CN113903685A - Continuous semiconductor wafer wet etching machine - Google Patents
Continuous semiconductor wafer wet etching machine Download PDFInfo
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- CN113903685A CN113903685A CN202111093050.5A CN202111093050A CN113903685A CN 113903685 A CN113903685 A CN 113903685A CN 202111093050 A CN202111093050 A CN 202111093050A CN 113903685 A CN113903685 A CN 113903685A
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- semiconductor wafer
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 238000001039 wet etching Methods 0.000 title claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 56
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 53
- 238000004140 cleaning Methods 0.000 claims description 18
- 230000007723 transport mechanism Effects 0.000 claims description 15
- 238000005406 washing Methods 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000005341 toughened glass Substances 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 47
- 230000007246 mechanism Effects 0.000 description 13
- 239000007921 spray Substances 0.000 description 13
- 238000007599 discharging Methods 0.000 description 8
- 241000220317 Rosa Species 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000001914 filtration Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Weting (AREA)
Abstract
The invention discloses a continuous semiconductor wafer wet etching machine, which relates to the technical field of etching machines and comprises a case, wherein an etching table is arranged in an inner cavity of the case, a fixed disc is arranged in the middle of the top surface of the etching table, a first bulge part is arranged on the side surface of the fixed disc, a second bulge part is arranged on the side surface of the fixed disc, and a servo motor is fixedly arranged in the etching table. This continuous type semiconductor wafer wet etching machine, through the extrusion cooperation between second bellying and the roof, promote two and promote the piece and carry out the removal of keeping away from each other along the direction spout through the slide bar, make two and promote the area that forms between the piece and be greater than the semiconductor wafer area, make semiconductor wafer remove to the top surface of backup pad, and make two pieces of promotion pieces carry out extrusion cooperation to semiconductor wafer under the elastic force of second spring, realized automatic function of fixing to semiconductor wafer.
Description
Technical Field
The invention relates to the technical field of etching machines, in particular to a continuous semiconductor wafer wet etching machine.
Background
The etcher may be classified into a chemical etcher using a chemical solution to achieve the purpose of etching through a chemical reaction and an electrolytic etcher using a principle that metal is dissolved in a solution containing tap water or saline as an etching subject by an anode, and thus, no contamination is generated when etching a wafer, and a continuous wet etching apparatus for a semiconductor wafer is developed in order to improve production efficiency during etching of a semiconductor wafer.
However, the existing continuous semiconductor wafer wet etching machine does not fix the wafer well during etching, and is easy to generate floating phenomenon during etching, and in addition, the existing continuous semiconductor wafer wet etching machine generally rinses the semiconductor wafer by pure water during cleaning, so that the cleaning efficiency and quality are not high, and the requirements of the existing continuous semiconductor wafer wet etching machine cannot be met.
Disclosure of Invention
In view of the deficiencies of the prior art, the present invention provides a continuous wet etching machine for semiconductor wafers, which solves the problems mentioned above in the background art.
In order to achieve the purpose, the invention is realized by the following technical scheme: a continuous semiconductor wafer wet etching machine comprises a machine case, wherein an etching table is arranged in an inner cavity of the machine case, a fixed disc is arranged in the middle of the top surface of the etching table, a first protruding portion is arranged on the side surface of the fixed disc, a second protruding portion is arranged on the side surface of the fixed disc, a servo motor is fixedly installed in the etching table, an output shaft of the servo motor is connected with a rotating disc, an electric hydraulic rod is arranged at the top of the rotating disc, a lifting block is fixedly connected to the top of the output end of the electric hydraulic rod, a plurality of groups of connecting rods are fixedly connected to the side surface of the lifting block, a supporting plate is fixedly connected to one end of each connecting rod, the supporting plates are uniformly arranged on the side portion of the fixed disc, two inclined guide sliding chutes are symmetrically arranged on the surface of each supporting plate, sliding rods are arranged in inner cavities of the guide sliding chutes, one ends of the sliding rods extend to the top surfaces of the supporting plates, and are fixedly connected with pushing blocks, the other end of the slide bar extends to the bottom of the support plate respectively and is fixedly connected with positioning plates, the middle part of the inner side surface of one positioning plate is provided with a positioning sleeve with an inner cavity, the middle part of the inner side surface of the other positioning plate is provided with a positioning rod, one end of the positioning rod is movably sleeved to the inner cavity of the positioning sleeve, the outer side of the positioning sleeve is sleeved with a second spring, the two ends of the second spring are respectively connected with the inner side surfaces of the two positioning plates, one sides of the two positioning plates, which are close to the fixed plate, are provided with top plates, the two top plates are mutually in sliding fit, the position of the top plates is matched with the second bulge part, the top surface of the support plate is provided with a positioning chute penetrating through the front side wall and the rear side wall, the inner cavity of the positioning chute is provided with a positioning slide block, one end of the top end of the positioning slide block is fixedly connected with a push plate, the position of the push plate is matched with the position of the first bulge part, the top surface of backup pad and the one side that is close to the fixed disk are provided with the dog, the inboard fixedly connected with first spring of dog, the one end of first spring is connected with the side of push pedal.
Optionally, an etching groove is formed in the top of the etching table, an alkaline washing groove is formed in the top of the etching table, an HF acid groove is formed in the top of the etching table, a cleaning groove is formed in the top of the etching table, a suction nozzle is arranged on the inner wall of the cleaning groove, and the positions of the etching groove, the alkaline washing groove, the HF acid groove and the cleaning groove are matched with the supporting plate.
Optionally, a supporting block is arranged on the top surface of the etching table, an electric telescopic rod is arranged on the side surface of the supporting block, the output end of the electric telescopic rod extends to the upper part of the cleaning tank and is fixedly connected with a water spray pipe, the bottom of the water spray pipe is provided with a water spray hole, a filter box is arranged above the supporting block, a filter sponge is arranged in the inner cavity of the filter box, the top of the filter box is provided with a sealing cover by screw thread, the side surface of the filter box is fixedly connected with a water guide hose, one end of the water guide hose extends to the inner cavity of the water spray pipe, a mounting block is fixedly connected to the side surface of the etching platform and positioned at the outer side of the cleaning tank, the top surface fixed mounting of installation piece has the water pump, the equal fixedly connected with of input and the output of water pump absorbs water the pipe, one the one end that absorbs water the pipe is connected with the suction nozzle, another the one end that absorbs water the pipe extends to the inner chamber of rose box.
Optionally, the height of the push plate is greater than the height of the push block.
Optionally, a feeding conveying mechanism is arranged on the outer side of the case, one end of the feeding conveying mechanism extends to the inner cavity of the case and is matched with the position of the second protruding portion, a discharging conveying mechanism is arranged on the outer side of the case, and one end of the discharging conveying mechanism extends to the inner cavity of the case and is matched with the position of the first protruding portion.
Optionally, the bottom joint of rolling disc has the support ball, the surface that supports the ball is laminated with the top surface of fixed disk mutually.
Optionally, the front of the case is hinged with a maintenance door, the middle of the maintenance door is provided with toughened glass, the front of the case is fixedly provided with a control panel, and the control panel is electrically connected with the servo motor, the electric hydraulic rod, the feeding conveying mechanism and the discharging conveying mechanism respectively.
The invention provides a continuous semiconductor wafer wet etching machine, which has the following beneficial effects:
1. this continuous type semiconductor wafer wet etching machine, through the extrusion cooperation between second bellying and the roof, promote two and promote the piece and carry out the removal of keeping away from each other along the direction spout through the slide bar, make two and promote the area that forms between the piece and be greater than the semiconductor wafer area, make semiconductor wafer remove to the top surface of backup pad, and make two pieces of promotion pieces carry out extrusion cooperation to semiconductor wafer under the elastic force of second spring, realized automatic function of fixing to semiconductor wafer.
2. According to the continuous semiconductor wafer wet etching machine, the push plate is pushed to move along the guide sliding groove through the extrusion matching between the first protruding part and the push plate, so that the etched semiconductor wafer is pushed to the discharging and conveying mechanism to be discharged, and the function of automatically discharging the semiconductor wafer is realized.
3. This continuous type semiconductor wafer wet etching machine, when backup pad and semiconductor wafer dip in the pure water of cleaning tank inner chamber, control panel control water pump and electric telescopic handle start, the inner chamber of rose box is taken out to the pure water that is located the cleaning tank inner chamber to the water pump filters, the inner chamber of water spray pipe is got into from the water guide hose to the pure water after the filtration, spout the surface to the semiconductor wafer from the hole for water spraying, the water pump drives the spray pipe and removes simultaneously, the function of washing the semiconductor wafer has been realized, the pure water of supplementary cleaning tank inner chamber rinses the semiconductor wafer, the operating mass when having improved this continuous type semiconductor wafer wet etching machine and wasing.
Drawings
FIG. 1 is an internal schematic view of a chassis of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
FIG. 3 is a schematic structural diagram of the front side of the present invention;
FIG. 4 is a schematic structural view of a fixing plate according to the present invention;
FIG. 5 is a top view of the mounting plate of the present invention;
FIG. 6 is a bottom view of the fixing plate of the present invention;
FIG. 7 is a side view of the mounting plate of the present invention;
FIG. 8 is a schematic structural view of a pusher block of the present invention;
FIG. 9 is a schematic view of a positioning plate according to the present invention;
FIG. 10 is an exploded view of the clamping mechanism of the present invention;
FIG. 11 is a schematic view of a second spring according to the present invention;
FIG. 12 is a schematic view of a first spring according to the present invention;
FIG. 13 is a schematic view of the support block of the present invention.
In the figure: 1. a chassis; 2. an etching table; 3. a servo motor; 4. rotating the disc; 5. fixing the disc; 6. a lifting block; 7. an electro-hydraulic lever; 8. a support plate; 9. a first boss portion; 10. a second boss portion; 11. a connecting rod; 12. supporting the balls; 13. etching a groove; 14. an alkaline washing tank; 15. an HF acid tank; 16. a cleaning tank; 17. a guide chute; 18. positioning the chute; 19. a stopper; 20. a first spring; 21. positioning the sliding block; 22. mounting blocks; 23. a water pump; 24. a suction pipe; 25. a suction nozzle; 26. a support block; 27. a filter box; 28. filtering the sponge; 29. a sealing cover; 30. an electric telescopic rod; 31. a water spray pipe; 32. a water spray hole; 33. a water guide hose; 34. pushing the plate; 35. a slide bar; 36. a pushing block; 37. positioning a plate; 38. a top plate; 39. positioning a rod; 40. a positioning sleeve; 41. a second spring; 42. a feed transport mechanism; 43. a discharge conveying mechanism; 44. a control panel; 45. repairing the door; 46. and (4) tempering the glass.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 13, the present invention provides a technical solution: a continuous semiconductor wafer wet etching machine comprises a machine case 1, an etching table 2 is arranged in an inner cavity of the machine case 1, a fixed disc 5 is arranged in the middle of the top surface of the etching table 2, a first protruding portion 9 is arranged on the side surface of the fixed disc 5, a second protruding portion 10 is arranged on the side surface of the fixed disc 5, a servo motor 3 is fixedly installed inside the etching table 2, an output shaft of the servo motor 3 is connected with a rotating disc 4, an electric hydraulic rod 7 is arranged on the top of the rotating disc 4, a lifting block 6 is fixedly connected to the top of the output end of the electric hydraulic rod 7, six groups of connecting rods 11 are fixedly connected to the side surface of the lifting block 6, a supporting plate 8 is fixedly connected to one end of each connecting rod 11, six supporting plates 8 are uniformly arranged on the side portion of the fixed disc 5, two inclined guide sliding grooves 17 are symmetrically arranged on the surface of each supporting plate 8, sliding rods 35 are arranged in inner cavities of the two guide sliding grooves 17, one end of the slide bar 35 extends to the top surface of the support plate 8 and is fixedly connected with a pushing block 36, the other end of the slide bar 35 extends to the bottom of the support plate 8 and is fixedly connected with a positioning plate 37, the middle part of the inner side surface of one positioning plate 37 is provided with a positioning sleeve 40 with an inner cavity, the middle part of the inner side surface of the other positioning plate 37 is provided with a positioning rod 39, one end of the positioning rod 39 is movably sleeved to the inner cavity of the positioning sleeve 40, the outer side of the positioning sleeve 40 is sleeved with a second spring 41, two ends of the second spring 41 are respectively connected with the inner side surfaces of the two positioning plates 37, the two pushing blocks 36 are driven to slide along the guide sliding chute 17 by the elastic action of the second spring 41 so as to clamp a workpiece, one side of the two positioning plates 37, which is close to the fixed plate 5, is provided with a top plate 38, the two top plates 38 are mutually slidably attached, and the position of the top plate 38 is matched with the second bulge part 10, when the second protruding portion 10 extrudes the top plate 38, the two pushing blocks 36 are driven to move away from each other along the guiding sliding groove 17, so that a workpiece is conveniently fed to a position between the two pushing blocks 36 on the supporting plate 8 by the feeding and conveying mechanism 42, the top surface of the supporting plate 8 is provided with a positioning sliding groove 18 penetrating through the front side wall and the rear side wall, an inner cavity of the positioning sliding groove 18 is provided with a positioning sliding block 21, one end of the top end of the positioning sliding block 21 is fixedly connected with a pushing plate 34 above the supporting plate 8, the position of the pushing plate 34 is matched with the position of the first protruding portion 9, one side of the top surface of the supporting plate 8, which is close to the fixed disk 5, is provided with a stop block 19, the inner side of the stop block 19 is fixedly connected with a first spring 20, one end of the first spring 20 is connected with the side surface of the pushing plate 34, the pushing plate 34 is driven by the first protruding portion 9 to extrude the pushing plate 34, so as to drive the pushing plate 34 to move towards the direction away from the fixed disk 5, thereby driving the push plate 34 to push the workpiece between the two push blocks 36 to the discharging conveying mechanism 43 for discharging.
Wherein, etching tank 13 has been seted up at the top of etching platform 2, the inner chamber in etching tank 13 is provided with the etching solution, alkaline washing tank 14 has been seted up at the top of etching platform 2, alkaline washing tank 14's inner chamber is provided with sodium hydroxide or potassium hydroxide solution, be used for neutralizing acidic material, get rid of porous silicon, HF acid tank 15 has been seted up at the top of etching platform 2, HF acid tank 15's inner chamber is provided with HF solution, be used for passivating hydrogen ion, washing tank 16 has been seted up at the top of etching platform 2, washing tank 16's inner chamber all is provided with the pure water, be used for wasing the chemical substance on semiconductor wafer surface, washing tank 16's inner wall is provided with suction nozzle 25, etching tank 13, alkaline washing tank 14, HF acid tank 15 and washing tank 16's position and backup pad 8 looks adaptation.
Wherein, the top surface of etching platform 2 is provided with supporting shoe 26, the side of supporting shoe 26 is provided with electric telescopic handle 30, electric telescopic handle 30's output extends to the top of wash bowl 16 and fixedly connected with spray pipe 31, hole for water spraying 32 has been seted up to the bottom of spray pipe 31, the top of supporting shoe 26 is provided with rose box 27, the inner chamber of rose box 27 is provided with filtering sponge 28, sealed lid 29 is installed to the top screw thread of rose box 27, the side fixedly connected with water guide hose 33 of rose box 27, the one end of water guide hose 33 extends to the inner chamber of spray pipe 31, the side of etching platform 2 just is located the outside fixedly connected with installation block 22 of wash bowl 16, the top surface fixedly mounted of installation block 22 has water pump 23, the equal fixedly connected with suction pipe 24 of input and the output of water pump 23, the one end of one suction pipe 24 is connected with suction nozzle 25, the one end of another suction pipe 24 extends to the inner chamber of rose box 27.
Wherein the height of the push plate 34 is greater than the height of the push block 36.
Wherein, the outside of machine case 1 is provided with feeding transport mechanism 42, the one end of feeding transport mechanism 42 extends to the inner chamber of machine case 1 and is adapted with the position of second bellying 10, carry the inner chamber of machine case 1 to semiconductor wafer through feeding transport mechanism 42, and make semiconductor wafer move to the surface of backup pad 8, the outside of machine case 1 is provided with ejection of compact transport mechanism 43, the one end of ejection of compact transport mechanism 43 extends to the inner chamber of machine case 1 and is adapted with the position of first bellying 9, carry the semiconductor wafer that the etching is accomplished out of the inner chamber of machine case 1 through ejection of compact transport mechanism 43.
Wherein, the bottom joint of rolling disc 4 has support ball 12, and the surface that supports ball 12 is laminated mutually with the top surface of fixed disk 5, supports rolling disc 4 through supporting ball 12, and supplementary rolling disc 4 rotates through supporting ball 12 in addition.
Wherein, the front of machine case 1 articulates there is maintenance door 45, and the middle part of maintenance door 45 is provided with toughened glass 46, and the front fixed mounting of machine case 1 has control panel 44, and control panel 44 is respectively with servo motor 3, electronic hydraulic stem 7, feeding transport mechanism 42, ejection of compact transport mechanism 43 electric connection.
To sum up, when the continuous semiconductor wafer wet etching machine is used, when the rotating disc 4 drives one of the support plates 8 to move to the position of the second protruding portion 10, the second protruding portion 10 on the lower side of the fixed disc 5 is in extrusion fit with the top plate 38, the two pushing blocks 36 are pushed to move away from each other along the guide sliding groove 17 through the sliding rod 35, so that an area larger than the area of the semiconductor wafer is formed between the two pushing blocks 36, then the feeding and conveying mechanism 42 is started to move the semiconductor wafer to the top surface of the support plate 8, then under the continuous rotation of the rotating disc 4, the pushing plate 34 is separated from the fit with the second protruding portion 10, so that under the action of the elastic force of the second spring 41, the two pushing blocks 36 move close to each other along the guide sliding groove 17 through the sliding rod 35 until being in extrusion fit with the two sides of the semiconductor wafer respectively, so as to clamp and fix the semiconductor wafer, when the support plate 8 with the semiconductor wafer clamped therein rotates to the upper part of the etching tank 13, the servo motor 3 is closed to stop rotating, the electric hydraulic rod 7 is started to drive the support plate 8 and the semiconductor wafer to be immersed into the etching solution in the inner cavity of the etching tank 13 for etching, the electric hydraulic rod 7 is started after etching for a fixed time to lift the support plate 8 and the semiconductor wafer and drive the support plate 8 and the semiconductor wafer to rotate to the upper part of the alkaline washing tank 14, acidic substances on the semiconductor wafer are neutralized by a sodium hydroxide or potassium hydroxide solution in the inner cavity of the alkaline washing tank 14, and hydrogen ions are passivated by an HF solution in the inner cavity of the HF acid tank 15, when the support plate 8 and the semiconductor wafer are immersed into pure water in the inner cavity of the cleaning tank 16, the control panel 44 controls the water pump 23 and the electric telescopic rod 30 to be started, so that the water pump 23 pumps the pure water in the inner cavity of the cleaning tank 16 into the inner cavity of the filter tank 27 for filtering, the filtered pure water is introduced into the inner cavity of the water spray pipe 31 from the water guide hose 33, sprayed from the water spray holes 32 to the surface of the semiconductor wafer, meanwhile, the electric telescopic rod 30 drives the water spraying pipe 31 to move, when the semiconductor wafer is moved to the position of the first protruding part 9 after the etching is finished, because the height of the push plate 34 is greater than that of the push block 36, the first protrusions 9 can be engaged with the upper portion of the push plate 34, thereby pushing the push plate 34 to move along the guide slide groove 17, so as to push the etched semiconductor wafer to the discharging and conveying mechanism 43 for blanking, at this time, the first spring 20 is in a stretching state, and then, with the continuous rotation of the rotating disc 4, the pushing plate 34 is gradually separated from the first protruding part 9, in the process of detachment, the push plate 34 is reset under the elastic force of the first spring 20, and the semiconductor wafer is etched in sequence according to the above steps.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. A continuous semiconductor wafer wet etching machine comprises a machine box (1), and is characterized in that: an etching table (2) is arranged in an inner cavity of the case (1), a fixed disc (5) is arranged in the middle of the top surface of the etching table (2), a first protruding portion (9) is arranged on the side surface of the fixed disc (5), a second protruding portion (10) is arranged on the side surface of the fixed disc (5), a servo motor (3) is fixedly installed inside the etching table (2), an output shaft of the servo motor (3) is connected with a rotating disc (4), an electric hydraulic rod (7) is arranged at the top of the rotating disc (4), a lifting block (6) is fixedly connected to the top of the output end of the electric hydraulic rod (7), a plurality of groups of connecting rods (11) are fixedly connected to the side surface of the lifting block (6), a supporting plate (8) is fixedly connected to one end of each connecting rod (11), and the supporting plates (8) are uniformly arranged on the side portion of the fixed disc (5), the surface of the supporting plate (8) is symmetrically provided with two inclined guide sliding chutes (17), the inner cavities of the guide sliding chutes (17) are provided with sliding rods (35), one end of each sliding rod (35) extends to the top surface of the supporting plate (8) and is fixedly connected with a pushing block (36), the other end of each sliding rod (35) extends to the bottom of the supporting plate (8) and is fixedly connected with a positioning plate (37), the middle of the inner side surface of one positioning plate (37) is provided with a positioning sleeve (40) with an inner cavity, the middle of the inner side surface of the other positioning plate (37) is provided with a positioning rod (39), one end of each positioning rod (39) is movably sleeved to the inner cavity of the positioning sleeve (40), the outer side of the positioning sleeve (40) is sleeved with a second spring (41), and two ends of the second spring (41) are respectively connected with the inner side surfaces of the two positioning plates (37), one side of each of the two positioning plates (37) close to the fixed disc (5) is provided with a top plate (38), the two top plates (38) are mutually attached in a sliding way, the top plate (38) is matched with the second bulge (10), the top surface of the supporting plate (8) is provided with a positioning sliding groove (18) penetrating through the front side wall and the rear side wall, a positioning slide block (21) is arranged in the inner cavity of the positioning slide groove (18), one end of the top end of the positioning slide block (21) is fixedly connected with a push plate (34) above the supporting plate (8), the position of the push plate (34) is matched with the position of the first bulge (9), a stop block (19) is arranged on the top surface of the supporting plate (8) and one side close to the fixed disc (5), the inner side of the stop block (19) is fixedly connected with a first spring (20), and one end of the first spring (20) is connected with the side face of the push plate (34).
2. A continuous semiconductor wafer wet etching machine as claimed in claim 1, wherein: the etching device is characterized in that an etching groove (13) is formed in the top of the etching table (2), an alkaline washing groove (14) is formed in the top of the etching table (2), an HF acid groove (15) is formed in the top of the etching table (2), a cleaning groove (16) is formed in the top of the etching table (2), a suction nozzle (25) is arranged on the inner wall of the cleaning groove (16), and the positions of the etching groove (13), the alkaline washing groove (14), the HF acid groove (15) and the cleaning groove (16) are matched with the support plate (8).
3. A continuous semiconductor wafer wet etching machine as claimed in claim 1, wherein: the top surface of the etching table (2) is provided with a supporting block (26), the side surface of the supporting block (26) is provided with an electric telescopic rod (30), the output end of the electric telescopic rod (30) extends to the upper part of the cleaning tank (16) and is fixedly connected with a water spraying pipe (31), the bottom of the water spraying pipe (31) is provided with a water spraying hole (32), the upper part of the supporting block (26) is provided with a filter box (27), the inner cavity of the filter box (27) is provided with a filter sponge (28), the top of the filter box (27) is provided with a sealing cover (29) in a threaded manner, the side surface of the filter box (27) is fixedly connected with a water guide hose (33), one end of the water guide hose (33) extends to the inner cavity of the water spraying pipe (31), the side surface of the etching table (2) is fixedly connected with an installation block (22) on the outer side of the cleaning tank (16), and the top surface of the installation block (22) is fixedly installed with a water pump (23), the water pump is characterized in that the input end and the output end of the water pump (23) are fixedly connected with water suction pipes (24), one end of one water suction pipe (24) is connected with a suction nozzle (25), and one end of the other water suction pipe (24) extends to the inner cavity of the filter box (27).
4. A continuous semiconductor wafer wet etching machine as claimed in claim 1, wherein: the height of the push plate (34) is greater than that of the push block (36).
5. A continuous semiconductor wafer wet etching machine as claimed in claim 1, wherein: the outside of quick-witted case (1) is provided with feeding transport mechanism (42), the one end of feeding transport mechanism (42) extend to the inner chamber of quick-witted case (1) and with the position looks adaptation of second bellying (10), the outside of quick-witted case (1) is provided with ejection of compact transport mechanism (43), the one end of ejection of compact transport mechanism (43) extends to the inner chamber of quick-witted case (1) and the position looks adaptation of first bellying (9).
6. A continuous semiconductor wafer wet etching machine as claimed in claim 1, wherein: the bottom joint of rolling disc (4) has support ball (12), the surface that supports ball (12) is laminated mutually with the top surface of fixed disk (5).
7. A continuous semiconductor wafer wet etching machine as claimed in claim 1, wherein: the front of machine case (1) articulates there is maintenance door (45), the middle part of maintenance door (45) is provided with toughened glass (46), the front fixed mounting of machine case (1) has control panel (44), control panel (44) respectively with servo motor (3), electronic hydraulic stem (7), feeding transport mechanism (42), ejection of compact transport mechanism (43) electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111093050.5A CN113903685A (en) | 2021-09-17 | 2021-09-17 | Continuous semiconductor wafer wet etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111093050.5A CN113903685A (en) | 2021-09-17 | 2021-09-17 | Continuous semiconductor wafer wet etching machine |
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| Publication Number | Publication Date |
|---|---|
| CN113903685A true CN113903685A (en) | 2022-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111093050.5A Pending CN113903685A (en) | 2021-09-17 | 2021-09-17 | Continuous semiconductor wafer wet etching machine |
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| CN (1) | CN113903685A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115116908A (en) * | 2022-08-22 | 2022-09-27 | 四川洪芯微科技有限公司 | Wafer groove corrosion device |
| CN115775735A (en) * | 2022-12-02 | 2023-03-10 | 江苏东海半导体股份有限公司 | Preparation method of silicon carbide accumulation state MOSFET with groove |
-
2021
- 2021-09-17 CN CN202111093050.5A patent/CN113903685A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115116908A (en) * | 2022-08-22 | 2022-09-27 | 四川洪芯微科技有限公司 | Wafer groove corrosion device |
| CN115116908B (en) * | 2022-08-22 | 2023-01-10 | 四川洪芯微科技有限公司 | Wafer groove corrosion device |
| CN115775735A (en) * | 2022-12-02 | 2023-03-10 | 江苏东海半导体股份有限公司 | Preparation method of silicon carbide accumulation state MOSFET with groove |
| CN115775735B (en) * | 2022-12-02 | 2023-11-07 | 江苏东海半导体股份有限公司 | Preparation method of silicon carbide accumulation state MOSFET with groove |
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