile terminal provided in the embodiment of the present application, during the shooting process, the imaging light of the shot object enters the lens assembly 20 and then reaches the image sensor 41, and photons in the imaging light strike the image sensor 41 to generate movable charges, which are internal photoelectric effects, and the movable charges are collected to form an electrical signal. The flexible circuit board 50 transmits the electrical signals to the motherboard. An A/D converter (analog-to-digital converter) and a DSP (Digital Signal Processor ) are arranged on the main board, the A/D converter converts the electric signals into digital signals, and the digital signals are processed by the DSP. Finally, the image is transmitted to a screen of the mobile terminal to display the image, and shooting of the shot object is realized.

The image sensor 41 may be a CMOS (Complementary Metal Oxide Semiconductor ) or a CCD (Charged Coupled Device, charge coupled device), or may be another type of image sensor 41 other than a CMOS or a CCD, such as a CID sensor (Charge Injection Device ). It will be appreciated that for CMOS, the DSP may be integrated within the CMOS. The CMOS has the advantages of high integration level, low power consumption, low cost and the like, and is suitable for mobile phones with limited installation space.

The specific way of auto-focusing the lens assembly 20 is not limited, and in an exemplary embodiment, referring to fig. 1 and 3, the lens assembly 20 includes an actuator 21 fixedly disposed on the fixing base 10, a lens barrel 22 fixedly connected to the actuator 21, and a lens group disposed in the lens barrel 22, the actuator 21 drives the lens barrel 22 to translate along an optical axis, and the lens barrel 22 drives the lens group to move synchronously. In this manner, translational movement of the lens assembly 20 along its optical axis can be achieved. In another embodiment, the lens assembly 20 comprises a liquid lens. Liquid lenses refer to optical lenses made from one or more liquids. The liquid lens can change the liquid state and thus the focal length. That is, the liquid lens can realize the auto-focusing function of the lens assembly 20 without translating along the optical axis.

The particular type of actuator 21 is not limited and exemplary actuators 21 include, but are not limited to, voice coil motors, stepper motors, or piezoelectric motors, among others.

To facilitate the translation of the first movable portion 51 and the second movable portion 52 along with the image sensor assembly 40, in an embodiment, referring to fig. 1 and 4, the first movable portion 51 and the second movable portion 52 are wound around the outer periphery of the fixing base 10. Thus, the first movable portion 51 and the second movable portion 52 have a large movable space.

In an exemplary embodiment, the fixing base 10 is substantially hexahedral, and the plane on which the first movable portion 51 and the plane on which the second movable portion 52 are located are parallel to two adjacent sides of the fixing base 10. Specifically, the side surface of the fixing base 10 is connected with the top surface of the fixing base 10 and the bottom surface of the fixing base 10. In this way, the space occupied by the first movable portion 51 and the second movable portion 52 is small, and the first movable portion 51 and the second movable portion 52 can be prevented from directly contacting the corner outside the fixing base 10, so that the reliability is improved.

In an embodiment, referring to fig. 1 to 4, the flexible circuit board 50 includes a substrate 53 extending from the first movable portion 51 to the bottom side of the fixing base 10, the image sensor assembly 40 includes an image sensor 41 fixedly and electrically connected to the substrate 53, and a carrying structure 42 between the driving assembly 30 and the substrate 53, where the driving assembly 30 and the substrate 53 are fixedly connected to the carrying structure 42. The driving assembly 30 drives the bearing structure 42 to translate, and the bearing structure 42 drives the substrate 53 and the image sensor 41 fixedly arranged on the substrate 53 to translate synchronously. On the one hand, the substrate 53 is located outside the fixing base 10, so that the movement space of the substrate 53 is larger, the substrate 53 can translate synchronously along with the bearing structure 42, and the electronic components on the substrate 53, such as the image sensor 41, can be prevented from colliding with the fixing base 10 or other structural members, and the electronic components and/or the electrical wiring on the substrate 53 can be prevented from being damaged. On the other hand, the substrate 53 is a part of the flexible circuit board 50, and the substrate 53, the first movable portion 51 and the second movable portion 52 adopt the same base material, so that the layout of the electrical wiring on the substrate 53, the first movable portion 51 and the second movable portion 52 is facilitated, and the reliability is higher. In yet another aspect, the carrier structure 42 can strengthen the base plate 53, strengthening the connection between the drive assembly 30 and the image sensor assembly 40.

In an embodiment, referring to fig. 2 to 5, the fixing base 10 has a limiting space 10a with two open top and bottom sides, the lens assembly 20 is located outside the fixing base 10 and disposed at the open top side of the limiting space 10a, the substrate 53 is disposed at the open bottom side of the limiting space 10a, the bearing structure 42 is located in the limiting space 10a and has a light transmission channel 42a, the driving assembly 30 is located in the limiting space 10a and has a light transmission channel 30a communicating with the light transmission channel 42a, and the driving assembly 30 drives the bearing structure 42 to translate in the limiting space 10 a.

The base plate 53 is located outside the fixing base 10 and is disposed at the bottom side opening of the limiting space 10a, that is, the image sensor 41 is located on the top surface of the base plate 53, and the image sensor 41 is located at the bottom side opening of the limiting space 10 a. The light transmission channel 30a corresponds to the open top of the spacing space 10a, the light transmission channel 42a corresponds to the open bottom of the spacing space 10a, and the imaging light of the lens assembly 20 enters the spacing space 10a through the open top of the spacing space 10a, and then is projected onto the image sensor 41 through the light transmission channel 30a, the light transmission channel 42a and the open bottom of the spacing space 10 a. In the case of camera module shake, the driving assembly 30 drives the bearing structure 42 to translate in the limiting space 10a, and the bearing structure 42 drives the substrate 53 and the image sensor 41 to translate synchronously, so as to compensate shake. The bearing structure 42 is located in the limiting space 10a, and the limiting space 10a limits the movement range of the bearing structure 42, for example, the bearing structure 42 abuts against the inner bottom wall surface of the limiting space 10a, so as to limit the translation of the bearing structure 42 to the bottom side, and thus, the increase of the distance between the lens assembly 20 and the image sensor 41 along the optical axis direction is avoided.

Referring to fig. 3 and 5, in an embodiment, the fixing base 10 includes a support plate 11 having a light inlet 11a, a baffle 12 having a light outlet 12a, and a support body 13, where the support plate 11 and the baffle 12 are disposed at intervals along a height direction of the camera module, the support body 13 is supported between the support plate 11 and the baffle 12, the support plate 11, the baffle 12, and the support body 13 together enclose a limiting space 10a, the lens assembly 20 is located at the light inlet 11a, and the substrate 53 is located at the light outlet 12 a. Thus, the fixing seat 10 has a simple structure and a light weight. The imaging light of the lens assembly 20 enters the limiting space 10a through the light inlet 11a, and is projected onto the image sensor 41 through the light outlet 12 a.

In an embodiment, referring to fig. 3 and 5, the supporting plate 11 and the supporting body 13 may be integrally formed. Thus, the manufacturing process of the fixing base 10 is further simplified, and the structure is simplified. After the assembly of the drive assembly 30, the load bearing structure 42, etc., the baffle 12 is then glued or welded to the support 13.

The specific shape of the support plate 11 is not limited, and the shape of the support plate 11 includes, but is not limited to, a circle, an ellipse, a polygon, or the like. For example, in one embodiment, referring to fig. 2, 3 and 5, the supporting plate 11 has a square shape with a light inlet 11a in a central area. The shape of the light inlet 11a is not limited, and exemplary shapes of the light inlet 11a include, but are not limited to, circular, elliptical, polygonal, or other shapes.

The specific placement and number of the supporting bodies 13 are not limited, and in one embodiment, referring to fig. 3 and 5, the supporting bodies 13 are plural, and the plural supporting bodies 13 are disposed at intervals along the circumferential direction of the supporting plate 11. Thus, the structure of the fixing base 10 is more stable. For example, in one embodiment, referring to fig. 3 and 5, four supporting bodies 13 are uniformly arranged at intervals along the circumferential direction of the supporting plate 11. In this way, the baffle plate 12 and the support plate 11 can be supported more stably. Further, the support plate 11 is square with a light entrance 11a in the central area. Four supporting bodies 13 are respectively provided on four corners of the square supporting plate 11.

It should be noted that the number of the substrates, the number of the embodiments of the present application refers to two or more.

The particular shape of the baffle 12 is not limited and the shape of the baffle 12 includes, but is not limited to, circular, elliptical, polygonal, etc. For example, in one embodiment, referring to fig. 3 and 5, the baffle 12 has a square shape with a light outlet 12a in a central area. The shape of the light outlet 12a is not limited, and exemplary shapes of the light outlet 12a include, but are not limited to, circular, oval, polygonal, or other shapes. The light outlet 12a is relatively large in size, so that imaging light is conveniently projected onto the image sensor 41, and the carrying structure 42 is conveniently fixedly connected with the substrate 53.

The specific structure of the driving assembly 30 is not limited, in an embodiment, please refer to fig. 3, 4 and 6, the driving assembly 30 includes a connecting member 31, a shape memory member 32 and a circuit board 33, the connecting member 31 includes a connecting plate 311 fixedly connected with the fixing base 10, and at least one elastic arm 312 fixedly connecting the circuit board 33 and the connecting plate 311, the circuit board 33 is located between the connecting plate 311 and the base plate 53, the circuit board 33 is fixedly connected and electrically connected with the base plate 53, and the circuit board 33 and the connecting plate 311 are both fixedly connected and electrically connected with the shape memory member 32.

The connecting plate 311 is fixed, the connecting plate 311 is fixedly connected with the circuit board 33 through the elastic arm 312, and the circuit board 33 is movable. In the case of jitter compensation, the base plate 53, the circuit board 33, the connecting plate 311 and the shape memory element 32 are electrified, the shape memory element 32 is heated, the heated shape memory element 32 generates recoverable deformation, and the shape memory element 32 drives the circuit board 33, the base plate 53 and the image sensor 41 to translate along the deformation direction. In the case where it is necessary to restore the initial positions of the circuit board 33, the substrate 53, and the image sensor 41, the circuit board 53, the connection board 311, and the shape memory member 32 are powered off, the shape memory member 32 is cooled, and when the actual temperature of the shape memory member 32 is reduced to its preset temperature, the shape memory member 32 is restored to its deformed state, and the circuit board 33, the substrate 53, and the image sensor 41 are restored to the initial positions.

It should be noted that, the shape memory member 32 refers to a material that can be deformed in a recoverable manner according to the actual temperature, and when the actual temperature reaches the preset temperature, the original shape before the deformation can be recovered.

The shape memory member 32 is not limited to a specific material, and in an exemplary embodiment, the shape memory member 32 is a shape memory alloy (Shape Memory Alloys, SMA) which is an alloy material capable of recovering an original shape before the shape memory alloy is deformed when the actual temperature is reduced to a preset temperature. That is, the shape memory alloy has a shape memory effect (Shape Memory Effect, SME) by thermoelastic and martensitic transformation and inversion thereof, and is a material composed of two or more metal elements.

The number of the elastic arms 312 is not limited, and in an embodiment, referring to fig. 6 and 9, the number of the elastic arms 312 is plural, and the plurality of elastic arms 312 are uniformly arranged along the circumferential direction of the connecting plate 311 at intervals. Illustratively, the number of resilient arms 312 is two, with the two resilient arms 312 being symmetrically and evenly distributed. In another embodiment, the number of resilient arms 312 is one.

In an embodiment, referring to fig. 6 and 9, the elastic arm 312 includes a first straight arm 3121, a second straight arm 3122 and a tilting arm 3123, and a plane perpendicular to the optical axis is taken as a projection plane, where a straight line where the first straight arm 3121 is projected intersects a straight line where the second straight arm 3122 is projected; in the free state of the elastic arm 312, the first straight arm 3121, the second straight arm 3122, the inclined arm 3123 and the connection plate 311 are in the same plane, that is, the first straight arm 3121, the second straight arm 3122, the inclined arm 3123 and the connection plate 311 are in the same plane under the influence of the elastic arm 312 without being subjected to external force. The two ends of the inclined arm 3123 are respectively fixedly connected with the first straight arm 3121 and the second straight arm 3122, the end of the first straight arm 3121 far away from the second straight arm 3122 is fixedly connected with the connecting plate 311, and the bottom surface of the second straight arm 3122 is fixedly connected with the top surface of the loop plate 33. In this way, on the one hand, the circuit board 33 moves in a direction away from the connection plate 311 in the optical axis direction by gravity or the like, and the elastic arm 312 pulls back the circuit board 33 by elastic deformation force. On the other hand, the connection area of the second straight arm 3122 with the return plate 33 is larger, so that the connection between the second straight arm 3122 and the return plate 33 is more stable. On the other hand, with the plane perpendicular to the optical axis as the projection plane, the straight line on which the first straight arm 3121 is projected and the straight line on which the second straight arm 3122 is projected intersect, so that the first straight arm 3121 and the tilting arm 3123 can change the deformation direction simultaneously in the process of synchronously translating the loop plate 33 along with the shape memory member 32, so that the single stress of the first straight arm 3121 and the tilting arm 3123 is prevented from being too concentrated, and the first straight arm 3121 and the tilting arm 3123 are prevented from being excessively fatigued.

In one embodiment, referring to fig. 9, the connecting member 31 is an integrally formed structure. Illustratively, the connector 31 is an electrically conductive dome formed integrally from ductile metal.

In an embodiment, referring to fig. 6 to 9, the shape memory member 32 is in a strip shape, a first clamping table 3111 is formed on an outer peripheral side of the connecting plate 311, a second clamping table 331 is formed on an outer peripheral side of the circuit board 33, the first clamping table 3111 and the second clamping table 331 are flush in a height direction of the camera module, and two ends of the shape memory member 32 are fixedly connected with the first clamping table 3111 and the second clamping table 331 respectively. The first and second clamping tables 3111 and 331 are flush, and thus the shape memory member 32 is disposed substantially in a direction perpendicular to the optical axis, facilitating layout of the shape memory member 32 to control a driving direction of the shape memory member 32. The first clamping table 3111 is located at the outer peripheral side of the connection plate 311, and the second clamping table 331 is located at the outer peripheral side of the circuit board 33, so that the first clamping table 3111, the second clamping table 331 and the shape memory member 32 are prevented from occupying a limited space between the connection plate 311 and the circuit board 33, and the size of the camera module in the height direction thereof is facilitated to be reduced.

The specific structures of the first clamping table 3111 and the second clamping table 331 are not limited, and for example, referring to fig. 6 and 7, a first clamping groove is formed on the first clamping table 3111, one end portion of the shape memory member 32 is located in the first clamping groove, and the second clamping table 331 is tightened to tightly bond an inner wall surface of the first clamping groove with the end portion of the shape memory member 32, thereby clamping the shape memory member 32. The second clamping table 331 is formed with a second clamping groove in which the other end of the shape memory member 32 is located, and the second clamping table 331 is tightened to tightly bond the inner wall surface of the second clamping groove with the end of the shape memory member 32, thereby clamping the shape memory member 32. Thus, both ends of the shape memory member 32 are fixedly connected to the first clamping table 3111 and the second clamping table 331, respectively.

The number of the shape memory members 32 is not limited, and in one embodiment, referring to fig. 8, the shape memory members 32 are elongated, and four shape memory members 32 are distributed in a regular quadrilateral shape. That is, the four shape memory members 32 are parallel to each other, and the directions of the two adjacent shape memory members 32 are perpendicular to each other. In this manner, the translation of the image sensor assembly 40 in multiple directions perpendicular to the optical axis is controlled by the four shape memory members 32.

The amount of deformation of the individual shape memory members 32 and/or the number of deformed shape memory members 32, etc., may be controlled based on the current position of the image sensor 41. In an exemplary embodiment, only one of the shape memory members 32 may be extended or contracted, or both shape memory members 32 may be extended or contracted simultaneously, parallel to each other, and the image sensor assembly 40 may be moved in the direction in which the shape memory members 32 are located. In another embodiment, two adjacent shape memory members 32 may be respectively lengthened or shortened, and the image sensor assembly 40 may be translated in a direction intersecting the direction in which either shape memory member 32 is located. In yet another embodiment, any three of the shape memory members 32 may be elongated or shortened, respectively. In yet another embodiment, the four shape memory members 32 are lengthened or shortened, respectively.

In an embodiment, referring to fig. 3 and fig. 10 to fig. 14, the carrying structure 42 includes a carrying plate 421 located between the circuit board 33 and the substrate 53, the circuit board 33 and the substrate 53 are fixedly connected and electrically insulated with the carrying plate 421, the circuit board 33 is formed with a connection finger 332 extending toward the substrate 53, the carrying plate 421 has an avoidance gap 421a, and the connection finger 332 passes through the avoidance gap 421a to be fixedly connected and electrically connected with the substrate 53. The carrier plate 421 serves to strengthen the connection strength between the substrate 53 and the return board 33. Since the electrically insulating carrier plate 421 is disposed between the circuit board 33 and the substrate 53, the design difficulty of the circuit board 33 can be reduced.

Specifically, the substrate 53 is a flexible insulating substrate, and the carrier 421 can be electrically insulated from the substrate 53.

In one embodiment, referring to fig. 3, 11 and 12, the top surface of the carrier 421 is adhered to the circuit board 33. The bottom surface of the carrier plate 421 is adhered to the substrate 53. In this way, the connection strength between the circuit board 33, the substrate 53 and the carrier 421 is further enhanced.

In one embodiment, the circuit board 33 is a conductive metal substrate. On the one hand, the circuit board 33 is convenient to design and manufacture, so that an electric circuit is formed between the circuit board 33, the connecting piece 31 and the shape memory piece 32. On the other hand, the circuit board 33 may be made of a thin structure by a metal process, so that the size of the camera module in the height direction thereof can be reduced.

The specific manner of electrically insulating the carrier plate 421 from the circuit board 33 is not limited, and in an exemplary embodiment, referring to fig. 11 to 14, the carrier structure 42 includes an insulating plate 422 disposed between the circuit board 33 and the carrier plate 421, and the circuit board 33 and the carrier plate 421 are fixedly connected to and electrically insulated from the insulating plate 422. Therefore, the bearing plate 421 can be a metal substrate, so that the thickness of the structure is thinner by a metal process, so that the size of the camera module in the height direction is reduced. In another embodiment, insulating plate 422 may be coated with an insulating layer. Thus, the carrier 421 and the circuit board 33 can be electrically insulated. In another embodiment, the carrier 421 is made of plastic, silica gel or rubber. In this way, the carrier plate 421 can be electrically insulated from the circuit board 33, but the thickness of the carrier plate 421 is thicker.

In one embodiment, referring to fig. 11 to 14, the top surface of the insulating plate 422 is bonded to the circuit board 33. The bottom surface of the insulating plate 422 is bonded to the carrier plate 421. In this way, the connection strength between the circuit board 33, the substrate 53 and the insulating plate 422 is further enhanced.

In order to better support the driving assembly 30 and the bearing structure 42, in an embodiment, referring to fig. 9 to 14, the circuit board 33 is formed with a receiving opening 33a, and the camera module includes sliding members 60 disposed in the receiving opening 33a in a one-to-one correspondence manner, and the sliding members 60 are supported between the connecting plate 311 and the bearing plate 421. On the one hand, the slider 60 provides a supporting force for supporting the connection plate 311 and the carrier plate 421, so that the elastic arm 312 pulls the circuit board 33, and the slider 60 opens the connection plate 311 and the carrier plate 421 to equalize the forces of the circuit board 33 and the connection plate 311 in the optical axis direction. On the other hand, the sliding member 60 has a lower coefficient of friction and produces less frictional resistance, avoiding affecting the relative movement between the drive assembly 30 and the carrier structure 42.

In an embodiment, referring to fig. 9 to 14, the sliding member 60 is movably disposed between the connecting plate 311 and the bearing plate 421. That is, the slider 60 is movable within the receiving port 33a. The receiving opening 33a can restrict the movement of the slider 60, preventing the slider 60 from being separated from the receiving opening 33a.

In one embodiment, referring to fig. 12, the insulating plates 422 form through holes 422b corresponding to the sliding members 60 one by one, and the sliding members 60 are accommodated in the through holes 422b. The through hole 422b can also limit the movement of the slider 60 to prevent the slider 60 from coming out of the through hole 422b.

To further avoid the sliding member 60 from sliding, in one embodiment, one of the connecting plate 311 and the bearing plate 421 is fixedly connected to the sliding member 60, and the other of the connecting plate 311 and the bearing plate 421 abuts against the sliding member 60. For example, in one embodiment, the connecting plate 311 is fixedly connected to the sliding member 60, and the bearing plate 421 abuts against the sliding member 60. In another embodiment, the bearing plate 421 is fixedly connected to the sliding member 60, and the connecting plate 311 abuts against the sliding member 60.

The specific shape and structure of the sliding member 60 are not limited, and in an exemplary embodiment, referring to fig. 3 and 13, the sliding member 60 has a spherical shape. In a specific embodiment, in a state where the sliding member 60 is movably disposed between the connection plate 311 and the bearing plate 421, the contact surface between the sliding member 60 and the connection plate 311 and the bearing plate 421 is smaller, so as to further reduce the frictional resistance. In another embodiment, the slider 60 has a polyhedral shape, for example, a hexahedral shape.

In an embodiment, referring to fig. 2 to 5, the connection plate 311 and the carrier plate 421 are located in the limiting space 10 a. In this way, the limit space 10a is used to further limit the translation of the bearing plate 421 along the optical axis in a direction away from the connecting plate 311, so as to further avoid the sliding member 60 from sliding down.

In an embodiment, referring to fig. 2, 5 and 8 to 14, the fixing base 10 has a limiting space 10a with two open top and bottom sides, the lens assembly 20 is located outside the fixing base 10 and disposed at the open top side of the limiting space 10a, the substrate 53 is disposed at the open bottom side of the limiting space 10a, the supporting structure 42 and the driving assembly 30 are both located in the limiting space 10a, the driving assembly 30 is formed with a light-transmitting channel 30a penetrating through the connecting plate 311 and the circuit board 33, the supporting structure 42 is formed with a light-transmitting channel 42a penetrating through the supporting plate 421, and the light-transmitting channel 42a is communicated with the light-transmitting channel 30 a.

The light transmission channel 30a corresponds to the open top of the limit space 10a, and the light transmission channel 42a corresponds to the open bottom of the limit space 10 a. The imaging light of the lens assembly 20 enters the limiting space 10a through the top side opening of the limiting space 10a, and then is projected onto the image sensor 41 through the light-transmitting channel 30a, the light-transmitting channel 42a and the bottom side opening of the limiting space 10 a. Specifically, the connection plate 311 is formed with a first light-passing hole 311a, the circuit board 33 is formed with a second light-passing hole 33b, and the first light-passing hole 311a and the second light-passing hole 33b are part of the light-passing channel 30 a. The carrier plate 421 is formed with a first light hole 421b, and the first light hole 421b is a portion of the light-transmitting channel 42 a.

In some embodiments, referring to fig. 11 and 12, the insulating plate 422 is formed with a second light transmission hole 422a, and the second light transmission hole 422a is a part of the light transmission channel 42 a.

Referring to fig. 11 to 14, the bearing structure 42 includes an elastic column 424 disposed on an outer peripheral side of the bearing plate 421, and the driving assembly 30 drives the bearing structure 42 to elastically contact with an inner wall surface of the limiting space 10a during the translational movement of the bearing structure 42 in the limiting space 10 a. The elastic column 424 is in elastic contact with the inner wall surface of the limit space 10a, so that the image sensor assembly 40 is prevented from shaking or being damaged due to the fact that the image sensor assembly 40 impacts the fixed seat 10 in the moving process, and a buffering effect is achieved.

Referring to fig. 11 to 14, the bearing structure 42 includes a bearing platform 423 disposed on an outer peripheral side of the bearing plate 421, the bearing platform 423 is disposed in one-to-one correspondence with the elastic columns 424, the bearing platform 423 is formed with mounting holes 423a, the elastic columns 424 include a column 4241, a neck 4242 fixedly connected with the column 4241, and an enlarged body 4243 disposed at an end of the neck 4242 away from the column 4241, and the enlarged body 4243 can pass through the mounting holes 423a in a manner of restoring deformation so that the neck 4242 passes through the mounting holes 423a.

The size of the enlarged body 4243 is larger than the size of the mounting hole 423a. The enlarged body 4243 deforms to pass through the mounting hole 423a until the neck 4242 passes through the mounting hole 423a, and the enlarged body 4243 recovers the deformation, so that the enlarged body 4243 and the column 4241 act together to prevent the neck 4242 from falling out of the mounting hole 423a.

The specific shape of the enlarged body 4243 is not limited, and in an exemplary embodiment, please refer to fig. 11 and 12, the enlarged body 4243 is disc-shaped.

The particular material of the enlarged body 4243 is not limited, and in one embodiment, the substrate of the enlarged body 4243 includes, but is not limited to, flexible plastic, rubber, or silicone, etc.

In an embodiment, referring to fig. 13 and 14, a plane perpendicular to the optical axis is taken as a projection plane, and the projection outline of the circuit board 33 is located within the projection outline of the carrier 421. In this way, on the one hand, the circuit board 33 is prevented from colliding with the inner wall surface of the limit space 10a so as to protect the circuit board 33.

In one embodiment, referring to fig. 11 and 12, the carrying platform 423 includes two intersecting side plates 4231, and each side plate 4231 has a mounting hole 423a formed therein; the column 4241 is hexahedral, two sides of the column 4241 corresponding to the side plates 4231 are respectively provided with a neck 4242 and an expansion 4243, and the two necks 4242 are respectively penetrated through the mounting holes 423a of the two side plates 4231. In this way, the elastic posts 424 can be more firmly fitted to the carrier 423.

In one embodiment, referring to fig. 2, the camera module includes a sensing member 70 fixedly disposed on the fixing base 10, and a detecting member 80 fixedly and electrically connected to the substrate 53. The detecting member 80 can detect the sensing member 70 without contact to acquire the current position of the image sensor 41. The sensing element 80 is positioned on the base plate 53 to facilitate the supply of power to the sensing element 80. During the translation of the base plate 53 and the image sensor 41, the detecting element 80 translates synchronously with the base plate 53, the distance between the detecting element 80 and the sensing element 70 changes, and the detecting element 80 cooperates with the sensing element 70 to achieve the purpose of detecting the current position of the image sensor 41. In this way, it is convenient to move the image sensor 41 so that the photosensitive surface of the image sensor 41 is aligned with the lens assembly 20 to achieve shake compensation. The sensing element 80 is configured to detect the sensing element 70 in a contactless manner, avoiding physical connections, such as wires or other connection structures, between the sensing element 80 and the sensing element 70, thereby avoiding physical connections interfering with the synchronous translation of the sensing element 80 with the substrate 53.

The specific structures of the sensing element 70 and the detecting element 80 are not limited, and in one embodiment, referring to fig. 2, the sensing element 70 is a permanent magnet. The sensing element 80 is a magnetic field sensor, such as a hall sensor.

The number of sensing elements 70 is not limited, and in one embodiment, referring to fig. 3 and 6, four shape memory elements 32 are arranged in a regular quadrilateral pattern. At least three sensing elements 70 are provided, each sensing element 70 is disposed between two adjacent shape memory elements 32, and the detecting elements 80 are disposed in one-to-one correspondence with the sensing elements 70. In this way, accurate acquisition of the current position of the image sensor 41 is facilitated.

The specific position of the sensing element 70 on the fixing base 10 is not limited, and in an exemplary embodiment, referring to fig. 2, 3 and 5, the supporting plate 11 is recessed toward the bottom side to form a receiving groove 11b, and the sensing element 70 is disposed in the receiving groove 11 b.

Reference in the specification to "some embodiments," "one embodiment," "another embodiment," "a particular embodiment," and so forth, which describe a subset of all possible embodiments, does not necessarily refer to the same embodiment, and further, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments, it being understood that "some embodiments," "one embodiment," "another embodiment," "a particular embodiment," and the like, or different subsets of all possible embodiments, and may be combined with one another without conflict.

The foregoing is merely an embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered in the protection scope of the present application.

Claims

1. A camera module, comprising:

a fixing seat;

a lens assembly capable of auto-focusing;

the driving component is fixedly arranged on the fixing seat;

the flexible circuit board comprises a first movable part extending along a first direction and a second movable part bending from the first movable part to a second direction, wherein the first movable part is fixedly connected with the image sensor assembly and is electrically connected with the image sensor assembly, the first direction and the second direction are perpendicular to the optical axis, and the first direction and the second direction are intersected;

the flexible circuit board comprises a substrate extending from the first movable part to the bottom side of the fixed seat; the driving assembly comprises a connecting piece, a shape memory piece and a circuit board, wherein the connecting piece comprises a connecting plate fixedly connected with the fixing seat and at least one elastic arm fixedly connected with the circuit board and the connecting plate, the circuit board is positioned between the connecting plate and the base plate, the circuit board is fixedly connected with the base plate and is electrically connected with the base plate, and the circuit board and the connecting plate are both fixedly connected with the shape memory piece and are electrically connected with the shape memory piece.

2. The camera module of claim 1, wherein the first movable portion and the second movable portion are disposed around an outer periphery of the fixed base.

3. The camera module of claim 1, wherein the image sensor assembly comprises an image sensor fixedly and electrically disposed on the substrate, and a carrier structure between the drive assembly and the substrate, both of which are fixedly connected to the carrier structure.

4. The camera module according to claim 3, wherein the fixing base has a limiting space with two open top and bottom sides, the lens assembly is located outside the fixing base and is disposed at the open top side of the limiting space, the substrate is disposed at the open bottom side of the limiting space, the bearing structure is located in the limiting space and has a light transmission channel, the driving assembly is located in the limiting space and has a light transmission channel communicated with the light transmission channel, and the driving assembly drives the bearing structure to translate in the limiting space.

5. The camera module of claim 4, wherein the fixing base comprises a support plate with a light inlet, a baffle with a light outlet and a support body, the support plate and the baffle are arranged at intervals along the height direction of the camera module, the support body is supported between the support plate and the baffle, the support plate, the baffle and the support body jointly enclose to form the limit space, the lens assembly is located at the light inlet, and the substrate is located at the light outlet.

6. The camera module according to claim 1, wherein the elastic arm includes a first straight arm, a second straight arm, and an inclined arm, a plane perpendicular to the optical axis is taken as a projection plane, and a straight line where the first straight arm is projected intersects a straight line where the second straight arm is projected; in the free state of the elastic arm, the first straight arm, the second straight arm, the inclined arm and the connecting plate are in the same plane, two ends of the inclined arm are respectively and fixedly connected with the first straight arm and the second straight arm, the end part, far away from the second straight arm, of the first straight arm is fixedly connected with the connecting plate, and the bottom surface of the second straight arm is fixedly connected with the top surface of the loop board.

7. The camera module according to claim 1, wherein the shape memory member is in a strip shape, a first clamping table is formed on an outer peripheral side of the connecting plate, a second clamping table is formed on an outer peripheral side of the circuit board, the first clamping table and the second clamping table are flush in a height direction of the camera module, and two ends of the shape memory member are fixedly connected with the first clamping table and the second clamping table respectively.

8. The camera module of claim 1, wherein the shape memory members are elongated and four of the shape memory members are distributed in a regular quadrilateral.

9. A camera module according to claim 3, wherein the carrier structure comprises a carrier plate between the circuit board and the substrate, the circuit board and the substrate are both fixedly connected with the carrier plate and electrically insulated, the circuit board is formed with a connection finger extending toward the substrate, the carrier plate has an avoidance gap, and the connection finger passes through the avoidance gap and is fixedly connected with and electrically connected with the substrate.

10. The camera module of claim 9, wherein the carrier structure comprises an insulating plate disposed between the circuit board and the carrier plate, the circuit board and the carrier plate being fixedly connected to and electrically insulated from the insulating plate.

11. The camera module of claim 9, wherein the circuit board is formed with a receiving opening, and the camera module includes sliding members disposed in the receiving opening in a one-to-one correspondence, and the sliding members are supported between the connection board and the carrier board.

12. The camera module of claim 11, wherein the slider is movably disposed between the connection plate and the carrier plate; or alternatively, the first and second heat exchangers may be,

13. The camera module according to claim 9, wherein the fixing base has a limit space with two open top and bottom sides, the lens assembly is located outside the fixing base and is disposed at the open top side of the limit space, the substrate is disposed at the open bottom side of the limit space, the bearing structure and the driving assembly are both located in the limit space, the driving assembly is formed with a light transmission channel penetrating through the connecting plate and the circuit board, the bearing structure is formed with a light transmission channel penetrating through the bearing plate, and the light transmission channel is communicated with the light transmission channel;

14. The camera module of claim 13, wherein the bearing structure comprises a bearing table disposed on an outer peripheral side of the bearing plate, the bearing table is disposed in one-to-one correspondence with the elastic columns, the bearing table is formed with mounting holes, the elastic columns comprise columns, necks fixedly connected with the columns, and an expansion body located at one end of the necks away from the columns, and the expansion body can pass through the mounting holes in a mode of being deformed in a restoration mode so that the necks penetrate through the mounting holes.

15. The camera module of claim 13, wherein a plane perpendicular to the optical axis is taken as a projection plane, and the projection outer contour of the circuit board is located in the projection outer contour of the carrier board.

16. The camera module according to any one of claims 1 to 15, wherein the camera module comprises:

the induction piece is fixedly arranged on the fixing seat; and

the detection piece is fixedly and electrically connected to the substrate, and can detect the sensing piece in a non-contact mode so as to acquire the current position of the image sensor in the image sensor assembly.

17. A mobile terminal, comprising:

The camera module of any one of claims 1-16; and